Calendar of Events



                                   

2014

January 23

Carolinas Expo & Tech Forum  +

Location: Double Tree Raleigh Brownstone - University
1707 Hillsborough Street
Raleigh, NC 27605
Show Hours: 10:00AM - 3:00PM



Exhibitors

The cost to exhibit for corporate members is $350/$450 (Early/Late) and $425/$525 (Early/Late) for non-corporate members.(click here for membership information) The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on December 20th, 2013!

Important Exhibitor Materials:

  • Exhibitor Floorplan


  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!


    Free Technical Program & Schedule:

    The Carolinas Chapter of the SMTA would like to invite you to attend the following technical presentations from four renowned technical speakers.

    9:00AM
    Registration opens

    9:30AM – 10:15AM
    Manufacturing, Design, and Test of 2.5D- and 3D-Stacked ICs
    Professor Paul D. Franzon, Alumni Distinguished Professor of Electrical Computer Engineering at North Carolina State University


    tonyThree dimensional chips stacked using Through Silicon Via (TSV) technology has been under consideration and the subject of intensive research for several years now. Soon the technologies will become available through standard fabs. Will the technology be an instant hit, a niche, or a flop? What is needed to ensure it reaches hit status? What are the basic manufacturing steps and flows? This tutorial will discuss these question mainly in the context of the opportunities and challenges that face the designer. What are the significant opportunities presented by 3DIC? What problems will the designer face that will need clever solutions? What are the potential solution paths?

    11:00AM – 11:45AM
    Understanding the Alphabet Soup of IPC Standardstony
    Bob Doetzer, Circuit Technology, Inc.

    This session will help you understand the primary IPC assembly specifications and how they can benefit your organization. They are IPC-A-600H, IPC-A-610E, IPC-620B, IPC-7711/7721B, IPC-J-001E and Space addendum.

    12:00PM - 1:00PM
    Free Lunch on Show Floor!

    12:45PM
    Raffle on Exhibit Floor- Special thanks to our raffle sponsors:

    1:00PM – 1:45PM
    tony New and Emerging Technologies in Electronics
    Dan Baldwin, Engent, Inc.

    Emerging technologies have often been the cornerstone to periods of significant economic expansion. From the advent of the integrated circuit to its culmination in Moores Law, the future directions of electronics will play a key role in the next economic expansion. This presentation will discuss several emerging technologies in the electronic industry including an industry perspective of what's next in advanced electronics, a snapshot of emerging technologies impacting our industry, emerging material technologies, advances in automotive electronics, smart electronics based on MEMS and microsensor technology, and biomedical and molecular electronics as well as some industry roadmap highlights.

    2:15PM - 3:00PM
    TomBuck Enabling Technologies: The Future of HDI Via Structures, Power Delivery, and Thermal Management in Next-Gen Printed Circuits
    Tom Buck, Viasystems

    Faced with a converging set of design requirements, next generation printed circuits will not only see an increase in density, they will be driven by power, speed and thermal dissipation. This presentation examines critical printed circuit technologies that will be required for future systems. The session starts with an overview of advanced HDI via structures essential for chip scale packaging. Next, we will look at power delivery technique and low resistance design for drive electronics using integrated busbars and heavy copper. Finally, we will examine thermal management techniques incorporating thermal vias, embedded coins and heat sinks.


    3:00PM
    Expo Closes


    January 28

    SMTA Webtorial Properties and Applications of Low Temperature Solders  +


    Ning-Cheng LeeTwo (2) Hour Session
    Tuesday, January 28th 2014
    1:00pm to 3:00pm Eastern
    Presented by: Ning-Cheng Lee, Ph.D., Indium Corporation

    Overview:
    Since the dawn of the electronics industry, the soldering process has mainly encompassed component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former uses solder alloys with melting temperatures around 300°C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200°C. Low temperature solders with melting temperature < 170°C are currently mainly used for niche applications. However, iNEMI roadmap predicts low temperature soldering to become one of the mainstream processes by 2017. Low temperature soldering is greatly desired for a number of special applications, such as heat sensitive devices, systems with more hierarchic levels, parts with significant difference in coefficient of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.

