Calendar of Events



                                   

2015

January 8 & 15

SMTA Webtorial: Thermal Events: Root Cause Analysis & Prevention for Electronics  +


Two (2) 90 minute Sessions
Thursday, January 8 & 15, 2015
1:00pm to 2:30pm Eastern
Presented by: Cheryl Tulkoff, DfR Solutions

Cheryl Tulkoff



What You Will Learn:
Thermal events in electronics can be described as events where electronics, and potentially the environment surrounding them, are damaged in a manner that results in unplanned heat, smoke, flames, or damage while in operation. Why do thermal events like this occur? They result from a number of factors related to improper choices and variation in:

  • Design
  • PCB materials & construction
  • Input protection
  • Environment
  • Components
  • Quality
  • Electrical Overstress & ESD
  • Customer error / Mistake prevention
  • Sabotage
  • Unknown reasons

    This webtorial is design to walk you through the process of performing analysis on thermal event failures in the field. Analysis techniques and case studies will be covered along with some prevention and protections strategies.

    The course is designed for technicians and engineers working in design, manufacturing, quality, and field failure analysis.

    Webtorial Outline:

  • Background & Introduction
         o Need for Root Cause Analysis
  • Failure Analysis Intro
         o Thermal Events
         o Case Studies
  • Failure Analysis
         o Techniques & Tools for Thermal Events
  • Conclusions

    Instructor Bio:
    Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.

    Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She had held leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years and is also an ASQ Certified Reliability Engineer.


  • January 28

    Rocky Mountain Expo & Tech Forum  +

    Location: West Club at Mile High Stadium
    1701 Bryant Street
    Denver, CO 80204


    Exhibitors

    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on January 12th, 2015!

    NEW SPONSORSHIP! Diamond Vision
    Big Screenm Get your name and logo on the BIG SCREEN at Sports Authority Field and on the screens in the West Club during the Expo! Click HERE for more information

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Sponsorship and Advertising Form
  • Exhibitor Details

  • Exhibitor Floorplan

  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.



    Attendees

    Mark your calendars and plan to attend what is expected to be the Rocky Mountain event of the year. The SMTA Rocky Mountain Chapter is now taking registration for their 2015 Expo. We are expecting a sold out event, connecting exhibitors, and bringing the latest technology to the Rocky Mountain region while presenting impactful and meaningful technical sessions for your continued professional growth.

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Mile High Stadium Backstage Tour of Mile High Stadium
    As a special treat, we will have a backstage tour of Mile High Stadium for 50 attendees. Registrations are limited so book early. Two tours with a maximum group size of 25 each will be provided. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Registration is first come first serve so sign up TODAY! Tours will run at 12:30pm and 2:30pm

    Free Technical Program & Schedule


    Special Thanks to Our Coffee Break Sponsor:
    SVTronics, Inc.



    9:00am – 10:30am
    Opening Keynote Speaker: Phil Zarrow, ITM Consulting
    Phil Zarrow, ITM Consulting "The Deadly Sins of SMT Assembly"

    This technical session identifies the "deadly sins" of SMT assembly, both for Pb-free and "leaded" processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.

    11:15pm – 12:00pm
    Wilfried Clemens, Kolb Cleaning Technology
    Wilfried Clemens, Kolb Cleaning Technology "Cleaning Assembled Printed Circuit Boards: A Crucial way of Enhancing Reliability and Avoiding Problem Field Failures"

    Highly integrated circuitry and the permanent miniaturization make high quality production more and more crucial. Electrical assemblies which are mechanically, thermally or climatically under severe stress will be protected with special paints and coatings against environmental impact such as humidity, high temperature differences and vibration. But this only makes real sense if proper cleaning in all steps of the production process, from stencil cleaning to PCB cleaning prior to coating is guaranteed. This technical presentation will deal with all aspects of cleaning to ensure the reliability of electronic circuitry in the ever changing operational conditions in the most important industrial areas.

    12:00pm - 1:00pm
    Join us for Free Lunch and Networking on the Show Floor - PLUS Door Prize Drawings!

    Special Thanks to Our Lunch Sponsor: NPI Technologies

    Special Thanks to Our Door Prize Sponsors:

    Electrotek
    Electrotek





    Finetech/Martin
    Finetech





    Metcal/OK International
    OKI





    12:30pm - 1:00pm
    First Tour of the Stadium
    Limited to 25 people sign up today!


    1:30pm – 2:15pm
    Afternoon Keynote Speaker: Dr. Bill Cardoso, Creative Electron
    Dr. Bill Cardoso, Creative Electron "SMT LED, BGA, and QFN Inspection"

    In this presentation Dr. Cardoso will cover manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The presentation will focus on the pitfalls of manufacturing and inspecting PCBs with these devices and solution to the technical challenges encountered by luminaire integrators and contract manufacturers. This tutorial is targeted at manufacturing, process, and quality personnel responsible for designing; implementing and/or controlling the surface mount device application and inspection process.

    2:30pm - 3:00pm
    Second Tour of the Stadium
    Limited to 25 people sign up today!


    3:00pm - 5:00pm
    Meet and Greet with the Best in the Business!
    Join us after the show for Networking and Celebration at the West Club at Sports Authority Field




    Enjoy a beverage on our After Party Sponsor:A-Tek Systems


    February 2 - 5

    Pan Pacific Microelectronics Symposium 2015  +

    Location
    Sheraton Poipu Resort
    Kauai , HI


    The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.


    February 10 & 17

    SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices  +


    Two (2) 90 minute Sessions
    Tuesday, February 10 & 17, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Ning-Cheng Lee, Ph.D., Indium Corporation

    Ning-Cheng Lee

    What You Can Learn From This Course:
    Electromigration is migration of metal materials driven by the high current density. With the continuous miniaturization and increasing versatility and speed of electronic devices, the current density of miniaturized solder joints is getting so high that the solder joint integrity deteriorates rapidly due to electromigration. This is particularly true for high power devices. This course covers all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. Electromigration behavior within redistribution layer is also reviewed and discussed. Most importantly, recommendation will be provided about how to achieve long life under high current-stressed conditions for solder joints and redistribution layer through optimized designs.

    Outline:
    1)EM mechanisms

  • Effect of current density and temperature
  • EM path through solder, Al, and Cu
  • Effect of solder grain orientation
  • Effect of solder composition

    2) EM resistance of solder joints
  • Sn vs Pb
  • Pb-containing vs Pb-free
  • Relative resistance of solder, Cu, Ni, and IMC
  • Effect of solder volume
  • Relative performance of solder joints with variation in metallurgy and configuration
  • Recommended designs of solder joints for superior EM resistance

    3) EM resistance of RDL
  • Effect of via diam, pad opening, Cu thickness of UBM, size of taper trace, configuration of RDL vs via location and solder location


    Who Should Attend:
    Any one who wants to know the electromigration phenomenon in details and wants to know how to prevent electromitration within their products should take this course.

    Instructor Bio:
    Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

    Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, and 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference. He was honored as 2002 SMTA Member of Distinction, and received 2003 Lead Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He served on the board of governors for CPMT, serves on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.


  • March 10

    Space Coast Advanced SMT Chapter Tutorial Program  +

    Enabling Implementation of Advanced Technologies

    Location
    Mack Technologies
    Melbourne , FL 32904



    Instructor: Denis Barbini, Universal Instruments

    March 10, 2015
    9:00 a.m. - 4:30 p.m.
    Mack Technologies
    7505 Technology Drive
    Melbourne, FL 32904
    (321) 725-6993


    Registration Deadline is March 5th!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers



    About the Instructor:

    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.


    Contact Karen Frericks at 952-920-7682 with questions.


  • March 17

    Puget Sound Advanced SMT Chapter Tutorial Program  +

    Enabling Implementation of Advanced Technologies

    Location
    Microsoft
    Redmond , WA 98052



    Instructor: Denis Barbini, Universal Instruments

    March 17, 2015
    8:30 a.m. - 4:00 p.m.
    Microsoft
    15563 NE 31st Street
    Redmond, WA 98052

    Registration Deadline is March 12th!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Puget Sound Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers



    About the Instructor:

    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.


    Contact Karen Frericks at 952-920-7682 with questions.


  • March 18 & 25

    SMTA Webtorial: Process Optimization and Defect Elimination for PCB Assembly   +


    Two (2) 90 minute Sessions
    Wednesday, March 18 & 25, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Tim Jensen, Indium Corporation

    Tim Jensen

    Overview:
    In this workshop, a detailed discussion of soldering materials, components, and PCBs will be given to help the attendee understand the important aspects of each to produce a complete electronics product that meets current and future legislative restrictions. Additionally, a detailed discussion of the assembly process will be covered with an examination of process optimization and defect elimination.

    What you will learn:
    1) The Different Solder Alloy Systems (Cost and Reliability)

  • How the Pb-Free Alloys Were Chosen
  • Trends Toward Alternative Alloys
  • The Importance of Dopants

    2) How Solder Paste Selection Influences Profitability, Reliability, and Efficiency
  • Composition: Flux, Powder and the Many Additives
  • Powder Types
  • The Formation of Intermetallics
  • Sn/Pb vs. Pb-Free

    3) Optimizing the Pb-Free Stencil Printing Process
  • Why 65% of Assembly Defects are From Printing
  • SMT Printing Fundamentals
  • Stencil Design
  • Achieving an Optimized Lead-Free SMT Printing Process

    4) The Pb-Free Reflow Process
  • Lead-Free Reflow Differences
  • Ramp to Peak versus Soak Profiles
  • Achieving an Optimized Lead-Free SMT Reflow Process

    5) Pb-Free SMT Defects: Causes and Solutions
  • Tombstoning
  • Graping
  • Head-In-Pillow
  • Voiding
  • Poor Wetting
  • Higher Temperature Issues

    6) Through-hole Soldering Optimization for Defect Minimization
  • Lead-Free Wave Soldering Process Fundamentals
  • Reliability vs. Hole Fill: J-STD-004B Dilemma
  • SAC vs SnCu Alloys
  • Poor Hole Fill
  • Achieving an Optimized Lead-Free Wave Soldering
  • SMT Alternatives to Wave Soldering

    Who should attend:
    This program provides a practical set of information that can be applied for those in electronics manufacturing positions such as process engineering.

    Your Instructor:
    Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.

    Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials


  • March 19

    Free Webinar: Shining a Light on LED Technology   +



    Thursday, March 19th @ 1:00 PM Eastern
    Presenter: Martine Simard-Normandin, MuAnalysis

    Martine Simard-Normandin

    Overview
    Light emitting diodes, LEDs, have evolved tremendously in the last few years. They are no longer relegated to such roles as low output power indicator lights on panels, or seasonal decorative light strings. Just as electronics has infiltrated every aspect of our lives, a LED invasion is aggressively underfoot. Yet the technology behind these devices is poorly understood, often leading to avoidable early failures. In this webinar we will look at every aspect of LED technology. First we will explore the semiconductor devices themselves and the structures within that allow them to be efficient emitters. Next we will focus on high brightness LEDs and review their packaging and assembly challenges. Then we will investigate LEDs in luminaires: the phosphor materials of the LED devices, LED driving circuits, dimming issues. Finally, the long term reliability issues and failure mechanisms of LED devices will be reviewed.

    Topic Outline:
    Introduction

  • What are LEDs
  • History

    Physics of the semiconductor die
  • Band diagrams
  • Types of LEDs
  • Quantum wells
  • Contact metallurgy

    Packaging
  • Heat, heat, heat
  • Lens or no lens
  • Phosphors
  • A19 format

    Reliability consideration
  • Performance
  • LM79 and LM80
  • Failure modes

    Who should attend?
    This webinar presents an overview of current LED technology for design engineers, component engineers, quality engineers and their managers who may not be familiar with the physics, internal structure and reliability issues of LEDs as components.

    Presenter's Bio
    Dr. Martine Simard-Normandin, President, MuAnalysis Inc. Dr. Simard-Normandin has over 30 years experience in microelectronics, specializing in semiconductor device physics, reverse engineering and electrical and material characterization. She has authored or co-authored more than 50 scientific journal and conference papers on microanalysis. Dr. Simard-Normandin holds a B.Sc. in physics from the Université de Montréal, a M.Sc. and Ph.D. in astronomy from the University of Toronto. She was awarded an Industrial Postdoctoral Fellowship from the American Physical Society, focusing on microelectronics, and recently the prestigious Medal of the Faculty of Arts and Sciences of the Université de Montréal. Dr. Simard-Normandin has held the positions of Manager - Materials and Device Analysis at STMicroelectronics’ Centre for Microanalysis and Manager of Materials and Structures Analysis at Nortel Networks. In 2002 she founded MuAnalysis Inc., a privately-owned Canadian company offering expertise in failure analysis, materials analysis and reliability testing.


