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Rocky Mountain Expo & Tech Forum +
1701 Bryant Street
Denver, CO 80204
The Rocky Mountain Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on December 16th, 2016!
NEW SPONSORSHIP! Diamond Vision
Get your name and logo on the BIG SCREEN at Sports Authority Field and on the screens in the West Club during the Expo! Click HERE for more information
Important Exhibitor Materials:
Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.
Mark your calendars and plan to attend what is expected to be the Rocky Mountain event of the year. The SMTA Rocky Mountain Chapter is now taking registration for their 2017 Expo. We are expecting a sold out event, connecting exhibitors, and bringing the latest technology to the Rocky Mountain region while presenting impactful and meaningful technical sessions for your continued professional growth.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 2:30pm.
Parking Information
(you can park in either lot J or lot C)
Free Technical Program:
A Special Thank You To Our Coffee Sponsor:
9:00AM
Registration opens
A Special Thank You To Our Technical Program Sponsor:
9:30am – 10:15am
Wearable Electronics Drives a New Manufacturing Paradigm!
Charles E. Bauer, Ph.D., TechLead Corporation
With all the excitement around IoT (Internet of Things), big data and cognitive computing the impact of wearable electronics and smart textiles on the manufacturing environment frequently gets lost in the noise. However, these trends create many new and exciting challenges for the electronics industry, including new design, manufacture, test, and supply chain paradigms. The central role played by sensors, energy storage and energy harvest devices results in altogether revolutionary packaging concerns. Intended for intimate contact with human skin in diverse, often hostile environments such as automobile cabins and seawater, these systems require new yet proven safe and reliable materials as well as customized application configurations. This presentation explores the seemingly conflicting requirements of achieving low cost while meeting the high volume, high mix product requirements of this brave new world of electronics systems.
10:00AM
Expo Opens
11:15am – 12:00pm
Complete Integration of Manufacturing Machines into PCB Assembly
Mark Laing, Mentor Graphics
Virtually every SMT manufacturing line consists of more than one vendor of equipment when SMT, Test and Inspection machines are taken in to account. Collectively these different machine technologies have unique challenges for both programming and monitoring as part of an efficient PCB manufacturing environment.
Considering the various and complex test and inspection methodologies, both automated and manual in addition to the sophisticated pick and place equipment, it is important to recognize the importance of complete and consistent information when configuring, programming and optimizing line operation. The delivery of complete PCB schematic, layout, part and package data for all these machine types, in a way that ensures a single, fast, mistake-free flow is essential.
Given the consistency of data preparation, this presentation will then go on to cover the challenges of collecting and exchanging of live SMT, test and inspection machine data that is created during PCB manufacturing that must then be delivered to multiple business and “smart” manufacturing systems to further drive the optimization of complex, flexible electronics manufacturing.
12:00pm - 1:30pm
Join us for a complimentary lunch and networking on the Show Floor!
A Special Thank You To Our Lunch Sponsor:
1:45pm - 2:30pm
Stencil Design to Improve Yields
Tony Lentz and Greg Smith, FCT Assembly
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It’s commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult. This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented on the following common SMT defects:
• Poor Solder Paste Release: Focus will be placed on small components
• Solder-balls (Mid Chip Solder Beads): Stencil design to minimize solderballs
• Tombstoning: Improving tombstoning with stencil design
• Bridging at Print: Simple guidelines to eliminate bridging
• Insufficient Solder Volume at SMT Reflow: Look at the correlation of stencil design to solder volume after reflow
• Bridging at SMT Reflow: What causes bridging after reflow when it is not present after print
• Voiding: Design ideas to reduce voiding through stencil design
This paper summarizes the results of this study with respect to the variables tested. Root Causes of these challenges will be identified and practical stencil design recommendations will be made with the intent of eliminating defects and improving yields during the printing process.
3:00pm - 4:00pm
Meet and Greet with the Best in the Business! Join us after the show for Networking and Celebration at the West Club at Sports Authority Field
A Special Thank You To Our Reception Sponsor:
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Google2017 Mini in Minny Officer's Leadership Forum +
Hilton Minneapolis/Bloomington Hotel
Minneapolis , MN
The SMTA invites all NEW Chapter Officers to the Inaugural "Mini in Minny" Chapter Officer's Leadership Forum
Develop leadership skills, learn the ins and outs of running a chapter, and put faces to names at SMTA HQ at our orientation weekend for all brand new SMTA Officers. Move forward with enthusiasm and confidence as effective leaders in your chapter.
Download all breakout session presentations here!
2017 SMTA Leadership Forum Agenda
March 3, Friday Hilton Minneapolis/Bloomington
Arrivals
The Hilton boasts a wonderful restaurant (Bloomington Chophouse) as well as a lounge and a Starbucks Coffee Lounge for lunch or dinner on your own. If you have time and want to venture further, the world-famous Mall of America is only a short complimentary shuttle ride away.
7:00 p.m. Welcome Newbies Happy Hour
Hors d'oeuvres and adult beverages will be served, but we ask that you eat dinner prior to the reception.
Sponsored by the Space Coast SMTA Chapter
Location: Executive Lounge at Hilton Minneapolis/Bloomington
March 4, Saturday SMTA Office, Eden Prairie, MN
8:00 a.m. Transfer to SMTA Office
Location: The shuttle will depart from the main Hilton Lobby
8:30 a.m. Breakfast
Location: SMTA HQ
Breakout Meetings
Topics covered will include:
12:00 p.m. Working Lunch
Location: SMTA HQ
Breakouts Continue
5:00 p.m. Transfer back to Hilton Hotel
6:30 p.m. Transfer to Pinstripes Bistro
Enjoy dinner and a little friendly competition at Pinstripes, where they offer fresh, made-from-scratch Italian-American cuisine and an upscale take on bowling and bocce.
Location: Pinstripes - Edina. The shuttle to Pinstripes will depart from the Hotel Lobby.
March 5, Sunday
Departures
DRESS CODE: The Forum weekend dress code is casual.
Logistics: Hotel, Travel & Events
Hilton Minneapolis/Bloomington Hotel
3900 American Boulevard West
Bloomington, MN 55437
Make your hotel reservations directly with the Hilton's Reservations Department by Wednesday, February 8, 2017.
Book your hotel room online here!
Booking via Phone: 414-935-5959, ask for group code "SMTA"
The negotiated rate is $79 plus tax per night for a standard king room.
Reservations requested after Wednesday, February 8, 2017 will be accepted as long as availability permits on a first-come, first-serve basis, but will be at the higher prevailing rates versus the special group rate. You will need to guarantee the first night’s room and tax with a credit card or check advance deposit. You can cancel your reservation until 12:01 a.m. on the day of arrival without incurring any cancellation charge. Cancellations after that point and no-shows will forfeit the first night’s room and tax deposit.
Check-in time is 3:00 p.m., and check-out is 12:00 noon. You will need 2 nights (arriving 3/3/17 and departing 3/5/17). Amenities include coffee maker, iron and ironing board, hair dryer, mini-fridge, WiFi access, 24-hour room service, as well as other in-room amenities.
If you choose to stay at a different hotel or make other arrangements you will need to make your own transportation arrangements to all events.
TRAVEL ARRANGEMENTS
If you plan to attend the 2017 “Mini in Minny” Chapter Officer Leadership Forum, SMTA requests that you attend the Welcome Reception Friday, March 3, at 7:00 p.m. and be present at all events Saturday, March 4. You are free to make your return airline arrangements whenever convenient on Sunday, March 5. There are no formal SMTA events on Sunday.
AIRPORT SHUTTLE INFORMATION: The Hilton Minneapolis/Bloomington Hotel offers guests a free shuttle to and from MSP during their stay. Please call 952-893-9500 to setup the shuttle. The hotel’s front office staff will be able to take their contact and flight information and give them instructions where to meet. We recommend you call in advance. If you don’t call until you land, your wait for transportation may be longer.
Funding & Sponsorships
$ FUNDING $
The SMTA Officer’s Leadership Forum is open to all NEW officers. All food and beverage during the duration of the program will be covered by SMTA. Entertainment and instruction is also included for all qualifying new officers.
Each officer is responsible for his or her travel to Minneapolis and hotel expenses. We hope that your employers understand the value of the benefits of SMTA membership and will support your trip. If not, Forum expenses are acceptable chapter expense items within the SMTA and Chapter Bylaws.
All new officers must discuss it with your President and Treasurer before you make any non-refundable airline or hotel arrangements.
If it is impossible for your company or chapter to fund travel expenses, ask Karen (karenchapters@smta.org or 952.920.7682) about our financing assistance. We want to work with you to ensure that all new officers are able to attend.
HELP THE SMTA GROW
Please help us to make this inaugural event continue every other year. Please consider becoming a sponsor and “Help the SMTA Grow”.
Please help us support those chapters whose treasuries are insufficient to send anyone to Minneapolis. We want all new officers to be able to attend – you can help us make that happen! Contact Karen to find out more about which chapters are in need. You can direct your contribution toward a particular chapter or just donate it wherever it will do the most good. If you prefer, you can sponsor an event during the weekend. Any sponsorship, any amount, is appreciated.
SPONSORSHIPS AVAILABLE:
ANY AMOUNT IS WELCOME!
All Forum Sponsors will be introduced at the Welcome Reception, receive verbal recognition and signage recognizing the sponsors during the event to show our appreciation of your chapter's support of your peers.
Thanks to our current chapter sponsors!
LA/Orange County Chapter Tutorial Program: Design for Testability Strategies for Today's Circuits +
Paradigm Contract Manufacturing LLC
Garden Grove , CA 92841-1823
| Instructor: Louis Ungar, Advanced Test Engineering (A.T.E.) Solutions, Inc.
March 16, 2017 | Price: Members - $200 Non-Members - $275 (A one-year Individual SMTA Membership is included in the non-member price) LA/Orange County Chapter Officers - $100 SPECIAL OFFER! The LA/OC Chapter will subsidize the cost of registration for all student attendees. Student Members - $FREE! (Regularly $50) Student Non-Members - $20 (Regularly $70. A one-year Student SMTA Membership is included in the non-member price) |
Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
Introduction:
The objective of this course is to familiarize attendees with how the testing problem should be tackled for today’s ever more complex electronic circuits. To compound the problem, access to the circuit is ever shrinking making mechanical probing more challenging and less effective. Design for Testability (DFT) techniques, including use of the JTAG/IEEE 1149.1 boundary scan helps in keeping up. The course covers issues of how to ensure that circuit boards populated with SMT devices are built correctly, but goes further to confront the question of ensuring that it in fact functions correctly. The course will cover the objectives of various test methods but will also include ways to overcome their limitations. Finally, a profitable test strategy is described and how the traditional test paradigm must change to take advantage of it.