    Outline:
    1. Design of low temperature solder alloys
    2. In-bearing systems and their properties
    3. Bi-bearing systems and their properties
    4. Recent development in B-bearing low temperature alloys
    5. Applications of low temperature solders

    Who Should Attend:
    Any one interested in low temperature soldering, their applications, and wants to know how to achieve it should take this course

    Instructor Bio:
    Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.


    February 5 & 12

    SMTA WebtorialHead in Pillow Causes & Process Solutions  +


    Bob Willis

    Two (2) 90 Minute Sessions
    Wednesday, February 5 and 12, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Bob Willis, Bobwillisonline.com

    Overview:
    Open circuit and intermittent defects are the worst problem an engineer has to face in manufacture, difficult to find and often a problem to get to the root cause. The increasing use of area array packages and package on package assembly combined with lead-free processes has highlighted a new defect type referred to as head in, or head on pillow. We explain the problem, process parameters and ways of eliminating this type of defect during assembly.

    This type of failure is not unique to lead-free or area array components we have been experiencing a similar problem in the past with fine pitch packages which will also be illustrated during Bob's webtorial.

    Topics Covered:

  • What is Hip and Hop
  • Same defect type on surface mount
  • Solder sphere oxide
  • Solder sphere and package wetting tests
  • Reducing void formation in reflow
  • PCB/Component Package Warpage
  • Solder paste exhaustion
  • Reflow profile correction
  • Test methods and simulations
  • Pry testing
  • Inspection optically and with x-ray

    Who Should Attend:
    This webtorial is designed for design, process and quality engineers responsible for eliminating reflow rejects like head on or in pillow. Much of the material presented is extremely visual and practical making it ideal for manufacturing staff, like all the instructors training it not just theory, it's a "How to Do It Session, based on practical experience."

    Instructor Bio:
    Bob Willis currently operates training and consultancy business based in England and has created one of the largest collections of interactive training material in the industry. With his online training webinar's Bob has provided a cost effective solution to training worldwide and regularly runs training for SMTA, SMART, IPC and recently EIPC. Although a specialist for companies implementing lead-free manufacture Mr Willis has provided worldwide consultancy in most areas of electronic manufacture over the last 25 years. This is based on working in manufacture with contract assembly, printed board manufacture and environmental test facilities. This has earned him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has also been presented with the SMTA International Leadership Award and IPC Committee Award for contribution to their standards activity.


  • February 11 - 13

    Pan Pacific Microelectronics Symposium 2014  +

    Location
    Hapuna Beach Prince Resort
    Big Island , HI



    Feb 28 - Mar 2

    SMTA Officer Leadership FORUM 2014  +

    The Wild Side of SMTA!

    Location
    DoubleTree by Hilton
    Bloomington , MN 55439


    February 28 - March 2, 2014
    DoubleTree by Hilton – Bloomington-Minneapolis South
    7800 Normandale Boulevard, Bloomington, MN 55439

    RSVP Deadline: January 17, 2014

    The SMTA invites all Chapter Officers to join your peers at the 9th Chapter Officer's Leadership FORUM. You can expect to be brought up to speed on all the new and exciting tools and techniques to make you more efficient in 2014.

    You will learn to:

  • Develop leadership skills
  • Learn from focused breakout sessions
  • Network with your peers
  • Move forward with enthusiasm and confidence as effective leaders in your career, community, and as an SMTA leader.
  • Download detailed info and hard copy reg form

    Leadership Workshop

    "The Wild Side of SMTA!"

    Facilitator: Chris Heeter, The Wild Institute

    Boring meetings? Dis-engaged membership? Shake it up. Join us for a weekend packed with inspiration, innovation, and applicable tools.

