Calendar of Events

2016         

                                   

2016

January 21

SMTA Webinar: Key Technical Challenges and Process Improvements for an Electronics Manufacturing Provider  +


Thursday, January 21, 2016
1:00pm to 2:30pm Eastern
Presented by: Bob Farrell, Benchmark Electronics

Overview: This webinar summarizes key technical challenges and process improvements for an Electronics Manufacturing Service (EMS) provider. The topics encompass SnPb assembly, hybrid assembly (Pb-free Ball Grid Array on a SnPb assembly), and Pb-free assembly for IPC Class 2 and 3 assemblies using no clean and water soluble chemistries. Assemblies include large, thick, heavy boards that are thermally disparate.

Instructor Bio:
Bob Farrell has a Bachelors of Science in Mechanical Engineering from Union College, a Masters of Science in Mechanical Engineering from Worcester Polytechnic Institute, and a graduate nanotechnology certificate from the University of Massachusetts Lowell. He is an advanced development engineer and has been on the Benchmark Electronics corporate Pb-free team from 2003 to the present and has provided on site support to a number of Benchmark manufacturing facilities as they converted to Pb-free manufacturing. Bob has been an active member of the New England Lead Free Electronics consortium from 2004 until the present and has worked closely with the Center for Advanced Life Cycle Engineering (CALCE) based at the University of Maryland on a number of projects including PoP's, alternative Pb-free alloys, and a nanotechnology based printed circuit board finish. He has extensive experience developing SnPb and Pb-free rework processes for through hole and BGA components. Bob is a co-author of Chapter 6 of the book "Green Electronics Design and Manufacturing" by Dr Sammy Shina and he has made a number of technical presentations at IPC, IMAPS, SMTA, and CALCE conferences.


January 25 - 28

Pan Pacific Microelectronics Symposium 2016  +

Location
Hapuna Beach Prince Resort
Big Island , HI 96743


The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.


January 27 & 28

SMTA Webtorial: Solder Joint Voids: All You Should Know  +


Two (2) 90 minute Sessions
Wednesday, January 27, 2016 and Thursday, January 28, 2016
1:00pm to 2:30pm Eastern
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group

Overview:
Four fronts in the industry have rekindled the interest and concerns about solder joint voids - the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics containing "smaller" solder joints; and the increased demand in solder joint reliability for high reliability products. Different types of solder joint voids, their causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance will be outlined. The webtorial will conclude with the steps to minimize solder joint voids of both the BGA (array solder ball) solder joints and lead-frame solder joints.

Main topics:

Part 1

  • Potential effects
  • Likely impact on Reliability
  • Case studies
  • Different Sources
  • Factors contributing to each of the sources
  • Role of solder alloy composition

    Part 2

  • Mitigating approaches
  • BGA voiding - additional factors
  • BTC solder joint voids
  • Voids criteria vs. applications
  • Inspection
  • Summary & recommendations

    Who should Attend:
    The webtorial provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

    About the Speaker:
    Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge to this webtorial through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications. She has 450+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker at innumerable international and national events. Dr. Hwang has received many honors and awards. She has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory, and on the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.


  • February 9 & 16

    SMTA Webtorial: Printed Circuit Board Failures-Causes and Cures  +


    Two (2) 90 minute Sessions
    Tuesday, February 9 and Tuesday, February 16, 2016

    12:00pm-1:30pm Eastern
    Presented by: Bob Willis, Bobwillisonline.com

    Overview:
    The printed circuit board is the building block of any electronic assembly and as such must exceed specification and be totally compatible with the assembly processes used in modern assembly. Failures in PCBs can be cosmetic, often the most common reason for rejection in manufacture or assembly. Failures can be found during assembly and final test which are not ideal but much better than field returns. Bob will provide a set of posters on common process problems for use in your factory for training.

    If you have a specific PCB failure you would like to Bob to cover in his webinar send him an email and image to bobwillis@smta.org

    PCB Failures

    In his presentation Bob will highlight test methods you can try and tricks of the trade to understand how PCBs can fail and how to eliminate many of the common causes. After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides is sent to each delegate after the webinar.

    PCB Failures

    Selected topics covered in the webinar:

  • What and how to test boards for different failure
  • Common PCB failure survey
  • Through hole plating failures
  • CAF contamination shorts
  • PCB Delamination
  • Baking boards the issues
  • Nickel/Gold – Black pad & Black Tar
  • Inner layer separation
  • Solder mask cracking
  • Solderability

    Bob Willis Instructor Bio:
    Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Group Technical Committee. Although a specialist for companies implementing surface mount and area array technology Mr Willis has provided training and consultancy in most areas of electronic manufacture for over 30 years.


  • February 12

    Michigan Advanced SMT Chapter Tutorial Program & Member Appreciation Event  +

    Enabling Implementation of Advanced Technologies

    Location
    Oak Pointe Country Club
    Brighton , MI 48116





    Instructor: Denis Barbini, Universal Instruments

    February 12, 2016
    Tutorial Program: 9:00 a.m. - 4:30 p.m. (Registration at 8:30 a.m. Lunch is included)
    Optional Happy Hour: 4:30-7:00 p.m.
    Oak Pointe Country Club
    4500 Club Drive
    Brighton, MI 48116
    (810) 229-4554



    Incredible Value! A fraction of the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Only 100 attendees allowed. Register now to guarantee a spot!

    Price:

    SPECIAL OFFER! The Michigan Chapter will subsidize over half the cost of registration for all attendees.

    Members: $75
    Regularly $200

    Non-Members: $150
    Regularly $275
    A one-year Individual SMTA Membership is included in the non-member price.

    Michigan Chapter Officers: FREE
    Regularly $100

    Student Chapter Members: FREE
    Regularly $50

    Student Non-Members: $25
    Regularly $55
    A one-year Student SMTA Membership is included in the non-member price.

    Membership Appreciation Happy Hour

    As a special appreciation to our loyal members, please plan to stay for our Membership Appreciation Happy Hour! Enjoy appetizers and complimentary tickets for cocktails courtesy of the Michigan Chapter from 4:30-7:00 p.m.

    Any Michigan SMTA MEMBER is welcome to stop by for this gathering. Only Tutorial Attendees receive complimentary drink tickets. Contact Karen Frericks at 952-920-7682 with questions.

    About the Tutorial

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers

    About the Instructor:


    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.



  • February 19 - 22

    2016 SMTA Chapter Officer's Leadership Forum  +

    Location
    Westin Dallas Fort Worth Airport Hotel
    Irving , TX 75063


    SMTA Officer Leadership FORUM 2016
    The Next Generation

    The 10th SMTA Chapter Officer's Leadership FORUM was a HUGE success! Thank you to all of the chapters officers, board members, and staff who helped to make it such a memorable weekend!

    View a scrapbook of the event here

    You will learn to:
    Develop leadership skills, learn from focused breakout sessions, network with your peers and move forward with enthusiasm and confidence as effective leaders in your career, community, and as an SMTA leader.

    View Full Agenda Here
    View Full Agenda Here

    DRESS CODE: The FORUM weekend dress code is casual.

    Funding & Sponsorships

    $ FUNDING $

    The SMTA Officer’s Leadership Forum is free for all officers. The SMTA will cover two hotel rooms for two nights (4 total room nights) for officers from your chapter. International chapters are covered for two rooms for three nights (6 total room nights.) If your chapter requires more than the allotted hotel room nights, those charges will be at your own or your chapter’s expense. Rooms at the hotel are at a negotiated rate of $94 plus taxes ($108.10) per night. The hotel will charge your credit card for additional room nights upon check-in. Your credit card will also be charged by the hotel after the program for any incidental charges not covered by the SMTA (for example, gift shop charges or minibar use). Rooms are double occupancy. If you are traveling with another officer and are comfortable sharing a room, please indicate your desire on the registration form or online registration site. Sharing rooms is encouraged by the SMTA to save costs.

    Each officer (chapter) is responsible for his or her travel expenses. We hope that your employers understand the value of the benefits of SMTA membership and will support your trip. If not, Forum expenses are acceptable chapter expense items within the SMTA and Chapter Bylaws. Make all room reservations through Karen Frericks (do not go directly to the hotel) and purchase your travel tickets early. If it is impossible for your company or chapter to fund travel expenses, ask Karen (karenchapters@smta.org or 952.920.7682) about our financing assistance. We want to work with you to ensure that all chapters are represented.

    HELP THE SMTA GROW

    Because we are moving the Forum to Dallas this year, the SMTA is in great need of financial assistance from chapters. Please consider becoming a sponsor and “Help the SMTA Grow."

    SPONSORSHIPS AVAILABLE

    Chapter Sponsors: $100 - $1000+ (multiple sponsors)
    Any amount is welcome! Help officers from international, student, and domestic chapters to attend. Please help us support those chapters whose treasuries are insufficient to send anyone to Dallas. We want to have 100% representation from all chapters – you can help us make that happen! Contact Karen to find out more about which chapters are in need. You can direct your contribution toward a particular chapter or just donate it wherever it will do the most good.

    Facility Tour Sponsor: $1500 (1 sponsorship)
    Help us provide a bus to take interested officers to Texas Instruments

    WELCOME RECEPTION Sponsor: $350 (multiple sponsors)

    Texas Star Dinner Theater Sponsors:

  • Sponsor a Table at the Theater for your chapter - $200 (multiple sponsors)
  • Sponsor transportation to the theater - $1500 (1 sponsorship)
  • Cocktail Reception Sponsor - $750 (2 sponsorships)
    Your chapter name will appear on one round of drink tickets at the event
  • All FORUM Sponsors will be introduced at the Welcome Reception, receive verbal recognition and signage recognizing the sponsors during the event to show our appreciation of your chapter’s support of your peers.

    We have a great program designed for all officers and all chapters. The paramount experience at the FORUM will be “Networking with Peers”. You have a wealth of knowledge and experience to pass on to other leaders. Please make attending the Forum happen for other chapter officers, and help us bring this quality of entertainment and learning to everyone. Your generosity will be greatly appreciated by chapters, officers, and the SMTA. Please coordinate your sponsorships through the SMTA with Karen. Thank you very much.

    Logistics: Hotel, Travel & Events

    HOTEL MEETING SITE – Reservation Information

    Westin Dallas/Fort Worth Airport Hotel
    4545 W. John Carpenter Fwy.
    Irving, TX 75063
    www.westindallasfortworthairport.com

    Make all your hotel reservations through KAREN FRERICKS at SMTA, including any additional rooms needed by your chapter. SMTA will pay for two rooms for two nights (four total room nights) per chapter. The Westin will bill your credit card for any additional room nights. Complete the Hotel Reservation information on your Registration form or at the online registration site. Feel free to call Karen (952-920-7682) if you have questions about hotel reservations.

    TRAVEL ARRANGEMENTS – Reservation Information

    If you plan to attend the 2016 Chapter Officer Leadership Forum, SMTA requests that you attend the Welcome Reception Friday, February 19, at 7:00 p.m. and be present at all sessions until Sunday, February 21, at 12:00 noon. Please do not make airline reservations earlier than a 2:00 p.m. departure on Sunday. If you are staying for the Tactical Problem Solving Session on Sunday, you can make your departure arrangements any time after 6:00 p.m. on Sunday or anytime on Monday.

    AIRPORT SHUTTLE INFORMATION: The Westin Dallas Fort Worth Airport offers guests a free shuttle to and from DFW during their stay. The DFW airport has 5 separate terminals each with multiple pick up locations. For this reason each guest must call the hotel for a shuttle pick up once they have their bags. The hotel will need the terminal and gate information then they can provide instructions on where to wait for the shuttle. Once a shuttle is dispatched, please anticipate to wait up to 25 minutes due to the size of the Airport and the traffic congestion.

    SPECIAL EVENTS & SOCIAL ACTIVITIES

    Facility Tour (optional)

    Friday, February 19th

    The Dallas SMTA Chapter is graciously coordinating a Facility Tour offered to the first 50 people to register. On Friday, Feb 19th, 2016 at 2:30pm you will have the rare opportunity to get a first-hand look at Texas Instruments' premier Analog Semiconductor Wafer Fab named RFAB. Here are just a few things that you will see during the 45 minute tour. RFAB Facility

  • History of RFAB and examples of products they build
  • Architectural elements of the LEED certified buildings
  • Overview of the semiconductor process
  • Structural makeup of a wafer fab cleanroom
  • Window tour of the 220,000-square-foot ISO Class 100 turbulent clean room

    For more information on this amazing facility, please click here.

    For your planning purposes, the bus to TI will depart from the Westin lobby at 1:30 p.m. Expect to return by 4:15 p.m.

    IMPORTANT: Complete the Facility Tour/Open House part of the online RSVP system if attending.

    Blast Off! Welcome & Networking Reception:

    February 19, 7pm

    Unleash your inner geek and get ready to blast off into “The Next Generation” at this evening’s Welcome & Networking Reception. This evening will feature some time for you to re-connect with old friends and make new ones, along with introductions of the Board of Directors, and SMTA Staff. Come prepared with some success stories you can share with other chapters. Also be sure to get your picture taken in our photo booth area, so future generations can see all the fun that was the 2016 Chapter Officer’s Leadership Forum in 2016!

    Leadership Workshop

    Saturday, February 20th

    "The Next Generation"

    Keynote Speaker: Dr. Story Musgrave

    SMTA is providing an outstanding opportunity for you to support your professional development. Our Leadership Workshop Facilitator this year, Dr. Story Musgrave, has an incredible resume as a professional speaker, professor, professional photographer, Walt Disney Fellow, producer, director, writer, performing artist, landscape architect, test pilot, flight instructor, trauma surgeon, emergency room physician, and NASA astronaut. All of this, and he still found time to be a father of seven and grandfather of three! He brings his life experiences from his multi-faceted career into his theory of “massive creativity” and will show you how to apply that to your life as an officer in the SMTA, your career, and your home life. We know the challenges you face and have designed this leadership conference especially for you.