How You Will Benefit:
Topics Covered:
- What does this cost?
- How much does it save?
- How can we profit from better tests?
Who should attend?
Many people are involved in creating a product and they should be concerned that it can be proven to be good before it is sold. Quality, manufacturing, and design engineers not only need to know test to contribute to its success, but also to reap its rewards by the information tests can provide for future improvements. Managers of all disciplines need to know how tests are performed and how to benefit from them rather than simplistically aim only to lower test costs. Finally, test engineers need this course so they can communicate their concerns with others in the organization.
About the Instructor:
Louis Ungar
Mr. Ungar enjoys a well-known reputation in the electronics testing profession. He has built, programmed, and selected Automatic Test Equipment (ATE) for a large number of clients both in the commercial and military community. Having introduced the first university course on ATE and Design for Testability (DFT) at UCLA, he has taught similar courses to companies around the world. He led the Surface Mount Technology Association (SMTA) Testability Committee to publish the SMTA Testability Guidelines from 2002 with the most recent 2014 SMTA Testability Guidelines. He has been involved with the IEEE standards committee for several DFT standards, including the IEEE-1149.1, the 1149.4 and the 1687 and has been honored as a life-time member of the American Society of Test Engineers and is the Tutorial Chair of the IEEE AutoTestCon. He is involved with the IPC-2231 standard for DFX, where X is substituted for Testability, Reliability, Manufacturability, etc. He is also the co-author of a technical paper on False Alarms and No Fault Found that won the Best Management Paper award at AutoTestCon 2015. Mr. Ungar completed courses towards a MA in Management and holds a BS degree in Electronics Engineering and Computer Sciences from UCLA. He continues teaching DFT and BIST courses at conferences, at companies and at public forums around the world.
Contact Karen Frericks at 952.920.7682 with questions.
SMTA Webinar: What are the Next Concerns in Counterfeit Electronics? +
1:00pm-2:00pm Eastern
Presented by: Diganta Das, Ph.D., CALCE/University of Maryland
Complimentary Webinar for Members!
Course Overview:
The counterfeit part mitigation and control plans reached a milestone in 2016 with release of the long awaited test standard AS 6171. The year also saw release of an updated version of "Counterfeit Electrical, Electronic, and Electromechanical (EEE) Parts; Avoidance, Detection, Mitigation, and Disposition" and its accompanying aerospace recommended practices. This Webinar will cover the salient elements of these published standards and the status of other related standards. In addition, the concerns on the future of counterfeit - including those of non-electronic systems, higher level assembly, tampered electronic components and systems and their relationship with the highly visible area of cyber-security. This coverage will include other sources of standards such as JEDEC and IPC and top level analysis of reported counterfeit data.
About the Presenter:
Dr. Diganta Das (Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is an Associate Research Scientist at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices. His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics based risk mitigation of electronics. Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development. He is an Associate Editor of the journal Microelectronics Reliability. He is a Six Sigma Black Belt and a member of IEEE, IMAPS and SMTA.
SMTA Webtorial: Role of Bismuth in Lead-free Systems – All You Need to Know +
Two (2) 90 minute Sessions
March 22 and 23, 2017
1:00pm to 2:30pm Eastern
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group
Overview:
Bismuth (Bi), which is introduced either through the supply chain or by design, is becoming an inevitable element in lead-free electronic products. With the deliberation of all relevant parameters, theoretical and practical, Bi plays a “potent” role in electronic solder systems. The proper use of Bi can profoundly benefit the performance and reliability of electronic package and assembly including solder joint performance, tin whisker mitigation, among others. An adequate understanding of the properties and performance parameters of Bi is critical to product reliability. This webtorial will discuss the relevant aspects of Bi to help dispel misconceptions and to demonstrate performance criteria related to Bi. The goal is to help achieve the desired level of performance and product reliability. Your questions and issues for solutions and discussions are welcome.
Main topics for Part 1:
--Physical properties
--Mechanical behavior
--Dissolving into solder joint
--Estimation of concentration of Bi in solder joint
--Effect of compositional change
--Compositional change
--Stress vs. strain
--Fatigue behavior
--Stress vs. strain
--Fatigue performance
Main topics for Part 2:
--Pb-containing
--Pb-free
--Melting temperature range
--Compositional control level
--Physical, mechanical properties
--BGA thermal fatigue performance
--Causes
--Solutions
--Presence or absence
--Thermograms
--Detectable or non-detectable effects
--General guidelines
Who Should Attend:
The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.
Bio:
Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and government programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. She has received numerous honors/awards including the U.S. Congressional certificate of recognition, induction into WITI International Hall of Fame, named "R&D Star-to-Watch" by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 450+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and implementations, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University's Board of Trustees.
South East Asia Technical Training Conference on Electronics Assembly Technologies 2017 +
Olive Tree Hotel
Penang 11950 Malaysia
Thank you for attending the 2017 South East Asia Technical Conference on Electronics Assembly. See you next year!
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Why Should You Attend:
SMTA Webinar: Exploring Interferometry Sensors for Advanced Packaging Metrology Applications +
Tuesday, April 4, 2017
11:00am-12:00pm Central
Presented by: Julia Brueckner, Ph.D., Quantum Analytics
Complimentary Webinar for Members!Overview:
The end of node scaling is approaching. As a consequence, the need to start scaling the packages is growing constantly. Fan out wafer-level packaging (FO-WLP) offers an efficient solution due to its possibility for high IO count, thin package and short development times. The process flow to build a so called redistribution layer (RDL) requires a full lithography and plating cycle. To ensure a reliable product, all involved process steps need to be tightly monitored and controlled accurately. The challenge here: how to measure step height of pads or under bump metallization (UBM) features on structures that are not completely flat and show height variations. In this webinar, we’ll explore ways to tackle that problem and introduce the work flow of a stable algorithm to evaluate the above mentioned features automatically for different devices. We will discuss how White Light Interferometry (WLI) and Spectral Coherence Interferometry (SCI) can be used to achieve fast and accurate measurements of step heights, critical dimensions (CDs) of pads, UBM structures, as well as polymer thickness. We will share data taken from measurements - displaying full wafer maps, 3D profiles, and identifying the anomalies that are revealed.
Topics Covered:
Who Should Attend:
About the Presenter:
Julia, a native of Offenbach, Germany, received her Bachelor and Master of Science degrees from Johann-Wolfgang-Goethe University, Frankfurt. In 2015, she received her Ph.D. in Chemistry from the University of Heidelberg for her dissertation: Ultrafast Triplet Formation in N-Substituted Pentacene Derivatives. During her studies she was awarded several scholarships including a Fulbright scholarship to UC Berkley, and a Procter & Gamble award for the best thesis in the Master of Chemistry studies. Upon receiving her Ph.D., Julia joined Sentronics Metrology in Mannheim, Germany as an applications scientist. In March 2016, she was requested to directly work with Quantum Analytics, the US distributor to promote Sentronics Metrology equipment in the US semiconductor industry.
West Penn Expo & Tech Forum +
101 Mall Plaza Blvd.
Monroeville, PA 15146
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on March 3rd, 2017!
Important Exhibitor Materials:
Please contact SMTA Director of Exhibitions Emily Stuckmayer with questions or for additional information.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Wednesday, April 5, 2017
10:00AM–3:00PM
Free Technical Program & Schedule:
More Details Coming Soon!
8:00AM
Registration Opens
Special Thanks to Our Coffee Sponsor:
8:30AM-9:30AM
9:30AM
10:00AM – 11:00AM
Complimentary Hot Lunch
12:30PM – 1:30PM
2:30PM – 3:30PM
Reducing QFN Voiding
Mario Scalzo, Indium Corporation
Expo Opens
Coping with Pb-free in High Performance Engineering Design
Anthony Rafanelli, Ph.D., Raytheon Corporation
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by these materials both as interconnections and finishes. Summarizing at a high level, these challenges represent risks associated with 1) durability of the interconnection and 2) deleterious effects of tin whiskers. The IPC PERM Council has been the lead industry group focusing on the identification of those challenges and risks associated with use of these new materials. Their efforts have led to a significant increase in the knowledge base with respect to technical guidance and risk mitigation resulting in tools for use by the many engineering disciplines (design, manufacturing, quality, production, materials science) that comprise successful aerospace and defense product development. These tools are mostly made up of standards and handbooks focused on system performance, tin whisker risk mitigation, Pb-free product testing, technical guidance, and rework/repair. What was missing was design guidance. Accordingly, IPC Task Group 8-81D (Research Coordination and Technical Guidance), of the IPC PERM COUNCIL, has undertaken an assignment to generate an industry-wide guide to aid engineers in designing with Pb-free technology. The focus is to provide insight and information such that the design will maintain performance requirements for aerospace, defense, and high-performance (ADHP) products and systems. Having started out as a "laundry list" of Pb-free concerns and challenges identified by the ADHP industry, the guide is structured such that those “delta” considerations, i.e. technical knowledge gaps with Pb-free technology are brought to the designer’s attention. Furthermore, the guide highlights Pb-free concerns, as they are encountered in the phases which generally reflect the product development cycle used by Aerospace, Defense, and High-Performance systems industries. This paper presents an overview of the PERM Council and a summary of efforts to generate a Pb-free design guide.
Special Thanks to Our Lunch Sponsor:
Why Reball BGA’s
Brian Watson, SemiPack Services
Why BGA Reballing? There are multiple reasons to Reball BGA's. From design aspects to life span to EOL components that have oxidized to quality and yield improvement, BGA Reballing is an essential part of non commercial applications. We will review thee aspects, plus best practice and the options available to reball components. A brief overview will also be given on this subject.
I . Support of Sn/Pb for Military and Space designs
a. Designs that were qualified as tin/lead cannot be switched to lead-free without re qualification.
b. If additional hardware is needed years later everything must be converted to tin lead.
c. Typical programs require a 20 year spare parts purchase at the end of production.
d. Electronic parts acquired 10-20 years ago often require some kind of re-tinning.
e. Building new hardware with refinished components will increase quality and yields.