    Most of the time, people show up to associations half-engaged, waiting to see what the organization can do for them; missing the point that engagement is where the real benefits reside. As an SMTA officer and no doubt in the rest of your work life, you are part of a group of individual characters, asked to build a team that is both knowledgeable and motivating for your chapter. Chris helps get you there with perspective, humor, and expertise. Her sled dogs (presented virtually, they don't understand the nuances of carpeting or buffets) offer powerful examples of taking a laughable range of personalities and getting them to work together and go the same direction down the trail.

    Top take aways:

  • Learn how to be a more effective leader, for SMTA and other areas of your professional life
  • Understand team dynamics—the needs and motivations of various personalities, how to work together
  • Discover what YOU need in order to do your work
  • Assess your chapter through a “Wild” lens, see how innovative you are willing to be in order to enliven your chapter, recruit volunteers and new members, and deepen the benefits for you and your membership

    Breakout Session Topics
    Complete schedule coming soon!
  • How is the SMTA Organized
  • Planning/Conducting Expos
  • Chapter Technical Education Opportunities
  • Meeting Planning Tips
  • Chapter Finances
  • Student Chapters/MentorNet
  • Promotion Using Social Media
  • SMTA Online Toolkit
  • Membership
  • Presentation Skills
  • Recruiting Volunteers
  • "Turnaround" Chapters – How They Did It

    Be a Sponsor!
  • "Help the SMTA Grow" Sponsorship for Chapters: $100-$1000+ (multiple sponsors) Any amount is welcome! We have officers from Brazil, India, Penang and Student Chapters who need your support to attend the FORUM and your sponsorship will help pay for them to attend.

  • Welcome/Networking Reception Sponsorship: $350 (multiple sponsors)
    All FORUM Sponsors will be introduced at the Welcome Reception, receive verbal recognition and signage recognizing the sponsors during the event to show our appreciation of your chapter's support.

    Thanks to our current chapter sponsors!

    Atlanta Chapter

    Carolinas (NC, SC) Chapter

    Central Texas Chapter

    Dallas Chapter

    Empire (NY) Chapter

    Houston Chapter

    Intermountain Chapter

    LA / Orange County Chapter

    Ohio Valley Chapter

    Oregon Chapter

    Space Coast Chapter

    Upper Midwest Chapter

    West Penn Chapter

    Wisconsin Chapter

    Facility Tour and SMTA Open House

    Friday, February 28th, 1:00-4:00pm

    The Upper Midwest SMTA Chapter is graciously coordinating a Facility Tour offered to the first 25 people to register. This year we will be visiting Great Lakes Engineering, a trend-setting manufacturer of surface mount stencils, precision laser cut parts and photo chemical machined parts for the defense, medical, electronics, aviation, energy, telecommunications, and computer industries. Following the tour, you are invited to attend an Open House at SMTA Headquarters. The tour/open house visit will be on Friday, February 28th, 1:00-4:00 p.m. The Upper Midwest Chapter will provide round-trip transportation. If you wish to have transportation you must be at the DoubleTree Hotel Registration Desk by 12:30 p.m. to meet the bus. After the tour and Open House, the bus will return you to the hotel at about 4:30 p.m.

    IMPORTANT: Complete the Facility Tour/Open House part of the online RSVP system if attending.

    Northwoods Welcome & Networking Reception:

    February 28, 7pm

    Get into the North Woods atmosphere at this evening's Welcome & Networking Reception. Wear your fishing/hunting/hiking gear and be prepared for a trip "Up North" on this year’s trip to the Wild Side of SMTA!

    Saturday Evening Activity

    Saturday, March 1

    Sky Deck Sports Grille & Lanes
    Mall of America, 6:30-9:00 p.m.

    Enjoy dinner and an exciting evening of games including bowling, pool, video games, and incredible High-Def sports viewing at this top-rated entertainment venue in the Mall of America!


  • March 4

    Dallas Expo & Tech Forum  +

    Location: Plano Center
    2000 E. Spring Creek Pkwy
    Plano, TX 75074
    Show Hours: 10:00AM - 3:00PM


    Exhibitors

    The cost to exhibit is $400/$500 (early/regular) for corporate members. The cost to exhibit for non corporate members is $475/$575 (early/regular).(click here for membership information). The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on February 14th, 2014!