  • March 19

    Oregon Advanced SMT Chapter Tutorial Program  +

    Enabling Implementation of Advanced Technologies

    Location
    Axiom Electronics
    Beaverton , OR 97006-6939



    Instructor: Denis Barbini, Universal Instruments

    March 19, 2015
    8:30 a.m. - 4:00 p.m.
    Axiom Electronics
    19545 NW Von Neumann Drive
    Beaverton, OR 97006-6939

    Registration Deadline is March 13th!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Oregon Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers



    About the Instructor:

    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.


    Contact Karen Frericks at 952-920-7682 with questions.


  • March 24

    Dallas Expo & Tech Forum  +

    Location: Plano Centre
    2000 E. Spring Creek Pkwy
    Plano, TX 75074


    Exhibitors

    The cost to exhibit is $400/$500 (early/regular) for corporate members. The cost to exhibit for non corporate members is $475/$575 (early/regular).(click here for membership information). The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on March, 3rd, 2015!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Promotional Tools


  • Exhibitor Floorplan

  • See You at the Plano Centre!

    2000 E. Spring Creek Pkwy, Plano, TX 75074



    Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.



    Attendees

    Kyzen Corporation

    Special thanks to our Technical Program Sponsor, Kyzen Corporation!


    Free Technical Program & Schedule:

    7:30AM
    Registration opens

    8:00AM – 9:00AM
    White Belt Lean Six Sigma White Belt Training
    Albert Clary, The SixSigma Way

    Businesses today face mounting pressures to solve resource issues, control costs, and better manage information. Finding ways to actually enable efficiency and productivity remains a challenge for many companies. Top companies with successful track records of significant continuous improvement have discovered one possible solution called Lean Six Sigma methodology. Lean Six Sigma, (LSS) is a relatively unknown approach to most companies. It can do more than simply improve processes, but also assist you in achieving unprecedented operational excellence. When deployed throughout the organization as “the method to do business”, it can help leaders discover a range of opportunities far beyond operations. This would include enhanced financial performance, increased customer satisfaction, improved branding and an organization that has an inherent desire to grow and innovate. During the white belt class you will learn what lean is, what six sigma is, and some of the tools of the DMAIC methodology. Examples of successful deployments from different industries will also be discussed.

    9:15AM – 10:00AM
    Randy PCB Design-To-Cost Drivers
    Randy Mattsen, Field Applications Engineer, ViaSystems

  • Description of the trade-offs and cost impact of design attributes
  • Convey trend data effecting cost  (not to be used for specific quotes)
  • Provide design guidance for attribute selection during the product design phase
  • PCBs are custom designed and require early supplier involvement to achieve the most cost effective product
  • Cost factors relate to panels, not piece part cost directly

  • 11:00AM – 11:45AM
    Irene Sterian ReMAP'ing The Global Market
    Irene Sterian, Executive Director, Celestica/ReMAP

    As “Electronification" continues to proliferate and shape the future of new products, Refined Manufacturing Acceleration Process (ReMAP) focuses on solving global challenges of aging population, energy sources, and the environment and will offer advanced materials and processes for next-generation electronics manufacturing. Irene Sterian will discuss, and present examples, of ReMAP project concepts for miniaturization and cost reduction in Optics and Photonics, Solar Module Energy efficiencies, and alternative materials for lead-free soldering.  

    12:00PM - 1:00PM
    Join us for Free BBQ (with a Vegetarian Option) Lunch and Networking on the Show Floor - PLUS Door Prize Drawings!

    Special Thanks to Our Lunch Sponsor: NPI Technologies

    SVTronics
    Special thanks to our Door Prize Sponsor, SVTronics!


    1:30PM – 2:15PM
    Mike Bixenman QFN Design Considerations to Improve Cleaning
    Mike Bixenman, DBA, Kyzen Corporation

    QFN Design for cleaning research found that the level of flux residue under the bottom termination is reduced when there is a channel for flux volatiles to outgas. When opening spaces under the bottom termination, the ability for air to flow and exhaust during reflow reduces flux residue under the bottom termination. The data conclusively found that when flux volatiles outgas and escape from under the component during reflow, greater than 70% of flux residues outgas with the remaining residue forming around the solder pads. This opens up flow channels to allow the cleaning fluid to penetrate, wet and dissolve remaining residues. The presentation will talk to design considerations that improve cleaning effects and reduce voiding in the QFN ground pad area.


    March 26

    Houston Expo & Tech Forum  +

    Location: Stafford Centre
    10505 Cash Road
    Stafford, TX 77477


    Exhibitors

    The cost to exhibit is $400/$500 (early/regular) for corporate members. The cost to exhibit for non corporate members is $475/$575 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on March 5th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Promotional Tools


  • Please contact SMTA Expo Manager Amanda Dodson with questions or for additional information.



    Attendees

    Free Technical Program & Schedule:

    10:00AM
    Registration opens

    11:00AM-11:45AM
    White Belt Embedded Technology
    Hikmat Chammas, Honeywell

    Continuous demand for additional electrical/electronic functions while maintaining small real-estate has forced the industry toward miniaturization; embedded passive technology has been used to replace passive surface mounted components such as resistors and capacitor in several telecommunications, radio wave, Space applications. The embedded passive technology offer significant component placement reduction over the standard Surface Mount Devices (SMD), and improve the utilization of real-estate for additional functionality and improvement in DFM and reduction in COPQ. Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk.


    12:00PM - 12:30PM
    Join us for Free Lunch and Networking on the Show Floor - PLUS Door Prize Drawings!

    Special Thanks to Our Lunch Sponsor: NPI Technologies


    1:00PM – 1:45PM

    Irene Sterian ReMAP'ing The Global Market
    Irene Sterian, Executive Director, Celestica/ReMAP

    As “Electronification" continues to proliferate and shape the future of new products, Refined Manufacturing Acceleration Processes (ReMAP) focuses on solving global challenges of aging population, energy sources, and the environment and will offer advanced materials and processes for next-generation electronics manufacturing. Irene Sterian will discuss, and present examples, of ReMAP project concepts for miniaturization and cost reduction in Optics and Photonics, Solar Module Energy efficiencies, and alternative materials for lead-free soldering.  



    2:00PM – 2:45PM
    Mike Bixenman QFN Design Considerations to Improve Cleaning
    Mike Bixenman, DBA, Kyzen Corporation

    QFN Design for cleaning research found that the level of flux residue under the bottom termination is reduced when there is a channel for flux volatiles to outgas. When opening spaces under the bottom termination, the ability for air to flow and exhaust during reflow reduces flux residue under the bottom termination. The data conclusively found that when flux volatiles outgas and escape from under the component during reflow, greater than 70% of flux residues outgas with the remaining residue forming around the solder pads. This opens up flow channels to allow the cleaning fluid to penetrate, wet and dissolve remaining residues. The presentation will talk to design considerations that improve cleaning effects and reduce voiding in the QFN ground pad area.


    April 7

    Intermountain (Boise) Expo & Tech Forum  +

    Location: Boise State University
    Student Union Building Jordan Ballroom
    1910 University Drive
    Boise, ID 83725



    Exhibitors


    Boise Expo & Tech Forum has SOLD OUT! Please contact Kaitlyn at kaitlyn@smta.org or call 952-920-7682. Thank you!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details

  • Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    9:00AM
    Registration opens

    10:00AM – 10:45AM
    White Belt Low Standoffs, High Densities, and High Reflow Technologies. The Challenges of Modern Day Cleaning
    Mike Konrad, President, Aqueous Technologies

    Over the past several years, and for an increasing number of electronic assemblers, contamination removal from post-reflow circuit assemblies has transitioned from an “optional” to a “mandatory” process. Ironically, as more assemblies require cleaning, the process of contamination removal has become increasingly challenging.

    Higher component densities, lower stand-off component stand-off heights, and higher reflow temperatures have combined forces that make it both important to remove contamination and difficult to do so.

    This presentation will cover the conventional cleaning challenges associated with modern assembly and component designs and the chemical and mechanical designs required to meet this challenge.

    Modern assembly designs not only dictate new approaches to cleaning, they also change cleanliness testing criteria. The cleanliness “pass/fail” criteria used since the 1970’s is, for many assemblers, outdated. This topic will also be discussed.


    11:15AM – 12:00PM
    Randy Improving Device Reliability When Building Highly Dense Assemblies
    David Lober, Kyzen Corporation

    The miniaturization of modern electronics continues to challenge the effectiveness of common cleaning processes and the ability to obtain desired cleaning performance and optimal yield. Highly dense assemblies have more interconnects per surface area, which results in tighter pitch and lower standoff gaps. As standoff gaps lower, flux residues have less area to outgas during reflow. This results in more active residues under bottom terminations. A longer wash time is typically required to properly clean under the Z-axis.

    Exposed metallization’s outside the solder alloy and pad finish are now common on highly dense assemblies. Reactive metals such as Al, Cu, Ag and Ni can react with cleaning agents. Potential metal incompatibilities has created the need for improved cleaning agents that both clean and not materially attack or corrode exposed metals.

    Companies who require devices to meet long term reliability need an improved industry specification that allows for an accurate risk assessment. The problem is that the risk assessment is a multi-variable issue influenced by flux type, activation temperature, component type and placement; wash characteristics, solder paste volume, PCB cleanliness and component contamination. Generally “clean” does not mean product is clean where it matters most.


    12:15PM - 1:30PM
    Join us for Free Lunch and Networking on the Show Floor


    1:30PM – 2:15PM
    Sheldon Stewart Hot Bar Soldering Challenges & Solutions-Advantages & Challenges
    Sheldon Stewart, Plexus Corporation

    Hand soldering flexible circuits to a rigid substrate is an acceptable process when build quantities are small. As build quantities go up, involving multiple hand solder operators and shifts, consistency and quality will suffer. One solution for this challenge is hot bar soldering. This paper will detail a case where hand soldering was replaced with a hot bar process. Product design considerations, equipment and tooling will be discussed but the focus will be to share the process development methodology and verification. Hot bar soldering can be a very repeatable process with low to moderate capital investment requirement that eliminates the need for skilled hand solder operators.

    2:30PM – 3:15PM
    Christian Vega

    Optimizing Dispensing Performance via Real-Time Feedback
    Christian Vega, GPD Global


    Accurate fluid dispensing is a necessary evil in the manufacturing process. All fluids can’t be simply screened, dipped or sprayed. For most dispensing applications fluids are provided in syringes or cartridges and this fluid is then fed to a dispensing pump. A dispensing pump may be an auger or jetting type for example. When looking closely at the dispensing pumps they are made of high precision parts and high level controllers, so why is it that dispense pumps still have variability during the dispense process and especially from the start to end of a fluid reservoir? During this presentation we shall discuss the reasons for dispense variability and how they can be overcome to make your dispensing process accurate and repeatable from the start to end.

    3:30PM
    Drawing for Door Prizes



    4:00PM
    Show Closes


    April 14 - 16

    South East Asia Technical Training Conference on Electronics Assembly Technologies 2015  +

    Location
    Eastin Hotel Penang
    Penang 55424 Malaysia


    The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

    The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

    The conference is "claimable from HRDF under SBL scheme."


    Technical Program Finalized

    Sessions and topics in our 2015 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.

    View the full program here!




    Intel's Mokler to Give Keynote Address

    How Thinner, Smaller Packages are Challenging Board Assembly Manufacturing

    Scott Mokler, Intel Corporation Scott Mokler, Intel Corporation

    As electronic devices grow in complexity and functionality they are also becoming smaller, thinner and more integrated. This combination, along with the continuous drive for cost reduction, creates a myriad of new challenges for surface mount and assembly processes. At Intel, we are investigating these challenges and exploring opportunities to accelerate Moore’s law though novel SMT and assembly technologies. In this presentation, I will describe our efforts to address the challenges, such as high temperature warpage, and to create opportunities such as Direct Chip Attach (DCA) and System-in-Package (SiP) integration to meet device miniaturization requirements.

    Scott Mokler manages the platform development group within Intel’s Assembly & Test Technology Development Group. His team leads research and development in PCB and SMT technologies as well as board & system test integration for Intel. He has over 50 publications in the areas of semiconductor surface chemistry, semiconductor test as well as PCB and SMT technology. Scott graduated from Oregon State University with a PhD in Chemistry and spent five years as a Research Associate at the Imperial College prior to joining Intel in 1994.





    Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately


  • April 15

    Atlanta 19th Annual Expo  +

    Location: Gwinnett Civic Center
    6400 Sugarloaf Parkway
    Duluth, GA 30097


    Exhibitors

    The cost to exhibit is $400/$500 (early/regular) for corporate members. The cost to exhibit for non corporate members is $475/$575 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $55 per booth. Early bird expires on March 27th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details


  • Meet and Greet with the Best in the Business!