II . Reliability
a. Tin whiskers have been discovered on SAC 305 BGAs.
b. Electronic failures from tin whiskers can be intermittent and difficult to trouble shoot. (Hughes Satellite lost spacecraft due to tin whiskers)
c. Solder joint life for tin lead has been studied for many more years than lead-free.
d. The long term life of lead-free solders is still to be determined in actual use.
Stencil Nano-coating: Filtering the Fact from the Fiction
Speaker TBA, StenTech
Stencil nano-coating has been promoted in the US for more than 4 years… but many questions remain as to when and where these techniques and products can and should be implemented. As a key figure who helped to promote and bring attention to this technology in the USA, Eric Moen hopes to answer many questions as to the benefits, uses, and effectiveness of utilizing stencil nano-coating for improving solder paste printing yields. What are the optimal conditions for nano-coating? When should nano-coating not be used? Where is the proof of the effectiveness of nano-coating? How long will the nano-coating last? The purpose of this presentation is to help in answering these and many other questions relevant to the topic of stencil nano-coating.
4:00PM
Expo Closes
Puget Sound Defect Resolution Chapter Tutorial Program +
Astronics AES
Kirkland , WA 98034
| Instructor: Jim Hall, ITM Consulting April 18, 2017 8:30 a.m. - 4:00 p.m. Astronics AES 12950 Willows Road NE Kirkland, WA 98034 | Price: |
Introduction:
We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.
Course Outline:
Part 1
- Prevention: Process Development and Validation
- Variation (Common Cause)
- Continuous Improvement
- Failure – PCBA does not function
- Repair or Scrap
- Escapes – Identified by customer
- Reduced Reliability
- Process Indicator
- Special Cause vs. Common Cause
- Inspection
* Manual
* AOI
* X-Ray
- Test
* ICT
* Functional
* Contamination
- False Calls / Escapes
- Special Cause vs. Common Cause
- Variability (repeatability)
- Accuracy
- Process not Optimized
- “5 Whys”
- Cause and Effect Diagram
* 6 M’s
* Levels: Specific Processes vs Interactions
- Incoming Materials
- Handling
- Process Problems
* Wrong Process
* Degraded Process
* Poor Process (common cause defects)
Part 2
- General: wrong process, material, etc.
- Printing
- Placement
- Soldering
- Singulation
- Coating
- Mechanical Assembly
- Testing
- Wrong Part
- Damaged Parts
- Shorts
- Opens
- Poor Wetting
- Insufficient
- Contamination
- New Specific Defects
* HiP
* Graping
- Pad Cratering
- CAF
About the Instructor:
Jim Hall
Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Springfield, TN). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. He is one of the featured “Assembly Brothers” on the audio feature “Board Talk” hosted on the Circuit Insight online magazine. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:
Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 500 engineers in the US, Canada, Mexico, Malaysia, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.
As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered through the Thayer Engineering School, Dartmouth College, presenting units on subjects including:
Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 35 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for SMTA, IPC, and IMAPS.
Contact Karen Frericks at 952-920-7682 with questions.
Atlanta 21st Annual Expo +
6400 Sugarloaf Parkway
Duluth, GA 30097
The Atlanta Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!
The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).
The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $55 per booth. Early bird expires on March 8th, 2017!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:
Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Show Hours: 10:00AM – 3:00PM
Special Thanks to Our Coffee Sponsor:
AM Technical Sessions 10:30AM - 11:30AM:
Hidden Gems: Emerging Tools, Techniques, and Technologies for Achieving Higher Yields, Optimized ROI, and Minimizing Defects in Your Electronics Assembly Process
Special Thanks to Our Lunch Sponsor:
PM Technical Sessions 1:00PM – 2:00PM
Solder Paste and Voiding Challenges
Special Thanks to Our Snack Sponsor:
NEW! The 2017 Atlanta Expo will feature an Equipment Showcase with functioning machines right on the show floor! Don't miss the chance to see live demonstrations from some of the area’s leading suppliers!
2017 CHARITY RAFFLE INFORMATION
The Atlanta Chapter is holding a charity raffle again this year with drawings for great prizes throughout the day.
Exhibitors are invited to donate raffle prizes. Raffle tickets will be sold the day of the Expo, with all proceeds benefiting Special Kneads and Treats. For information on how to donate contact SMTA Expo Manager Emily Stuckmayer at emily@smta.org!
Contamination and Cleaning Forum
Moderated by Doug Philbrick, I. Technical Services
A panel of three industry representatives and two local manufacturers will discuss current cleaning and contamination challenges pertaining to electronics assemblies and stencils.
Industry Representatives
Local Manufacturers
Staff Process Development Engineer
L3 Aviation Products
1355 Bluegrass Lakes Parkway
Alpharetta, GA 30004
Phone: 770-752-7000
Director of Engineering
Engent, Inc.
3140 Northwoods Pkwy. Suite 300A
Norcross, GA 30071
Phone: 678-990-3320
Jeff Mogensen, President, Utopia Sales Partners
Jeff Mogensen will discuss a host of new tools and technologies that will help achieve higher yields and maximize ROI in the areas of stencils, solder paste printing and inspection, reflow, and metrology. The goal of this technical session is to acquaint the attendee with a summary of many new products and processes throughout the assembly process that are helping to propel our industry toward “zero defects.”
Industry Roundtable
Moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB/CIRCUITS ASSEMBLY; President of UP Media Group
Hosted and moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB and a PCB designer for 20 years, this informal discussion will focus on the world of PCB design, its challenges, its future, with a focus on how to facilitate communication with the entire PCB supply chain, including fabrication and assembly. If you're a PCB designer or engineer, provide EDA software or just want to understand how to better work with a design group, join us for a casual conversation that promises to be a lively look at the world of PCB design...and beyond.
Tim O’Neill, Technical Marketing Manager, AIM Solder
Tim O’Neill will present the salient details of two separate presentations: “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction,” which was presented at Apex 2017, and his white paper “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing.”
Join us after the Expo at Tin Lizzy's Cantina for a networking happy hour with light appetizers and drinks!
Special Thanks to Our Happy Hour Sponsor:
Special Thanks to Our Equipment Showcase Participants:
Special Kneads and Treats, a non-profit specialty bake shop, provides free birthday cakes to children in our community that cannot afford them while providing Special Needs adults in the same community a place to learn a skill and develop a sense of accountability and pride. Our program gives special needs adults the opportunity to serve those less fortunate or in need. Profits from standard sales go back into community programs promoting Special Needs awareness, research and other areas of need.
Click Here to See the List of Prizes!
Oregon Defect Resolution Chapter Tutorial Program +
Axiom Electronics
Beaverton , OR 97006
| Instructor: Jim Hall, ITM Consulting April 19, 2017 8:30 a.m. - 4:00 p.m. Axiom Electronic 19545 NW Von Neumann Drive Beaverton, OR 97006 | Price: |
Introduction:
We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.
Course Outline:
Part 1
- Prevention: Process Development and Validation
- Variation (Common Cause)
- Continuous Improvement
- Failure – PCBA does not function
- Repair or Scrap
- Escapes – Identified by customer
- Reduced Reliability
- Process Indicator
- Special Cause vs. Common Cause
- Inspection
* Manual
* AOI
* X-Ray
- Test
* ICT
* Functional
* Contamination
- False Calls / Escapes
- Special Cause vs. Common Cause
- Variability (repeatability)
- Accuracy
- Process not Optimized
- “5 Whys”
- Cause and Effect Diagram
* 6 M’s
* Levels: Specific Processes vs Interactions
- Incoming Materials
- Handling
- Process Problems
* Wrong Process
* Degraded Process
* Poor Process (common cause defects)
Part 2
- General: wrong process, material, etc.
- Printing
- Placement
- Soldering
- Singulation
- Coating
- Mechanical Assembly
- Testing
- Wrong Part
- Damaged Parts
- Shorts
- Opens
- Poor Wetting
- Insufficient
- Contamination
- New Specific Defects
* HiP
* Graping
- Pad Cratering
- CAF
About the Instructor:
Jim Hall
Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Springfield, TN). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. He is one of the featured “Assembly Brothers” on the audio feature “Board Talk” hosted on the Circuit Insight online magazine. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:
Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 500 engineers in the US, Canada, Mexico, Malaysia, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.
As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered through the Thayer Engineering School, Dartmouth College, presenting units on subjects including:
Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 35 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for SMTA, IPC, and IMAPS.
Contact Karen Frericks at 952-920-7682 with questions.
SMTA China East Technology and Vendor Conferences 2017 +
Shanghai World Expo Exhibition & Convention Center
Shanghai China
Technology Conference: 25-26 April 2017
Vendor Conference: 25-27 April 2017
Shanghai World Expo Exhibition & Convention Center
The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai 2017. This event, held in conjunction with NEPCON China 2017, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.
SMT Processes Certification (Eden Prairie, MN) +
SMTA Headquarters
Eden Prairie , MN
Instruction: English
Test: English
Instructor: Jim Hall, ITM Consulting
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.
This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.
Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Wisconsin Expo & Tech Forum +
6401 S 13th St,
Milwaukee, WI 53221
The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.
Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.
Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.
2017 International Electrostatic Discharge Workshop +
Location
Granlibakken Tahoe
Tahoe City , CA
The IEW facilitates access to and interactions with industry leaders through invited seminars, technical sessions, special interest groups (SIGs), discussion groups (DGs), and invited speakers. Participants meet in a relaxed, invigorating atmosphere and engage in discussions about the latest research and issues of interest within the EOS/ESD community.
Puget Sound Expo & Tech Forum +
15255 NE 40th Street
Redmond, WA 98052
The cost to exhibit is:
$450 for one 8'x10' booth, or $800 for 2 booths.
$350 for one 5' table, or $600 for 2 tables.
The cost to exhibit includes 2 5' X 19 ½” tables, 2 chairs, light and electricity.
Please contact Anny Zhang to register for the event.
Please see the Puget Sound Chapter Page for More Information on Technical Sessions and Expo Materials.
Two Technical Programs:
1. 2.5/3D Packaging
2. New developments in Lead free Solders, Board Level Adhesive/Underfill, and Interconnect
SMTA Webtorial: Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination +
Two (2) 90 minute Sessions
May 9 and 11, 2017
12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
Presented by: Bob Willis, bobwillis.co.uk
Overview:
This session includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob's presentation comes alive with many unique process video clips on testing and failures which provide a clear understanding of the root cause of failure and corrective action. A FREE copy of Bob's e-book on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course.
Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering
Topics will include:
Bio:
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production. Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA
Carolinas Expo & Tech Forum +
6426 Burnt Poplar Rd
Greensboro, NC 27409
The Carolinas Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!
The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 14th, 2017!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Tuesday, May 16, 2017
10:00AM–3:00PM
Free Technical Program & Schedule:
9:00AM
Registration opens
A Special Thank You To Our Coffee Sponsor: Nortec Humidity! 
9:30AM–10:15AM
Accelerating the Internet of Things Economy in NC
Bob Stennett, Business Development Manager, NC RIoT
If the 3rd industrial revolution pumped electricity into every object, the Internet of Things - coined the fourth industrial revolution - will inject intelligence into every object. The IoT market opportunity provides a rare chance for forward thinking industries, cities, states, and regions to stake a claim on this rapidly emerging market.
Here lies the problem this generation faces in the midst of a digital transformation: With such a massive overhaul of our systems on the horizon, how will businesses, towns, institutions and the workforce adapt? How can IoT become a tool for all, instead of furthering the digital divide between urban and rural communities? Who will serve as the connective tissue to bring multiple stakeholders together to capitalize on IoT’s possibilities efficiently and effectively? How will organizations efficiently leverage the technology tipping points that enable this revolution?
It’s these questions that RIoT strives to answer. Our mission: capture IoT opportunities through economic development, education, and ecosystem building in support of the Internet of Things and disruptive technologies.
10:00AM
Expo Opens
11:00AM – 11:45AM
2D, 2.5D, and 3D X-Ray Inspection – What’s a “D”?
Bill Cardoso, Ph.D., Creative Electron
The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to became an integral part of the quality assurance function of modern electronic manufacturers.
However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. Unfortunately, x-ray companies are not always clear about the pros and cons of each option. As a result, users end up buying too much or too little capabilities. In either situation, the user is left without the right x-ray inspection solution.
The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. We will set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.
12:00PM
Complimentary Lunch
A Special Thank You To Our Coffee Sponsor:General Microcircuits, Inc! 
1:00PM – 1:45PM
IPC-1782 Standard for Traceability of Critical Items Based On Risk
Cameron Shearon, Lead Quality Engineer, AT&T
Traceability has grown from being a specialized need for certain safety critical segments of the industry, to now being a recognized need for the industry as a whole, especially those companies who use remote EMS partners. The perception of traceability data collection persists as it being a burden to manufacturing, then providing value only when the most rare and disastrous of events take place. Different requirements for traceability have evolved in the industry, dictated mainly by OEM companies, which create confusion. In addition, counterfeit materials are now being seen as being a growing epidemic in the industry, creating significant additional costs for inspection as well as rework and recall, with no way currently to successfully assign responsibility.
Traceability, as defined by the IPC-1782 standard, is the first such standard for the electronics assembly industry, and represents the opportunity to resolve all of these issues, creating a single flexible traceability specification that can be adopted for all company sizes and sectors across the industry. The scope includes support for the most demanding instances for detail and data integrity such as those required by critical safety systems, all the way through to situations where only basic traceability, such as for simple generic consumer products, is required.
In this presentation, we will illustrate applications and examples of how traceability can be of continuous value and benefit to manufacturing itself, as well as being insurance against any serious market defect. The effectiveness of traceability against counterfeit will also be shown.
Traceability, as defined by the IPC-1782 standard represents the most effective quality and anti-counterfeit tool available, becoming an intrinsic part of the best practice “Smart factory” operation.
2:15PM – 3:00PM
What Can You Do In A Smart Factory?
Zac Elliott, Technical Marketing Engineer, Mentor Graphics
We hear a lot these days about “Smart Factories”, including such buzzwords as “Industry 4.0”. But mostly, we hear questions. What makes a factory “Smart”? Do I need a massive solution from a certain provider, or can the overall solution be built up from functions provided by different providers? How would they all work together? What are the components to make an existing factory into a “Smart” one so as to avoid capital expense? Is there an affordable “Smart” Solution for smaller companies?
Answering all of these questions is very important, as in a competitive market, opportunity has been seen to be fading away over the last few years, in favour of manufacturing in remote locations around the world. Today however, the tables are turning, and for some have already turned. With greater tax incentives for on-shored manufacturing on the horizon, improved automation and robotics technology, there is a renewed feeling of optimism in the industry, but rewards only for those who embrace the latest industry expectations.
This presentation shows how the Smart factory is closely related to on-shoring, and the technologies that are necessary to bring access to the Smart factory within reach of everyone, to existing factories today.
3:00PM
Expo Closes
Contamination, Cleaning and Coating Conference +
Location
Radisson Blu Hotel Amsterdam Airport Schiphol
Schiphol-Rijk Netherlands
Organized by
and 
May 22-24, 2017
Radisson Blu Hotel Amsterdam Airport Schiphol
Amsterdam, Netherlands
Thank you for attending!
SMTA and SMART Group thank you for being part of their first-ever co-organized conference in Europe. The conference focus was on contamination, cleaning and conformal coating in the manufacture of electronics. We hope to see you next year for this two-day event featuring presentations, workshops, and a panel discussion.
Purchase the conference proceedings! 
Thank you exhibiting companies!
Foresite
INVENTEC Performance Chemicals
Conference Organizers
Conference Chair:Mike Bixenman, KYZEN Corporation
Executive Committee:
Contamination, Cleaning and Coating Expo +
Location: Radisson Blu Hotel Amsterdam Airport Schiphol
Amsterdam
Exhibit Hours:
Monday, May 22: 2:30 p.m. - 6:00 p.m.
Tuesday, May 23: 8:30 a.m. - 5:30 p.m.
Wednesday, May 24: 8:30 a.m. - 3:00 p.m.
For a hard copy of the sponsorship and exhibits form in USD, click here.
For a hard copy of the sponsorship and exhibits form in Pounds Sterling or Euro, click here.
Exhibit space entitles you to:
Sponsorship Opportunities:
Register here to attend the expo only!
Technical conference and workshops not included.
Plan now to join us for free lunch and the chance to network with leading suppliers to our industry!
Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance. Click here to register for the conference.
SMTA Webinar: Supply Chain Risk Insights Powered by Watson? +
Thursday, June 1
1:00pm-2:00pm Eastern
Presented by: Tom Ward, IBM and Rahul Nahar, IBM
Complimentary Webinar for Members!
Summary:
How do supply chain leaders know when to take costly risk mitigating actions to recover from the impact of a natural event (ie. a hurricane or earthquake) and when can they simply take caution, but no action?
Course Overview:
Managing global supply chains can be a risky business. The race for leaner supply chains has placed supply chain sites and suppliers in some unstable regions of the world. Events ranging from major hurricanes to social unrest and epidemics, threaten to disrupt the delivery of products and services. Risk Insights is a threat visualization service which uses the power of Watson to help supply chain leaders mitigate risk. Risk Insights utilizes news, weather event and social media data using Watson technologies to delivers new insights to IBM Risk Analysts on Bluemix. Data is ingested from dozens of real time reports ranging from the TWC to Twitter feeds from the National Hurricane Center. The trajectory of each named storm is monitored and displayed on Risk Insights. The storm track is supplemented with hourly analyzed news about the climatic event as it occurs. Risk analysts get the latest view of typhoons and hurricanes and are alerted when these intersect with their supply base.
Objectives:
About the Presenters:
Tom Ward is currently the IBM Enterprise Services Cloud and Cognitive strategist. He has led supply chain cloud projects over the past six years and for the past three years, Tom has led Watson applications for the Supply Chain. He has been a featured supply chain conference speaker and published author in Forbes, Supply Chain Management Review, AME, ASQ and APICS. Tom has a Master’s degree in EE from RPI.
Rahul Nahar is the IBM Enterprise Services Analytics, Architecture & Strategy Senior Technical Staff Member. In his current role Rahul leads the development of Analytics and Cognitive Solutions for Enterprise Services. Rahul has been leading the effort to leverage Watson API’s and Solutions in Account Receivables Collections, Supply Chain Risk Management (Risk Insights), Quality and Client Satisfaction. Rahul has a broad experience in developing and implementing Analytic Solutions for across the Supply Chain. Rahul has a Master’s in ME from UVa.
International Conference on Soldering & Reliability 2017 +
Edward Village Markham
Markham , ON L3R 0A3 Canada
The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.
Toronto SMTA Expo & Tech Forum +
Location: Edward Village Markham
50 East Valhalla Drive
Markham, ON L3R 0A3
The Toronto Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!
Exhibit Hours:
Wednesday, June 7, 2017: 10:00am – 3:30pm
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
Early Registration Ends May 5th! Rates go up $100!
For a hard copy of the sponsorship and exhibits form, click here.
Exhibit space entitles you to:
Sponsorship Opportunities:
Register here to attend the expo only!
Technical conference and workshops not included.
Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!
ICSR Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.
Exhibit Hours:
Wednesday, June 7, 2017: 10:00am – 3:30pm
9:00am
Registration Opens
10:00am
Expo Opens
12:00pm - 1:00pm
Free Lunch!
A Special Thank You To Our Lunch Sponsor: Nortec Humidity!
1:00pm – 2:00pm
Nanotechnology in Electronics Packaging, Interconnect, and Assembly: Hype or Reality?
Chuck Bauer, Ph.D., TechLead Corporation
While often exaggerated and over-promised, nanotechnology now provides vital performance enhancements to electronic systems after over a decade of R&D. Advanced solders and adhesives pioneered nanotech adoption by electronics manufacturers by minimizing technical risk and masking their nanotechnology nature via drop-in alternatives. Hype gives way to breakthrough as new nanotech solutions address multiple aspects of packaging, interconnect, and assembly. Leading nanotech contributions today include surface finishes for stencils and tin whisker mitigation, adhesives, die attach and solder replacements, via structures, additive circuit formation and 3D printing, novel conductors and dielectrics, and passive components. The authors examine a broad range of exciting evolutionary as well as revolutionary nano-based technologies for electronics manufacturing, identifying key technical challenges and fascinating practical applications characterizing the potential routes to commercialization. As with most technical developments, evolutionary nano-enabled solutions find quicker adoption thanks to existing standards and infrastructure, but revolutionary nano-alternatives entice early adopters with their potential, albeit at substantial risk, to displace incumbent technologies or even more excitingly to create entirely new markets. Presentations of practical and cost effective applications demonstrate that nanotechnology today indeed represents reality instead of hype.