    Breakout Session Topics

    SMTA is preparing individualized learning for you on a variety of topics you want to know about with Breakout Sessions throughout the day on Saturday. You will have the opportunity to choose the Breakout Sessions that interest you the most and tailor it to your current position and needs. We will be offering special Breakout Sessions on a “Space Apprentice Track” for first-time officers.

    Complete schedule coming soon!

  • Meeting Planning
  • Engaging Volunteers
  • Working with Students & Young Professionals
  • Membership
  • Being Überproductive
  • Planning Expos or Special Events
  • Other Suggestions?

    Saturday Evening Activity

    Saturday, February 20

    "Missed Fortune" a Lone Star Murder Mystery
    Texas Star Dinner Theater

    Take a light-hearted trip back to the Old West 1880’s, where laughs fly like bullets and hilarity is the law of the land. When the mystery is solved, justice has prevailed to the cheers and applause of the audience. Lone Star Murder Mysteries are scripted 90 minute, interactive comedy shows. SMTA is taking over the whole theater in this exclusive performance just for us! The show is performed in three acts with an intermission. Following Act Two is an interrogation period where audience members interrogate the suspects in an effort to solve the mystery. A three-course dinner is included. Be sure to indicate your entrée and dessert choices on the registration form.

    Your guests are invited and the cost is $75 (FORUM attendees no charge). Please plan to pay for guest fees upon your arrival at the Friday evening Welcome & Networking Reception. The Texas Star Dinner Theater is a short bus ride away from the Westin. SMTA shuttle will be provided.

    Texas Star Dinner Theater: Where history meets hilarity!



    "Moving into the Next Generation: SMTA in 2016 and Beyond" General Sessions and Officer Breakout Meetings

    Sunday, February 21

    To wrap up all you learned this weekend and to look forward to the future, we have a content-packed General Session for you this morning. Our Chapter Leadership Committee has been hard at work revising our Chapter of the Year program, and will give you an update of their progress. Bring your ideas of how to improve COTY. We’ll also have some other updates from the Board of Directors to let you know their plans for the future of the SMTA.

    Mid-morning will feature some honest dialogue in one final round of Breakout Sessions. You will have a chance to get together with others in your same officer position to talk about obstacles and to strategize on ways to overcome them.

    Finally, we will end up with a short Q&A session with your Board of Directors before we send you out for forge into the future (or DFW Airport) for your departures.



    International Officers Tactical Problem Solving Session

    Sunday, February 21

    We would like to extend a special invitation to our international officers to attend our FORUM weekend. Because of the great distance you are traveling and the investment of your time, we decided to include some special events just for you. After all the domestic officers depart, we are planning a special one-on-one Tactical Problem Solving Session. We ask that you come prepared with any issues that you need help with. At this session, you will be paired with Board Members, SMTA Staff or experienced chapter officers who will work with you, making phone calls, sending emails, whatever it takes to solve your most pressing problems. After a good afternoon’s work, your reward is a special dinner at Love & War in Texas, a unique restaurant and live music haven in Grapevine, TX.

    Thanks to our current chapter sponsors!

    Capital (DC) Chapter

    Carolinas (NC, SC) Chapter

    Central Texas Chapter

    Dallas Chapter

    Empire (NY) Chapter

    Guadalajara Chapter

    Houston Chapter

    Intermountain Chapter

    LA / Orange County Chapter

    Long Island Chapter

    Ohio Valley Chapter

    Oregon Chapter

    Puget Sound Chapter

    Rocky Mountain Chapter


    Silicon Valley Chapter

    Space Coast Chapter

    Upper Midwest Chapter

    Wisconsin Chapter



    Frequently Asked Questions

    1. When should I arrive and depart in Dallas?
    All officers should arrive in time for our “Blast Off!” Welcome Reception on Friday, Feb. 19 at 7:00 p.m. If you plan to attend the optional Facility Tour at Texas Instruments, you need to be at the Westin Hotel in time for the bus which departs at 1:30 p.m. If you are a domestic officer, the conference ends at 12:00 p.m. on Sunday, Feb. 21. Please book your return flights no earlier than a 2:00 p.m. departure. If you are an international officer, the conference ends after dinner Sunday evening. You can book your return flight for anytime the next morning, Feb. 22.

    2. Will I need transportation in Dallas?
    There is a complimentary airport shuttle to get you to the Westin upon arrival. All our events with the exception of the Facility Tour and our fun evening out on Saturday to the Texas Star Dinner Theater will be held at the Westin DFW Airport Hotel. We will have buses to take you to the offsite events. You do not need to arrange for transportation.

    3. Should I reserve a room directly with the Westin DFW?
    No. Please register at http://smta.org/forum/ and let me know how many nights you need at the hotel. I will make all reservations at the Westin by means of a rooming list. If you need to pay for your own hotel room nights, that will be noted on the rooming list. The hotel will charge your credit card upon arrival. If your room is paid by SMTA, it will be applied to our Master Account.

    4. What is my financial responsibility?
    SMTA is taking care of all your food and beverage, training, and entertainment for the duration of the program. We are also paying for 2 rooms for 2 nights for domestic chapters and 2 rooms for 3 nights for international. Sharing a room with another officer is encouraged to save costs. If your chapter requires additional rooms or room nights, those will be charged to your credit card upon arrival. Our contracted room rate is $94 plus tax per night ($108.10 inclusive). We also ask that you pay for your own travel arrangements to get to Dallas. Your first option to obtain reimbursement for your expenses should be your employer. You will receive excellent training that will not only make you a better SMTA officer – it will make you a better employee as well. If reimbursement from your company is not possible, then you should obtain reimbursement from your chapter treasury. Please be sure to consult with your President and Treasurer to decide how many people you can send and how much you can be reimbursed for. If neither option is possible, please contact me. I will try to obtain sponsorship assistance from other chapters. We want to make sure all chapters are able to send at least one representative.

    5. Can I bring a guest?
    Yes. Guests are welcome to attend the Blast Off Welcome Reception on Feb. 19 at no charge. If you would like your guest to attend the performance at the Texas Star Dinner Theater, the cost is $75 per guest. That amount is payable by check or credit card when you arrive. Guests are not invited to any other activities, but the Dallas area boasts lots of great activities that they can enjoy.

    6. What are our sponsorship opportunities?
    Because we are moving the Forum to Dallas this year, the SMTA is in great need of financial assistance from chapters. Please consider becoming a sponsor and “Help the SMTA Grow”. Please see http://smta.org/forum/ for some suggested sponsorship donations, but any amount, directed toward any aspect of the Forum is appreciated.


  • March 1

    Houston Expo & Tech Forum  +

    Location: Stafford Centre
    10505 Cash Road
    Stafford, TX 77477


    Exhibitors

    The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on February 2nd, 2016!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details


  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Free Technical Program & Schedule:

    10:00AM
    Registration opens

    11:00AM-11:45AM
    Mike Bixenman Characterizing Materials at the Component Interface Can Improve Reliability
    Mike Bixenman – Chief Technology Officer, Kyzen Corporation

    Reliability test methods are performed during the Design for Manufacturing phase to validate process conditions, quality and product reliability. Once the process is signed off by the OEM, CMs do not have a simple test method they can use to verify that the product is being built to designed test levels. Ionic testers were commonly used as a process check, but with the emergence of highly dense interconnects and more complex flux designs, this process tool does not provide an accurate assessment. A new site specific test method has been designed to run a performance qualification on boards built with the specified soldering materials, reflow settings and cleaning methods real time. High impedance measurements are performed on break off coupons designed with component geometries used to build the assembly. This test method provides a gauge of potential contamination sources coming from the build process that can contribute to electrochemical migration. If the process is outside limit values, the CM can do a root cause analysis and correct the problem.

    12:00PM
    Complimentary Lunch!

    Join us for Complimentary Lunch and Networking on the Show Floor – PLUS Raffle Prize Drawings!
    Special Thanks to Our Lunch Sponsor: NPI Technologies




    1:00PM-1:45PM
    Alan Albee There Is No Instant Pudding – Understanding the Role Test Plays in Managing the Quality of Electronic Printed Circuit Board Assemblies
    Alan Albee – Product Marketing Manager, Teradyne

    The primary role of all Printed Circuit Board Assembly manufacturers is to produce defect free products; however, all PCBA manufacturers, whether they like to admit it or not, produce defects. Typical modern Surface Mount Technology lines produce 300 to 500 defects for every million PCB assembly operations. Not all defects result in faults that cause the PCBA to malfunction. The goal of manufacturers is to detect, categorize, repair those faults and correct the manufacturing processes that allowed the defects to occur. Improving manufacturing quality levels to accomplish those objectives requires a hierarchical test strategy and a complementary selection of test and inspection equipment - so that repair actions are focused on true faults and process improvements are focused on reducing marginal defects that lead to faults. The strategy strikes a balance between the short term pressures to ship product and the long term goals of achieving world class manufacturing quality levels.


    2:00PM-2:45PM
    Elizabeth Benedetto Detection of Pad Crater Initiation in Shock Using Acoustic Emission Detection
    Elizabeth Benedetto - Distinguished Technologist, HP Inc

    Acoustic emission detection was used to identify damage events on electronic assemblies during mechanical shock testing. Two board designs manufactured from several laminate types were instrumented with acoustic transducers and dropped multiple times at acceleration levels between 100 and 250g. Acoustic events that indicated a failure within the footprint of the ball grid array were identified and located using triangulation. Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events. The results indicate that acoustic emission detection can be used to identify and locate pad cratering during shock within approximately 5 mm, and has the potential to significantly improve the speed and precision of mechanical shock testing.


    3:00PM
    End of Show Grand Prize Drawing!


    March 3

    Dallas Expo & Tech Forum  +

    Location: Plano Centre
    2000 E. Spring Creek Pkwy
    Plano, TX 75074



    Exhibitors

    The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

    The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird expires on February 4th, 2016!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • SMTA Dallas Expo 2016 Floor Plan
    Click here to view the floorplan!


    See You at the Plano Centre!

    2000 E. Spring Creek Pkwy, Plano, TX 75074



    Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.



    Attendees

    iPad

    Register for your chance to win an iPad Air II.

    Only attendees that register in advance are eligible for the drawing of the iPad door prize.

    CR Assembly
    Special thanks to our Technical Sessions Sponsor, CR Assembly!


    Free Technical Program & Schedule:

    8:00AM
    Registration opens

    Island SMT
    Special thanks to our Breakfast Sponsor, Island SMT!



    8:30AM – 9:15AM
    Teardown: Why is it Important to See What's Inside Our Gadgets?
    Dr. Glenn Thomas, Creative Electron

    The impulse to break a new gadget to "see what's inside" is often the first sign someone will become an engineer. However, modern teardowns go far beyond pure curiosity: they provide us critical insights into the nature and construction of these devices. In this talk we will cover the teardown of several gadgets, from the early Blackberries to the Apple Watch, to understand how the SMT industry has changed. These findings will also help us forecast where we are going as a community by discussing miniaturization and packaging, automation and labor force location, device features, and other important topics. These are key issues we need to address to keep U.S. SMT manufacturing relevant.

    9:15AM – 10:00AM
    Read a Board Shop Fast - How to Perform a Lean Self-Assessment Audit
    Richard Rahn, Leonardo Group

    How “Lean” is your company? Why should you even care? It should come as no surprise that Lean Manufacturing (along with its sister strategy Six Sigma) has become essential for survival in today’s hyper-competitive world . Lean companies tend to be more profitable, more flexible, with fewer defects, and much higher employee satisfaction and involvement. While it is sometimes thought that Lean is not a good fit for “job shops” or smaller organizations, continuous improvement and the use of the scientific method certainly does, which is the essence of Lean.

    Fortunately, it’s not that hard to assess your current state of Leanness. A 60-minute walk-through of your facility can give you a surprisingly accurate snapshot of your Lean maturity, as well as give you some great ideas for improvement. In this 45-minute session, veteran Lean mentor Richard Rahn will train you in the use of a quick self-assessment audit, based on the well-know “Read A Plant Fast” method that was published the Harvard Business Review in 2002, and adapted to SMT Board Shop environments. You’ll be able to return to your facility, conduct the audit fast, and be on your way to launching or enhancing your Lean improvement efforts!

    10:00AM
    Expo Opens

    11:00AM - 11:45AM
    Cleanliness Makes a Difference When Miniaturization Kicks in - A New Test Method for Identifying Contamination Coming from the Build Process
    Mike Bixenman, DBA, KYZEN Corporation

    A weakness of current reliability test methods is that they are performed at the qualification and validation stage. These methods are run on test boards designed to simulate the actual product being built. Both electronic and chemical test methods are typically performed by outside reliability labs. Once the process is signed off by the OEM, CMs do not have a simple test method that they can use to verify that the product is being built to designed test levels. Ionic testers were commonly used as a process check but with the emergence of highly dense interconnects and more complex flux designs, this process tool does not provide an accurate assessment.

    A new site-specific test method has been designed to run a performance qualification on boards built with the specified soldering materials, reflow settings and cleaning methods real time. High impedance measurements are performed on break off coupons designed with component geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the build process that can contribute to electrochemical migration. If the process is outside limit values, the CM can do a root cause analysis and correct the problem. The purpose of this research paper is to present an improve test methodology for ensuring that assemblies are built to the designed specifications.


    12:00PM
    Complimentary Lunch

    Join us for Complimentary BBQ Lunch (with a Vegetarian Option) and Networking on the Show Floor - PLUS Door Prize Drawings!

    Special Thanks to Our Lunch Sponsor: NPI Technologies

    SVTronics
    Special thanks to our Door Prize Sponsor, SVTronics!