    Join us after the show for an Exhibitor Networking and Celebration at Arena Tavern!
    2000 Satellite Blvd NW, Duluth, GA 30097



    A Special Thank You To Our Meet and Greet Sponsor:











    Please contact SMTA Expo Manager Amanda Dodson with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Show Hours: 10:00AM – 3:00PM

    2016 CHARITY RAFFLE INFORMATION

    The Atlanta Chapter is holding a charity raffle again this year with drawings for great prizes throughout the day. The Food Bank of North East Georgia is a 501 (c) 3 non-profit organization dedicated to help feeding the ill, needy, seniors, and children of northeast Georgia. Their mission is to work toward ending hunger as part of an overall community effort to alleviate poverty. All proceeds from our raffle will benefit this group.

    Exhibitors are invited to donate raffle prizes. Raffle tickets will be sold the day of the Expo, with all proceeds benefiting The Food Bank of North East Gerogia.

    For information on how to donate contact SMTA Expo Manager Emily Stuckmayer at emily@smta.org!

    Gwinnett Braves New This Year!! Attendees will each receive a BINGO card and will be encouraged to visit a specified number of exhibitor booths during the show. Those who submit a completed BINGO card will receive a voucher for a pair of Gwinnett Braves tickets!

    Free Technical Program & Schedule:

    10:30 AM – 11:15 AM
    pH Neutral vs Alkaline Cleaning Agents
    Kalyan Nukala, ZESTRON America Kalyan Nukala, M.S.Chem.Eng., ZESTRON America
    Although modern aqueous alkaline cleaning agents effectively remove flux residues, achieving satisfactory results often requires an increase in temperature, exposure time, chemical concentration, and mechanical energy resulting in material compatibility issues. This presentation includes data from three case studies detailing how newly developed pH neutral formulations have proven to be capable of removing difficult post reflow residues from complex board geometries without affecting material compatibility of sensitive components.


    12:00 PM – 12:30 PM
    Lunch 'n Learn Keynote on the Show Floor

    Understanding the Power of your Network
    Jason Moss, Georgia Manufacturing Alliance Jason Moss, Georgia Manufacturing Alliance
    Be sure to attend this powerful Lunch ‘ Learn session to learn the basics of growing your personal and professional network. Jason Moss, “Master Networker”, will explain the key reasons why you need a strong network and will share a simple action plan that will produce results. Learn how your career will benefit from a strong network, plus seven reasons to build a successful network and three easy steps to get started.



    Thank you to our lunch sponsor World Micro! World Micro

    1:30PM – 2:30PM
    Industry Roundtable
    Moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB, & President of UP Media Group

    Pete Waddell
    Hosted and moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB, President of UP Media Group and a PCB designer for 20 years.



    April 21 - 24

    SMTA China East 2015  +

    Location
    Shanghai China



    April 28 - 30

    SMT Processes Certification (Kokomo, IN)  +

    Location
    Foresite, Inc.
    Kokomo , IN 46902


    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • May 5

    Michigan Expo & Tech Forum  +

    Location: Laurel Manor
    39000 Schoolcraft Road
    Livonia, MI 48150


    Exhibitors


    Michigan Expo & Tech Forum has SOLD OUT! Please contact Kaitlyn to be put on a wait list at kaitlyn@smta.org or call 952-920-7682. Thank you!

    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 10th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Application
  • Exhibitor Details


  • Please contact SMTA Expo Manager Kaitlyn Gherity with any questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    9:00am – 9:30am
    Registration

    9:30am-10:30am
    Substrates and Inks
    Jeff Parker, Insulectro

    Jeff Parker
    This presentation will begin with ink basics and move into ink applications and uses found in manufacturing applications today. The discussion will cover the advantages and disadvantages of using printed electronics, and why it makes sense over traditional methods of electronic circuitry fabrication. A variety of new and evolving uses will be discussed along with practical methods for manufacturing products and devices used in mainstream products on a global scale.

    10:00am
    Expo Opens

    12:00pm-1:00pm
    Free Lunch

    1:30pm-2:30pm
    Design and Assembly for Bottom Terminated Components
    Scott Nelson, Harris Corporation

    Scott Nelson
    Portable electronics, miniaturization, and cost reduction have been key drivers in the dramatic increase in use of bottom termination components (BTC’s) over the past several years. Similar to when the Ball Grid Array (BGA) was introduced into the market, BTC’s have brought with them new challenges and adjustments in design and assembly processes. For high reliability applications, these adjustments must be made with caution to avoid creating the potential for long term reliability issues and latent field defects.

    3:00pm
    Expo Closes

    3:00pm-4:30pm
    Happy Hour



    Join us after the show for an Exhibitor Networking and Celebration in the Aspen Room at Laurel Manor!



    May 5

    Oregon Expo & Tech Forum  +

    Location: Tektronix Building
    38 Conference Center
    Beaverton, OR


    Exhibitors

    The cost to exhibit is $450 for a booth and $350 for a table. The cost to exhibit includes: one 5ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Please note: This year both tabletops and booths will be available. Those purchasing a table top please refrain from using banners, screens etc.

    A $50 discount per booth/table will be offered for multiple spots at one show or one or more in each location.

    Please contact Dave Larson to register for the event.



    Attendees

    Please see the Oregon Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 7

    Puget Sound Expo & Tech Forum  +

    Location: Red Lion Hotel
    11211 Main Street
    Bellevue, WA 98004


    Exhibitors

    The cost to exhibit is $350 for one table, $600 for 2, whether in 1 location or 1 in both locations. The cost to exhibit includes: one 5ft draped table, two chairs, company sign, lunch, directory listing and attendee list.

    Please contact Dave Larson to register for the event.



    Attendees

    Please see the Puget Sound Chapter Page for More Information on Technical Sessions and Expo Materials.

    A Special Thank You To Our Sponsor:






    May 12

    Wisconsin Expo & Tech Forum  +

    Location: Milwaukee Airport Crowne Plaza
    6401 S 13th St,
    Milwaukee, WI 53221


    Exhibitors

    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

    Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.



    Attendees
    Attendees Register Now

    Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 19 - 21

    International Conference on Soldering & Reliability 2015  +

    Location
    Hilton Markham Suites
    Markham , ON Canada


    The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as finer powders in solder paste, heat dissipation, and novel components and technologies.


    May 19

    Carolinas Expo & Tech Forum  +

    Location: Gaston College
    201 Hwy 321 South
    Dallas, NC 28034


    Exhibitors

    The cost to exhibit for corporate members is $350/$450 (Early/Late) and $425/$525 (Early/Late) for non-corporate members.(click here for membership information)

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 17th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Please contact SMTA Expo Manager Amanda Dodson to register.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Tuesday, May 19, 2015
    10:00AM–3:00PM


    9:00AM
    Registration opens

    9:30AM-10:15AM
    New IPC Programs and Specifications for Enhanced Productivity
    Bob Doetzer, Circuit Technology Inc.

    The IPC has several new programs including the IPC Validation Services that are designed to increase efficiency and profitability. They have also recently introduced the revision F of the 610 and J standard as well as their new online testing. This presentation will discuss these new programs and how they may benefit your company.

    11:00AM–11:45AM
    X-Ray Inspection for Solder Paste Voids in PCB Assemblies
    Bill Cardoso, Creative Electron

    Introduction to x-ray technology
    Introduction to GMC
    Case studies - assembly and inspection of:
    LED
    BGA
    QFN

    12:00PM–1:00PM
    Free lunch on the show floor!

    A Special Thank You To Our Lunch Sponsor:













    1:00PM–1:45PM
    Embedded Planar Capacitance and Resistors
    Tom Buck, Viasystems

    This tutorial examines the use of embedded planar capacitance and resistance in high speed applications. Starting with an overview of the power delivery network (PDN) within a PCB, planar capacitance is then introduced as a method of reducing the PDN impedance to improve performance. We will then examine materials and design techniques to minimize resonance values and structures to minimize inductance within the PCB. Following, we will investigate the use of embedded planar resistors to enhance performance in RF and digital applications as well as increasing density. Starting with a basic overview of the manufacturing process we will then look at various design techniques to implement the technology as well as expected performance values.

    2:15PM–3:00PM
    Solid State Lighting "The Good the Bad and the Ugly"
    Dave Cox, Cree Inc.

    A decade in the life of a Lighting Class LED- We will follow an LED from cradle to grave touching on the following topics: packaging , tape and reel, pick and Place, Solder Mask, reflow, chemical compatibility, conformal coating, top 5 ways to kill a LED, Counterfeits and more.

    3:00PM
    Expo Closes


    May 21

    Toronto SMTA Expo & Tech Forum  +

    In conjunction with the International Conference on Soldering & Reliability (ICSR)

    Location: Hilton Toronto/Markham Suites Conference Centre
    8500 Warden Avenue
    Toronto, ON L6G 1A5
    Show Hours: 10:00am - 3:30pm


    Exhibitors

    Exhibit Hours:
    Thursday, May 21, 2015: 10:00am – 3:30pm

    The exhibit floor has SOLD OUT! Please contact Patti Coles at 952-920-7682 for Sponsorship Opportunities.

    Download Exhibitor Details

    Sponsorship Opportunities:
    Click here to download more information

  • Lanyard Sponsor $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Bag Sponsor - $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Coffee Break Sponsor - $550 SOLD!
  • Lunch Sponsor - $800

    Special Thank You to our Sponsors:

    Special thanks to Comtree Inc. as our Expo coffee break sponsor. Coffee Break Sponsor



    Attendees

    Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

    ICSR Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Exhibit Hours:
    Thursday, May 21, 2015: 10:00am – 3:30pm

    9:30am
    Registration Opens

    10:00am
    Expo Opens

    Free Technical Presentations on Printing & Cleaning
    Click HERE to download tech session schedule

    10:00am – 10:30am
    Stencils for Mixed Flip Chip
    Sue Holmes, Photo Stencil LLC

    The requirement to combing FC (Flip Chip) and SMT assembly on the same substrate has increased dramatically with the demand for smaller and smaller assemblies. Stencils play a major role for this mixed technology. This presentation will review several stencil configurations to satisfy these requirements. 3D Electroform Stencils and Step Electroform Stencils for printing flux or paste for FC and paste for SMT in a “Two Print System” will be shown. The first print is normally a thin stencil for printing FC, the second print stencil has a relief pocket wherever the first print stencil applied material. Both FC and SMT reflow at the same time. Another stencil configuration allows paste for SMT to be printed first and flux for FC second using “flux reservoir printing”. The second stencil has a relief pocket where paste was printed with the first print. Reservoir printing is a process where the stencil has a reservoir with apertures in the bottom of the reservoir. Applying positive pressure to the filled reservoir allows material to be extruded through the stencil apertures. Flux or paste reservoir printing is also useful when the FC is attached in a cavity in the substrate. A 3D Electroform stencil is used for this application and will be demonstrated in this presentation. A relief step Electroform ball drop stencil design for printing flux and then distributing solder balls on a substrate having 01005 chips already mounted on the substrate will be described.

    10:30am – 11:00am
    The Development of a 0.3mm Pitch CSP Assembly Process, Part 1: Stencil Printing Considerations
    Mark Whitmore, DEK Printing Solutions

    With shrinking component technology the stencil printing process is becoming increasingly challenged. Not only do long established design rules need to be broken to accommodate finer pitches, but print quality and consistency of print are becoming even more critical in delivering a high yield assembly process.
    A major body of work is currently underway looking at several different aspects of the stencil printing process and their impact upon the assembly process and ultimate reliability of 0.3CSP components.

    In this study a systematic approach is being taken. In the first instance, factors concerning the stencil printing process have been considered. The key learnings from this are now been applied to the assembly of actual components which will subsequently be subjected to reliability testing.
    In Part 1 (to be presented here), stencil printing factors such as aperture design (circles, squares, diamonds), aperture size (150 microns thru 200 microns) and printing technology (standard squeegees, active squeegees) have been investigated. Full details with regards to the results and data analysis will be presented together with conclusions and choices made for subsequent assembly trials.

    11:00am - 11:30pm
    Mike Bixenman How Clean is Clean Enough?
    Mike Bixenman, DBA, Kyzen Corporation

    Highly dense assemblies with small gap distance between adjacent leads or interconnects increases the electric field and potential for leakage currents from contamination sources. Bottom terminated components soldered onto the PCB have flux residue trapped between the component body and board. Ionics in flux residue can exacerbate contamination levels under the component. One concern is when flux residue underfills and bridges conductors. When the Z-Axis is below 50µm, flux cannot properly outgas from under the component. When this occurs, flux residues that flow away from solder pads may be unreacted. These residues are soft and may contain ionic contaminates under the component.