2:00pm - 2:30pm
iNEMI Roadmap 2017 and Research Priorities
Alan Rae, TPF Enterprises
The 2017 iNEMI roadmap is now the only comprehensive electronics roadmap left in the Western Hemisphere. This talk outlines some of the findings relevant to the assembly community and the process underway to develop Research Priorities for companies, University and Government laboratories.
2:30pm - 3:00pm
Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach
Mike Bixenman, DBA, KYZEN Corporation
Bottom terminated electronic components can fail from contamination trapped under the device. Many devices are designed with large, uninterrupted solder mass and a low standoff height, which close off paths for flux to outgas during reflow. The surface tension effects and wetting properties of the flux within solder paste can underfill the device with active residue that bridges conductive paths. Environmental conditions can mobilize conductive ions that lead to metal migration, and from which ultimately causes intermittent performance and failure. Non-standard test methods have been developed to perform site specific analysis of both contamination trapped under the bottom termination and reliability expectations based on the current assembly process conditions. These test methods allow an OEM to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.
The purpose of this research paper is to demonstrate the use of these non-standard test methods to design printed circuit board features that allow the flux to outgas during reflow, test both ionic contamination and surface insulation resistance under a site specific component, selection of solder paste, reflow process conditions and optimization of the cleaning process. Data that helps an OEM determine up-front what does not work and the process conditions that do work will provide design conditions for building reliable electronic hardware.
3:00pm
Dessert & Coffee Break!
3:30pm
Expo Ends
Tijuana Expo & Tech Forum +
Please see the SMTA Mexico Chapter Page for More Information on Expo Materials.
Please see the SMTA Mexico Chapter Page for More Information on Technical Sessions.
Symposium on Counterfeit Parts and Materials 2017 +
College Park Marriott Hotel & Conference Center
College Park , MD
Technical Symposium: June 27-29, 2017
Expo: June 27-28, 2017
Workshops: June 29, 2017
University of Maryland, College Park, MD
SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Parts and Materials. The program will be held June 27-28 at the College Park Marriott Hotel & Conference Center. The Workshops will be held June 29 at the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.
Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.
Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.
Program Finalized!
The program features sessions on Standards, the Role of Test Laboratories in Reporting, Future Technologies, Counterfeits Lifecycle, Detection Related Issues, Current and Future Tools, and views across the Supply Chain.
Keynote Speakers Announced
"Cloned" Devices - How Similar or Different Are Those from Originals
Thomas Sharpe, SMTCorp
Clones had been a concern of people in the electronics parts supply chain for a long time but generally as something that is to come in the future, not now. Badly made clones had been relatively easy to detect through materials comparison and as a result, there is some complacency. In this Keynote address, Tom Sharpe will show that we need to get more prepared for a clone onslaught. He will present information on the direction to which China is moving into very quickly as a state-sponsored manufacturer of much more complex clone devices within the next 4-6 years and that push will have impact globally and on the US.
An Overview of Historical Trends Relating to Suspect Counterfeit, Non-Conforming and High Risk Electronic Components
Mark Snider, ERAI
Mark A. Snider is the founder and President of ERAI, Inc., a privately held global information services organization that monitors, investigates and reports issues that are affecting the global supply chain of electronics. Since 1995, ERAI has been the industry leader for in-depth information on counterfeit, substandard and high-risk parts. What started as a small group of companies sharing data to protect each other from losses resulting from fraudulent activities has since grown into the industry's most complete and comprehensive resource for industry-related market intelligence. Mark has previously presented at NASA's Quality Leadership Forum (QLF), Aerospace Industry Association (AIA), The Surface Mount Technology Association (SMTA) and The Center for Advanced Life Cycle Engineering (CALCE), Department of Defense (DOD), Missile Defense Agency (MDA), Diminishing Manufacturing Sources and Material Shortages (DMSMS), The Nuclear Procurement Issues Committee (NUPIC) and The National Intellectual Property Rights Coordination Center (IPRCC).
The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.
Symposium on Counterfeit Parts and Materials-Tabletop Exhibition +
3501 University Blvd East
Hyattsville, MD 20783
Sponsorship Opportunities:
**All Sponsorships require an exhibit booth reservation**Provide 150 lanyards and they will be the official lanyard for the conference. If you would like us to provide the lanyards, it will be an extra $400. You will receive logo recognition in the show directory, conference website and signage.
Tote Bag Sponsorship (Limit 1)-$400 (if provided by company/$800 if provided by SMTA) -SOLD
Provide your logo on all of the conference attendee bags! If you would like SMTA to provide the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.
Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$500
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.
Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$350
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.
Exhibitor Information:
Contact Jenny Ng for available booth space. 952-920-7682 or jenny@smta.org
Please note that exhibit traffic will be minimal while symposium is in session.
Click here to view floor plan.
Exhibit space entitles you to:
Download a hard copy of the registration form
Cost to exhibit: Rates increase $100 after May 31, 2017
| Booth type | CALCE/SMTA Members | Non-Members |
| One table includes access to Electrical Outlet | $550 | $650 |
| One table no access to Electrical Outlet | $500 | $600 |
Exhibit Attendee:
Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.
Come and visit the exhibits for FREE. Plan to network with leading suppliers in the counterfeit industry. We will provide you with FREE refreshments.
Tuesday, June 27 (9:45am – 2:45pm)
9:45 AM
Exhibits Open
10:15 AM
Risk Assessment in SAE 6171
Michael Azarian, Ph.D., CALCE
11:00 AM
JESD-243, Who is it Intended to Serve
Lee Mathiesen, Lansdale Semiconductor Inc
11:30 AM
Meeting the 'Risk Assessment' requirements of ISO 9001:2015, AS9100D or AS9120B
Anne Poncheri, InterCEPT
12:00 PM
LUNCH
2:45 PM
Exhibits Close for the Day
Wednesday, June 28 (9:45am - 3:00pm)
9:45 AM
Exhibits Open
10:15 AM
Special Plenary Talk: A Systems Engineering Approach to Cyber Physical Systems Security
Prof. John Chandy, Ph.D., UConn Center for Hardware Assurance, Security, and Engineering
12:00 PM
LUNCH
3:00 PM
Exhibits Close
SMTA Webtorial: Stencil Printing-The Essentials +
Two (2) 90 minute Sessions
Tuesday, July 18, 2017 - 1:00pm to 3:00pm Eastern
Bonus: Virtual tour of Stentech stencil manufacturing facility after the Tuesday session!
Thursday, July 20, 2017 - 1:00pm to 2:30pm Eastern
Presented by: Chrys Shea, Shea Engineering
Overview:
Session 1, July 18, 2017
This introductory course on SMT solder paste stencil printing gives the attendees a solid foundation in the basic elements of printing to help them reduce defects and improve yields on the production line. Topics include the flow behavior of solder pastes, the mechanics of the process and the key role of tooling in successful printing.
After understanding the basic elements of the process and their influence on yields, attendees then review troubleshooting tactics, including the 5-miunte check that reveals the source of most problems. A more detailed review of the most probable causes of defects follows, discussing reasons for solder bridges, peaking, insufficient deposits, and gasketing and alignment issues.
Session 2, July 20, 2017
All about stencils! This session focuses on stencil design, stencil materials, stencil manufacturing processes and stencil nanocoatings. The session begins with optimizing stencil design and construction based on PCB layout and component type. It discusses approaches for BTCs, miniaturized, and through-hole components by using aperture designs, multi-level stencils and solder preforms.
It then reviews materials and manufacturing processes, discussing the different options for stainless steel and nickel, and the state of the market on electroforming, laser cutting and elecropolishing.
Nanocoatings are quickly gaining popularity. An overview of the types of nanocoatings available, the benefits and drawbacks of each, and user-generated data on the process improvement they offer are discussed in detail. Additionally, a spreadsheet to help calculate the cost of defects, printer consumables, and payback periods on nanocoatings is demonstrated and the download link is provided.
Attendees are encouraged to ask questions or bring specific problems to the class for suggestions and inputs.
Course Outline
Session 1, July 18, 2017
1. Solder Paste Behavior
1.1. Properties & characteristics
1.2. Behaviors during the printing process
1.3. Printability differences between no-clean and water wash, tin-lead and lead-free
2. Mechanics of the Printing Process
2.1. Alignment and gasketing
2.2. PCB support
2.3. Squeegee or direct print head motion
2.4. Paste setup & release
2.5. Area ratios and transfer efficiencies
3. Troubleshooting Process Problems
3.1. 5-minute system check
3.2. Typical defects and likely root causes to investigate
Session 2, July 20, 2017
4. Stencil Technology
4.1. Optimizing design and materials based on PCB layout
4.2. Stencil Stepping
4.3. BTC and QFN aperture design
4.4. Preforms
4.5. Pin-in-Paste
5. Stencil Materials and Manufacturing Processes
5.1. Nickel – Electroformed and plated over stainless steel
5.2. Stainless Steel – stress relieved, fine grain and high-tension capable new materials
5.3. Electroforming
5.4. Laser Cutting
5.5. High tension foils and frames
5.6. Stencil Inspection & verification for production
6. Nanocoatings
6.1. Purpose
6.2. Types
6.3. Benefits
6.4. Quantifying costs and ROI spreadsheet
Who Should Attend:
About the presenter:
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA "Member of Technical Distinction" award.
Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.
SMTA Webtorial: Stencil Printing-Advanced Topics +
Two (2) 90 minute Sessions
August 8 and 10, 2017
1:00pm to 2:30pm Eastern
Presented by: Chrys Shea, Shea Engineering
Overview:
Session 1, August 8, 2017
This advanced course on SMT solder paste stencil printing builds upon the basics to give the attendees a larger toolkit for troubleshooting and process improvement. The session starts with handling incoming stencils, and the need to clean and verify them before putting them into production. A simple stencil verification method using SPI is described in detail, as is the inclusion of test coupons to aid in troubleshooting stencil quality issues.
The session continues with detailed methods of troubleshooting suspected stencil issues, showing images and data from several real-world stencil trials. It discusses the impact of aperture size and thickness variation, aperture location, and wall cut quality.
Stencil underwiping is presented, reviewing types of wipe sequences, wiper papers, and solvents, particularly as they relate to modern lead-free solder pastes and the preservation of nanocoatings. Videos and ultraviolet images of the effects of cleaning and nanocoatings are shown.