    1:30PM – 2:15PM
    Impact of Flux Residues on the Reliability of Electronic Assemblies
    Bruno Tolla, Ph.D, Kester, Inc.
    Reliability is one of the key performance drivers of the microelectronics industry today, from conventional Electronics Assembly to high-end Semiconductor packaging applications. The miniaturization and complexification of the component architectures, coupled with their operation in ever harsher environments, dramatically increases the risk of in-field failure. In this context, understanding the chemical influence of flux residues on the failure modes of electronic assemblies is of paramount importance for the selection of assembly materials and the design of adequate processes. For this purpose, we will leverage our fundamental knowledge of flux systems and soldering mechanisms, and complement it by a series of customized tests for corrosion and electrochemical migration in various application-representative configurations. Chemically-driven failure modes will be analyzed in terms of the chemical equilibria at play between the flux and its environment (the assembly operating conditions). This will illustrate how sound chemical principles paired with a thorough understanding of the application environment can enable the design of robust and reliable chemical packages mitigating the risks of in-field failures for the final assemblies.

    3:00PM
    Expo Closes


    March 29 & 31

    SMTA Webtorial: Stencil Printing – The Essentials  +


    Two (2) 90 minute Sessions
    Tuesday, March 29 and Thursday, March 31, 2016

    1:00-2:30pm Eastern
    Presented by: Chrys Shea, Shea Engineering Services

    Chrys Shea Overview:
    Session 1, March 29, 2016
    This introductory course on SMT solder paste stencil printing gives the attendees a solid foundation in the basic elements of printing to help them reduce defects and improve yields on the production line. Topics include the flow behavior of solder pastes, the mechanics of the process and the key role of tooling in successful printing.

    After understanding the basic elements of the process and their influence on yields, attendees then review troubleshooting tactics, including the 5-minute check that reveals the source of most problems. A more detailed review of the most probable causes of defects follows, discussing reasons for solder bridges, peaking, insufficient deposits, and gasketing and alignment issues.

    Session 2, March 31, 2016
    All about stencils! This session focuses on stencil design, stencil materials, stencil manufacturing processes and stencil nanocoatings. The session begins with optimizing stencil design and construction based on PCB layout and component type. It discusses approaches for BTCs, miniaturized, and through-hole components by using aperture designs, multi-level stencils and solder preforms.

    It then reviews materials and manufacturing processes, discussing the different options for stainless steel and nickel, and the state of the market on electroforming, laser cutting and elecropolishing. Nanocoatings are quickly gaining popularity. An overview of the types of nanocoatings available, the benefits and drawbacks of each, and user-generated data on the process improvement they offer are discussed in detail. Additionally, a spreadsheet to help calculate the cost of defects, printer consumables, and payback periods on nanocoatings is demonstrated and the download link is provided. Attendees are encouraged to ask questions or bring specific problems to the class for suggestions and inputs.

    Outline:

    Session 1, March 29, 2016
    1. Solder Paste Behavior
    1.1. Properties & characteristics
    1.2. Behaviors during the printing process
    1.3. Printability differences between no-clean and water wash, tin-lead and lead-free
    2. Mechanics of the Printing Process
    2.1. Alignment and gasketing
    2.2. PCB support
    2.3. Squeegee or direct print head motion
    2.4. Paste setup & release
    2.5. Area ratios and transfer efficiencies
    3. Troubleshooting Process Problems
    3.1. 5-minute system check
    3.2. Typical defects and likely root causes to investigate

    Session 2, March 31, 2016
    4. Stencil Technology
    4.1. Optimizing design and materials based on PCB layout
    4.2. Stencil Stepping
    4.3. BTC and QFN aperture design
    4.4. Preforms
    4.5. Pin-in-Paste
    5. Stencil Materials and Manufacturing Processes
    5.1. Nickel – Electroformed and plated over stainless steel
    5.2. Stainless Steel – stress relieved, fine grain and high-tension capable new materials
    5.3. Electroforming
    5.4. Laser Cutting
    5.5. High tension foils and frames
    5.6. Stencil Inspection & verification for production
    6. Nanocoatings
    6.1. Purpose
    6.2. Types
    6.3. Benefits
    6.4. Quantifying costs and ROI spreadsheet

    Who Will Benefit from this Course:

  • SMT assembly process engineers, technicians and advanced-level operators who are responsible for production or new product introductions processes
  • Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields and identifying root causes of failures
  • OEM supply chain engineers who assess and/or support SMT assembly contractors


  • April 12 - 14

    South East Asia Technical Training Conference on Electronics Assembly Technologies 2016  +

    Location
    Eastin Hotel Penang
    Penang Malaysia


    The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

    The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

    The conference is "claimable from HRDF under SBL scheme."


    Online registration is now closed! Please register on-site.




    Technical Program Finalized

    Sessions and topics in our 2016 program will focus on new Solder Alloys for Reliability, LED Technology, Traceability, Test, High Reliability, Components, Microelectronics, Printing, Assembly, BGAs, BTCs, and Harsh Environments Issues.

    View the full program here!




    Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately


  • April 20

    SMTA Webinar: PCB Surface Finishing Overview: How Process Parameters Effect Functional Performance   +


    Wednesday, April 20, 2016
    1:00pm to 2:30pm Eastern
    Presented by: Lenora Toscano, MacDermid Enthone
    Lenora Toscano
    Complimentary Webinar for Members!

    Overview:
    The performance expectations of printed circuit board surface finishes are greater than just solderability preservation. Historically, they were designed solely to protect copper from oxidation prior to the soldering of components. This included any storage and transportation from board manufacture to the assembly facility. Now the expectations are much greater; superior solderability, contact performance, wire bondability, corrosion resistance, extended life in aggressive environments and all this must be achieved at a low cost.

    As the last step in the manufacture of printed circuit boards, all process steps leading to the surface finish must be taken into consideration. The quality of the product entering the surface finish line will affect the resultant performance. It is important to follow operating guidelines to ensure a wide operating window. This Tutorial will detail the surface finishes on the market and the pros and cons associated with them from a fabrication perspective. It will review process cycles and suggest areas from improvement. The session will focus on process parameters within the surface finish line to help promote a wide operating window and achieve desired performance.

    This will not only benefit the line engineer but also supplier quality managers and the designers putting various finishes into their specifications. It will also give end users a better understanding of the challenges associated with each surface finish which may help with selection for specific technologies.

    Outline:
    1. Review of surface finish offerings
    2. Surface finish process cycles and suggestions for improved performance
    3. Discussion of the copper quality entering the surface finish line and its effects

    Who Should Attend: Anyone who deals with specifications and/or defect analysis for surface finishes. Those responsible for choosing the surface finish for end use products. Process engineers and supplier quality managers.

    Instructor Bio:
    Lenora Toscano is the Director of OEM Applications for the Electronics Division of MacDermid Enthone. Her responsibilities enable her to work closely with fabricators, EMS and OEM’s to understand customers’ needs for all MacDermid Enthone’s product lines. By narrowing the communication gaps within the electronic supply chain, Lenora is able to satisfy fabricators and OEM needs.

    Lenora has been in the industry for over 18 years, has numerous technical publications and holds four patents. She graduated from the University of Connecticut with a Bachelor’s Degree in Chemistry and received her Master’s Degree in Chemistry.


    April 20

    Atlanta 20th Annual Expo  +

    Location: Infinite Energy Center (Formerly Gwinnett Center)
    6400 Sugarloaf Parkway
    Duluth, GA 30097
    Show Hours: Wednesday, 10am - 3pm



    Exhibitors


    The Atlanta Expo has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!

    The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $55 per booth. Early bird expires on March 4th, 2016!

    Click here to learn more about the exciting ideas for our 20th Annual Expo!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details
  • Hard Copy of Exhibitor Reg Form
  • Map to Infinite Energy Center Loading Docks

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Show Hours: 10:00AM – 3:00PM



    Free Technical Program & Schedule:

    Special Thanks to Our Coffee Sponsor:



    Special Thanks to Our Technical Session Sponsor:



    10:30 AM – 11:15 AM
    pH Neutral vs Alkaline Cleaning Agents
    Kalyan Nukala, ZESTRON America Kalyan Nukala, M.S.Chem.Eng., ZESTRON Americas
    Although modern aqueous alkaline cleaning agents effectively remove flux residues, achieving satisfactory results often requires an increase in temperature, exposure time, chemical concentration, and mechanical energy resulting in material compatibility issues. This presentation includes data from three case studies detailing how newly developed pH neutral formulations have proven to be capable of removing difficult post reflow residues from complex board geometries without affecting material compatibility of sensitive components.


    12:00 PM – 12:30 PM
    Lunch 'n Learn Keynote on the Show Floor

    Understanding the Power of your Network
    Jason Moss, Georgia Manufacturing Alliance Jason Moss, Georgia Manufacturing Alliance
     Georgia Manufacturing Alliance Be sure to attend this powerful Lunch ‘ Learn session to learn the basics of growing your personal and professional network. Jason Moss, “Master Networker”, will explain the key reasons why you need a strong network and will share a simple action plan that will produce results. Learn how your career will benefit from a strong network, plus seven reasons to build a successful network and three easy steps to get started.




    Special Thanks to Our Lunch Sponsor:



    1:30PM – 2:30PM
    Industry Roundtable
    Moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB/CIRCUITS ASSEMBLY & President of UP Media Group

    Pete Waddell
    Hosted and moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB and a PCB designer for 20 years, this informal discussion will focus on the world of PCB design, its challenges, its future, with a focus on how to facilitate communication with the entire PCB supply chain, including fabrication and assembly. If you're a PCB designer or engineer, provide EDA software or just want to understand how to better work with a design group, join us for a casual conversation that promises to be a lively look at the world of PCB design...and beyond.




    Special Thanks to Our Snack Break Sponsor:



    3:30PM
    Happy Hour Reception
    Arena Tavern

    Arena Tavern
    Join us at the Arena Tavern after the show for some light appetizers and drinks, and the chance to network with some of the industry's leading professionals!

    Arena Tavern
    2000 Satellite Blvd,
    Duluth, GA 30097

    Special Thanks to Our Reception Sponsor:



    2016 CHARITY RAFFLE INFORMATION

    Food Bank of Northeast Georgia The Atlanta Chapter is holding a charity raffle again this year with drawings for great prizes throughout the day. The Food Bank of Northeast Georgia is a 501 (c) 3 non-profit organization dedicated to help feed the ill, needy, seniors, and children of northeast Georgia. Their mission is to work toward ending hunger as part of an overall community effort to alleviate poverty. All proceeds from our raffle will benefit this group.

    Exhibitors are invited to donate raffle prizes. Raffle tickets will be sold the day of the Expo, with all proceeds benefiting The Food Bank of Northeast Georgia.

    Click here to see the current raffle prizes!!

    For information on how to donate contact SMTA Expo Manager Emily Stuckmayer at emily@smta.org!

    Gwinnett Braves New This Year!! Each EXPO attendee will receive a FILL IN TO WIN card. They must visit 15 different exhibitors during the show and have each exhibitor fill in the card with a company name and signature. Those who submit a completed game card will receive a voucher for a pair of Gwinnett Braves tickets!

    Download/View a postcard of the event
    SMTA Atlanta Expo Post Card


    April 26 & 28

    SMTA Webtorial: Solder Reflow Fundamentals Understanding Thermal Profiles and Defect Mitigation   +


    Two (2) 90 minute Sessions
    Tuesday, April 26 and Thursday, April 28, 2016

    1:00-2:30pm Eastern
    Presented by: Fred Dimock, BTU International and Karl Seelig, AIM

    Overview:
    This class is an extension of Solder Reflow Fundamentals – Understanding and Obtaining Profiles. It focuses on how the shape of reflow profiles affects various defects and what the SMT engineer/technician can do to eliminate them. It is designed for the SMT engineers/technicians that want a better understanding of the reflow process, identifies defects, and gives practical troubleshooting steps. This was a high rated workshop from SMTAI that you can attend right from your desk!

    Outline:

  • Recipe and Profiles
  • Properties of Solder Paste
  • Metals and flux
  • Profile shapes
  • Defect identification and mitigation
  • Solder Balls
  • Opens
  • Voids
  • Tombstoning

    Who Should Attend:
    This will benefit SMT process engineers and technicians that want a better understanding of the reflow process and to learn practical steps to eliminate soldering defects.

    Instructor Bio
    Fred Dimock is the Manager of Process Technology at BTU International in Massachusetts and a member of the SMTA Technical Committee.

    He holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelors Degree in Ceramic Engineering from the State University of New York at Alfred. (SUNY) His extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU.

    Fred has assisted many companies with process refinements, and has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German. He received “The Best Vendor Presentation” award at the East China SMTA conferences in 2011 and 2012.

    He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr Lasky and Jim Hall.

    Karl Seelig is Vice President of Technology of AIM. In his over 30 years of industry experience, he has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly & process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He has also received numerous patents in soldering technology, including four lead-free solder alloys.


  • April 26

    Puget Sound DFX Chapter Tutorial Program  +

    Location
    Microsoft
    Redmond , WA 98052



    Instructor: Dock Brown, DfR Solutions

    April 26, 2016
    8:30 a.m. - 4:00 p.m.
    Microsoft
    4729 154th Place NE
    Building 83
    Redmond, WA 98052

    Registration Deadline is April 15th!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • SMTA Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    DFX is an integrated set of technical and management disciplines which are followed to simultaneously reduce lifecycle costs, improve customer satisfaction, and facilitate regulatory compliance. The X in DFX has been variously presented as being simply ‘Excellence’ to incorporating a long list of product considerations such as: Manufacturing, Reliability, Service, Quality, Test, Safety, etc.

    Requirements:

  • Design
  • Production
  • Support

    Understand Your Environments:

  • Business
  • Regulatory
  • Economic
  • Storage
  • Usage

    A key to competitive, profitable product realization is design for X (DFX); i.e., design for manufacturability, testability, installability, compliance, reliability, and other downstream considerations. DFX is a philosophy and practice that ensures quality products and services, reduces the time to market for a product, and minimizes life-cycle costs. Therefore, it is crucial to achieving customer satisfaction.