    Pockets of contamination are influenced by numerous factors such as flux type, activation temperature, component type and placement, wash characteristics; solder paste volume, PCB cleanliness, and other sources of contamination. Conductive residues readily lead to leakage currents and electrical shorts. Ion Chromatography and Surface Insulation Test methods are commonly used to assess circuit reliability. A short coming of these methods is their inability to pin point where the location from which harmful contamination resides.

    Surface Insulation Resistance testing can be used to test the resistance between the anode and cathode. When there is ionic contamination present, resistance drops. An improvement to SIR testing has been introduced at the IPC/SMTA High Performance Cleaning and Coating Conference. The method places sensors under component terminations in an effort to measure resistance of the residue at distances close to and away from the pad termination. The theory behind this new test method is to provide a method for accurately measuring resistance of the contamination at the specific area under the component. The purpose of this research is to use this new test method to measure the resistance on non-cleaned and cleaned test boards using a low residue, rosin and water soluble solder pastes under a series of bottom termination components. Testing the location, flux type, quantity and mobility may provide an improved risk assessment of reliability expectations.

    11:30am - 12:00pm
    Verification of Cleaning Under Leadless Components
    Ishrat Hasan, Creation Technologies

    The continuous miniaturization of electronic devices provides increased challenges for assembling PCBs with higher-density components. The use of fine-pitched and low-standoff components, combined with the necessity of having circuit board assemblies free of ionic contaminants from flux residue becomes an ever-increasing challenge for the manufacturing process, especially during the washing stage.
    It is important that a robust washing process is established and a process control maintained for ensuring total removal of flux through reliable cleaning.
    This paper will discuss some of the work done by the author for the qualification of a reliable and effective washing process under low-standoff components and its detection method. The paper covers the work on:

  • Cleanliness of water-soluble solder paste residue under low profile components
  • Practical methods for achieving a reliable cleaning process
  • Verification method for the cleanliness

    12:00pm - 1:30pm
    Free Lunch on Show Floor!

    3:00pm
    Dessert & Coffee Break!
    Provided By Special thanks to Comtree Inc. as our Expo coffee break sponsor.

    3:30pm
    Expo Ends


  • May 22 & 29

    SMTA Webtorial: Solder Joint Voids – All You Should Know   +


    Two (2) 90 minute Sessions
    Friday, May 22 & 29, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Jennie Hwang Ph.D., H-Technologies Group

    Jennie Hwang

    Overview:
    Three fronts in the industry rekindle the interest and concern about solder joint voids – the increased use of newer packages (BTCs, PoPs), the ever-miniaturized electronics containing “smaller” solder joints, and the increased demand in solder joint reliability for high reliability products. Different types of solder joint voids, their causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance and the steps to minimize solder joint voids will be outlined.

    What will you learn:
    Part 1:

  • Potential effects
  • Likely impact on Reliability
  • Case studies
  • Different Sources
  • Factors contributing to each of the sources
  • Role of solder alloy composition

    Part 2:
  • Mitigating approaches
  • BGA voiding – additional factors
  • BTC solder joint voids
  • Voids criteria vs. applications
  • Inspection
  • Summary

    Who Should Attend:
    The course provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

    Bio:
    Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge and experience to this tutorial through both hands-on and advisory capacities. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications. She has 450+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker in innumerable international and national events. Dr. Hwang has received numerous honors and awards. She has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory, and on the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.


  • June 4

    Huntsville Expo & Tech Forum  +

    Location: Von Braun Center
    700 Monroe Street
    Huntsville, AL 35801


    Exhibitors

    The cost to exhibit for corporate members is $400/$500 (early/late) and $475/$575 (early/late) for non-corporate members. The cost to exhibit includes: one 8x10 booth, one 6ft draped table, two chairs, company sign, reception, directory listing and attendee list. Electricity is an additional $30 per outlet. Earlybird pricing expires May 15th, 2015.

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details

  • Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    9:00AM
    Registration opens

    9:30AM – 10:30AM
    Tom Borkes On-Shoring: Competing in High Labor Rate Environments - The Critical Success Factors
    Keynote: Tom Borkes, The Jefferson Project

    The “experts” say, the U.S. will always assemble electronic products in prototype, low and medium volumes, but high volume production is gone forever – relegated to low labor rate regions of the world. However, what actually costs more to assemble per unit: 100 cell phones or 1,000,000 cell phones? Shouldn’t the labor, setup and tooling cost LESS per unit for high volume production? Why aren’t we more competitive in high volume than in low volume assembly?
    We often fail to recognize that there a two ways to reduce product assembly labor cost: Reducing labor rates AND reducing labor content. The latter is harder, but in many applications more prudent. This presentation addresses the three critical success factors involved in labor cost that result in successfully competing with low labor rate production. A case study is used to demonstrate how the proper use of automation is an effective counterweight to low labor rate competition.

    11:00AM – 11:45AM
    Bill LED, BGA, and QFN Inspection
    Bill Cardoso, Creative Electron

    In this presentation we will cover the manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The presentation will focus on the pitfalls of manufacturing and inspecting PCBs with these devices and solution to the technical challenges encountered by luminaire integrators and contract manufacturers. This presentation is targeted at manufacturing, process, and quality personnel responsible for designing; implementing and/or controlling the surface mount device application and inspection process. Those personnel responsible for training operators and technicians to perform assembly inspection or control the manufacturing process would also benefit from this presentation.

    12:00PM - 1:00PM
    Free Lunch

    1:00PM – 1:45PM
    Mike Bixenman PCB Surface Cleanliness May Not Tell the Whole Story
    Mike Bixenman, DBA, Kyzen Corporation

    This presentation talks to Surface Insulation Resistance and Ionic Species testing advancements. Surface Insulation Resistance testing can be used to test the resistance between the anode and cathode. When there is ionic contamination present, resistance drops. The method places sensors under component terminations in an effort to measure resistance of the residue at distances close to and away from the pad termination. The theory behind this new test method is to accurately measure resistance of the contamination at the specific area under the component. Testing the location, flux type, quantity and mobility may provide an improved risk assessment of reliability expectations.

    2:00PM – 2:30PM
    Tom Borkes Silicon Biometric for Component Authentication
    Jim Lewis, Lewis Innovative

    Silicon Biometrics are based on intrinsic characteristics of the silicon that is resistant to forgery and counterfeiting. This presentation will define Silicon Biometrics and explain how Silicon Biometrics can be used to detect counterfeit components and authenticate genuine components.


    June 9

    Capital Advanced SMT Chapter Tutorial Program  +

    Enabling Implementation of Advanced Technologies

    Location
    ZESTRON Americas
    Manassas , VA 20109





    Instructor: Denis Barbini, Universal Instruments

    June 9, 2015
    9:00 a.m. - 4:30 p.m.
    ZESTRON Americas
    11285 Assett Loop
    Manassas, VA 20109
    (703) 393-9880


    Featuring Hands-On Learning & Demos in Zestron's Technical Center!
    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Capital Chapter Officers: $100
  • ZESTRON Employees: $100
  • Student Chapter Members: $50
  • Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price.)


  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory works with countless novel technologies in electronics manufacturing. From fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials. Incorporating these enabling technologies presents the challenges – process change requirements? Yield, and ultimately reliability, impacts? These novel technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). These lessons reveal through discussions of material selection, current electronics research, and case studies. Further review of design considerations for many advanced assembly processes as well as various types of analytical techniques for materials characterization round out the course.

    What you will learn:

  • Trends in component evolution & how to overcome the associated implementation challenges
  • Best practices in assembly – printing, inspection, placement, & soldering
  • Understanding challenges in materials – alloys, pastes, PCB finishes, etc…
  • Analytical testing techniques & how to identify root causes for production failures.
  • Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Who should attend:

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers



    About the Instructor:

    Denis Barbini Denis C. Barbini, Ph.D.
    Denis is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, several books and presented to thousands of his peers on the results of his research over the past 14 years. Denis has traveled the electronics manufacturing world visiting over 30 countries providing guidance and solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes that deliver the specified functionality and reliability. Denis volunteers his time serving on the board of the Surface Mount Technology Association. For the past 7 years, his focus has been on implementing new programs that deliver leading edge technology solutions for the user.


    Contact Karen Frericks at 952-920-7682 with questions.


  • June 11 & 18

    SMTA Webtorial: PCB Fabrication Methodologies and Strategy for Embedding Passive and Active Components  +


    Thursday, June 11 & 18, 2015
    1:00pm - 2:30pm Eastern
    Instructor: Vern Solberg, Solberg Technologies

    Vern Solberg

    Overview:
    Although the printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces, companies attempting to improve functionality and minimize space are now considering embedding a broad range of components within the circuit structure. Both uncased active and passive component elements are candidates for embedding but the decision to embed components within the multilayer circuit structure must be made early in the design process. Some components are easy candidates for integrating into the substrate while other may involve more complex processes and will be difficult to rationalize. Although a majority of the discrete passive and active devices may remain mounted on the outer surfaces of the multi-layer board, embedding one or more silicon based semiconductor elements within the inner layers of the structure will enable greater utilization of the circuit boards outer surfaces. Benefits can include improved performance, For example, by embedding the semiconductor on an inner layer of the circuit directly in line with a related semiconductor package mounted on the outer surface, the conductor interface can be minimized. The close coupling of semiconductor elements significantly reduces inductance and contributes to increasing signal speed.

    Course objectives:
    This course was developed to better enable the product designer and manufacturing specialist to have a clear understanding of the principles for electronic packaging by embedding components in an organic multilayer circuit board structure. The course will include design guidelines, material selection and termination methodology for embedding both ‘active and passive components including resistor, capacitor, inductor and discrete transistor elements. Process variations for embedding and interconnecting thinned semiconductor elements within the multi-layer PCB will be illustrated with examples of core type and coreless substrate structures.

    Who Should Attend?
    The material presented has been specifically prepared for PCB Designers, Design Engineers and those responsible for electronic product development, assembly processing and manufacturing efficiency. This would include manufacturing and test engineering specialists for the OEM, ODM and EMS providers.

    Course Outline
    Part One: EMBEDDED COMPONENT PCB DEVELOPMENT

    Planning strategy

  • Market drivers for miniaturization
  • Total circuit consideration
  • Internal component mounting
  • External component mounting
  • Circuit interface variations

    Layout strategy
  • Embedded passives mounting plus external attachment
  • Passives inside mounting structure plus external attachment
  • Embedded actives and passives plus external attachment

    Base materials and build-up structures
  • Organic base material selection criteria
  • Conductor characteristics (copper foil/film)
  • Passive component forming material and process
  • Discrete passive component selection
  • Solder and other attachment materials

    Part two: EMBEDDED COMPONENT PCB FABRICATION PROCESS VARIATIONS
    Core and coreless structures

  • Two sided base core (with or without vias)
  • Multilayered base core (with or without thru, blind, or buried vias)
  • Die first coreless package processing

    Embedded component PCB development
  • PCB supplier selection
  • Land pattern development
  • Component termination guidelines
  • Plating and coating alternatives

    Component attachment process
  • Preparation for component placement
  • Assembly process variations for passive components
  • Preparation for embedding active die elements
  • Assembly process variations for active die elements

    About the presenter:
    Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas related to both commercial and aerospace electronic product development and is active as an author and as an educator. In addition to tutorial and workshop programs for industry related events Mr. Solberg has been involved with the training of both students and faculty members at the University of Wisconsin, School of Engineering in Milwaukee and Kansas State Universities Microelectronics Laboratories in Salina.

    Solberg holds several patents for 3D IC packaging innovations including the folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication. Vern also participates in and supports several industry organizations including IPC, SMTA , IEEE and IMAPS.


  • June 18

    Philadelphia Expo & Tech Forum  +

    Location: Valley Forge Casino Resort
    1160 First Ave.
    King of Prussia, PA 19406


    Exhibitors

    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on May 22, 2015!

    Click here for Ad and Sponsorship opportunities!

    Click Here for Hotel Accommodations!

    Please contact SMTA Expo Manager Amanda Dodson with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, June 18, 2015
    10:00AM–3:00PM


    9:30AM
    Registration opens

    10:00AM-10:45AM
    The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance
    Mitch Holtzer, Global Director CTS, Alpha an Alent plc Company

    Electrical reliability is a fundamental requirement for every circuit assembly. Surface insulation resistance is a globally accepted standard for predicting the electrical reliability of a printed circuit. This paper will attempt to measure how the reflow profile used in an SMT process affects the electrical reliability of three no-clean solder paste residues.