Session 2, August 10, 2017
Automated Solder Paste Inspection (SPI) is almost as important as the print process itself. SPI helps maintain process control, dial-in difficult PCBs, track defect trends and feedback positional errors or the need to perform an underwipe to the printer.
The session starts with basic methods of SPI equipment and their measurement algorithms. It continues with tips for production implementation and setting inspection tolerances. It then introduces simple experimental methods that can be performed quickly and easily to improve yields.
The differences between accuracy and repeatability are discussed, as are the effects of setting of reference planes and measurement thresholds. Finally, special features of some machines are highlighted, and their impact on the overall printing process output are discussed.
Finally, new information from current research projects, if available, will be presented.
Course Outline
Session 1, August 8, 2017
1. Stencil Verification
1.1. SPI verification
1.2. Test coupons
1.3. SEM images
1.4. Cleaning before using
2. Stencil Troubleshooting
2.1. Physical damage
2.2. Foil thickness
2.3. Aperture size
2.4. Aperture location
2.5. Impact on AR & TE
2.6. Cut Quality
3. Underwiping
3.1. Purpose and methods
3.2. UV Test results
3.3. Solvent requirements
3.4. Solvent compatibility with solder pastes
3.5. Solvent and paper compatibility with nanocoatings
Session 2, August 10, 2017
4. Automated Solder Paste Inspection (SPI)
4.1. SPI basics
4.2. Production implementation
4.3. Setting inspection tolerances
4.4. Improving print yields
4.5. Accuracy and Repeatability
4.6. Reference planes and measurement thresholds
4.7. Special features to improve performance
Who Should Attend
About the presenter:
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.
Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.
SMT Processes Certification (Portland, OR) +
Portland , OR
Instruction: English
Test: English
Instructor: Jim Hall, ITM Consulting
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.
This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.
Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
SMT Processes Certification (Guadalajara, Mexico) +
Flex : North Plant
Zapopan , JA Mexico
Instruction: Spanish/English
Test: English
Instructor: Iván Castellanos, Indium Corporation
Flex : North Plant
Carretera Base Aérea # 5850, Building # 4
Meeting room. Multimedia/Maya
Colonia La Mora, Zapopan, Jalisco 45136
México
SMTA China South Technology and Vendor Conferences 2017 +
Shenzhen Convention & Exhibition Center
Shenzhen China
Technology Conference: 28-31 August 2017
Vendor Conference: 29-31 August 2017
Shenzhen Convention & Exhibition Center, Shenzhen, PR China
The SMTA China cordially invites you to participate in SMTA China South Conference located in Shenzhen 2017. This event, held in conjunction with NEPCON China 2017, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.
SMTA International 2017 +
Donald E Stephens Convention Center
Rosemont , IL
Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, and Quality and Reliability.
SMT Processes Certification (SMTA International 2017 - Rosemont, IL) +
Donald Stephens Convention Center
Rosemont , IL
Co-located with SMTA International Conference.
Instruction: English
Test: English
Instructor: Jim Hall, ITM Consulting
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.
This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.
Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
SMTA International Electronics Exhibition +
Rosemont, IL
SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.
Penang Expo +
1 Solok Bayan Indah, Queensbay
11900 Bayan Lepas
Penang
Please see the Penang Chapter Page for More Information on Technical Sessions and Expo Materials.
Please see the Penang Chapter Page for More Information on Technical Sessions and Expo Materials.
Austin (CTEA) Expo & Tech Forum +
2525 West Anderson Lane
#365
Austin, TX 78757
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15th, 2017!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:
Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
Exhibit Hours:
Tuesday, October 10th, 2017
10:00AM–3:00PM
8:30AM
Registration Opens
Refreshments Available
9:00AM-9:30AM
Enabling Smart & Connected Devices Via IoT
Tom Pannell, Sr. Director of Marketing, Silicon Labs
The Internet of Things (IoT) is viewed by many as the next big thing. Connecting every day “things” in our homes, offices, cars, factories, and cities to the Internet will improve our lives and transform industries. The IoT market could exceed 70 billion devices by 2025, but several obstacles remain in achieving the market’s full potential. Tom Pannell, Senior Director of IoT Marketing at Silicon Labs, will explore what it will take to accelerate the promise of IoT. The presentation will consider the business and engineering challenges of adding connectivity to electronic devices, including cost, ease of use, energy efficiency, interoperability, future extensibility, and security. Addressing these challenges will unleash the limitless possibilities of a more connected world.
9:30AM–10:00AM
Engineering for Humankind - Bold Predictions for 2018 & Beyond
Tom Ortman, President & CEO, Concurrent Design
Mr. Ortman is president of Concurrent Design, a high technology engineering firm, with a focus on emerging technologies which benefit society including: electronics, semiconductors, clean tech, and medical devices. Concurrent Design serves as a bridge from the science in the R&D lab, through engineering development, and out through manufacturing to the mass commercialization of these technologies. It is the nature of this business to see very early stage technologies, and hopefully to help nurture and incubate them. One of Mr. Ortman’s pleasures is the contemplative aspect of exploring technology ideas to their natural conclusion. Based upon the work at Concurrent Design, Mr. Ortman will share his thoughts on some bold ideas to benefit humankind as we look into the near future.
10:00AM
Expo Hall Opens
11:00AM–11:30AM
Austin’s MEMS & Sensors Industry - Days of Disruption, Market Creation, and Industry Growth
Brent Lunceford, President, Memstronics
Austin’s MEMS (Micro-Electro-Mechanical Systems) & Sensors industry started with joint ventures between the Microelectronics and Computer Technology Corporation (known as MCC), IBM, and Raytheon in the late 1990s as a response to the rapidly burgeoning field of ultra-miniature 3D electronics technology. Other companies and universities soon became involved, including Cypress Semiconductor, Texas Instruments, 3M, Kodak, Rockwell, Lockheed Martin, Harris Corporation, Hughes Research Labs, UCLA, UC Berkeley, and the University of Texas at Austin. In 2000, MCC established Austin’s first MEMS company, and today, the Central Texas region benefits from numerous companies that make up the regional industry. MEMS & Sensors are key enabling technologies for products such as smart phones, industrial automation systems, IoT systems, autonomous vehicles, wearable electronics, drones, robotics, oil and gas telemetry, and biomedical and health informatics products. This presentation will cover the history of Austin’s strategic innovation in MEMS, its market creation, its growth across broad industries, and future opportunities for these technologies.
12:00PM–1:00PM
COMPLIMENTARY LUNCH!
Special Thanks to Our Lunch Sponsor: NPI Technologies 
1:00PM
Door Prize Drawing and More Networking
1:30PM–2:00PM
Solder Joint Quality and High Reliability Solder Alloys for Automotive and Critical High Reliability Assemblies
Frank Andres, Customer Tech Support Mgr, Alpha Assembly
Highly reliable soldering alloys are becoming increasingly important to multiple segments of the electronics industry including automotive, medical, and military. Exactly what constitutes a highly reliable alloy is dependent on the environment the finished assembly will perform in. While the alloy is important, understanding its interaction with the soldering process is critical to making sure a quality solder joint is formed. This presentation will discuss the role of alloy, flux, metallization, and intermetallic formation. Additionally, it will look at the requirements in the industry for assemblies operating in environments outside the SAC305 range.
3:00PM
Expo Closes
SMTA Webinar: Advances in Stencil Technology for Achieving Successful Printing Results +
Oct 11, 2017
1:00pm-2:00pm Eastern
Presented by: Chrys Shea Shea Engineering Services
Complimentary Webinar for Members!
Summary:
ALL NEW! Fresh from the most recently published research, Chrys is bringing the latest knowledge in stencil printing to address important questions from the users’ perspective: • How does nanocoating help the print process? Is it worth the cost? • Will high tension stencils improve print quality? • When should Type 5 solder paste be considered for fine feature printing? • What’s the difference between wet wiping and dry wiping? • Do wiper parameters, papers, solvents and sequences make a big difference? • What are the new methods of making stepped stencils? • What is the role of wall roughness in the print process? • What is the easiest way to minimize QFN voids? Join this presentation to: • REVIEW the data • SEE the photos • WATCH the videos • LISTEN for tips and tricks that will help your process If you couldn’t get to the SMTA International or IPC APEX conferences, the latest published research is coming to you! Highlights of technical studies published by AIM, KYZEN, Shea Engineering Services, MET, FCT, and a 4-company New England consortium will be included in the presentation.
About the Presenters:
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA "Member of Technical Distinction" award.
Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.
SMT Processes Certification (Guadalajara, Mexico) +
Location
Guadalajara , JA Mexico
Co-located with Guadalajara Expo.
Instruction: English
Test: English
Instructor: Jim Hall, ITM Consulting
Guadalajara Expo & Tech Forum +
Guadalajara
Please see the Guadalajara Chapter Page for More Information on Expo Materials.
Please see the Guadalajara Chapter Page for More Information on Technical Sessions.
Here is a recap of the 2015 event:
Long Island Expo & Tech Forum +
1350 Walt Whitman Road
Melville, NY 11747
Please contact Sharon Dietrich with questions or for additional information.
Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.
Intermountain Utah Expo & Tech Forum +
A. Ray Olpin University Union - Saltair Room
200 S Central Campus Drive
Salt Lake City, UT 84112
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 29th, 2017!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:
Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Thursday, October 19, 2017
10:00AM–3:00PM
Free Technical Program & Schedule:
8:00AM
Registration opens
9:00AM – 9:45AM
It All Starts with the Stencil
Speaker: Kevin Buckner, KYZEN
Because the majority of printing problems start at the printer level, we will discuss solder paste release, slumping of the solder block, solder balls being left in apertures and over pumping. Also, we will examine multiple ways to clean stencils and their apertures with different types of mechanical energy and different chemistries, including solvent and aqueous solutions. By attending this presentation, you will learn how small changes to process can yield big rewards in production.
10:00AM
Expo Opens
11:00AM – 11:45AM
Water, Water, Everywhere: Understanding the tremendous damage that moisture causes to electronic components, how to control it, and what FA equipment do we use to analyze it.
Speaker: Steve Greathouse, Plexus Corp.
Moisture is everywhere and is essential for life to exist. However, it is an unwanted partner in the assembly of electronic products. It is truly amazing to see the severe damage done by moisture to electronic components and boards during the manufacturing process. The sad thing is that most engineers, technicians, and operators don’t see the damage until it is overwhelmingly bad. How do you know how to tell when a part is moisture sensitive, how sensitive it is, how to control its exposure and moisture saturation, and how to protect against it damage will be a significant part of this presentation.