  • Design for Manufacturability (DFM)
  • Design for Assembly (DFA)
  • Design for Sourcing (DFS)
  • Design for Reliability (DFR)
  • Design for Environment (DFE)

    About the Instructor:

    Dock Brown Dock Brown
    Dock Brown brings his more than 30 years of electronics reliability experience to clients of DfR Solutions. Prior to joining DfR Solutions, he worked at Medtronic for 20 years where he most recently concentrated on the transition to RoHS materials and processes of harsh environment Class III medical devices. He was also responsible for supplier assessment and approval, on-going supplier audits, failure analysis, corrective actions, MRB, sampling, and ultimately full accountability for quality and reliability of COTS and custom parts and assemblies from a worldwide supplier base. Earlier in his career, Mr. Brown also worked at Sundstrand Data Control where he led the implementation of the Boeing AQS program and with Olin Aerospace. As a volunteer, he has been involved with TMS, MRS, ASQ, IEEE, IPC, and SMTA. He has taught statistics, design of experiments, and has contributed to the development of several international standards. He is a Certified Reliability Engineer and an ISO Lead Assessor.



    Microsoft
    Sponsored by Microsoft
    Thank you for your support!



    Contact Karen Frericks at 952-920-7682 with questions.


  • May 3

    SMTA Webinar: Assessment of Electronic Part Supply Chain, Distributors, and Test Laboratories for Counterfeit Avoidance  +


    Tuesday, May 3, 2016
    1:00pm to 2:30pm Eastern
    Presented by: Diganta Das, Ph.D., CALCE

    Complimentary Webinar!

    Overview:
    This Webinar will take you through industry efforts on standardization to help the supply chain address the issues of counterfeiting. Some additional efforts have occurred outside standardization and collaborative industry efforts will also be covered. Dr. Das will bring you up to date with the current status of standardization documents and show you how to utilize the results of such efforts for the benefit of your organization as well as reduce overall supply chain risks.

    Topics Covered:

  • Standards related to part distributor assessment from SAE and others
  • JEDEC standard on “counterfeit” parts
  • Updates to SAE 5553 and related ARP, definitions documents
  • Process change notices
  • AS6171 Counterfeit part detection techniques
  • SAE AS6174 Counterfeit Materiel Standard

    About the Presenter:
    Dr. Diganta Das is a member of the research staff at the Center for Advanced Life Cycle Engineering. Dr. Das is the organizer of the most trusted event in fighting counterfeit electronics in the United States and with SMTA he had organized 10 conferences with large participation of industry, government, law enforcement, test laboratories and standards development organizations. He is a group leader for the SAE G-19 counterfeit detection standards group and has a leading role in developing the standards. He has organized sessions in SAE's Aerospace Conference on counterfeit electronics. He has developed and taught courses on counterfeit electronics and helped develop training material related to counterfeit electronics. He is the recipient of SMTA's member of Technical Distinction Award in 2014 for his effort on counterfeit electronics prevention. He is the foremost expert on electronic part tagging and tracking including authentication methods like DNA. He has worked with the US Department of Defense in developing material characteristics based detection of counterfeit electronics. He works closely with the US law enforcement community in awareness training for the industry. His other research interests include electronic parts supply chain, part recycling and reuse, LED failure mechanisms, and power electronics reliability. Dr. Das has published more than 100 articles on these subjects.


  • May 5

    West Penn Expo & Tech Forum  +

    Location: DoubleTree Monroeville
    101 Mall Plaza Blvd.
    Monroeville, PA 15146


    Exhibitors


    The West Penn Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 7th, 2016!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!


    Exhibit Hours:
    Thursday, May 5, 2016
    10:00AM–3:00PM


    Free Technical Program & Schedule:

    8:00AM
    Registration opens

    8:30AM-9:15AM
    Electrostatic Discharge Awareness Training
    Marilyn Lawrence, MIT CIT, Conformance Technologies

    Workers in the electronics manufacturing industry handle or work around electrostatic discharge sensitive (ESDS) components in some manner on a daily basis. Though ESD cannot be entirely eliminated, a basic awareness can help keep ESD levels low and damage to components to a minimum. There are also misconceptions about handling ESDS components and the materials used to protect them.

    9:15AM – 10:00AM
    Board Pad Design and Stencil Design and their Effect on Reliability
    Jasbir Bath, Owner, Bath Consulting LLC

    There are challenges in electronics manufacturing to improve manufacturing yield and reliability with the variety of components being assembled on the board. The presentation will review board pad design and stencil aperture design for a variety of components including chip components, BGA/CSP components, BTC/MLF/QFN/ LGA components and lead-frame components and look at their effect on manufacturing yield and board level reliability with reference to various IPC and related industry standards.

    10:00AM
    Expo Opens

    11:00AM – 11:45AM
    Industry 4.0
    Mark Northrup, VP of Advanced Technical Operations and Strategy, IEC Electronics

    The implementation of Industry 4.0 will be accompanied by changing requirements and demands for the human in the factory. The manufacturing personnel will be facing a new assortment of jobs involving data security, specifications, monitoring, cyber-space production systems, and a verification of production strategies. This will require training and technological support so that the workers can realize their full potential and adopt the role of strategic decision-makers and flexible problem-solvers. This paper demonstrates examples and solutions of implementation of cyber-space production systems , technological support of workers, intelligent user interfaces, data security, and adequate qualification strategies. Industry 4.0 will require a inter-disciplinary understanding to be successful.

    12:00PM
    Complimentary Lunch

    1:30PM – 2:15PM
    Practical Guidelines in Handling Moisture Sensitivity of SMT Packages
    Mumtaz Bora, Sr. Staff Packaging Engineer, Peregrine Semiconductor

    Handling of moisture sensitive packages is an ongoing learning process in volume manufacturing. Improperly handled and stored MSDs can impact yields and reliability. The presentation will cover a review of the industry standards for MSDs( J-STD-020, J-STD 033 and J-STD 075) and their applications in moisture control. PWBs used for assembly also require controlled storage and handling. Board surface finishes, storage and baking guidelines will be reviewed per the IPC 1601 standard. Handling of MSDs from receipt to use at reflow will be reviewed, including practical guidelines in labeling, tracking, packing , storage and supplier audits.

    3:00PM
    Expo Closes


    May 9 - 11

    International Conference on Soldering & Reliability 2016  +

    Location
    Hilton Toronto/Markham Suites Conference Centre
    Toronto , ON L6G 1A5 Canada


    The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.


    May 9 - 11

    SMT Processes Certification (ICSR- Toronto,Ontario)  +

    Location
    Hilton Toronto/Markham Suites Conference Centre
    Toronto , ON L6G 1A5 Canada


    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • May 10

    Toronto SMTA Expo & Tech Forum  +

    In conjunction with the International Conference on Soldering & Reliability (ICSR)

    Location: Hilton Toronto/Markham Suites Conference Centre
    8500 Warden Avenue
    Toronto, ON L6G 1A5


    Exhibitors

    Exhibit Hours:
    Tuesday, May 10, 2016: 10:00am – 3:30pm

    Early-Bird Registration Ends April 1st! Rates go up $100!

    For a hard copy of the sponsorship and exhibits form, click here.

    View the floor plan.

    Exhibit space entitles you to:

  • 6 ft. Draped table
  • Two Chairs
  • Attendee list (sent after the conference)
  • Company sign
  • Lunch & Breaks
  • Sponsorship Opportunities:

  • Lanyard Sponsor $400/$800 (Official sponsor for ICSR Conference & Toronto Expo) SOLD!
  • Bag Sponsor - $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Refreshment Break Sponsor - $550 SOLD!
  • Lunch Sponsor - $800





    Attendees

    Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

    ICSR Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


  • May 10

    Oregon Expo & Tech Forum  +

    Location: Tektronix Building
    38 Conference Center
    Beaverton, OR


    Exhibitors


    The Oregon Expo & Tech Forum has SOLD OUT! Please contact Dave Larson to be put on a wait list at dlarson@tekproducts.com. Thank you!

    The cost to exhibit is $450 for a booth and $350 for a table. The cost to exhibit includes: one 5ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Please note: This year both tabletops and booths will be available. Those purchasing a table top please refrain from using banners, screens etc.

    A $50 discount per booth/table will be offered for multiple spots at one show or one or more in each location.

    Please contact Dave Larson to register for the event.



    Attendees

    Please see the Oregon Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 10

    Wisconsin Expo & Tech Forum  +

    Location: Milwaukee Airport Crowne Plaza
    6401 S 13th St,
    Milwaukee, WI 53221


    Exhibitors

    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

    Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.



    Attendees

    Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 12

    Puget Sound Expo & Tech Forum  +

    Location: Red Lion Hotel
    11211 Main Street
    Bellevue, WA 98004


    Exhibitors Register Now
    Exhibitors


    The Puget Sound Expo & Tech Forum has SOLD OUT! Please contact Dave Larson to be put on a wait list at dlarson@tekproducts.com. Thank you!

    The cost to exhibit is $350 for one table, $600 for 2, whether in 1 location or 1 in both locations. The cost to exhibit includes: one 5ft draped table, two chairs, company sign, lunch, directory listing and attendee list.

    Please contact Dave Larson to register for the event.



    Attendees

    Please see the Puget Sound Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 17 & 19

    SMTA Webtorial: It is Time for Low Temperature - Low Temperature Solders, New Development, and Their Applications   +


    Two (2) 90 minute Sessions
    Tuesday, May 17 and Thursday, May 19, 2016

    1:00-2:30pm Eastern
    Presented by: Ning-Cheng Lee, Ph.D., Indium Corporation

    Ning-Cheng Lee Overview:
    Since the dawn of the electronic industry, the soldering process encompasses mainly component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former use solder alloys with melting temperatures around 300C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200C. Low temperature solders with melting temperature < 180C are currently mainly used for niche applications. However, the iNEMI Roadmap predicts low temperature soldering to become one of the main stream processes by 2017. Low temperature soldering is greatly desired for a number of special applications, such as heat sensitive devices, systems with more hierarchic levels, parts with significant difference in coefficient of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.

    Outline:

  • Market Demand & Tentative Binary Alloys Options
  • SnIn
  • BiSn
  • BiSn + Ag
  • BiSn + Proprietary Dopants
  • BiSn + In, Ni
  • BiSn + Sb, Zn, Ag
  • SnInAg & Applications
  • Summary
  • Appendix

    What you will Learn
    You will learn the benefits of low temperature soldering, and how this may broaden your options in product design, your soldering process, your choice of components and board materials, and hierarchic combinations. You will also know the variety of solder alloys, and the pro and cons of each of the alloys in terms of their properties and their performance at the applications.

    Who Should Attend:
    Technology directors, technology managers, product managers, design engineers, process engineers, reliability engineers, material scientists, process technicians, and any one who is interested in low temperature soldering, their applications, and wants to know how to achieve it should take this course.

    Instructor Bio
    Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Ning-Cheng is the author of "Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies" by Newnes, and co-author of "Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials" by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.


  • May 19

    Michigan Expo & Tech Forum  +

    Location: Laurel Manor
    39000 Schoolcraft Road
    Livonia, MI 48150



    Exhibitors


    The Michigan Expo & Tech Forum has SOLD OUT! Please contact Kaitlyn to be put on a wait list at kaitlyn@smta.org or call 952-920-7682. Thank you!

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 22nd, 2016!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details

  • Please contact SMTA Expo Manager Kaitlyn Gherity with any questions or for additional information.



    Attendees

    Plan now to join us for complimentary technical sessions, lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, May 19th, 2016
    10:00AM–4:00PM

    Registration Opens at 8:30AM

    Free Technical Program & Schedule:

    8:30AM
    Registration opens

    9:00AM – 10:00AM
    Selestak Introduction to the Benefits of Employing Plasma Treatment Prior to Conformal Coating in Today's Advanced Board Assembly Environment
    Dave Selestak, Nordson MARCH

    The reliability and performance of modern advanced electronic assemblies is steadily increasing to meet market requirements and demands. Contemporaneously, demands are such that material choices become as environmentally friendly as possible. Such constraints have presented the electronics industry with unforeseen challenges caused by certain limitations of legacy materials. For example, RoHS requirements have driven printed circuit board assembly materials to ever higher temperature capabilities. The High Tg materials are designed to withstand the higher reflow temperatures of lead free solders but present their own set of problems down the line in subsequent manufacturing steps. In particular the adhesion of existing conformal coatings to advanced materials has presented significant challenges. Either advanced conformal coatings can be applied to overcome the adhesion issues or an alternative is necessary.
    Read More!

    10:00AM
    Expo opens

    11:00AM – 12:00PM
    Keeping Critical Considerations for Conformal Coating Reliability
    Jason Keeping, Celestica, Inc.

    Conformal Coating is a very mature process and application technique, however the importance of conformal coating is now re-emerging as the industry is coping to deal with changes associated with Pb-free and to drive cost out of the associated coating processes. Two key requirements for this success is for the Conformal Coating material to be where required as per design along with adhere and maintain this coverage for its intended expectancy, both for the assembly and the Conformal Coating material.
    Read More!

    Special Thanks to Our Lunch Sponsor MicroScreen LLC!




    12:00PM - 1:00PM
    Complimentary Lunch

    3:30PM-4:30PM
    Happy Hour Reception

    4:00PM
    Expo Closes


    May 24 - 26

    SMT Processes Certification (Queretaro, Mexico)  +

    Location
    Interlatin
    Queretaro 76138 Mexico


    Rescheduling: Date/location TBA

    Certification at Interlatin (Open to the public).
    Instruction: Mostly Spanish
    Test: English
    Instructor: Iván Castellanos, Indium Corporation

    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • May 24

    Carolinas Expo & Tech Forum  +

    Location: Holiday Inn Greensboro Airport
    6426 Burnt Poplar Rd
    Greensboro, NC 27409


    Exhibitors

    The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 22nd, 2016!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details

    Please contact SMTA Expo Manager Emily Stuckmayer to register.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!