    Important Exhibitor Materials:

  • Exhibitor Floorplan


  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details


  • Expo Brochure
  • Promotional Poster

  • Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    7:30AM
    Registration opens

    8:00AM – 9:00AM
    White Belt Lean Six Sigma White Belt Training
    Albert Clary, The SixSigma Way

    Businesses today face mounting pressures to solve resource issues, control costs, and better manage information. Finding ways to actually enable efficiency and productivity remains a challenge for many companies. Top companies with successful track records of significant continuous improvement have discovered one possible solution called Lean Six Sigma methodology. Lean Six Sigma, (LSS) is a relatively unknown approach to most companies. It can do more than simply improve processes, but also assist you in achieving unprecedented operational excellence. When deployed throughout the organization as “the method to do business”, it can help leaders discover a range of opportunities far beyond operations. This would include enhanced financial performance, increased customer satisfaction, improved branding and an organization that has an inherent desire to grow and innovate. During the white belt class you will learn what lean is, what six sigma is, and some of the tools of the DMAIC methodology. Examples of successful deployments from different industries will also be discussed.

    9:15AM – 10:00AM
    Nausha Asrar Determine Critical Cleaning Process Parameters for QFN’s
    Naveen Ravidran, ZESTRON Corporation

    QFN or Quad Flat No Leads or MLF (Micro Lead Frame) packages are one of the fastest growing package types within the electronics industry. These components physically and electrically connect integrated circuits to printed circuit boards. The QFN package is similar to the Quad Flat Package, but the leads do not extend out from the package sides. This is a near CSP plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. The package includes an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The body size of the component ranges from 2mm x 2mm to 12mm x 12mm and the lead pitch could be as low as 0.4 mm.

    11:00AM – 12:00PM
    Glenn Miner The Technology of High Density Placement & Micro Components
    Scott Wischoffer, Fuji America Corporation

    A look at the challenges and technology developed to reliably place the new smaller package sizes that are on the horizon. This Includes:
    - Equipment Challenges
    - Component Packaging
    - Component Handling
    - Vision Processing Challenges

    12:00PM - 1:00PM
    Free Lunch on Show Floor!

    Special thanks to lunch sponsor:

    NPI Technologies

    1:00PM – 2:00PM
    Dr. Ning-Cheng Lee Lead-Free Solder Alloys – Pros and Cons, and Novel High Temperature Option BiAgX
    Dr. Ning-Cheng Lee, Indium Corporation

    This talk covers the pros and cons of lead-free soldering, including process and reliability. The reliability discussed includes the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history. A novel high temperature lead-free solder system BiAgX will also be presented, including the design of this system and the reliability of solder joints formed.


    Special thanks to Door Prize sponsor:

    SVTronics



    March 5

    Free Webinar: Plasma Stencil Treatments: A Statistical Evaluation  +


    Free for members!
    Wednesday, March 5, 2014
    Presenter: Matt Kelly, P.Eng, MBA, IBM Corporation

    Offered at Two Convenient Times!
    Attend this webinar at either 12-1pm EST (for attendees in Americas and Europe) or 9-10pm EST (for attendees in Asia)

    Overview
    As printed circuit board complexities continue to increase, packing more functionality into smaller physical dimensions has become increasingly important. As a result, a wider variety of electronic components are being incorporated into product bills of materials. Large body ASICs (logic) and sub-system docking connectors generally drive large SMT pad designs, while fine pitch devices such as flip chip QFNs, 0402, and 0201 chip passives are now commonplace within electronic circuitry.

    Integration of these large and small body components onto a single printed circuit board assembly (PCBA) with ever increasing population densities and tighter placement spacings, drives the need for consistent solder paste print deposits to ensure maximum first pass assembly yields and highest product quality / reliability levels.