What types of equipment is used to detect these and other failures in products? A discussion of the different types of failure analysis equipment available, what data will it give you, and how to select the right type of equipment to get the results you want will be given.
12:00PM
Complimentary Lunch
1:00PM - 1:45pm
Electronic Manufacturing Trends and Outlook
Speaker: Patrick Ryan, Ryan Technical Services
After several years of lackluster growth, 2017 is rebounding with diversified growth in many of the key indicator markets. This paper looks at the key drivers and electronic market trends going forward. We will also look at macro-electronic packaging trends along with some consumer electronics trends driving consumer demand.
2:00PM - 2:45pm
Understanding SIR
Speaker: Joe Bahou, Indium Corporation
Surface Insulation Resistance (SIR) testing is a commonly accepted means of determining the electrical reliability and corrosive nature of a solder flux residue. This presentation will discuss the basic process and principles of Surface Insulation Resistance (SIR) testing as prescribed by the IPC. It will also give a brief overview and comparison of the changes in SIR testing between J-STD-004A and J-STD-004B as well as the pros and cons of each method.
2:45PM
Tour of Materials Characterization Lab
Dr. Sean Clancy, Associate Director & Program Manager of the Materials Characterization Lab (MCL), will provide a tour of the MCL, a user research facility managed by the Materials Science and Engineering (MSE) Department at the University of Utah. The lab offers clients access to a wide-range of analytical instrumentation and services, including: Cross-Sectioning, DSC, FTIR, Instron mechanical testing, SEM-EDS, XRD, and much more. The MCL has an extensive history of successful collaborations with academia, government, and industry clients ranging from start-ups to multinational corporations in the aerospace, automotive, coatings, geochemical, medical, semiconductor, and other markets. MSE faculty and staff serve as resources in the following areas of specialization: bio-fuel cells, ceramics, composites, computational electronic materials and polymers, electronic materials and assemblies, explosive sensing, nanomaterials, nanotechnology, and more. Additional information is available at https://mcl.mse.utah.edu/.
3:00PM
Expo Closes
International Wafer-Level Packaging Conference Exhibition +
2050 Gateway Place
San Jose, CA 95110
Sponsorship and Exhibitor Information
Booths are sold out!
Contact Jenny Ng, iwlpc@iwlpc.com or 952-920-7682, to be put on a waitlist.
View all sponsorship and exhibition opportunities.
Dates: October 24-25, 2017
Location: DoubleTree by Hilton Hotel, San Jose, CA
Exhibits Move-In
Monday, October 23 from 12:00pm-5:00pm
Expo Hours
Tuesday, October 24 from 10:00am-4:15pm | Reception 4:15pm-5:30pm
Wednesday, October 25 from 9:30am-2:30pm
Exhibits Move-Out
Wednesday, October 25 from 2:30pm-6:30pm
Why Exhibit at IWLPC?
* Reach a focused international audience* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
What type of attendees will be there?
Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
What's Included?
8'x10' Pipe & Drape inside exhibit hall (a table & two chairs are provided)
OR
6ft table-top outside exhibit hall/foyer (NO pipe & drape, ONLY a table and two chairs)
Click here to view the floor plan!
Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.
SMTA Webtorial: Solder Joint Voids- All You Should Know +
Two (2) 90 minute Sessions
Nov 1 and 2, 2017
1:00pm to 2:30pm Eastern
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group
Overview:
With the goal to produce reliable products while achieving high yield production, this webtorial provides a holistic overview on solder joint voids. Four fronts in the industry have rekindled the interest and/or concerns about solder joint voids – the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics comprising “delicate” solder joints; and the increased demand in solder joint reliability for high performance and high reliability products. Different sources of solder joint voids, their respective causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance, and the steps to minimize solder joint voids of both the array solder ball solder joints (e.g., PoP, BGA, CSP) and lead-frame solder joints (e.g., QFP, BTC) will be outlined. The webtorial will conclude with the source of voids that is most critical to reliability, thus to avoid.
Course Outline:
Part 1
Part 2
Who Should Attend:
The webtorial provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.
Bio:
Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge to this webtorial through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to high reliability issues. Her work covers both commercial and military applications. She has 475+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker at innumerable international and national events. Dr. Hwang has received many honors and awards. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory, and on the National Institute of Standards and Technology (NIST) Assessment Committee, National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University's Board of Trustees.
LA/Orange County Expo & Tech Forum +
4101 E Willow Street
Long Beach, CA 90815
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 6th, 2017!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:
Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Thursday, November 2, 2017
10:00AM–3:00PM
9:00AM
Registration opens
10:00AM
Expo Opens
11:00AM–11:30AM
Thermal Imaging for R&D and PCB Inspections
Tony Shockey, Applications Development Manager, Fluke Corporation
"Our world in infrared, what it appears to be and where it can be used." This presentation will cover applications, tips, and tricks to help use thermal imaging technology most effectively for PCBA inspection and trouble shooting.
11:45AM–12:45PM
Complimentary lunch!
1:00PM–1:30PM
Unforgiving Environments - Proper Handling & Storage Controls Go a Long Way Toward Print Quality
Timothy O'Neill, Technical Marketing Manager, AIM Solder
Solder paste is the foundation of SMT assembly process and the importance of consistent paste performance cannot be overstated. This presentation explains the basics of how a solder paste formula is developed and manufactured and how the end user can optimize handling and usage to maximize performance, reduce defects and minimize waste.
2:00PM–2:30PM
Effective Cleaning Approaches for Southern California Electronics Assemblers
Barbara & Edward Kanegsberg, BFK Solutions
The best way to clean electronics assemblies depends on the flux, the design of the assembly, and on your customer requirements. Not cleaning or cleaning with water alone is not always the right approach. Cleaning process options have changed over the past few months; there are new cleaning agents and new cleaning equipment. We will tell you about the advantages and problems of new and familiar cleaning agents. We’ll get you up to speed on cleaning agents that are allowed or even encouraged by regulators and on some cleaners that may be banned, locally and at the National level. We will also answer your questions about cleaning process effectiveness, regulatory requirements, and process costs.
2:30PM
Raffle on Show Floor!
3:00PM
Expo Closes
productronica 2017 +
Location
Munich Germany
This year SMTA hosts a two-day program of technical presentations on Wednesday and Thursday. Topics include harsh environments applications, HDI, substrate advances, photonics, and reliability issues. Come to learn about cutting-edge research from Bosch, Cisco, Fraunhofer, iNEMI, and RIT, among others.
productronica, the world's leading trade show for electronics development and production, underlines its reputation as the innovation platform with a plethora of related events. Prominent speakers, hands-on sessions as well as special shows promise a variety of learning and networking opportunities on top of the over 1,200 exhibitors.
SMTA Technical Program in the SMT Speakers Corner (A1.220) in Hall A1
| Wednesday 15.11.17 | ||
| Time | Title | Speaker |
| 13:00 | Modular Power Electronics, Realized by PCB Embedding Technology | Lars Boettcher, Fraunhofer IZM Berlin |
| 13:30 | Leti's Future Outlook of Hot Topics | Didier Louis, CEA/Leti |
| 14:00 | HDI-Technology for Harsh Environment Electronics Based on LTCC Substrates | Jens Mueller, Ph.D., Ilmenau University of Technology |
| 14:30 | Via-in-Pad Plated Over (VIPPO) Design Considerations for the Mitigation of a Unique Solder Separation Failure Mode | Scott Priore, Cisco Systems |
| 15:00 | Risk for Ceramic Component Cracking Dependent on Solder Alloy and Thermo-mechanical Stress | Jorg Trodler, Heraeus Deutschland |
| Thursday 16.11.17 | ||
| Time | Title | Speaker |
| 13:00 | CT Technology Advances Imaging Microelectronics to Assembled Products | Keith Bryant, Yxlon International |
| 13:30 | Advanced Substrates: Technology Shifts Lead to Changing Landscapes | Andrej Ivankovic, Ph.D., Yole Developpement |
| 14:00 | The Future of Photonics Integration Packaging - Is Mass Production Possible? | Martin Anselm, Ph.D., Rochester Institute of Technology |
| 14:30 | TBD | Bill Bader, iNEMI |
| 15:00 | Utilization of the IPC B52 Test Board Platform for Release in the Automotive Industry | Lothar Henneken, Ph.D., Bosch |
Co-located with Semicon Europa
SMTA Webtorial: Reflow - Understanding the Complete Process & Defect Prevention +
Two (2) 90 minute Sessions
November 14 and 16, 2017
12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
Presented by: Bob Willis, bobwillis.co.uk
Overview:
The session includes solder paste testing, different reflow methods, reliable solder joint formation on high and low temperature and causes and cures of most common failures. Here we examine the most common process issues seen in the industry and how design, board selection and process materials can cause issues in manufacture. We look at the fundamentals of reflow with convection and vapour phase to understand the cause of failures
With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses of most reflow issues see in industry. Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. Each delegate registered on the webinar will receive a free set of wall charts on reflow soldering and temperature profiling
If you have a specific process problems with reflow send it to Bob to include in the webinar.
Topics will include:
Bio:
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division.
As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production.
Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection
Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck
In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA
SMT Processes Certification (Dallas, TX) +
Verion Training Systems
Dallas , TX 75244
Instruction: English
Test: English
Instructor: Jim Hall, ITM Consulting
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.
This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.
Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
New England Expo & Tech Forum +
50 Forester Street
Worcester, MA 01608
All booths are 10'x10'. All spaces come with 1 6' draped table and 2 chairs. Attendee list will be emailed 1 week after show is complete. All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up.
Please contact Mark Siems to register for a table or for additional questions!
Please see the Connecticut Chapter Page for More Information on Technical Sessions and Expo Materials.
LED Assembly, Reliability & Testing Symposium 2017 +
The Archie K. Davis Conference Center
Research Triangle Park , NC 27709
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium at the The Archie K. Davis Conference Center in Research Triangle Park, NC from November 28 to 30, 2017.
The LED Assembly, Reliability & Testing (A.R.T.) Symposium will provide attendees with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.
Keynote Speakers Announced!
Keynote Day 1:
Ralph Tuttle, Engineering Manager, Cree
Topic: High Power LED Solder Joint Reliability
Tuesday, November 28, 2017 | 8:45 am
Keynote Day 2:
Warren Weeks, Director of Quality & Technical Services, Hubbell Lighting
Topic: Assembly, Reliability, and Testing (A.R.T.) of LED Luminaires
Wednesday, November 29, 2017 | 8:30 am
Technical Program Finalized!