    Three different reflow temperature vs. time profiles, a 1.5 °C/s ramp to 230°C, a 1.5 °C/s ramp to 250°C and a 90 s soak at 175°C with a 230°C peak, were used to reflow three lead-free solder pastes in both air and nitrogen atmospheres. Fourier transform infrared spectra of the reflowed flux residues shows how reflow profile conditions and atmosphere affects the decrease of a peak around 1700 cm-1 and the appearance and increase of another peak at 1600 cm-1. The 1700 cm-1 is smaller for flux residues that were reflowed under hotter conditions and for those that were reflowed in air. The peak at 1600 cm-1 is larger for residues exposed to hotter reflow profiles in air, but is hardly present for residues reflowed in nitrogen. The affect of these reflow conditions on surface insulation resistance (SIR) per IPC-TM-650 Method 2.6.3.7 at 40°C 90% RH and 12V bias has been studied. This measurement shows that hotter reflow conditions result in higher SIR values for two of the pastes, as would be expected, but has a smaller affect on the third paste.

    11:15AM–12:00PM
    What Am I looking At??
    John Travis, Sales Manager, Nordson Dage and Nordson Yestech

    This presentation is designed to give you a better understanding of how to interpret PCB level defects using Digital High Resolution X-Ray. You will be exposed to many different types of solder related defects such as head-in-pillow, BGA and substrate opens. This seminar will give you a better understanding of what you are going to see using today’s high magnification, high resolution digital x-ray systems.

    12:00PM–1:00PM
    Free lunch on the show floor!

    1:00PM–2:00PM
    Requirements for Aviation, Space and Defense Organizations
    Richard A. Litts, President, Litts Quality Technologies, Inc.

    Richard Litts of Litts Quality Technologies, Inc. will present an AS9100 Rev. “C” Quality Management System (QMS) ~ Requirements for Aviation, Space and Defense Organizations Overview session for the Surface Mount Technology Association.

    The presentation will cover the: Goals and objectives of the AS9100 Rev. “C” standard Interaction of the ISO 9XXX:20xx QMS Family of Standards Concepts and language of AS9100 Rev. “C” Standard The 8 - Quality Management Principles The Process Approach of the standard The Process Effectiveness Assessment Report (PEAR), and The Registration Process



    2:00PM–3:00PM
    Happy Hour

    3:00PM
    Expo Closes

    A Special Thank You To Our Sponsor:






    June 23 - 25

    Symposium on Counterfeit Parts and Materials   +

    Location
    Marriott Inn & Conference Center
    Hyattsville , MD 20783


    Technical Symposium: June 23-24, 2015
    Expo: June 23-24, 2015
    Workshops: June 25, 2015

    University of Maryland, College Park, MD

    SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Parts and Materials. The program will be held June 23-25 at the Marriott Inn & Conference Center next to the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.

    Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.


    Keynote: Functional Clones – The Most Dangerous NEW Counterfeit Threat Facing D&A Industry Manufacturing Today

    Tom Sharpe, SMT Corporation
    Tom Sharpe, SMT Corporation
    Defense Industry OEMs are now facing a much more insidious counterfeit threat than at any time in the past. The existence of cloned electronic components bearing the markings of major component manufacturers in today's global supply chains has been recently clearly established within SMT Corporation's labs. The most worrisome aspect of these "made from scratch" fakes is their ability to easily pass visual package inspection AND electrical testing to the manufacturers data sheet. In his keynote presentation at the Symposium on Counterfeit Parts and Materials, Tom Sharpe, SMT Corporation, will share some good examples of this most concerning counterfeiter capability as well as some cutting-edge counterfeit mitigation processes to identify this dangerous material.


    Session Topics Include:
  • Impact of supply chain changes on the component management practices: quality, reliability, manufacturability
  • Electronic parts distribution: current stage and evolution
  • Authentication techniques for securing electronic part supply chain
  • Federal procurement practices and its impact on electronic supply chain
  • Inspections tools and techniques for detecting counterfeit parts
  • New areas of counterfeit concerns: materials, energy storage
  • Industry and international working groups and standards on electronic part supply chain and counterfeit electronic parts


  • The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


    July 8

    Free Webinar: LEDs and Solid State Lighting Ecosystem   +




    Wednesday,July 8th @ 1:00 PM Eastern
    Presenter: Makarand “Chips” Chipalkatti, Ph.D., Senior Director, Solid State Lighting (SSL)

    Makarand “Chips” Chipalkatti

    Overview
    Over a decade and a half ago, when LED lighting was a subject of debate and considerable disbelief, some had predicted a disruptive change in the lighting industry of the sort that happens once in a generation. This disruption is now real, and the lighting industry is clearly undergoing tectonic change in rapid fire mode. Every major incumbent manufacturer is undergoing constant reorganization, while new start-ups emerge claiming a place in the new lighting industry. Yet, LED lighting has not generated the sort of profits expected despite significant growth. Global supply chains and fierce competition by hundreds of new players has created quite a challenge. Yet, there is great opportunity in this industry expected to be $21B by 2018 according to a recent report. Where do those opportunities lie and where are the new growth areas for industry players in the lighting, semiconductor, and electronics industry? This talk will cover some of the transformation process and point to the areas of current and future change. Future growth corridors that are now visible will also be discussed.

    Presenter's Bio
    Dr. Makarand “Chips” Chipalkatti was till recently Senior Director, Solid State Lighting (SSL) and Emerging Market Initiatives for OSRAM SYLVANIA. Since March 2010 his primary focus was on executing innovation, and as a solid state lighting evangelist for OSRAM. Chips received a Ph.D. in Polymer Science & Eng. from Univ. of Massachusetts and a B.Tech Chem. Eng. from IIT Bombay. His early work included research on advanced materials and organic light sources. Chips transitioned from technology development to commercial execution of technology in 2000, when he led the start-up of OSRAM’s LED lighting business in North America. Since 2005, Dr. Chips led the Strategic Innovation Management function for OSRAM SYLVANIA and continued to serve as a key member of OSRAM’s global innovation leadership. Chips’ role as a corporate entrepreneur has led to several new business initiatives and open innovation projects. Dr. Chips has also played a pioneering role in the Solid State Lighting industry as an industry leader in various trade bodies and working with public agencies. Dr. Chips has now launched an executive consulting practice focusing on industry transformation, innovation and entrepreneurship with special emphasis on the commercialization of innovation. He serves globally as an industry consultant for product, services and business strategy targeting technology intensive verticals including the emerging Ecosystem of Solid State Lighting.


    July 16

    Ohio Expo & Tech Forum  +

    Location: Doubletree Cleveland - Independence
    6200 Quarry Lane
    Independence (Cleveland), OH 44131


    Exhibitors


    The Ohio Expo & Tech Forum is SOLD OUT! Please contact Emily to be put on the waiting list for the show at emily@smta.org or call 952-920-7682. Thank you!

    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on June 19th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details
  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, July 16, 2015
    10:00AM–3:00PM


    9:00AM
    Registration opens

    A Special Thank You To Our Breakfast Sponsor:









    9:30AM-10:15AM
    Evaluating Conformal Coatings Using Accelerated Atmospheric Corrosion Tests Abstract
    Dr. Barry Hindin, Senior Research Scientist, Advanced Materials Group at Battelle

    Conformal coatings are most often used to provide protection to circuit boards from humidity and mechanical damage. Some conformal coatings have been found, however, to actually exacerbate the damage to silver-bearing surface mounted components when exposed to sulfur vapor-bearing environments. This presentation will present the various accelerated tests used to evaluate conformal coatings and their ability to protect against formation of silver sulfidation and copper creep corrosion as well as examples of successful conformal coatings.

    12:00PM–1:00PM
    Free lunch on the show floor!

    A Special Thank You To Our Lunch Sponsor:









    1:00PM–1:45PM
    X-Ray Inspection for SMT Quality Assurance and Control
    Bill Cardoso, Ph.D., Chief Executive Officer and founder of Creative Electron.

    Radiography is a well established technique widely utilized for quality control and assurance. In this presentation we will focus on modern radiography techniques and how they have been deployed in the inspection of failures in printed circuit boards (PCB) during the assembly of LEDs, BGAs, and QFNs. The target audience for this topic includes technical teams looking for specific answers to challenging assembly and inspection questions and business teams trying to understand how quality impacts the bottom line.

    3:00PM
    Expo Closes


    August 11 & 18

    SMTA Webtorial: Solder Paste Printing and Inspection  +


    Chrys Shea Two (2) 90 minute Sessions
    Tuesday, August 11 and 18, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Chrys Shea, Shea Engineering Services

    Overview: This two-part webtorial combines the basics of SMT solder paste stencil printing and process troubleshooting with an overview of automated Solder Paste Inspection (SPI) technologies in both laboratory and production environments.

  • Process basics include material properties, process steps and the mechanics of proper printer setups.
  • Process troubleshooting builds on the basics to help attendees identify potential root causes of print quality problems and how to diagnose them.
  • The SPI overview discusses the three major types of SPI measurement technologies and the similarities and differences in their measurement algorithms.
  • Laboratory use of SPI demonstrates how the technology is used in stencil printing research and development studies.
  • Production use of SPI discusses the importance of print yields, appropriate tolerance settings, considerations in transfer efficiencies and statistical process control.

    Who will benefit from this course?

  • SMT assembly process engineers and technicians responsible for production or new product introductions processes
  • Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields
  • OEM supplier quality engineers responsible for supporting and/or assessing SMT assembly contractors

    Instructor Bio:
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.
    Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.
    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.


  • September 1 & 3

    SMTA Webtorial: Design for Cleaning and Reliability  +


    Two (2) 90 Minute Sessions
    Tuesday, Sept 1 and Thursday Sept 3, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Mike Bixenman, Kyzen Corporation

    Overview:
    Reliability engineering challenges the complexity of systems, performance and environments. Reliable hardware is more challenging to reproduce due to component size, residues trapped under bottom terminations, shorter distance between conductors, higher pinout devices in a smaller footprint, increased electrical field and environmental factors. There is no one universal test method for quantifying reliability risks. The amount and nature of the data generated depends on the product being produced, the consequences of failure and the end-use environment.

    Residues under component terminations can impact device functions over time. The problem is that the standoff heights within the Z-Axis of miniaturized components are approaching one mil. During reflow, flux residues can become entrapped under the bottom terminations. Mobile ions within the flux residues form leakage currents, especially when the device is operating within humid environments. Ionics in flux residue can exacerbate contamination levels under the part, which can lead to high resistance shorts across pads.

    Companies who require devices to meet long term reliability must clean electronic hardware. This two part Webtorial will teach Design for Cleaning and Reliability.

    Topics Covered:
    Session #1: Design for Cleaning
  • Interrelationships surrounding the Cleaning Process
  • Reduction of Residues under Bottom Terminated Components
  • Cleaning Process Factors
  • Matching the Cleaning Process to the Application
  • Material Compatibility
  • Process Control
  • Tracking and Monitoring

    Session #2: Design for Reliability
  • Failure Modes
  • Materials Characterization
  • Process Validation
  • System Health Condition
  • Monitoring
  • Continuous Improvement

    Instructor Bio:
    Dr. Mike Bixenman is the Chief Technology Officer and Co-Founder of Kyzen Corporation. Mike is an active research fellow who tackles industry problems by running collaborative research studies with industry experts. The co-authors of this research – Mark McMeen and Jason Tynes of STI Electronics designed the Sensor Test Board / Test Method and David Lober of Kyzen Corporation worked on the test method. Kyzen has joined the STI research team to conduct research on an improved test method to measure the resistance of residues from non-cleaned and cleaned test boards using low residue solder pastes under a series of bottom terminated components.


  • September 15

    Free Webinar: Solder Paste Print & Reflow Problems - Causes & Cures   +



    Tuesday, September 15, 2015 @ 1:00 PM Eastern
    Presenter: Bob Willis, SMTAI Feature Organiser

    Overview
    Printing solder paste or other conductive material requires zero defects printing if a high first pass yield is to be achieved when using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect?

    Correct printer set-up, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspections is required in other AOI applications like solder joint analysis. there are common process defects during printing and reflow and with this webinar we show you the causes and cures to help your yield improvement.

    The webinar will be presented by Bob Willis SMTAI Feature Organiser.

    Topics covered in the webinar:

  • Solder paste inspection standards
  • Soldering yield impact with poor printing
  • Common solder paste defects
  • Impact on reliability based on paste thickness
  • Solder joint inspection defects
  • Common process defects causes and cures

    A copy of each of the slides presented will be sent out after the webinar.

    The webinar will run for between 60-90min with question and answer session and limited to 100 people.