    Exhibit Hours:
    Tuesday, May 24, 2016
    10:00AM–3:00PM


    Free Technical Program & Schedule:

    9:00AM
    Registration opens


    Special thanks to our Coffee Sponsor ACDi!










    9:30AM-10:15AM
    What is the Market Opportunity in IoT? Can NC RIoT Lead North Carolina in this Land Grab?
    Larry Steffann, Wireless Research Center of North Carolina

    The Wireless Center of North Carolina www.wirelesscneter-nc.org is a one of a kind nonprofit based in Wake Forest, NC. It’s a world class test facility doing leading edge wireless /antenna engineering for fortune 50 companies to startups. We are a CTIA ,A2LA and Verizon test house. Our mission is economic development focused on creating new companies and technology. The Wireless Center is the founder of NC RIoT (North Carolina Regional Internet of Things) a 1,500 member IoT community, its focus is on identifying our community’s value in the IoT value chain. Our members offer services from sensors and devices to data analytics. We hold meeting monthly typically upwards of 300+ people on a variety of IoT topics. www.ncriot.org The organization sponsors reflect global , local and regional partners and companies.

    10:00AM
    Expo Opens

    11:00AM – 11:45AM
    Teardown Analysis on Wearables and IoT Devices
    Bill Cardoso, Ph.D., Creative Electron

    Teardowns are powerful tools to gain invaluable insight on how things are designed and built. Critical lessons can be learnt from this process to improve our jobs as designers and manufacturers of electronic products. In this presentation we will start with the Apple Watch, a wearable device that went from novelty to market leader in just a few weeks. Added to its impressive commercial success, this device is an incredible work of electronic packaging design. In this presentation we will show the details of the Apple Watch teardown, showing its many layers and complexities. We augment the teardown with x-ray images of several parts of the Apple Watch to gain extra insights on how this tightly packaged device is assembled. We will also present other similar teardowns, including cell phones and wearables.

    12:00PM
    Complimentary Lunch

    Special thanks to our Lunch Sponsor General Microcircuits, Inc!










    1:00PM – 1:45PM
    Equipment Manufacturing Readiness for Miniaturization
    Shawn Robinson, Panasonic Factory Solutions Company of America

    The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40 percent smaller than today's 0402M (0.4mmxO.2mm) microchip, the new 03015M (0.3mmxO.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. Building on our expertise and testing, this presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Advanced Process Control (APC) can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.

    2:15PM – 3:00PM
    An Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios
    Bill Kunkle, MET Stencil

    Certain types of Nano coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These Nano coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge.

    This paper presents data on small area ratio printing for component designs including 01005 (0402 metric) chip components and 0.3 mm and 0.4 mm pitch micro BGAs. The aperture area ratios studied range from 0.80 down to 0.30. The effects of Nano coatings are studied and compared to uncoated laser cut steel stencils. Two types of stencil materials are evaluated including fine grain and ultra fine grain steels. Stencil thicknesses are varied from 0.003 inch (75 µm) to 0.004 inch (100 µm) to 0.005 inch (125 µm). Lastly solder paste powder size is varied including IPC Types 3, 4 and 5. The effects of all of these variables are examined in relation to small aperture area ratios. Based on the results of the work a set of guidelines for stencil material, nano coating and solder paste type will be proposed in order to achieve good solder paste printing results.

    3:00PM
    Expo Closes


  • June 7 - 8

    Ultrapure Water Micro Conference   +

    Location
    Austin , TX


    The Ultrapure Water Micro conference collects the leading thinkers, planners and doers on the water side of microelectronics manufacturing in one place to discuss technological breakthroughs and upcoming needs, cost saving and reuse opportunities, and developments in the sector. Visit ultrapurewatermicro.com to book your pass for UPW Micro 2016, June 7-8 in Austin, Texas."


    June 8

    Oregon Chapter Tutorial Program: 4 Ps of SMT in a Lead Free World  +

    Problems and Promises, Principles and Practice

    Location
    Axiom Electronics
    Beaverton , OR 97006-6939



    Instructor: Ray Prasad, Ray Prasad Consultancy Group

    June 8, 2016
    8:30 a.m. - 4:00 p.m.
    Axiom Electronics
    19545 NW Von Neumann Drive, #200
    Beaverton, OR 97006-6939

    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Oregon Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)


  • New this year! Get a $20 EARLY BIRD discount on regular Member and Non-Member registrations if registration is completed by midnight on May 6, 2016.

    Members (with Early Bird): $180
    Non-Members (with Early Bird): $255

    Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    About This Course:
    The objective of this course is to identify the technical issues in Through hole, SMT, tin-lead, Lead Free BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. After a brief overview of SMT components and advanced packaging, the course provides details of all the SMT manufacturing processes including paste application, lead free soldering, Selective Soldering, and repair. The course concludes by providing examples of common defects and their root causes.

    How You Will Benefit: After completing this course you will be able to

  • Get a good understanding of SMT, its benefits and limitations
  • Select appropriate SMT components, materials, processes, and equipment
  • Get an overview of BGA, CSP, PoP
  • Troubleshoot SMT and Lead free problems in manufacturing
  • Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment


    Topics Covered:

  • Brief Overview of SMT and Lead Free including SMT components, Advanced Packaging including, BGA, BTC, Flip Chip and PoP
  • Solder paste and its application and Soldering (Wave and Reflow) for tin-lead and Lead Free
  • Flux and Cleaning and No Clean
  • Examples of Defects and their root causes
  • Repair


    Who should attend:
    Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of SMT, Lead Free, Fine pitch, and BGA manufacturing issues for building assemblies in-house or at a subcontractor will benefit from this course.



    About the Instructor:

    Ray Prasad Ray Prasad
    Mr. Prasad is an inductee to the IPC Hall of Fame and has more than 30 years of experience in all aspects of Surface Mount Technology (SMT). He has been responsible for developing and implementing SMT for numerous system products. While serving as a lead engineer, he introduced SMT into the airplanes at Boeing and managed the global implementation of SMT at Intel Corporation when SMT was at its infancy in early 80’s.

    Mr. Prasad’s expertise includes all areas of SMT including SMT, Fine pitch, ball grid array, chip scale packaging technology, and design for manufacturing. He has chaired various IPC committees related to these subjects (IPC 7095 on BGA and IPC 7093 on BTC, IPC 7351 on land pattern design and IPC 786 on Moisture Sensitive Packages). In addition to authoring a textbook on surface mount technology used at leading Universities, Mr. Prasad has published more than 100 papers and currently serves on the advisory board of a SMT magazine.

    Education

  • M.B.A from University of California at Berkeley.
  • M.S., Materials Science and Engineering from University of California at Berkeley
  • B.S., Metallurgical Engineering from Regional Institute of Technology, Jamshedpur in India

    Consulting and Work History
    In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.

    Awards/Associations
    Mr. Prasad is an inductee to the IPC Hall of Fame – the highest honor in our industry and he is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel Achievement Award.

    Publications/Patents
    Author of the textbook Surface Mount Technology: Principles and Practice and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.

    A longtime member of IPC, he is currently the Chairman IPC 7530 “Reflow Profile Development” and IPC-7095 "Design and Assembly Process Implementation for BGA". He is also the Chairman of IPC-7093 "Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF.

    Ray is the past Chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (IPC 786, now J-STD-020/33) committees.


    Contact Karen Frericks at 952-920-7682 with questions.


  • June 9

    Philadelphia Expo & Tech Forum  +

    Location: Radisson Hotel Valley Forge
    1160 First Ave.
    King of Prussia, PA 19406


    Exhibitors

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on May 13, 2016!

    Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!


    Exhibit Hours:
    Thursday, June 9, 2016
    10:00AM–3:00PM


    Free Technical Program & Schedule:

    9:30 AM
    Registration opens

    Special thanks to our Coffee Sponsor Cumberland Electronics Strategic Supply Solutions!








    10:00 AM
    Stencil Printing’s New Tools and Technologies
    Chrys Shea, President, Shea Engineering Services

    This presentation describes new and emerging stencil printing technologies. Chrys Shea of Shea Engineering Services, will describe new technologies that are becoming available to help PCB assemblers boost yields, reduce costs and improve process controls.

    What you will learn?
    • New foil materials, mesh materials, high tension mounting, and nanocoatings
    • New stencil cutting and stepping technologies
    • New solder paste flux mediums, room temperature stability, and the trend toward finer solder powder types in response to miniaturization
    • New hardware and software upgrades on stencil printing equipment

    Who should attend?
    • Solder paste process printing technicians and engineers
    • Manufacturing engineering and quality assurance managers
    • New product engineers, especially those associated with miniaturization

    11:00 AM
    The Evolution of Metrology Tools for Determining Thermal Warpage of BGA’s, PoP’s, B2B’s and PCB Substrates
    Eric Moen, Vice President of Sales and Marketing, Akrometrix LLC.

    For 20 years, companies have been considering the warpage behavior, over temperature, of electronics components and PCB materials. The microelectronics industry as a whole requires new applications and implementations of thermal warpage metrology, specifically:
    - Accurate replication of the production environment, including heating ramp rates and temperature uniformity
    - Solutions for measuring gaps between two mating surfaces (i.e. component to PCB)
    - Drastic increases in sample volume and regions of interest for quality assurance at production volumes
    - Reducing the need for sample preparation, specifically surface painting
    - New and improved gauges to quantify measured surface results
    - Measuring discontinuous surfaces
    - Automated pass/fail decision making (based on gauge results)
    - Automated spatial recognition and assignment of numerous sample surfaces in a single acquisition
    - Adaptable metrology equipment creation allowing modular use of multiple surface metrology techniques

    This presentation will address developments of tools and methods addressing many industry needs and concerns relating to thermal warpage metrology.

    1:00 PM
    An Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios
    Fred Cox, MET Stencil

    Certain types of Nano coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These Nano coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge.

    This paper presents data on small area ratio printing for component designs including 01005 (0402 metric) chip components and 0.3 mm and 0.4 mm pitch micro BGAs. The aperture area ratios studied range from 0.80 down to 0.30. The effects of Nano coatings are studied and compared to uncoated laser cut steel stencils. Two types of stencil materials are evaluated including fine grain and ultra fine grain steels. Stencil thicknesses are varied from 0.003 inch (75 µm) to 0.004 inch (100 µm) to 0.005 inch (125 µm). Lastly solder paste powder size is varied including IPC Types 3, 4 and 5. The effects of all of these variables are examined in relation to small aperture area ratios. Based on the results of the work a set of guidelines for stencil material, nano coating and solder paste type will be proposed in order to achieve good solder paste printing results.

    2:00 PM
    Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
    Jason Fullerton, Customer Technical Support Engineer, Alpha Assembly Solutions

    Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste flux residues are suitable for reliable electronic assemblies.

    Ionic contamination testing is recognized by the IPC as a standard for evaluating the cleanliness of assemblies that have subjected to a cleaning process. IPC J-STD001F calls for a cleanliness level of < 1.56 µg/cm² NaCl equivalent after the cleaning processes. Historically, this threshold originated from the cleanliness specifications of military and aerospace original equipment manufacturers (OEMs). Several automotive and consumer electronic OEM’s still use this standard for qualifying assemblies built with no-clean materials.

    This study will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.


    Happy Hour:

    2:00 PM–4:00 PM


    Join us after the Expo for a networking Happy Hour with light drinks and appetizers!


    June 15

    SMTA Webinar: Management Overview of the Smart Factory (Industry 4.0) Principles, Costs, Risks and Benefits  +


    Wednesday, June 15, 2016
    12:00pm to 1:00pm Eastern
    Presented by: Jay Gorajia, Mentor Graphics

    Internet of Manufacturing Complimentary Webinar for Members!

    Overview:
    In this webinar, we will investigate what Industry 4.0 or "Smart Factory" actually is, but really, and more importantly, what the issues are behind it that makes significant change to the PCB electronics industry inevitable. We will look at the whole supply and demand chain, at what changes need to be made, starting with the consumer, the customer, to understand what their demands are, how they want to behave, and what benefits or changes Industry 4.0 will bring to them. Manufacturing analytics are core to Industry 4.0, and its related Cyber-Physical Systems connectivity to better manage delivery, quality and customer integration and collaboration. We will also look across the breadth of the electronics manufacturing organization, to see exactly what is required to make a step-change practically possible when adopting the principles of Industry 4.0, and the related benefits.

    Outline:

  • Defining Industry 4.0 and the Smart Factory
  • Barriers to Entry/Challenges
  • What does it specifically mean to Electronics companies (design and manufacturing)
  • Tour of a Factory 4.0
  • Partner management (customers, supply chain)
       - Enabling true Design Collaboration and automated manufacturing feedback
  • Who benefits?
  • Summary

    Who Should Attend:
    This webinar is intended for Electronic Manufacturing management, production, quality, IT, engineering, and design interface/collaboration teams.

    Jay Gorajia Speaker Bio:
    Jay Gorajia is Director of Consulting, PCB Design and Manufacturing Services, for the Consulting Division at Mentor Graphics. Jay works with contract manufacturers and OEMs to improve efficiency and help define cost, quality and productivity improvement solutions in design quality, design to manufacturing, manufacturing engineering and production manufacturing. For over 20 years Jay has worked with hundreds of manufacturers and design organizations around the world, resulting in real improvements through a systematic metrics-based methodology. Mr. Gorajia holds a Bachelor’s degree (B.Sc.) in Electronic Engineering and a Masters in Business Administration (MBA) in Technology Management. He has published a number of articles and White Papers in industry leading technical magazines and industry conferences.