    Balancing solder paste printing of large and small print deposits has been reported to be enhanced using various surface treatments on laser cut stencils. This study focused on examining the effects of a plasma coating compared to conventional stainless steel, laser cut technology. Printing performance on a variety of components was evaluated including five different BGAs, flip chip QFNs, SMT electrolytic capacitors, 0805, 0402, and 0201 chip passives. Lead-free no clean and water soluble paste chemistries were included, along with two different aperture ratio (A/R) design points for all components studied. For assessing the durability of the plasma coating production volume cleaning simulations were conducted with twenty four different solvents.

    Statistical analysis was conducted to evaluate any observed differences between conventional stencil technology and a plasma treated alternative. A design of experiments was conducted to evaluate main effects and interactions, helping to make data generated decisions to answer the question: Do plasma treated stencils offer benefits over conventional technology stainless steel laser cut stencils?

    About the Presenter
    Matt Kelly, P.Eng, MBA, works for IBM Corporation as a Senior Technical Staff Member helping to convert the firm's portfolio of electronic products, focusing on high complexity, high reliability Server and Storage applications, to new RoHS compliant constructions. He is a key member of the IBM Lead-Free Server Development Core Team. The objective of this global role is to help develop new technologies and ensure new solutions are properly implemented across IBM's hardware manufacturing supply chain. He is an IBM Certified Systems Lead Auditor and is a DFSS Black Belt. He has been working to develop Lead-Free assembly technologies since 1999. Matt is active within SMTA, iNEMI, JEDEC, and IPC industry associations. He is currently is a member of the SMTA Technical Committee. He is the winner of 2007, 2010, and 2011 SMTAI Best International Paper Awards, the 2009 Pan Pacific Microelectronics Symposium Best of Conference, 2009 APEX Best International Paper, and 2009 IMAPS Best Paper of Session awards.He has published more than 60 technical papers to industry, has several US patents issued with several new disclosures in progress. Matt holds a Bachelors of Chemical Engineering from McMaster University, is a licensed professional engineer in the province of Ontario, and has received his MBA in Strategic Management from Sir Wilfrid Laurier University.


    March 6

    Houston Expo & Tech Forum  +

    Location: Stafford Centre
    10505 Cash Road
    Stafford, TX 77477
    Show Hours: 10:00AM - 3:00PM


    Exhibitors

    The cost to exhibit is $400/$500 (early/regular) for corporate members. The cost to exhibit for non corporate members is $475/$575 (early/regular).(click here for membership information). The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on February 14th, 2014!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details

  • Expo Brochure
  • Promotional Poster

  • Please contact SMTA Director of Exhibitions Emmy Garner with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    10:00AM
    Registration opens

    10:30AM – 11:00AM
    Nausha Asrar Failure Investigation - Cause to Prevention
    Nausha Asrar, Schlumberger

    The purpose of failure analysis is entirely positive: to prevent further failures. Failure occurs when a system or part of a system fails to perform up to the expectations for which it was created. Without an accurate analysis of the failure, efforts to make corrective action can be futile or counterproductive. Therefore, a better understanding of failure mechanism helps considerably in reducing failures and improving the reliability of the tool/component/assembly. In this presentation, emphasis has been given on the importance of cause and effect principles. Systematic failure investigation, root cause determination and implementation of the preventive measures will prevent recurrence and improve yield, service life and reliability.

    11:30AM – 12:00PM
    Glenn Miner PCBA Design Guidelines and DFM Requirements
    Glenn Miner, Engineering Manager, Benchmark Electronics

    "Guidelines" and "Requirements" are what those who design PCBAs have to learn to deal with... but when, where, what, why and just how much do we get involved? Waiting until there is wet solderpaste on the board is a little late to find problems. Having an unplanned re-spin of your PCB is never easy to explain. Missing a critical release date is even more difficult. Will this presentation give you all the answers? No. But you may learn enough to get you pointed in the right direction.

    12:30PM - 1:00PM
    Free BBQ Lunch on Show Floor!