  • September 16 - 17

    Medical Electronics Symposium 2015  +

    Location
    Marylhurst University
    Portland , OR


    Final Attendee Details



    SMTA, INEMI, MEPTEC and OregonBio have joined forces to again host this international conference, focusing on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. Last year’s conference attracted about 200 attendees and more than 30 exhibitors. Prior to last year, MEPTEC's and SMTA's conferences were held in Phoenix, Arizona and Milpitas, CA, respectively, drawing technology experts, entrepreneurs and service providers that work in this niche technology space. Typical applications within this space involve implantable defibrillators, neurostimulators and drug delivery, interventional catheters, pillcams, ultrasound transducers, hearing aids, biosensors, microfluidics, wireless communications, as well as future diagnostic and treatment solutions that may use stretchable electronics, microelectromechanical systems (MEMS) or nanoelectromechanical systems (NEMS).



    View current program here.




    Keynote Address: Soft Electronics for the Human Body

    John Rogers John A. Rogers, Ph.D., University of Illinois

    Recent advances in materials science and mechanical engineering enable construction of high performance optical and electronic microsystems that can flex, bend, fold and stretch, with ability to accommodate large (>>1%) strain deformation with a purely elastic mechanics. Such technologies can be integrated intimately and non-invasively with the surfaces of important organ systems in the human body.

    This talk summarizes fundamental and applied aspects of three recent examples that address currently unmet clinical needs:
    (1) 'skin-like', wearable electronics for continuous, clinical quality measurements of health status,
    (2) high resolution mapping systems capable of resolving fast, transient behaviors in brain activity, and
    (3) soft sensors and stimulators for advanced forms of cardiac electrotherapy.

    Professor John A. Rogers obtained BA and BS degrees in chemistry and in physics from the University of Texas, Austin, in 1989. From MIT, he received SM degrees in physics and in chemistry in 1992 and the PhD degree in physical chemistry in 1995. From 1995 to 1997, Rogers was a Junior Fellow in the Harvard University Society of Fellows. He joined Bell Laboratories as a Member of Technical Staff in the Condensed Matter Physics Research Department in 1997, and served as Director of this department from the end of 2000 to 2002. He is currently Swanlund Chair Professor at University of Illinois at Urbana/Champaign, with a primary appointment in the Department of Materials Science and Engineering. He is also Director of the Seitz Materials Research Laboratory.




    Keynote Address: vBloc Neurometabolic Therapy: Pioneering Micro-electroceutical Treatment of Metabolic Disease

    Mark B. Knudson Mark B. Knudson, Ph.D., FAHA, EnteroMedics, Inc.

    The concept of treating disease with electroceuticals – using electrons instead of molecules, has gained currency in recent years within the medical, scientific and engineering communities. Early success has come with the application of microelectronic techniques to up-regulating neuromodulation implants, or neurostimulators. Neurostimulation is the therapeutic activation of the nervous system utilizing a pulsed waveform delivered by microelectrodes. A majority of the work being done in the electroceuticals arena has focused on this form of neuromodulation which seeks to increase neurophysiologic activity using low frequency, low amplitude electrical pulse trains. To date this technology has been utilized in the treatment of a number of conditions including hearing loss, epilepsy, pain, and abnormal heart rhythms, to list a few. EnteroMedics’ approach is different from these previous electroceutical neuromodulation devices. vBloc Neurometabolic Therapy has pioneered the blocking part of the neuromodulation spectrum. Rather than increasing neural signals, this therapy interrupts them using a unique algorithm with high frequency, low amplitude waveforms that lead to the blocking of the neurophysiologic transmission on the axon, putting vBloc Neurometabolic Therapy in a neuromodulation category all its own, neuroblocking. Obesity and metabolic disease are an ideal first target for this therapy. By blocking the signals between the gut organs and the brain rather than altering the anatomy, we are offering people with metabolic disease and obesity an option they have not had before – a minimally-invasive, non-anatomy altering solution. vBloc therapy works by controlling hunger and changing a patient’s relationship with food. This presentation will address the development of vBloc Neurometabolic Therapy from scientific concept through a January 2015 FDA approval and its relationship to future trends in this fast-growing field.

    Dr. Knudson is Founder, Chairman, President and Chief Executive Officer of EnteroMedics Inc (NASDAQ:ETRM), a position he has held since 2003. He has previously served as managing partner of an early stage venture capital firm and as President of Johnson and Johnson Professional Diagnostics, a Johnson and Johnson Company, following Johnson and Johnson's (NYSE:JNJ) acquisition of Arden Medical Systems, a company he founded in 1983. Subsequently, Dr. Knudson was the founder or involved in the founding of over 20 healthcare companies and successfully exited via acquisitions or initial public offerings (IPO). He held positions in Research and Development management at Cardiac Pacemakers, Inc. (CPI-Guidant) and was a member of the faculty of the University of Washington School of Medicine in Seattle, Washington. He was the recipient of an Individual Post-doctoral Fellowship Award from the National Institutes of Health. Dr. Knudson received the Ph.D. degree (Physiology) from Washington State University and a B.S. degree in biology from Pacific Lutheran University.




    Keynote Address: Design Challenges for Home Use Medical Devices

    Greg Thompson Greg Thompson, VP of Engineering, Sanmina Medical Division

    The presentation will cover the challenges that are encountered when taking traditional medical devices and implementing them for the home use environment. The clinical setting is a very controlled environment – this is not true of the home environment. Challenges exist due to foreign substances and rough handling (liquids/dirt/dust, bugs/pests, drop/shock and expected misuse, etc). Challenges also exist due to use by under-trained users – and users that don’t want to admit if the device has experienced accidental abuse.

    Greg Thompson is VP of Engineering for Medical Product Design within the Medical Division of Sanmina Corporation. In this roll Mr. Thompson is responsible for all design and development activates associated with the productization of new and improved medical devices and laboratory equipment. The Sanmina Medical Division serves many global customers by designing and manufacturing medical devices for professional use and consumer use. Mr. Thompson has been with Sanmina for more than 30 years in various design and management rolls. Since 2005 Mr. Thompson has managed the medical product design organization at Sanmina. The specific expertise offered by the medical product design team at Sanmina is full turnkey medical device design with compliance to regulatory standards, design controls, risk management, DFx, and supply chain design. Recently a significant focus has been on over the counter consumer medical devices.




    Keynote Address: Medical & Healthcare: What are the Opportunities for MEMS and Sensors?

    Benjamin Roussel Benjamin Roussel, MedTech Activity Lead, Yole Développement

    New technologies have the ability to transform healthcare globally: enable early diagnostic through new detection modalities, increase treatment efficiency with targeted drug delivery, and by allowing functions replacements through smart implants surgery.

    Due to tremendous potential of the applications, the medical and healthcare markets are nowadays considered by most electronics and semiconductors suppliers as a new growth opportunity. The potential is huge, ranging from high value/high margin medical devices to health consumer products for wellness and fitness.

    As part of this market, Wearable electronics is a significantly growing market, mainly driven by smart watches. Many products are already on the market, measuring physical and physiological parameters, which are transferred to a base station (typically a mobile phone). Added value is then created by specific "smart" applications.

    To feed these applications with data, the demand for all types of so-called bio-sensors is significantly increasing and affecting the way the sensor industry is organized. Pressure sensors, IR sensors, microfluidic chips, chemical and gas sensors are just few examples. Yole Développement will provide an overview of the applications and the challenges industry will face to enter this market.

    Benjamin Roussel is leading the MedTech activity (microfluidic and medical technologies) at Yole Développement. He holds a pharmacy diploma from the University Claude Bernard Lyon, complemented by a master degree in Technology and Innovation Management from EM Lyon Business School.






    Come to the MSEI Open House

    Come to the MSEI Open House September 17, 2015 | 3:00 PM - 5:30 PM
    6024 SW Jean Road, Lake Oswego, Oregon (Event held in Bldg A.)

    Micro Systems Engineering, Inc. invites you to visit their Lake Oswego campus to learn about implantable electronics products and capabilities. The open house will feature a presentation covering their product line and MST capabilities, followed by factory tours of their electronic module manufacturing facility. Refreshments will be served!

    Sign-up is required to attend this event. Please contact Teresa Stricker at teresa.stricker@mst.com and send her your full name, company, contact phone number and e-mail. You are responsible for providing your own transportation.

    View the flyer for more details. We hope you can join us!


    September 16 - 17

    Medical Electronics Sponsorship and Table Top Exhibit  +

    Location: Marylhurst University
    17600 Pacific Highway (Hwy. 43)
    Portland, OR 97036-0261


    Exhibitors

    Sponsorship Information

    Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the Sponsorship Benefits link below. For more information contact Gina Edwards at MEPTEC at gedwards@meptec.org or call 408-858-5493.

    Sponsorship Benefits

    Sponsorship Application*

    *If you wish to pay through our secure server please use the "Register for Sponsorship or Exhibit" button at the bottom of this page. We will still need the Application form filled out.

    Exhibiting Information

    The conference will include an exhibition area featuring up to 40 tabletop displays that will be open during conference breaks plus after hours.

    Please e-mail JoAnnStromberg regarding exhibiting at joann@smta.org or 952-920-7682; for sponsorship information please contact Gina Edwards, MEPTEC at gedwards@meptec.org or call 408-858-5493.

    Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings
  • Download a hard copy of the registration form

    Exhibit Pricing:
    Member* (*iNEMI/MEPTEC/OregonBio/SMTA): $895
    Non-member: $995

    Exhibit Hours:
    September 16: 10:00am – 5:00pm; Reception: 5:00pm – 7:00pm
    September 17: 10:00am – 3:30pm

    Please note that exhibit traffic will be minimal while symposium is in session.



    Attendees

    Exhibit Hall Hours for Paid Technical Conference Attendees

    September 16: 10:00am – 5:00pm; Reception: 5:00pm – 7:00pm
    September 17: 10:00am – 3:30pm
    To Register for the technical conference, click here.

    Exhibitor Reception (FREE)

    September 16: 5:00pm – 7:00pm
    If you are not going to register and attend the technical conference you can still join us for our exhibitor reception. This is a good opportunity to talk with our exhibitors as well as network with your industry colleagues.
    To Register for the Exhibitor Reception, click here.


    Sep 27 - Oct 1

    SMTA International 2015  +

    Location
    Donald Stephens Convention Center
    Rosemont , IL


    Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, and Quality and Reliability.


    September 29 - 30

    SMTA International Electronics Exhibition  +

    Location: Rosemont Convention Center
    Rosemont, IL


    Exhibitors

    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1000 attendees from 25 different countries.


    Sep 29 - Oct 1

    SMT Processes Certification (SMTA International - Rosemont, IL)  +

    Location
    Donald Stephens Convention Center
    Rosemont , IL


    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • October 5

    iNEMI/SMTA Automotive Electronics Workshop: Electronic Material Challenges for Vehicles of the Future  +

    Location
    MESSE DRESDEN
    Dresden 01067 Germany


    This workshop will immediately precede SEMICON Europa 2015.  The event is being organized in cooperation with SEMI and SMTA.



    Meeting Background

    Electronics penetration into the automotive segment continues to increase. Enhanced comfort, communication and safety features, as well as demand for more efficient vehicles and reduced emissions have driven many developments at device, component and module levels. This opportunity does not come without its challenges; automotive environments demand more in terms of thermal cycling, shock and vibration capabilities. In addition, there is a longer term reliability expectation of 10-20 years. iNEMI is hosting this workshop, in cooperation with SEMI and SMTA, to focus on the electronic materials needs for future automotive applications.



    Meeting Objectives

    The objectives for the workshop are to:

  • Assess industry input on the trends and drivers in automotive electronics.
  • Provide a forum to discuss key technology challenges facing the automotive supply chain in terms of materials.
  • Identify and prioritize opportunities that would benefit from industry collaboration.
  • Form action groups to define and execute the required industrial collaborative programs.


  • Who Should Attend

    Technology leaders and senior executives whose responsibilities include:

    • Advanced technology development
    • Product strategy and development
    • Sourcing and supply chain management
    • Product qualification and regulatory certification


    Benefits of Participation

    This iNEMI workshop will focus on the challenges of the electronics materials needs for automotive applications. Participation will enable your organization to identify the key challenges and needs and help prioritize this agenda for the automotive electronics industry.  Those who participate in the follow-on collaborative programs will enjoy a competitive advantage as new approaches and methodologies are developed and deployed to drive industry best practices.  Collaboration along the supply chain can reduce risk and accelerate technology development and adoption for the industry.



    Registration

    Register through Semicon Europa 2015.
    You will need to click the "Register Now" button in the Conference/Programs section. Once you get to the page where you select your booking options, you will need to scroll to the bottom of the page under "Partner Events."