  • June 28 - 30

    Symposium on Counterfeit Parts and Materials 2016  +

    Location
    Marriott Inn & Conference Center
    College Park , MD




    Thanks for attending in 2016!

    Details of the 2017 event are coming soon.




    Technical Symposium: June 28-30, 2016
    Expo: June 28-29, 2016
    Workshops: June 30, 2016

    University of Maryland, College Park, MD

    SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Parts and Materials. The program will be held June 28-29 at the College Park Marriott Hotel & Conference Center. The Workshops will be held June 30 at the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.

    Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.



    Keynote Speakers Announced



    Counterfeit Electronic Parts - Observations and Insights from a US Defense Industry Perspective

    Henry Livingston, BAE Systems Henry Livingston

    Henry Livingston had been an early and frequent voice in the area of risks posed by counterfeit electronics to the industry in general and the defense sector in particular. He will relate his observations and insights from personal experience in counterfeit electronic part avoidance related activity over the past decade pointing out where we went right and where we may have gone wrong. Henry will also present his thoughts on how SAE Aerospace Standard AS5553 can serve as criteria for assessing a 'Contractor Counterfeit Electronic Part Detection and Avoidance Systems' in compliance with recent department of defense regulations in view of changes both in the government regulations and in the standard.



    Getting Ready for Coming Deluge of Complex Cloned Devices

    Thomas Sharpe, SMTCorp Tom Sharp

    Clones had been a concern of people in the electronics parts supply chain for a long time but wa generally as something that is to come in the future, not now. Badly made clones had been relatively easy to detect through materials comparison and as a result, there is some complacency. In this Keynote address, Tom Sharpe will show that we need to get more prepared for a clone onslaught. He will present information on the direction to which China is moving into very quickly as a state-sponsored manufacturer of much more complex clone devices within the next 4-6 years and that push will have impact globally and on the US.





    The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


    June 28 - 29

    Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

    Location: College Park Marriott Hotel and Conference Center
    3501 University Blvd East
    Hyattsville, MD 20783


    Exhibitors

    Exhibitor Information:
    Contact Jenny Ng for available booth space. 952-920-7682 or jenny@smta.org

    Please note that exhibit traffic will be minimal while symposium is in session.


    Exhibit space entitles you to:

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings
  • Click here to view floor plan.

    Download a hard copy of the registration form

    Cost to exhibit:
    Rates increase $100 after May 30, 2016

    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $550 $650
    One table
    no access to Electrical Outlet
    $500 $600


    Sponsorship Opportunities:

    Lanyard Sponsor (Limit 1)Sold! -$400 (if provided by company/$800 (if provided by SMTA)
    Provide 150 lanyards and they will be the official lanyard for the conference. If you would like us to provide the lanyards, it will be an extra $400. You will receive logo recognition in the show directory, conference website and signage.

    Tote Bag Sponsorship (Limit 1)Sold! -$400 (if provided by company/$800 (if provided by SMTA)
    Provide your logo on all of the conference attendee bags! If you would like SMTA to provide the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.

    Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$500
    Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

    Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$350
    Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.



    Attendees

    Exhibit Attendee:

    Show Hours: 10:00am - 3:00pm

  • FREE Access to Technical Session 3 and 7
  • FREE Lunch
  • FREE Refreshment breaks

    *If you would like to attend other sessions, you will need to register for the symposium here.


  • July 12 & 14

    SMTA Webtorial: How to Design for Testability (DFT) for Today's Boards and Systems  +


    Two (2) 90 minute Sessions
    Tuesday, July 12 and Thursday, July 14, 2016

    1:00-2:30pm Eastern
    Presented by: Louis Y. Ungar, President, A.T.E. Solutions, Inc.

    Louis Y. Ungar

    Overview:
    Detailed review of the various guidelines covered in the SMTA/TMAG Testability Guidelines. Part 1 of the Webtorial will introduce attendees to the issues surrounding testing of electronic circuit boards and systems. It introduces testing concept and the mix of testers normally used. This includes the JTAG/IEEE-1149.1 boundary scan as well as built-in self test (BIST). With a combination of these technologies, the idea of non-intrusive board (and system) test is explored. The Webtorial takes the view that DFT is the best way to improve test performance and cost effectiveness. Towards that end Part 2 provides specific DFT guidelines. It concludes with exploring new standards and developments in DFT that will improve testing of boards and systems in the future.

    Part 1 (July 12) - Understanding Test, Test Strategies
    Introduction

  • What’s in today’s IC?
  • Today’s (and Tomorrow’s) Boards and Systems
  • Testing Philosophy and Economics
       - Conceptual Design and Failure Mode Effects Analysis    - Board/System Test Economics
  • Design for Testability: What, Why, How, Who and most importantly When?

    The Test Mix
  • Design Verification Tests
       o Functional Simulations
       - Signal Integrity
       - Margining and Robustness
  • Environmental Stress Screening, HALT, HASS, Burn-In
  • Qualification and Acceptance Testing
  • Automated Inspections
       - Optical Inspection (AOI)
       - X-Ray Inspection (AXI)
       - Thermal Characterization
  • Connectivity Testing
  • Manufacturing Defects Analysis (MDA)
  • In-Circuit Testing
       - Bed-of-Nails Access
       - Flying Probe Test
  • Boundary-Scan (JTAG/IEEE-1149.x)
  • Functional Board Testing
  • Built-In Self Test (BIST)
  • System Level Test and Diagnoses
  • Field Support Testing

    Strategies Towards "Non-Intrusive Board Test"
  • Traditional In-Circuit followed by Functional Board Test
  • Injecting Boundary Scan and BIST into the Traditional Approach
  • Testing to parallel design – a new paradigm

    Part 2 (July 14) – Implementing Design for Testability

    Detailed review of the various guidelines covered in the SMTA/TMAG Testability Guidelines.

  • Probing and Fixturing Guidelines
  • Flying Probe Guidelines
  • Vectorless Testing Guidelines
  • AOI Inspectability Guidelines
  • X-Ray Inspection Guidelines
  • Electrical Design Guidelines
  • Boundary Scan Guidelines
  • Analog and Mixed Signal Guidelines
  • Built-In Self Test Guidelines
  • Diagnoses and Support Guidelines

    The Future of DFT
  • How DFT makes sense… and dollars:
  • IEEE 1687 and Hierarchical Test
  • System JTAG (SJTAG)
  • Design for eXcellence (DFX)
  • Let's learn from the IC world: DFT to Scan to Compression to BIST to BISR (Built-In Self Repair)

    Who Should Attend:
    DFT is a design discipline that benefits test engineering, manufacturing, logistics, field support and even Marketing. In addition to overall quality improvement and more reliable end products, a major benefit of DFT is earlier time to market, and that is a major concern of all managers. Anyone who can influence or be influenced by DFT will find this Webtorial beneficial.

    Instructor Bio
    Louis Y. Ungar enjoys a well-known reputation in the electronics testing profession. He has built, programmed, and selected Automatic Test Equipment (ATE) for a large number of clients both in the commercial and military community. Having introduced the first university course on Automatic Testing and Design for Testability at UCLA, he and his company have taught similar courses to thousands around the world in publicly held forums, at company facilities and online. He has served on international standards committees, such as the IEEE. He led the Surface Mount Technology Association (SMTA) Testability Committee to publish the SMTA Testability Guidelines in 2002 and helped in the project to revise it several times since. He has helped develop an economic modeling tool, called The Test Flow Simulator and a testability management tool, called The Testability Director.


  • August 4

    Ohio Expo & Tech Forum  +

    Location: Embassy Suites Cleveland Rockside
    5800 Rockside Woods Boulevard
    Independence (Cleveland), OH 44131



    Exhibitors

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on July 1st, 2016!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details

  • Hard Copy of Exhibitor Reg Form

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, August 4, 2016
    10:00AM–3:00PM


    9:00 AM
    Registration opens

    A Special Thank You To Our Breakfast Sponsor:





    A Special Thank You To Our Coffee Sponsor:





    9:30 AM

    Holtzer The Discrepancy Between Ionic Contamination and SIR Testing in Predicting Electrical Reliability
    Mitch Holtzer, Alpha Assembly Solutions

    Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The Association Connecting Electronics Industries (IPC), Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement.

    Ionic contamination testing is recognized by the IPC as a standard for evaluating the cleanliness of assemblies that have subjected to a cleaning process. IPC J-STD001F calls for a cleanliness level of < 1.56 µg/cm² NaCl equivalent after the cleaning processes. Historically, this threshold originated from the cleanliness specifications of military and aerospace original equipment manufacturers (OEMs). These applications used rosin-based wave soldering fluxes, such as RMA’s, and cleaned with now presently banned fluorocarbon solvents. Many of these applications have subsequently implemented water soluble soldering processes. Several automotive and consumer electronic OEM’s still use this standard, to qualifying assemblies built with no-clean materials using mixed SMT and PTH assembly technologies.

    IPC-TM-650 Method 2.3.25 contains standard test methods for extracting contaminants from circuit boards using heated isopropanol (IPA) / water mixtures. Test method 2.3.25 is commonly referred to as the ROSE (Resistivity of Solvent Extract) test. Previous work [1,2] has shown poor correlation between the presence of extractable, corrosive weak organic acids and results from IPC-TM-650 2.3.25 test results, partially due to the lack of solubility of materials found in no-clean fluxes, and the higher SIR values imparted by rosins and resins in modern no-clean soldering materials.

    This study will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.

    12:00 PM–1:00 PM
    Free lunch on the show floor!

    A Special Thank You To Our Lunch Sponsor:






    1:45 PM

    Tenhover MEMS & Microelectronics Degree, and Talent Development Strategies
    Courtney Tenhover and Johnny Vanderford, Lorain County Community College

    This presentation will review the history of the MEMS and Microelectronics degree at Lorain County Community College and discuss the current status of the MEMS degree. We will also present a new talent innovation program, TRAIN OH, which is an earn and learn model where students will participate in a work based learning position with a local employer and attend school at the same time to earn an Associate Degree. Finally, we will discuss an upcoming course that will be offered at Lorain County Community College, Technical Publication and Presentation.

    3:00PM
    Expo Closes


    August 9

    SMTA Webinar: Corrosion in Data Centers  +


    Tuesday, August 9, 2016
    1:00pm to 2:30pm Eastern
    Presented by: Prabjit Singh and Marie S. Cole, IBM Corporation

    Complimentary Webinar for Members!

    Overview:
    Most data centers are well designed and are in areas with relatively clean environments, and most contamination is benign. Therefore, most data centers should not experience particulate or gaseous contamination-related IT equipment failures. However, according to the major IT equipment manufacturers, the number of data centers with contamination-related failures in the past ten years has increased significantly, though their number remains quite small. Much of the increase in the number of corrosion-related hardware failures is coming from the growth of server and storage system markets in Asia, particularly in China where the rapid industrial growth and the reliance on coal-fired power plants has heavily polluted the environment with sulfur-bearing gaseous contamination. This presentation will provide insight into the challenges faced by the IT industry in dealing with the hardware corrosion problems in the emerging markets in Asia and other unique industrial environments. Using outside air for cooling is considered the most straightforward way to reduce energy consumption in data centers, but it requires continuous monitoring of the air quality to preserve the reliability of IT equipment or more robust hardware. The corrosion mechanisms, the air monitoring techniques and the mitigation methods employed to contain the problem will be discussed.

    About the Presenters:
    Prabjit Singh is a Senior Technical Staff Member in the Materials and Processes Department in IBM Poughkeepsie, New York, with 36 years of experience in the metallurgical engineering aspects of mainframe computer power, packaging, cooling and reliability. He has more than 4 dozen issued patents, and is an IBM Master Inventor. PJ Singh received a B. Tech. from the Indian Institute of Technology, a MS and Ph.D. from the Stevens Institute of Technology, all in the field of metallurgical engineering. Recently, he received a MS in micro-electronic manufacturing from RPI and a MS in electrical engineering from the National Technological University. PJ Singh is active in ASHRAE, ISA, iNEMI and IPC technical societies researching printed circuit board creep corrosion and the acceptable limits of air contamination in mission-critical data centers. He is an adjunct professor of electrical engineers at the State University of New York at New Paltz.

    Marie Cole is a Distinguished Engineer in the Supply Chain Engineering organization within IBM Systems. Ms. Cole joined IBM in 1984 after completing a B.S. in Chemical Engineering from RPI and also has an M.S. in Materials Science from Columbia University. She is responsible for Supplier Technical Management strategies to qualify and introduce new technologies and sub-systems throughout the IBM Server and Storage system portfolio. She is a recognized industry expert on the lead-free solder transition of both packaging and assembly, as well as the development of BGA packaging and assembly processes. She also led the efforts to enhance the robustness of IBM hardware and develop new test methodologies to evaluate and qualify hardware for more severe data center environments. Ms. Cole currently represents IBM on the Board of Directors of iNEMI and previously served on the Board of Directors of the High Density Packaging User Group. She served two terms on the Surface Mount Technology Association Board of Directors and has been recognized as one of their Distinguished Speakers. She is the recipient of several IBM corporate level awards, the 2014 SMTA Founder’s Award and the 2014 ASM Engineering Materials Achievement Award.


    August 23 & 25

    SMTA Webtorial: Stencil Printing-Advanced Topics  +


    Two (2) 90 minute Sessions
    Tuesday, August 23, 2016 and Thursday, August 25, 2016

    1:00-2:30pm Eastern
    Presented by: Chrys Shea Shea Engineering Services

    Chrys Shea

    Overview:
    Session 1, August 23, 2016
    This advanced course on SMT solder paste stencil printing builds upon the basics to give the attendees a larger toolkit for troubleshooting and process improvement. The session starts with handling incoming stencils, and the need to clean and verify them before putting them into production. A simple stencil verification method using SPI is described in detail, as is the inclusion of test coupons to aid in troubleshooting stencil quality issues.