    Special thanks to lunch sponsor:

    NPI Technologies


    1:00PM – 1:45PM
    Dr. Ning-Cheng Lee Voiding Control and Reliability of Solder Joints with Backward Compatibility
    Dr. Ning-Cheng Lee, Vice President of Technology, Indium Corporation

    Although lead-free soldering has been the main stream of electronic industry, applications demanding high reliability have been reluctant in converting into lead-free assembly. Unfortunately, the component industry opts to stick with the lead-free majority. As a result, the high reliability applications often end up being processed in the backward compatible mode. Voiding performance of solder joints, particularly that of BGA or CSP components, has been observed to be a vulnerable feature at backward compatible process. In this presentation, the voiding performance of backward compatible system is analyzed in terms of reflow profiles and alloy combinations, and is compared against tin-lead systems and lead-free systems. The reliability of this backward compatible system is also reported.

    2:00PM – 2:45PM
    Dr. Paul Vianco, Sandia National Laboratories Challenges Facing the High Temperature Electronics Industry In the Event of Restrictions on High-Pb Solders
    Dr. Paul Vianco, Sandia National Laboratories

    High-lead solders continue to be used extensively in the oil, gas, and geothermal industries and are readily available because they come under the 7a exemption of the RoHS agreement. Nevertheless, the scenario must be considered in which high-Pb alloys are no longer exempt from RoHS restrictions and thus, would rapidly disappear from the supply chain. This presentation will address possible alternative methodologies for high temperature electronics - developing higher melting temperature solder alloys, while using the current manufacturing and test infrastructures. This approach will require the development of alternative supporting materials; fluxes, printed circuit board, new industry standards and the need to develop different reliability test protocols not only for higher operating temperatures but for environments significantly different from the harshest of military and underhood applications.


    March 11 & 13

    SMTA Webtorial Tin Whiskers – All You Should Know   +


    Jennie Hwang Two (2) 90 minute Sessions
    Tuesday, March 11 and Thursday March 13, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Jennie Hwang Ph.D., H-Technologies Group

    Overview:
    For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The course provides a holistic coverage on tin whisker from both physical/phenomenal occurrence and fundamental scientific perspectives. The course also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed.

    What will you learn:
    Part 1:

  • Definition & clarification
  • Physical phenomena
  • Reference point
  • Causes and factors
  • Concerns & impact
  • Reliability

    Part 2:

  • Test conditions
  • Mitigation remedies
  • Relative effectiveness
  • Plausible mechanism
  • Tin whisker vs. tin pest
  • Summary

    Who Should Attend:
    The webinar provides a working knowledge to all who are involved with or interested in tin whisker and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

    Bio:
    Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as in lead-free electronics, brings to the webinar her 30+ years experience in hands-on production and as an advisor to OEMs, EMS and U.S. government. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. She has received numerous honors/awards including the U.S. Congressional certificate of recognition, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; election to the National Academy of Engineering. She is the author of 400+ publications and several ground-breaking books on solder, SMT manufacturing and lead-free technology and implementations and an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.


  • April 7 - 8

    Dallas Lean Six Sigma Yellow Belt 2-Day Chapter Tutorial Program  +

    Location
    THESIXSIGMAWAY
    Dallas , TX 75252



    Instructor: Albert Clary, TheSixSigmaWay
    April 7 & 8, 2014
    9:00 a.m. - 4:30 p.m.
    THESIXSIGMAWAY
    17766 Preston Road
    Dallas, TX 75252
    PH - 800-726-1345
    FAX - 800-726-1345

    Price (Same for webinar and in-person) :
    Members $400 (US)
    Non-Members $475 (US) (A one-year individual SMTA membership is included in the non-member price)
    Dallas Chapter Officers $200

    This 2-Day Course includes a FREE Lean Six Sigma Yellow Belt Certification!

    If travel costs are an issue, you have the option to register for either the in-person event or the online webinar running concurrently.

    Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch each day, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Lean six sigma methodology continues to gain popularity in various sectors. It is well documented that the tools of lean and six sigma had been used successfully to save companies and other organizations, large and small, millions of dollars and to realize breakthrough improvements in quality and cycle time. Surface mount technology companies regularly use lean six sigma tools that include value stream mapping, 5S, Pareto charts, fishbone diagrams, house of quality, and DOE.
    Nowadays, professionals are required to have at least some lean six sigma training. For instance, TheSixSigmaWay had trained professionals from the electronics industry, aerospace, healthcare, banking, hospitality, military, agriculture sector, and state and federal governments.
    Attendees of This lean six sigma yellow belt class will receive a complete overview of the five Lean Six Sigma phases (Define, Measure, Analyze, Improve, Control) with emphasis on the Define and Measure phases. An understanding of the focus differences between Lean and Six Sigma, their history, and their primary objectives. Key tools used for both Lean and Six Sigma will be discussed; however, only tools from the Define and Measure phases will be comprehensive.

    PLEASE NOTE: White Belt Certification is not a Prerequisite for this course.

    Course Objectives:
    Attendees will understand:

    Define Phase – Day 1

  • Understanding Six Sigma
  • Understanding LEAN
  • Six Sigma Fundamentals
  • Selecting Projects : Voice Of Customer (VOC)
  • Process Mapping : Macro and Micro Level
  • Pareto Charting
  • LEAN concepts : Elements of Waste
  • Wrap Up and Action Items

    Measure Phase – Day 2

  • Introduction to Process Discovery
  • Introduction to Six Sigma Statistics
  • Measurement System Analysis (MSA)
  • Cause and Effect (Ishikawa Fishbone)
  • X Y Matrix
  • Process Failure Mode and Effects Analysis (PFMEA)
  • Process Capability - Cpk
  • Wrap Up and Action items

    Analyze Phase

  • Overview of concepts discussed on Day 1
  • Details covered in the Green Belt Class

    Improve Phase

  • Overview of concepts discussed on Day 1
  • Details covered in the Green Belt Class

    Control Phase

  • Overview of concepts discussed on Day 1
  • Details covered in the Green Belt Class

    Who Should Attend:
    This course is intended for all levels of business operation personnel who are concerned about and wish to become familiar and comfortable with Lean Six Sigma and obtain a yellow belt certification. This course will be of benefit to all levels of business operations. White Belt Certification is not a prerequisite for this course.

    About the Instructor:
    Albert Clary is an experienced Master Black Belt who has been involved with teaching and deploying lean six sigma for over 15 years. He has held various engineering, management and teaching positions at companies including Nortel and Hewlett Packard.

    He is knowledgeable in areas such as:

  • Manufacturing process metrics and controls
  • Marketing process metrics and controls
  • Call center operational metrics and controls
  • Network operations metrics and controls
  • Continuous Improvement tool set (DMAIC/PDSA/DFSS/DOE)
  • Complex statistical analysis
  • Data mining on large complex data sets
  • High impact market research
  • Albert holds a Bachelor of Science in chemistry and an MBA, in addition to various certifications, including lean six sigma black belt and master black belt.

    Contact Karen Frericks at 952-920-7682 with questions.


    April 8 - 10

    South East Asia Technical Conference on Electronics Assembly  +

    Location
    Eastin Hotel Penang
    Penang Malaysia


    The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

    The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

    The conference is "claimable from HRDF under SBL scheme."

    Sessions and topics in our 2014 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.

    Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately




    Technical Program

    Training Courses - Tuesday, April 8th

    9:00 am – 12:00 pm
    T1 - Electromigration – The Hurdle for Miniaturization and High Power Devices
    Ning-Cheng Lee, Ph.D., Indium Corporation

    9:00 am – 12:00 pm
    T2 - 3D PoP for the SMT World
    Charles Bauer, Ph.D., TechLead Corporation

    1:30 pm – 4:30 pm
    T3 - Achieving High Reliability of Lead-Free Soldering - Materials Consideration
    Ning-Cheng Lee, Ph.D., Indium Corporation

    1:30 pm – 4:30 pm
    T4 - Cleaning and Contamination Process Guide
    Mike Bixenman,Ph.D., Kyzen Corporation