    Pricing is as follows:

    Members (iNEMI, SEMI & SMTA)
    Early Bird €300
    Full Price €350

    Non-Members
    Early Bird €350
    Full Price €400



    Proposed Workshop Agenda

    The one-day workshop will have two speaker sessions, a panel session and an interactive deliberative session.  The focus of these sessions will be as follows:

    Registration
    10:00 - 10:30

    Session 1 - Keynote Session
    10:30 – 11:30
    - Automotive electronics:  perspectives on the next decade
    - Market drivers:  growth, economic, environmental

    Coffee Break
    11:30 - 11:45

    Session 2 - Electronics Manufacturing Challenges from a Supply Chain Perspective
    11:45 - 13:15

    Lunch
    13:15 - 14:15

    Session 3 - Panel Session with Key Stakeholders
    14:15 - 15:00

    Coffee Break
    15:00-15:15

    Session 4 - Breakout Discussion Groups
    - Identify areas for collaborative industry-led work

    Session 5 - Group Reports
    17:00 - 17:45

    Closing Discussion
    17:45 - 18:00



    Further Information

    Steve Payne
    steve.payne@inemi.org




    October 6 & 15

    SMTA Webtorial: Material Properties and How They Affect Electronic Devices  +


    Two (2) 90 Minute Sessions
    October 6 & 15, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Neil Poole, Ph.D., Henkel Electronic Materials LLC

    Overview:
    Adhesives, polymers, and soldering materials play an important role in manufacturing electronic devices. When looking at a technical data sheet for these materials it is important to understand how the properties defined on these data sheets affect the performance and reliability of the final end product. Furthermore, understanding how these properties are measured and what can and should be compared between data sheets. We will also look at how the process conditions play a role in these properties. We will discuss properties such as glass transition temperature (Tg), coefficient of thermal expansion (CTE), modulus, decomposition temperature (Td) and other material terms often used in technical data sheets. Attendees are encouraged to bring example technical data sheets and/or questions for discussion.

    We will then apply what had been discussed to look at one specific type of adhesives used in surface mount technology - Methods and Selection of underfill and encapsulant materials. We will discuss the differences between underfilling, potting, conformal coating, and encapsulation the advantages and disadvantages of each approach and the relation of performance to material properties for each.

    Outline:

  • Polymer Chemistry Basics
  • Rheology – Study of Flow
  • Physical Properties of Cured Adhesives
  • Glass Transition Temperature (Tg)
  • Coefficient of Thermal Expansion (CTE)
  • Modulus
  • Decomposition Temperature (Td)
  • Ionic Content
  • Conductivity
  • Thermal
  • Electrical
  • Adhesion
  • Adhesion Mechanisms
  • Measuring Adhesion
  • Curing
  • Heat
  • Light
  • Other
  • Physical Properties and Performance – a study

    Who Should Attend:

  • Engineers who use and specify adhesives and material in electronic applications.
  • Anyone who uses material supplier technical data sheets to make decisions on material selection.

    After this training course attendees will have a better understanding of how these material properties affect reliability performance, the relationship between process and properties and understand what properties can be compared between data sheets.


  • October 13 - 15

    International Wafer-Level Packaging Conference  +

    Interconnecting WLP, MEMS & 3D Integration

    Location
    DoubleTree San Jose Airport Hotel
    San Jose , CA


    IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


    October 14 - 15

    Guadalajara Expo & Tech Forum  +

    Location: Hotel Riu Guadalajara
    Guadalajara


    Exhibitors

    Please see the Guadalajara Chapter Page for More Information on Expo Materials.



    Attendees
    Attendees Register Now

    Please see the Guadalajara Chapter Page for More Information on Technical Sessions.


    October 14

    Long Island Expo & Tech Forum  +

    Location: Islandia Marriott Long Island
    3635 Express Drive North
    Islandia, NY 11749


    Exhibitors Register Now
    Exhibitors

    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact SMTA Expo Manager Kaitlyn Gherity or Sharon Dietrich with questions or for additional information.



    Attendees
    Attendees Register Now

    Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials,


    October 15

    LA/Orange County Chapter Tutorial Program: Zen and the Science of Electronic Assembly  +

    Location
    Paradigm Contract Manufacturing LLC
    Garden Grove , CA 92841-1823



    Instructor: Phil Zarrow, ITM Consulting

    October 15, 2015
    9:00 a.m. - 4:30 p.m. (8:30 a.m. Check-In)
    Paradigm Contract Manufacturing LLC
    11562 Knott Street, Unit 13-14
    Garden Grove, CA, 92841-1823
    PH - 714-889-7074
    FAX - 714-893-1801

    Price:
    Members - $200
    Non-Members - $275 (A one-year Individual SMTA Membership is included in the non-member price)
    LA/Orange County Chapter Officers - $100
    Student Members - $50
    Student Non-Members - $55 (A one-year Student SMTA Membership is included in the non-member price)

    New this year! Get a $20 EARLY BIRD discount on regular Member and Non-Member registrations if registration is completed by midnight on August 31, 2015.

    Members (with Early Bird): $180
    Non-Members (with Early Bird): $255

    Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    You have the responsibility and resources to improve the productivity of an assembly operation….what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

    Topics Covered:

  • Introduction
  • Optimization Objective
         - Getting the Most Productivity from an Existing Line
         - Definition of "Best Practices"
  • Best Preactices in the Assembly Process
  • Solder Paste Printing Process Best Practices
  • Pick and Place Best Practices
  • Reflow Soldering Best Practices
  • Wave and Selective Soldering Best Practices
  • Cleaning vs No-Clean Considerations and Best Practices
  • Best Practices Concerning "Challenging Technologies"
         - QFNs
         - Ultra Miniature Components (0201s, 01005s, ultra-fine pitch BGAs and CSPs)
  • Q & A


    Who should attend?
    This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.

    Phil Zarrow About the Instructor:

    Phil Zarrow
    Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

    Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

    Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.

    Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update's “Boardtalk” audio program.




    Contact Karen Frericks at 952.920.7682 with questions.


  • October 20

    Connecticut Expo & Tech Forum  +

    Location: Waterbury Marriott
    63 Grand Street
    Waterbury, CT 06702


    Exhibitors

    The cost to exhibit is $325/$350 (early/regular) for corporate members. The cost to exhibit for non corporate members is $350/$375 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please sign up by March 1st to be included in multi-expo pricing promotion.

    Please contact Mark Siems to register for a table or for additional questions!



    Attendees
    Attendees Register Now

    Please see the Connecticut Chapter Page for More Information on Technical Sessions and Expo Materials,


    October 20

    Austin (CTEA) Expo & Tech Forum  +

    Location: Norris Conference Center
    2525 West Anderson Lane
    #365
    Austin, TX 78757


    Exhibitors


    The Austin Expo & Tech Forum is SOLD OUT! Please contact Emily to be put on the waiting list for the show at emily@smta.org or call 952-920-7682. Thank you!

    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 18th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details

  • Norris Conference Center Location

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

  • Norris Conference Center Location

  • Free Technical Program & Schedule:

    Exhibit Hours:
    Tuesday, October 20th, 2015
    10:00AM–4:00PM


    9:30AM
    Registration Opens

    10:30AM-11:00AM
    White BeltImproving First Pass Yields and SMT Line Utilization for High Mix Low Volume Electronics Manufacturing
    Tommy Fox, Optimal Electronics

    Electronics manufacturers are challenged daily to improve profitability and utilization of assets in SMT manufacturing. Improvement approaches using software Manufacturing Execution Systems (MES) are discussed that increase first pass yield and increase line utilization for high-mix, low-volume electronics manufacturing.

    11:30AM–12:00PM
    White Belt Using Risk Analysis to Improve Project Plans, Budgets & Schedules
    Mike Tulkoff, Flipped Health

    There are many tools and software programs designed to help manage technology and business risks. Some of the familiar and commonly used techniques include Work Breakdown Structure (WBS), Gantt Charts, Critical Path Method (CPM), and Program Evaluation & Review Technique (PERT). However, a less commonly used but extremely valuable tool is the use of decision risk and risk analysis modeling. Monte Carlo simulation and the use of decision trees can be used to choose among alternatives in a risky environment. This presentation is designed to help break down and structure risky problems through the use of decision and risk analysis for the evaluation of real world projects and opportunities. Case study examples using Excel, @Risk, and PrecisionTree software will be shared. Add or expand your capabilities by learning more about these modeling methods. Resources: Data Analysis & Decision Making with Microsoft Excel by Albright, Winston and Zappe; Palisade for Excel, http://www.palisade.com/risk/, and http://www.palisade.com/precisiontree/

    12:00PM–1:00PM
    COMPLIMENTARY LUNCH!

    1:00PM
    Door Prize Drawing

    1:30PM–2:00PM
    White Belt Package on Package (PoP) Soldering Materials and Process Considerations
    Robert Wallace, Alpha

    Package on Package (PoP) technology has been one of the most requested areas for new product development and product trials. Assemblers at the forefront of miniaturization are either building products with PoP technology today, or evaluating the process. One key driver for this demand is the desire to reduce the time to market for New Product Introductions, particularly in feature rich, advanced hand held devices. An increasing trend is to mix and match memory and logic chips using PoP sub-assemblies. This allows, for instance, a hand held device maker to offer multiple options for memory capacity on a single platform. It also allows OEM’s and ODM’s to select from a menu of memory and logic device producers, rather than being locked into one company offering a SiP chip. This versatility is especially important during the NPI phase, as a new model may or may not receive commercial acceptance. Thus the risk of paying for the tooling and process development of a complex SiP assembly can be avoided. This presentation will describe test methods used by Alpha to qualify low viscosity PoP Solder Paste and Flux Gel and the unique application measurement process required. Unlike printed solder paste, PoP paste and flux gel is generally a dipping operation, and there have been several lessons learned in determining the correct viscosity, powder size distribution, and application technique required for a highly reproducible sub-assembly process. This presentation will explore multiple examples, and draw some conclusions on the successful qualification of a solder paste based PoP process.

    2:30PM–3:00PM
    Ed BriggsThe Transformative Future of Solar Energy
    DJ Rosebaugh, Lighthouse Solar


    This presentation is focused more on the macro and market view of distributed power generation versus detailed engineering issues. We will begin with a fundamental overview and history of solar PV power generation, system design, and technologies. That will serve as a foundation for discussing the implications of this technology on individuals and commercial entities, and to speculate on the long term implications and opportunities of distributed solar energy generation.

    4:00PM
    Expo Closes

    Special Thanks to Our Sponsors:

















    October 29

    Free Webinar: Latest Findings in Tin Whiskers in Electronics  +


    Thursday, October 29th
    10:00am - 11:30am Central
    Sponsored by the High Density Packaging Users Group
    Supporting organizations: IPC, EIPC, SEMI, CALCE, MEPTEC & SMTA

    Overview
    The purpose of this Webinar is to share recent developments regarding tin whiskers, particularly with respect to the use of SAC solders. Topics to be covered include whisker growth mechanisms, real life failure histories, and whisker mitigation strategies.

    Top people in the field will give presentations and participate in a short Q&A session at the end of the webinar. The Q&A session will use questions submitted by email. Only the panel will be unmuted.

    If you miss the webinar, don't worry! A recording will be made available.

    Schedule

    Brief introduction and welcome - D. Love (HDP User Group) <5 min>

    Mechanisms for Nucleation and Growth of Tin Whiskers: Implications for Finding Practical Solutions; Carol Handwerker (Purdue University), Eric Chason (Brown University) <25 min>

    Issues and Corrective actions for those using SAC solder and tin surface finishes; Polina Snugovsky (Celestica) <30 min>

    Real-life examples and mitigations, Mil-Aero perspective: Michael Osterman (CALCE); <25 min>

    Wrap-up: Carol Handwerker <10 min>

    Q&A Session moderated by Dave Love.

    Please send questions to the Moderator, David Love Dave49@hdpug.org


    October 29

    Empire Expo & Tech Forum  +

    Location: Radisson Hotel (Rochester)
    175 Jefferson Road
    Rochester, NY 14623


    Exhibitors Register Now
    Exhibitors

    The cost to exhibit is $225 for one table (price will increase to $300 after September 25th), $375 for two, $525 for three, or $675 for four. The cost to exhibit includes: one 6ft draped table, two chairs, electricity and attendee list.

    Please contact Drew Ake at aake@harris.com to register for the event.