    The session continues with detailed methods of troubleshooting suspected stencil issues, showing images and data from several real-world stencil trials. It discusses the impact of aperture size and thickness variation, aperture location, and wall cut quality.

    Stencil underwiping is presented, reviewing types of wipe sequences, wiper papers, and solvents, particularly as they relate to modern lead-free solder pastes and the preservation of nanocoatings. Videos and ultraviolet images of the effects of cleaning and nanocoatings are shown.

    Session 2, August 25, 2016
    Automated Solder Paste Inspection (SPI) is almost as important as the print process itself. SPI helps maintain process control, dial-in difficult PCBs, track defect trends and feedback positional errors or the need to perform an underwipe to the printer.

    The session starts with basic methods of SPI equipment and their measurement algorithms. It continues with tips for production implementation and setting inspection tolerances. It then introduces simple experimental methods that can be performed quickly and easily to improve yields.

    The differences between accuracy and repeatability are discussed, as are the effects of setting of reference planes and measurement thresholds. Finally, special features of some machines are highlighted, and their impact on the overall printing process output are discussed.

    Finally, new information from current research projects, if available, will be presented.

    Outline:

    Session 1, August 23, 2016
    1. Stencil Verification
    1.1. SPI verification
    1.2. Test coupons
    1.3. SEM images
    1.4. Cleaning before using
    2. Stencil Troubleshooting
    2.1. Physical damage
    2.2. Foil thickness
    2.3. Aperture size
    2.4. Aperture location
    2.5. Impact on AR & TE
    2.6. Cut Quality
    3. Underwiping
    3.1. Purpose and methods
    3.2. UV Test results
    3.3. Solvent requirements
    3.4. Solvent compatibility with solder pastes
    3.5. Solvent and paper compatibility with nanocoatings

    Session 2, August 25, 2016
    4. Automated Solder Paste Inspection (SPI)
    4.1. SPI basics
    4.2. Production implementation
    4.3. Setting inspection tolerances
    4.4. Improving print yields
    4.5. Accuracy and Repeatability
    4.6. Reference planes and measurement thresholds
    4.7. Special features to improve performance

    Who will benefit from this course?

  • SMT assembly process engineers and technicians responsible for production or new product introduction processes
  • Engineers and technicians just entering the SMT field who want to master the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields and identifying root causes of failures
  • OEM supply chain engineers responsible for supporting and/or assessing SMT assembly contractors


  • September 13

    SMTA Webinar: Practical Guidelines in Handling Moisture Sensitivity of SMT Packages  +


    Tuesday, September 13, 2016
    1:00pm to 2:30pm Eastern
    Presented by: Mumtaz Bora, Sr. Staff Packaging Engineer, Peregrine Semiconductor
    Mumtaz Bora
    Complimentary Webinar for Members!

    Overview:
    Handling of moisture sensitive packages is an ongoing learning process in volume manufacturing. Improperly handled and stored MSDs can impact yields and reliability. The presentation will cover a review of the industry standards for MSDs (J-STD-020, J-STD 033 and J-STD 075) and their applications in moisture control. PWBs used for assembly also require controlled storage and handling. Board surface finishes, storage and baking guidelines will be reviewed per the IPC 1601 standard. Handling of MSDs from receipt to use at reflow will be reviewed, including practical guidelines in labeling, tracking, packing, storage and supplier audits.

    About the Presenter:
    Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX. She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation. She has worked with suppliers and subcontractors in several parts of Asia. She is currently a Sr. Staff Packaging Engineer at Peregrine Semiconductor for qualification of RFIC packages for wireless, broadband Automotive and Hi-Rel/Space applications. She is a member of IPC standardization committees and contributes to the standards development. She has 16 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently President of the IMAPS San Diego Chapter and Vice President of SMTA San Diego chapter.


    September 14

    Space Coast Solder Paste Printing Chapter Tutorial Program  +

    Location
    Mack Technologies
    Melbourne , FL 32904



    Instructor: Chrys Shea, Shea Engineering Services

    September 14, 2016
    9:00 a.m. - 4:30 p.m.
    Mack Technologies
    7505 Technology Drive
    Melbourne, FL 32904
    (321) 725-6993


    Registration Deadline is August 31!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!



    Build Your Stencil Printing Expertise!


    The Space Coast SMTA Chapter is hosting a full-day stencil printing tutorial session led by Chrys Shea of Shea Engineering Services. Chrys will deliver decades of hands-on experience and applications research in the science (and art!) of stencil printing.
    The seminar will begin with the basics – solder paste material properties, VIDEOS of paste elasticity during separation, and the importance of proper tooling. Building on this foundation, the class then addresses alignment and gasketing issues, and the most common causes of both.

    After a short break, the class continues with troubleshooting strategies and tactics:
  • Basic 10-minute system check that identifies the root cause 80% of the time
  • Specific checks for root causes of defects not resolved with the overall system check
  • Investigating stencil issues, and the importance of stencil quality

    Nanocoatings are reviewed in detail, starting with their basic functionality and continuing with a comparison of the two major types, wipe-on and spray-on/thermal cure. Data generated by Chrys’ research over the past 5 years will be presented and analyzed. Videos of solder paste release from nanocoated and non-coated stencils demonstrate the substantial differences paste transfer rates. A price/performance payback calculator is also provided.

    After lunch, an extensive review of SPI technology, its capabilities, limitations and common algorithms are presented, and the discussion then turns to implementing and understanding SPI in both the production and laboratory environments. The SPI review concludes with examples of small experiments that can help quickly boost yields.

    The final session of the afternoon explores new and emerging technologies and current research:
  • Dry or solvent underwiping
  • Importance of wiper paper type
  • Under wipe videos
  • The combined effects of nanocoating and wet wiping
  • High tension foils
  • Laser-welded steps
  • Solder paste powder sizes

    This full day tutorial provides attendees with a combination of real-world production-floor experience, practical approaches to process improvement, and the latest research on printing technologies. Attendees will return to work ready to master their print process and start eliminating defects.


    About the Instructor:

    Chrys Shea Chrys Shea
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.

    Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing.

    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.




    Contact Karen Frericks at 952-920-7682 with questions.


  • September 23

    Penang Expo  +

    Location: Eastin Hotel
    1 Solok Bayan Indah, Queensbay
    11900 Bayan Lepas
    Penang


    Exhibitors

    Please see the Penang Chapter Page for More Information on Technical Sessions and Expo Materials.



    Attendees
    Attendees Register Now

    Please see the Penang Chapter Page for More Information on Technical Sessions and Expo Materials.


    September 25 - 29

    SMTA International 2016  +

    Location
    Donald E Stephens Convention Center
    Rosemont , IL


    Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, and Quality and Reliability.


    September 27 - 29

    SMT Processes Certification (SMTA International - Rosemont, IL)  +

    Location
    Donald Stephens Convention Center
    Rosemont , IL


    Co-located with SMTA International Conference.
  • September 27- Course (8:30-5pm)
  • September 28- ½ day of course + exam
  • September 29- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting

    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • September 27 - 28

    SMTA International Electronics Exhibition  +

    Location: Rosemont Convention Center
    Rosemont, IL


    Exhibitors

    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


    October 3 - 5

    SMT Processes Certification (Guadalajara, Mexico)  +

    Location
    Guadalajara , JA Mexico


    Co-located with Guadalajara Expo.
  • October 3- Course (8:30-5pm)
  • October 4- ½ day of course + exam
  • October 5- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting


    October 5 - 6

    Guadalajara Expo & Tech Forum  +

    Location: Hotel Riu Guadalajara
    Guadalajara


    Exhibitors

    Please see the Guadalajara Chapter Page for More Information on Expo Materials.



    Attendees

    Please see the Guadalajara Chapter Page for More Information on Technical Sessions.

    Here is a recap of the 2015 event:


    October 11

    Austin (CTEA) Expo & Tech Forum  +

    Location: Norris Conference Center
    2525 West Anderson Lane
    #365
    Austin, TX 78757



    Exhibitors

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 16th, 2016!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Norris Conference Center Location

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

  • Norris Conference Center Location

  • Free Technical Program & Schedule:

    Exhibit Hours:
    Tuesday, October 11th, 2016
    10:00AM–3:00PM


    8:30AM
    Registration Opens

    9:00AM-9:30AM
    White BeltEpidermal Sensor Systems for Sensing and Therapy
    Pulin Wang, CEO, Stretch Med, Inc.

    The Epidermal sensor system is a class of skin-mounted, tattoo-like circuits and sensors capable of multiple functions, such as continuous vital sign monitoring, human-machine interface, and administering transdermal therapies. Mechanical properties, such as thickness, softness, and mass density are well matched with the human epidermis and are therefore able to form a very intimate contact with human skin thereby providing unprecedented signal fidelity and comfort.

    These systems have successfully demonstrated many functions, including long-term, continuous, measurement of electroencephalogram (EEG), electrocardiogram (ECG), electromyogram (EMG), skin temperature, skin hydration, respiratory rate, blood pressure, and sweat analysis (e.g. glucose and lactate), as well as thermal treatment and transdermal drug delivery. However, the high material and manufacturing cost have greatly hindered the widespread use of disposable epidermal sensors. We therefore invented a cost and time effective, completely dry, benchtop “cut-and-paste” green manufacturing method to produce freeform and portable multi-parametric epidermal sensor systems.

    9:30AM–10:00AM
    White Belt Advancements in Acoustic Micro Imaging
    Jack Richtsmeier, Business Development Manager, Sonoscan, Inc.

    Acoustic Micro Imaging is an established non-destructive inspection technique that applies ultrasound for the inspection of microelectronic packaging, semiconductor devices and associated materials. The technology has been used for bond/disbond assessment, defect and flaw detection as well as materials characterization. Recent advancements and new technological developments have allowed more applications to be resolved within the semiconductor and microelectronics marketplace. Applications will include the following:

    -Very High Frequency Transducers
    -Waterfall & Water PlumeTM
    -3-D Imaging (Virtual Rescan Mode (VRMTM))
    -Frequency Domain Imaging (FDITM)
    -Micro-slicing (SonolyticsTM)
    -Integral Mode Imaging
    -Surface profilometry (Acoustic Surface Flatness (ASFTM))
    -Subsurface profilometry (Profile ModeTM)
    -Multi-layer analysis (SonosimulatorTM)

    This presentation will cover these latest advancements by showing examples and case studies through a variety of advanced packaging, wafer and MEM’s applications.

    10:00AM
    Expo Hall Opens


    11:00AM–11:30AM
    Ed BriggsChallenges for Next Generation Fog and IoT Computing
    Robert Oshana, Director of Software R&D for Microcontroller Products, NXP Semiconductors


    With the ever increasing bandwidth requirements on Internet edge equipment, compounded by the growing need for almost instantaneous content delivery to multiple IoT devices, these demands have created a situation where traditional hardware and software architectures for these edge devices are stressed to a new level. Given the need for this consolidation of both the traditional access-point features along with ”on demand” content delivery capabilities, there is a driving need to investigate new approaches in platform architectures for future edge devices.

    One approach to solving these growing feature consolidation demand trends is to utilize the partitioning qualities found in virtualization techniques for these new edge designs. Virtualization is common in the Cloud and other compute server environments. Providing instant content and internet access at the edge of the network is defined as Fog Computing. With Fog Computing, virtual machine (VM) feature partitioning and capability must be optimized for isolation of features. The performance of these consolidated / partitioned features in various guest VMs and performance optimized I/O for file systems and network interfaces is critical.

    As IoT continues to grow, access points and other edge equipment for IoT devices will evolve into consolidated Fog Servers with multiple features running on the same SoC. These VMs will both share and directly map storage devices and networking interfaces respectively. The introduction of Fog servers have VM demands not seen in the past for equipment at this point in the network. Currently available SoC devices based on ARMv8 64-bit technology, along with a Fog-optimized software architecture with proper feature partitioning and consolidation, can in fact achieve these functional requirements for next generation Fog computing systems.

    This paper will summarize the platform requirements for Fog computing and then show performance data for VM use cases for memory and network devices. The data shows that Fog Computing consolidation is all very possible with existing SoC multicore architectures and the VM over-head incurred in their deployment is very acceptable for these devices.

    12:00PM–1:00PM
    COMPLIMENTARY LUNCH!


    Special Thanks to Our Lunch Sponsor: NPI Technologies






    1:00PM
    Door Prize Drawing and More Networking


    1:30PM–2:00PM
    White BeltHigh Density/High Speed Flexible Circuits
    Steve Kelly, President, PFC Flexible Circuits


    This presentation will focus on materials and design for high density/high speed
    flexible circuits. The following topics will be covered:

    1) What is new in the flex market in terms of applications
    2) New materials
    3) Designing with new materials
    4) Rigid Flex and alternatives to rigid flex
    5) Design guidelines for flex and rigid flex – (this will be an attachment – too big to present)



    3:00PM
    Expo Closes


    October 18 - 19

    International Wafer-Level Packaging Conference Exhibition   +

    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110


    Exhibitors

    Sponsorship Opportunities


    IWLPC Sponsorship Opportunities
    View available Sponsorship and Exhibitor Opportunities




    Exhibitor Information

    Dates: October 18-19, 2016
    Location: DoubleTree by Hilton Hotel, San Jose, CA


    Move-In
    Monday, October 17| 12:00 p.m.-5:00 p.m

    Show Hours
    Tuesday, October 18| 10:00 a.m.-5:00 p.m.
    Exhibitor Reception | 5:30 p.m.-7:00 p.m.

    Wednesday October 19| 9:30 a.m.-3:30 p.m.

    Move-Out
    Wednesday, October 19|3:30 p.m.-7:30 p.m.


    Current Exhibitors and Sponsors- Click here for the Exhibitor FAQ


    Why Exhibit at IWLPC?

    * Reach a focused international audience
    * Generate Exposure in this highly competitive marketplace
    * Share New Products and concepts to the market
    * Enhance Relationships with existing customers and generate new leads

    What's Included?

