Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Thursday, October 19, 2017
Free Technical Program & Schedule:
9:00AM – 9:45AM
It All Starts with the Stencil
Speaker: Kevin Buckner, KYZEN
Because the majority of printing problems start at the printer level, we will discuss solder paste release, slumping of the solder block, solder balls being left in apertures and over pumping. Also, we will examine multiple ways to clean stencils and their apertures with different types of mechanical energy and different chemistries, including solvent and aqueous solutions. By attending this presentation, you will learn how small changes to process can yield big rewards in production.
11:00AM – 11:45AM
Water, Water, Everywhere: Understanding the tremendous damage that moisture causes to electronic components, how to control it, and what FA equipment do we use to analyze it.
Speaker: Steve Greathouse, Plexus Corp.
Moisture is everywhere and is essential for life to exist. However, it is an unwanted partner in the assembly of electronic products. It is truly amazing to see the severe damage done by moisture to electronic components and boards during the manufacturing process. The sad thing is that most engineers, technicians, and operators don’t see the damage until it is overwhelmingly bad. How do you know how to tell when a part is moisture sensitive, how sensitive it is, how to control its exposure and moisture saturation, and how to protect against it damage will be a significant part of this presentation.
What types of equipment is used to detect these and other failures in products? A discussion of the different types of failure analysis equipment available, what data will it give you, and how to select the right type of equipment to get the results you want will be given.
1:00PM - 1:45pm
Electronic Manufacturing Trends and Outlook
Speaker: Patrick Ryan, Ryan Technical Services
After several years of lackluster growth, 2017 is rebounding with diversified growth in many of the key indicator markets. This paper looks at the key drivers and electronic market trends going forward. We will also look at macro-electronic packaging trends along with some consumer electronics trends driving consumer demand.
2:00PM - 2:45pm
Speaker: Joe Bahou, Indium Corporation
Surface Insulation Resistance (SIR) testing is a commonly accepted means of determining the electrical reliability and corrosive nature of a solder flux residue. This presentation will discuss the basic process and principles of Surface Insulation Resistance (SIR) testing as prescribed by the IPC. It will also give a brief overview and comparison of the changes in SIR testing between J-STD-004A and J-STD-004B as well as the pros and cons of each method.
Tour of Materials Characterization Lab
Dr. Sean Clancy, Associate Director & Program Manager of the Materials Characterization Lab (MCL), will provide a tour of the MCL, a user research facility managed by the Materials Science and Engineering (MSE) Department at the University of Utah. The lab offers clients access to a wide-range of analytical instrumentation and services, including: Cross-Sectioning, DSC, FTIR, Instron mechanical testing, SEM-EDS, XRD, and much more. The MCL has an extensive history of successful collaborations with academia, government, and industry clients ranging from start-ups to multinational corporations in the aerospace, automotive, coatings, geochemical, medical, semiconductor, and other markets. MSE faculty and staff serve as resources in the following areas of specialization: bio-fuel cells, ceramics, composites, computational electronic materials and polymers, electronic materials and assemblies, explosive sensing, nanomaterials, nanotechnology, and more. Additional information is available at https://mcl.mse.utah.edu/.