    Attendees
    Attendees Register Now

    Please see the Empire Chapter Page for More Information on Technical Sessions and Expo Materials,


    November 5

    LA/Orange County Expo & Tech Forum  +

    Location: The Grand Event Center
    4101 E Willow Street
    Long Beach, CA 90815


    Exhibitors

    The cost to exhibit is $350/$450 (early/regular) for corporate members. The cost to exhibit for non corporate members is $425/$525 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 9th, 2015!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, November 5, 2015
    10:00AM–3:00PM


    9:30AM
    Registration opens

    10:00AM
    Expo Opens

    11:00AM–11:30AM
    The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance
    Karen Tellefsen and Mitch Holtzer, Alpha

    Electrical reliability is a fundamental requirement for every circuit assembly. Surface insulation resistance is a globally accepted standard for predicting the electrical reliability of a printed circuit. This paper will attempt to measure how the reflow profile used in an SMT process affects the electrical reliability of three no-clean solder paste residues. Three different reflow temperature vs. time profiles, a 1.5 °C/s ramp to 230°C, a 1.5 °C/s ramp to 250°C and a 90 s soak at 175°C with a 230°C peak, were used to reflow three lead-free solder pastes in both air and nitrogen atmospheres. Fourier transform infrared spectra of the reflowed flux residues shows how reflow profile conditions and atmosphere affects the decrease of a peak around 1700 cm-1 and the appearance and increase of another peak at 1600 cm-1. The 1700 cm-1 is smaller for flux residues that were reflowed under hotter conditions and for those that were reflowed in air. The peak at 1600 cm-1 is larger for residues exposed to hotter reflow profiles in air, but is hardly present for residues reflowed in nitrogen. The affect of these reflow conditions on surface insulation resistance (SIR) per IPC-TM-650 Method 2.6.3.7 at 40°C 90% RH and 12V bias has been studied. This measurement shows that hotter reflow conditions result in higher SIR values for two of the pastes, as would be expected, but has a smaller affect on the third paste.

    12:00PM–1:00PM
    Free lunch on the show floor!

    1:00PM–1:30PM
    Oh, Flux! – How Not to Clean Electronics Assemblies
    Barbara Kanegsberg & Ed Kanegsberg, BFK Solutions LLC

    Is it the irate customer? Is it the flux residue? Is it the friendly SCAQMD or OSHA inspector? You’ll laugh; you’ll cringe! You’ll have fun! Forget the success stories. We all tend to hear glowing reports of successes. Research has shown that successes are reported; failures are not. You can learn more from failures than successes. Hear about real-life cleaning mishaps. Hear about “partial successes.” Learn how to interpret success stories and adapt the approach for your own manufacturing facility. Come away with great ideas to clean electronics assemblies and to avoid costly investments in process equipment and chemicals that are not right for you. Understand how to fix small issues before the line goes down, before you lose business. Unlike reality T.V, most names will be changed to protect the innocent.

    2:00PM–2:30PM
    Effects of Shelf Life and Manufacturing Environment on Solder Paste
    Neil Poole, Henkel

    A number of studies have shown that up to 60-80% of all electronics assembly defects are related to the solder paste printing and reflow characteristics. Since the introduction of lead free solder paste, manufactures have concentrated on improving the printing performance and widening the reflow window, but the number one problem in assembly of circuit boards still point to the solder paste. While some of these defects can be blamed on environmental elements, temperature, and humidity on the factory floor or possible temperature variations during the shipping and handling. The condition of the paste, while fresh is usually good, but many of the process defects may be attributed to the logistics of getting material from the vendors to the shop floor. In this presentation Henkel will explore effects of shelf life and manufacturing environment on solder paste.

    3:00PM
    Expo Closes


    November 10 & 12

    SMTA Webtorial: Failure Analysis: Analytical Techniques and What They Tell You About Your Failure  +


    Martin AnselmTwo (2) 90 Minute Sessions
    Tuesday, November 10 and Thursday, November 12, 2015
    1:00pm to 2:30pm Eastern
    Presented by: Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)

    Overview:
    When reviewed in conjunction with research or production, failures provide a unique perspective on design for manufacturability and reliability. This course will provide valuable lessons learned from practical experience through discussion of material selection, current electronics research and failure analysis case studies. Analytical techniques for materials characterization will be discussed and how they can be used to determine root cause. Participants are encouraged to bring specific questions or examples of surface mount process difficulties to be shared in open discussion at the end of the course.

    Topics Covered:
  • Analytical testing techniques
  • Root causes of production failures
  • Failure analysis studies — analytical techn iques used for determining root cause for defects in fine-pitch printing, PoP, and high Tg laminate failures.

    Who should attend?
    Those involved in printed board design, assembly and bare board fabrication. Special emphasis will be placed on the integration of material selection, bare board fabrication and assembly as related to enhancing long-term reliability of printed boards subjected to lead-free assembly.

    Instructor Bio:
    Martin has recently accepted a position as an Assistant Professor at Rochester Institute of Technology (RIT) within the MMET department. In addition to teaching classes Martin is the Associate Director of the CEMA lab where he will be conducting research into electronics manufacturing, materials and reliability. He began his career in electronics Failure Analysis at Universal Instruments. Martin has worked with some of the world’s largest OEMs and CMs not only determining root cause, but to also implementing process, design and materials changes in order to improve end product quality, reliability, and manufacturability. While at Universal, Martin also managed the Advanced Research in Electronics Assembly (AREA) Consortium where he lead a team of researchers who conduct fundamental studies in electronics. AREA was funded by Tier 1 OEMs, CMs and Suppliers.


  • November 17 - 19

    See you in 2016! November 28-December 1 (Tentative dates)  +

    The bridge between research and development

    Location
    Crowne Plaza Midtown
    Atlanta , GA 30308


    The inaugural CALCE-SMTA LED A.R.T. Symposium at Atlanta, Georgia concluded during November 17 - 19, 2015. It was three days of packed technical presentations on LED Assembly, Failure Mechanisms, Packaging, Applications, Reliability and Testing and Cleaning. The material discussed had direct industry applications for the whole supply chain with unique emphasis on product realization with LEDs. In this event, we had 70 attendees, 16 exhibiting companies and 18 Technical presentations with people from 9 countries and 26 of the 50 United States.

    Robert F. Karlicek, Jr., Ph.D from Smart Lighting Engineering Research Center, Rensselaer Polytechnic Institute kicked off the symposium with a keynote address on Emerging Trends in LED with big picture forward looking issues in LED applications well beyond illumination. Kurt-Juergen Lang from Osram Opto Semiconductors focused on LED applications in automotive space in his keynote address. The symposium concluded with a tour at Georgia Tech Institute for Electronics and Nanotechnology and its laboratories followed by a tour of the Packaging Research Center.

    Workshop on LED Failure Mechanisms, Reliability and Qualification covered the latest in understanding of failure mechanisms of LEDS and how the industry is using or not using the knowledge on failure mechanisms in reliability assessment and qualification. If you are interested in future sessions of this course contact Dr. Diganta Das.

    Photos from the 2015 LED Symposium

    Thank you to everyone that attended the first LED Symposium and to our speakers and exhibitors. It was a great three...

    Posted by Surface Mount Technology Association - SMTA on Thursday, November 19, 2015





    Georgia Tech Packaging Tour

    November 18
    3:15 pm transportation pickup

    You are invited to tour the Georgia Tech Packaging Center. This is an exciting opportunity to tour a 300mm lab associated with the Institute of Electronics Nantechnology, hear from students on industry projects and network. Transportation and refreshments will be provided.




    FREE Webinar Download: LEDs and Solid State Lighting Ecosystem

    Presenter: Makarand "Chips" Chipalkatti, Ph.D., Dr. Chips Consulting

    Over a decade and a half ago, when LED lighting was a subject of debate and considerable disbelief, some had predicted a disruptive change in the lighting industry of the sort that happens once in a generation. This disruption is now real, and the lighting industry is clearly undergoing tectonic change in rapid fire mode. Every major incumbent manufacturer is undergoing constant reorganization, while new start-ups emerge claiming a place in the new lighting industry. Yet, LED lighting has not generated the sort of profits expected despite significant growth. Global supply chains and fierce competition by hundreds of new players has created quite a challenge. Yet, there is great opportunity in this industry expected to be $21B by 2018 according to a recent report. Where do those opportunities lie and where are the new growth areas for industry players in the lighting, semiconductor, and electronics industry? This talk will cover some of the transformation process and point to the areas of current and future change. Future growth corridors that are now visible will also be discussed.

    Download webinar slides Download webinar slides






    FREE Webinar Download: Shining a Light on LED Technology

    Presenter: Martine Simard-Normandin, MuAnalysis

    Light emitting diodes, LEDs, have evolved tremendously in the last few years. They are no longer relegated to such roles as low output power indicator lights on panels, or seasonal decorative light strings. Just as electronics has infiltrated every aspect of our lives, a LED invasion is aggressively underfoot. Yet the technology behind these devices is poorly understood, often leading to avoidable early failures. In this webinar we will look at every aspect of LED technology. First we will explore the semiconductor devices themselves and the structures within that allow them to be efficient emitters. Next we will focus on high brightness LEDs and review their packaging and assembly challenges. Then we will investigate LEDs in luminaires: the phosphor materials of the LED devices, LED driving circuits, dimming issues. Finally, the long term reliability issues and failure mechanisms of LED devices will be reviewed.

    Download webinar slides Download webinar slides


    November 17 - 18

    LED Assembly, Reliability & Testing Symposium & Exhibition   +

    Location: Crowne Plaza Midtown
    590 West Peachtree Street Northwest
    Atlanta, GA 30308


    Exhibitors

    LED Symposium Floor Plan

    Exhibitor Information:

    At the LED A.R.T. Symposium and Exhibition you will network with Assembly/Packaging Engineers, Corporate/General Management, Test Engineers, Designers, Buyers, R&D Engineers, and more.

    All booth spaces have SOLD OUT!




    Sponsorship Opportunities:
    Click here to download more information.

    Exhibitor Reception Sponsor: $2,000
  • Sponsors will make special toast and receive signage at the reception and also napkins and table tents at the reception! Reception will be in the Exhibit Hall.
  • FREE exhibit table with Electric
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • On-site signage (posted throughout conference/expo area)

    Lanyard Sponsor: $400/$800
  • Provide 150 Lanyards and they will be the official lanyard for the conference(If you would like us to make the lanyards it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • On-site signage (posted throughout conference/expo area)

    Bag Sponsor: $400/$800
  • Provide 150 Bags and they will be the official bags of the conference. (If you would like us to make the bags it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • Logo on all marketing event materials
  • On-site signage (posted throughout conference/expo area)

    Lunch Sponsors: $800
  • Logo recognition in Show Directory
  • Logo recognition and link to company Web site
  • On-site signage (posted throughout conference/expo area)

    Refreshment Break Sponsorships: $550
  • On-site signage (posted near coffee breaks)
  • Recognition in Show Directory

  • Venue Address:
    Crowne Plaza Atlanta Midtown
    590 West Peachtree Street NW
    Atlanta, GA 30308, US

    Table space includes:

  • 6 Foot Draped table
  • Two chairs
  • One Conference Pass (included in Exbhitor packet)
  • Electronic attendee list (sent approximately a week after the conference)
  • Directory listing
  • Lunch


  • Details:

  • You may use your table to display literature, products small pieces of equipment, table top display signs, etc.; we request that any table top items do not exceed two feet.

  • If you wish you can display a banner or some other appropriate type of sign on the front or top of the table.

  • As space is limited we are trying to minimize the space each table takes. If you have a pop-up or other items, please let us know and we'll try to accommodate you.

    SETUP and TEAR DOWN

    Tuesday, November 17
    7:30am-8:30am
    Atlanta AB

    Boxes will be delivered to the Atlanta AB Exhibit Hall.

    Show Hours:

    November 17: 8:00am – 6:30pm, Exhibitor Reception 5:00pm - 6:30pm November 18: 8:00am – 3:30pm

    Dismantle:

    By end of Conference

    SHIPPING INFORMATION

    Please address all packages as follows: LED Symposium/Your Company Name
    Attn: Jenny Ng, SMTA
    Crowne Plaza Atlanta Midtown
    590 West Peachtree Street NW
    Atlanta, GA 30308, US

    • Make sure your company name is visible
    • Due to limited space, please ship packages to arrive no earlier than two days prior to the event.
    • Exhibitors will be responsible for packing, labeling and shipping all outgoing materials. Please bring your own packing slips to ship your materials back.

    DIRECTIONS

    For directions, click here: www.cpatlantamidtown.com/contact/directions

    Getting to/from Hartsfield Jackson International Airport (ATL)

  • Taxi from the Airport to Hotel (15 minutes) Approximately $50
  • MARTA (train) Gold and Red lines run every 9 minutes. Hotel is closest to the "North Avenue" station. (23 minutes) $2.50

    Parking:
    Self-parking is available at a special rate of $15.00 with no in/out privileges. The self-parking garage is located behind the hotel on Spring Street.

    For questions, please contact
    Jenny Ng
    Conference and Education Manager
    952.920.7682
    Jenny@smta.org



    Attendees

    Exhibit Attendee:

    Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Come and visit the exhibits for FREE. Plan to network with leading suppliers in the LED component industry. We will provide you with FREE refreshments.

    Exhibit Hours:
    November 17: 8:00am – 6:30pm, Exhibitor Reception 5:00pm - 6:30pm
    November 18: 8:00am – 3:30pm


  • Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819