  • Two Choices:
    8'x10' Pipe & Drape inside exhibit hall (a table & two chairs are provided)
    OR
    6ft table-top outside exhibit hall/foyer (NO pipe & drape, ONLY a table and two chairs)
    View the latest floor plan

  • NEW! Standard Electricity Included
  • Two Free Lunches Per Day
  • Coffee Breaks
  • All Access to the Reception
  • Attendee List (sent after the conference)
  • Show Directory Listing
  • Company Sign
  • IWLPC Proceedings
  • One Conference Pass (a $700 value)

  • How Much is it to Exhibit?

    Early Registration
    Before/On July 27th
    Regular Registration
    After July 27th
    Member Non-Member Member Non-Member
    One Booth
    (8' D x 10' W)
    $1300 $1500 $1500 $1700
    One Table
    (6' Table)
    $900 $1100 $1100 $1300

    What type of attendees will be there?

    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

    Questions?

    Please contact your Chip Scale Review sales representative or Jenny Ng from SMTA with questions or for more information.



    Attendees

    Exhibition: October 18-19, 2016
    DoubleTree by Hilton Hotel, San Jose, CA


    Show Hours
    Tuesday, October 18| 10:00 a.m.-5:00 p.m.
    Exhibitor Reception | 5:30 p.m.-7:00 p.m.

    Wednesday October 19| 9:30 a.m.-3:30 p.m.


    October 18 - 20

    International Wafer-Level Packaging Conference  +

    Bridging the Interconnect Gap

    Location
    DoubleTree San Jose Airport Hotel
    San Jose , CA


    IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


    October 18 - 20

    SMT Processes Certification- Tulsa, Oklahoma  +

    Location
    Ducommun, Inc.
    Tulsa , OK 74146


    Held at Ducommun Incorporated
    11616 E. 51st Street, Tulsa, OK 74146
    .
  • October 18 Course (8:30-5pm)
  • October 19 ½ day of course + exam
  • October 20- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting

    Hotel

    Renaissance Tulsa Hotel and Convention Center offers a corporate rate of $119 plus tax. Call 910-307-2600 and mention "Ducommun."

    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • October 25 - 27

    SMTA-IPC High Reliability Cleaning and Conformal Coating Conference  +

    Location
    Hyatt Rosemont
    Rosemont , IL 60018


    Organized by SMTA and IPC

    October 25-27,2016
    Hyatt Rosemont
    Rosemont,IL


    "How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others.

    Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.

    The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.



    Advance online registration is now closed. Please register onsite.

    Click here to go to the full event website



    Book your hotel here



    Thank you to our sponsors!

    Gold Sponsors
    KYZEN Corporation ZESTRON Americas

    Silver Sponsor/ Tabletop Exhibitor
    Inventec

    Bronze Sponsor/ Tabletop Exhibitor
    Practical Components

    Lanyard Sponsor/Tabletop Exhibitor
    Aqueous Technologies

    Tabletop Exhibitors
    3M

    AAT

    KOLB

    MB Tech

    MicroCare

    Plasma Ruggedized Solutions

    PVA

    Specialty Coating Systems

    Techspray


    October 26 - 27

    High-Reliability Cleaning and Conformal Coating Conference - Expo  +

    Location: Hyatt Rosemont
    Rosemont, IL



    Exhibitors

    Tabletop Exhibit

    Cost: $1300 IPC or SMTA member/$1600 non member

  • One six foot table to be located in the break area
  • One electrical outlet
  • Company logo on all electronic and printed promotional materials
  • Logo on all on-site printed materials
  • List of Conference participants (after the event)
  • One complimentary Conference registration for tabletop staff
  • 20% Discount on one additional conference registration

    Sponsorship Opportunities

    Badge Lanyards

    Badge Lanyards, exhibitor provided $500 IPC or SMTA member / $625 non-member
  • Sponsor logo on electronic and printed promotional materials
  • Opportunity to display sponsor's promotional brochure at Registration counter

    Gold Sponsor

    $2500 IPC or SMTA member / $3125 non-member
  • Includes Sponsorship of Networking Reception (Tuesday) and Plated Luncheon (Wednesday)
  • Recognition as a event gold sponsor on electronic and printed promotional materials
  • Sponsor recognition announced during the reception
  • One complimentary conference registration

    Silver Sponsor

    $1500 IPC or SMTA member / $1875 non-member
  • Includes Sponsorship of Boxed Lunch (Tuesday and Thursday)
  • Sponsor logo on electronic and printed promotional materials
  • Boxed lunch personalized with sponsoring company logo

    Bronze Sponsor

    $1000 IPC or SMTA member / $1250 non-member
  • Includes Sponsorship of all conference Rereshment Breaks for all three days of the conference
  • Sponsor logo on electronic and printed promotional materials
  • Signage with sponsor logo displayed during refreshment breaks for all three days of the conference

    For more info about the program and to register for the conference, click here.


  • November 3

    SMTA Webinar: The Three Fundamentals to the Ultimate Reliability in Consumer Electronics  +


    Thursday, November 3, 2016
    Two convenient times: 11:00am or 2:00pm Eastern
    Presented by: Craig Hillman, Ph.D., DfR Solutions

    Complimentary Webinar for Members!

    Overview:
    The standard rule for reliability has been consumer electronics are cheap, disposable, and poor quality and military/space are robust, long-lasting, and very expensive. What if somebody broke these rules? Can you have a low-cost piece of electronics with very high reliability? How would you do it? What would it mean for every other industry willing to pay large sums to meet market expectations of performance? In this presentation, Dr. Craig Hillman, who has consulted with over 1000 electronic OEMs on reliability, will discuss how certain organizations consistently out-perform their peers in quality and reliability. Based on years of observing multiple organizations in a variety of markets, Dr. Hillman has identified the three key fundamentals that drive reliability excellence. Attend this exclusive webinar and learn how to implement these philosophies into your organization, regardless of whether you are the Vice President of Quality or a beginner reliability engineer.


    Nov 29 - Dec 1

    LED Assembly, Reliability & Testing Symposium 2016  +

    Location
    Crowne Plaza Midtown
    Atlanta , GA 30308


    CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium at the Crowne Plaza Midtown, Atlanta, GA from November 29 to December 1, 2016.

    Thanks for attending the 2016 LED A.R.T. Symposium and Expo. Stayed tuned for 2017 information.

    The LED Assembly, Reliability & Testing (A.R.T.) Symposium will provide attendees with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.



    Acuity Brands Lighting Center Tour

    Wednesday, November 30 | 4:00pm-5:00pm

    Be sure to sign up for the tour of Acuity Brands Lighting Center. You will need to provide your own transportation, but the hour-long tour will be well worth the drive. Get details and sign up on the registration page.



    Keynote Presentations Announced!

    Circular Economy in Lighting: Sustainability beyond Energy Savings
    Makarand H. (Dr. Chips) Chipalkatti, Ph.D., Dr. Chips Consulting LLC
    Tuesday, November 29, 2016 @ 8:30 AM

    LED: Revolution in Light and Displays
    Gary Feather, NanoLumens
    Wednesday, November 30, 2016 @ 8:00 AM



    Technical Program

    The program presentations include (Complete schedule of two day symposium):

  • Thermal, Optical, and Electrical Performance of LED Die Attach
  • Circular Economy Business models for LED Lighting
  • LED Corrosion Failure Mechanisms & Identification
  • Color Shift Analysis and Modeling of High Power pc-LED under High Temperature and High Humidity
  • LED Reliability Assessments as a function of Clean and Not Cleaned Packages
  • Ultra-Thin Coatings to Mitigate Damage of LEDs and Associated Printed Circuit Boards Due to Environmental Exposure
  • Hear from speakers representing all sectors of the LED manufacturing and assembly supply chain including:

    MuAnalysis Mentor Graphics
    Alpha Assembly Solutions Daktronics
    Indium Corporation Creative Electron
    3M NanoLumens
    ECC Corp Corecentric Solutions
    Kyzen Corporation Auburn University
    University of Maryland

    Contact Dr. Diganta Das (diganta@umd.edu) for more information on the technical program and the workshop.



    Workshop

    Light Emitting Diode (LED) Failure Mechanisms, Reliability, and Qualification - Full Day
    Dr. Diganta Das, CALCE - University of Maryland, College Park



    Exhibition

    Exhibitors will include:

  • Kyzen Corporation
  • ESPEC North America
  • Conductive Containers, Inc.
  • Rehm Thermal Systems, LLC
  • ICAPE-USA
  • Creative Electron, Inc.
  • And many more..

  • Nov 29 - Dec 1

    SMT Processes Certification (LED Symposium - Atlanta, GA)  +

    Location
    Crowne Plaza Midtown
    Atlanta , GA


    Co-located with LED A.R.T. Symposium.
  • November 29 Course (8:30-5pm)
  • November 30 ½ day of course + exam
  • December 1- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting

    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • Nov 29 - Dec 1

    LED Assembly, Reliability & Testing Exhibition   +

    Location: Crowne Plaza Midtown
    590 West Peachtree Street Northwest
    Atlanta, GA 30308


    Exhibitors

    Exhibitor Information:

    At the LED A.R.T. Symposium and Exhibition you will network with Assembly/Packaging Engineers, Corporate/General Management, Test Engineers, Designers, Buyers, R&D Engineers, and more.

    Download the brochure for details.

    View the floorplan here

    Cost to exhibit:

    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $750 $850
    One table
    no access to Electrical Outlet
    $700 $800


    Sponsorship Opportunities:

    Lanyard Sponsor: $400/$800 Sold!

  • Provide 150 Lanyards and they will be the official lanyard for the conference(If you would like us to make the lanyards it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • On-site signage (posted throughout conference/expo area)

    Bag Sponsor: $400/$800
  • Provide 150 Bags and they will be the official bags of the conference. (If you would like us to make the bags it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • Logo on all marketing event materials
  • On-site signage (posted throughout conference/expo area)

    Lunch Sponsors: $800
  • Logo recognition in Show Directory
  • Logo recognition and link to company Web site
  • On-site signage (posted throughout conference/expo area)

    Refreshment Break Sponsorships: $550
  • On-site signage (posted near coffee breaks)
  • Recognition in Show Directory

  • Venue Address:
    Crowne Plaza Atlanta Midtown
    590 West Peachtree Street NW
    Atlanta, GA 30308, US

    Table space includes:

  • 6 Foot Draped table
  • Two chairs
  • One Conference Pass
  • Electronic attendee list (sent approximately a week after the conference)
  • Directory listing
  • Lunch


  • Details:

  • You may use your table to display literature, products small pieces of equipment, table top display signs, etc.; we request that any table top items do not exceed two feet.

  • If you wish you can display a banner or some other appropriate type of sign on the front or top of the table.

  • As space is limited we are trying to minimize the space each table takes. If you have a pop-up or other items, please let us know and we'll try to accommodate you.

    SETUP and TEAR DOWN

    Tuesday, November 29
    7:30am-9:30am
    Georgia East

    Boxes will be delivered to Georgia East Hall.

    Show Hours:

    November 29: 9:30am-4:00pm
    November 30: 10:00am–3:30pm

    Dismantle:

    By end of Conference

    SHIPPING INFORMATION

    Please address all packages as follows: LED Symposium/Your Company Name
    Attn: Jenny Ng, SMTA
    Crowne Plaza Atlanta Midtown
    590 West Peachtree Street NW
    Atlanta, GA 30308, US

    • Make sure your company name is visible
    • Due to limited space, please ship packages to arrive no earlier than two days prior to the event.
    • Exhibitors will be responsible for packing, labeling and shipping all outgoing materials. Please bring your own packing slips to ship your materials back.

    DIRECTIONS

    For directions, click here: www.cpatlantamidtown.com/contact/directions

    Getting to/from Hartsfield Jackson International Airport (ATL)

  • Taxi from the Airport to Hotel (15 minutes) Approximately $50
  • MARTA (train) Gold and Red lines run every 9 minutes. Hotel is closest to the "North Avenue" station. (23 minutes) $2.50

    Parking:
    Self-parking is available at a special rate of $15.00 with no in/out privileges. The self-parking garage is located behind the hotel on Spring Street.

    For questions, please contact
    Jenny Ng
    Conference and Education Manager
    952.920.7682
    Jenny@smta.org



    Attendees

    Exhibit Attendee:

    Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Come and visit the exhibits for FREE. Plan to network with leading suppliers in the LED component industry. We will provide you with FREE refreshments.

    Exhibit Hours:
    November 29: 9:30am-4:00pm
    November 30: 9:30am–3:30pm

    View the latest Floorplan


  • December 7 & 8

    SMTA Webtorial: Tin Whisker – All You Should Know   +


    Jennie Hwang Two (2) 90 minute Sessions
    December 7 and 8, 2016
    1:00pm to 2:30pm Eastern
    Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group

    Overview:
    For the recent years, concerns about tin whiskers are intensifying although tin whisker and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The webtorial provides a holistic coverage on tin whisker from physical/phenomenal occurrence to fundamental scientific base to mitigating measures. The webtorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Relative ranking of the tin whisker propensity among lead-free solder alloys in relation to SnPb alloy will be outlined.

    What will you learn:
    Part 1:

  • Definition & clarification
  • Physical phenomena
  • Reference point & criteria
  • Causes and contributing factors
  • Concerns & impact
  • Reliability implications

    Part 2:

  • Test conditions
  • Mitigation remedies - Relative effectiveness
  • Plausible theory / mechanism
  • Tin whisker vs. tin pest
  • Summary
  • Recommendations - prevention & mitigation

    Who Should Attend:
    The webinar provides a working knowledge to all who are concerned with or interested in tin whisker and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

    Bio:
    Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge to this webtorial through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications. She has 450+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker at innumerable international and national events. Dr. Hwang has received many honors and awards. She has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory, and on the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.


  • Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819