View the program featuring research on:
View the program
Workshops on November 30:
| Time | Topic | Instructor |
| 8:30am - 12:00pm | Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Mode | Martine Simard-Normandin, Ph.D. MuAnalysis Inc. |
| 1:30pm - 5:00pm | Failure Mechanisms and Qualification Tests for LEDs | Diganta Das, Ph.D. CALCE University of Maryland |
Facility Tour
North Carolina State University
Nanofabrication Facility & FREEDM Systems Center
Wednesday, November 29
The tour is free to attend, just select the option when you register or stop by the registration desk!
3:30pm – NCSU Nanofabrication Facility (NNF)
2410 Campus Shore Drive, Raleigh, NC 27606
4:15pm – FREEDM Tour
Suite 100, Keystone Science Center (Centennial Campus)
1791 Varsity Drive, Raleigh, NC 27606
NCSU Nanofabrication Facility
The NCSU Nanofabrication Facility (NNF) provides access to semiconductor processing tools to researchers from academia, government labs, and industry. A full range of micro and nano-fabrication capabilities including lithography, plasma etching, metallization, and metrology are available at the NNF.
FREEDM Systems Center
At the FREEDM Center, we're building the internet of energy: a network of distributed energy resources that intelligently manages power using secure communications and advanced power electronics. Our research priorities include power electronics packaging, controls theory, solid state transformers, fault isolation devices, and power systems simulation and demonstration.
Stop by the registration desk to sign up. You are responsible for your own transportation. Visitor parking for NC State on North, Central and Centennial Campus is available for $2.00 per hour in the pay lots which accept MasterCard, Visa, Discover and American Express. Cash is not accepted.
LED Assembly, Reliability & Testing Exhibition +
12 Davis Drive
Research Triangle Park, NC 27709
Exhibitor Information:
Register to exhibit by October 30th. Prices will increase after that date!
At the LED A.R.T. Symposium and Exhibition you will network with Assembly/Packaging Engineers, Corporate/General Management, Test Engineers, Designers, Buyers, R&D Engineers, and more.
Download the brochure for details.
Cost to exhibit:
| Booth type | CALCE/SMTA Members | Non-Members |
| One table includes access to Electrical Outlet | $750 | $850 |
| One table no access to Electrical Outlet | $700 | $800 |
Sponsorship Opportunities:
Lanyard Sponsor: $400/$800
Bag Sponsor: $400/$800
Lunch Sponsors: $800
Refreshment Break Sponsorships: $550
Venue Address:
Archie K. Davis Conference Center
12 Davis Drive
Research Triangle Park, NC 27709 USA
Table space includes:
SETUP and TEAR DOWN
Tuesday, November 287:30am-8:30am
Archie Davis Conference Center
Boxes will be delivered to Archie Davis Conference Center.
Show Hours:
November 28: 9:30am-4:00pm
November 29: 9:30am–3:30pm
Dismantle:
By end of Conference
SHIPPING INFORMATION
Please address all packages as follows: LED Symposium/Your Company NameAttn: Jenny Ng, SMTA
Archie Davis Conference Center
12 Davis Drive
RTP, NC 27709, USA
- Make sure your company name is visible
- Due to limited space, please ship packages to arrive no earlier than two days prior to the event.
- Exhibitors will be responsible for packing, labeling and shipping all outgoing materials. Please bring your own packing slips to ship your materials back.
DIRECTIONS
For questions, please contact
Jenny Ng
Conference and Education Manager
952.920.7682
Jenny@smta.org
Exhibit Attendee:
Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.
Come and visit the exhibits for FREE. Plan to network with leading suppliers in the LED component industry. We will provide you with FREE refreshments.
Exhibit Hours:
November 28: 9:30am-4:00pm
November 29: 9:30am–3:30pm
Registration includes free lunch and access to these select presentations on Tuesday:
10:00 AM
Optical Wireless Communication using LEDs for Smart Lighting and IoT
John Muth, North Carolina State University
10:40 AM
High Reliability Solder Alloy for Automotive LED Applications
Jie Geng, Indium Corporation
11:20 AM
Counterfeit LEDs and How to Detect Them
Diganta Das, Ph.D., CALCE/University of Maryland
12:00 PM
Lunch
If you like to attend other sessions register here!
Silicon Valley Expo & Tech Forum +
2243 Lundy Avenue
San Jose, CA 95131
The Silicon Valley Expo & Tech Forum has SOLD OUT! Please contact Kaitlyn to be put on a wait list at kaitlyn@smta.org or call 952-920-7682. Thank you!
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 27th, 2017!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:
Free Technical Program & Schedule:
8:00AM
Registration opens
9:00AM
Expo Opens
9:00AM – 9:45AM
X-Ray Inspections for PCBA - Challenges and New Developments
Speaker: Elbert Suen, Flex
X-ray inspection systems are key tools for quality control, yield enhancement, and failure analysis of advanced printed circuits board assemblies (PCBA). The electronics industry has witnessed significant improvements in the X-ray inspection capabilities (AXI, 2DX, 3D CT, Large Board CT) during the last twenty years. These advancements have aided in the development of new high performance packages and PCBA processes. In many cases, X-Ray inspection is the only non-destructive technique to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, etc. Automated X-Ray inspection (AXI) has been available since 1999 at our manufacturing sites, and plays very important role to assure high quality SMT process. Along the way, manual X-ray systems (2DX and 3D CT) have been providing invaluable testing capabilities for verifying the AXI results, fine tuning the AXI parameters, process development, and X-ray inspection that is out of the scope of the AXI equipment.
Through the years these capabilities have been significantly improved and best practices have been developed on how to jointly use the AXI, 2DX(MXI), and 3D CT X-ray equipment to achieve best possible testing results and speed. In this paper, we will summarise the extensive experience we have accumulated while working on real problems together with our customers, X-ray inspection vendors and R&D teams. These projects include BGA HIP (head in pillow), solder charge connector, Package on Package, package 03015. In addition, we will discuss how to optimize test coverage and eliminate defect escapes during PCBA testing. These studies have been performed using variety of X-ray inspection systems at several production sites and lasted several years.
We will also discuss the X-ray inspection capabilities that are considered most important to the PCBA manufacturing process including: 1. Highest resolution X-ray images and clear distinction between good and defective pins; 2. Measurement data from inspection output; 3. Operator independent automated results for pass/fail condition; 4. Non-destructive e-cross section; 5. Easy and intuitive operation and programing; 6. Real time data feedback; 7. Flexible automated algorithms that are easily adjustable by the machine operator; 8. Zero defect escape with reasonable false call PPM.
11:00AM-11:45AM
SMT-WARS - Lessons Learned from a Contract Manufacturer and Their Customer Who Sued Them
Speaker: Michael Konrad, Aqueous Technologies
What happens when an electronic contract manufacturer follows their customer’s instructions to the detriment of the product? Product failures, blame, drama, and a really big lawsuit.
Mike Konrad will review the trials and tribulations of a contract manufacturer and their customer. Assembly residue-related failures (ECM) contributed to product failures, product recalls, and, ultimately, a multi-million-dollar lawsuit.
Misguided “best practice” techniques only made matters worse. This paper will discuss what factors contributed to the “perfect storm” of product failures. Factors that go as far back to original product designs, printed circuit board fabrication, storage and handling, assembly, testing, and coating. While mistakes were made all along the way, product failures could have been avoided with a few simple process changes, adding mere pennies to the cost of each assembly while saving hundreds of thousands of dollars in litigation.
12:00PM
Complimentary Lunch
1:30PM-2:15PM
Best Practices for Responsible, Efficient Technologies when Outsourcing Design and Manufacturing
Speaker: Pamela J. Gordon, Antea Group
When OEMs outsource product design and manufacturing, many have experienced reduced visibility to environmental compliance, slippage in Eco-Design progress, and compromises in using advanced efficient technologies. It doesn’t have to be this way. By deploying best practices and choosing suppliers well, OEMs can realize greater visibility to product compliance, higher levels of Eco-Design, and adoption of more efficient technologies. Pamela J. Gordon is a 26-year member of the SMTA and has objectively chronicled electronics outsourcing practices since 1984. In this presentation, she will lend her insights on maximizing products’ responsibility, innovation, and efficiency when outsourcing, drawing upon her experience training >1,000 electronic-product designers in meeting environmental regulations, exceeding compliance through Eco-Design, and assessing the latest resource-efficient technologies. OEM participants will gain actionable insights on how to best leverage their outsourcing suppliers, and outsourcing suppliers will have a roadmap for being the supplier of choice for providing OEMs with responsible and advanced products.
2:30PM-3:30PM
Reception
2:45PM
Tour of Bestronics Facility
3:00PM
Expo Closes
SMTA Webtorial: X-Ray Inspection of PCBs +
Two (2) 90 minute Sessions
December 6 and 13, 2017
1:00pm to 2:30pm Eastern
Presented by: Kamran Iqbal, Nikon Metrology and Bob Wetterman, BEST
Overview:
This webinar series will focus on the x-ray inspection of printed circuit boards. This seminar will be taught by two subject matter experts, one coming from the vantage point of inspection as part of being a service provider and the other from an x-ray researcher who will come at the discussion from an imaging and machine capability standpoint.
With the ever increasing trend towards miniaturization and the use of components with non-visual inspect able criteria, x-ray as QC tool is becoming a necessity even to the Tier 1 PCBA assembly area. Devices with pads underneath the device such as QFNs, LCCCs and LGAs have become the most placed component body style. Without x-ray the inspection and quality inspection cannot be made. Couple this to other devices such as traditional BGAs and ever finer-pitch connectors and the need for x-ray imaging augmenting optical inspection is getting to be a necessity. Even older throughhole devices, with lead-free solders and large thermal masses will test the ability to create proper hole fill. Verification of this hole fill becomes increasingly necessary.
This webinar series will have the following overarching goals:
Who Should Attend:
Bios:
Kamran Iqbal is currently a product manager with Nikon Metrology having experience with Nordson/Dage and Goepel Eectronics He also has experience in the automotive, medical and defense industries. He has extensive applications experience within the semiconductor industry, device packaging, SMT, Manufacturing, test and inspection. He holds both a bachelors and masters degree in engineering from the University of Bradford.
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.