    Conference Day 1- Wednesday, April 9th

    Session 1: Sustainable Lead Free Manufacturing

    Chair: David Vetharudge, Listech Technology

    9:00     Applying Lean Six Sigma in Manufacturing (Printed Circuit Board Assembly)
    Johan Jr. Chan, IBM Corporation

    9:30     Do's and Don'ts - Good and Bad Practices - Myths and Reality of Soldering, Rework and Repair
                Terry Clitheroe, SMCBA (Australian SMT Association)

    10:00 0.35mm Pitch Extra Small Outline No Lead (XSON) Package PCBA Process Characterization (On Main Board)
                  Ricky Liew, Motorola Solutions Sdn Bhd

    Coffee Break - 10:30 – 10:45

    Session 2: Solder Paste Reliability

    Chair: KL Lim, Plexus Corporation

    10:45   The Rheology and Printing Behavior of Water Soluble Solder Pastes
       Li Tianpeng, Kester Components Pte Ltd

    11:15   Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys
                Sze Pei Lim, Indium Corporation

    11:45 High Reliability Pb-Free Halogen Free Solder
               Ian Wilding, Henkel Ltd

    Lunch - 12:15 - 1:15

    Session 3: Reliability of Low Silver Alternatives to SAC Alloys

    Chair: Chee Choong Kooi, Intel Corporation

    1:15   The Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped With Mn
              Sehar Samiappan, Indium Corporation

    1:45   Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality
              Kok Kwan Tang, Intel Corporation

    2:15   Gold Embrittlement in Lead-free Solder
               Alex Chiu, Agilent Technologies

    2:45   Properties and Structure of Magnetic Receptive Fe_Centric SAC305 Solder
               R. Gopal Krishnan, National University of Singapore

    Coffee Break – 3:15 -3:30

    Session 4: Latest Advances in High Density Interconnect

    Chair: Khaw Mei Ming, Agilent Technologies

    3:30    TSV Barriers Create SMT Opportunities
                Charles Bauer, Ph.D., TechLead Corporation

    4:00   High Density Assembly in PCB Cavities
                Ranilo Aranda, Flextronics

    4:30   Failure Analysis of High Density Printed Circuit Board Assembly Inside Smartphone
                CK Lim, Intel Corporation




    Conference Day 2- Thursday, April 10th

    Session 5: Cleaning

    Chair: AK Tan, Jabil Circuit Sdn. Bhd.

    9:00   Concentration Monitoring & Closed Loop Control – A Technological Advancement
                Yeoh GT, ZESTRON

    9:30   Cleaning PCBs in Electronics: Understanding Today's Needs
               Steven Teh, Inventec Performance Chemicals

    10:00 Cleaning Soldering Residues from High Lead Soldered PCBs
                Mike Bixenman, Kyzen Corporation

    Coffee Break – 10:30 - 10:45

    Session 6:   Miniaturization

    Chair: Jensen Lee, Round Roots

    10:45  Ultra Miniaturized 01005 Passives Assembly
               Ng Chin Fei, Motorola Solutions

    11:15  Lead-Free and Halogen Free Solder Flip Chips Integration on Board Using SMT Process
                 Ranilo Aranda, Flextronics

    11:45   Failure Modes and Failure Analysis of LEDs in ICMs and Process and Design Optimization for LEDs Within ICMs
                Johan Jr. Chan, IBM Corporation

    Lunch – 12:15 – 1:15

    Session 7: QFN Reliability

    Chair: Tay Cheng Siew, Intel Product (M) Sdn. Bhd.

    1:15   Reliability Improvement of Array QFN Package
               You Chye How, Texas InstrumentS

    1:45   Optimizing Solder Voids Performance at Thermal Pad and Printability of its Peripheral Pads for Dual Row QFN Assembly
               Wong Hon Sern, Motorola Solutions (M) Sdn Bhd

    2:15   Bottom Termination Component Design Considerations to Improve Cleaning
               Mike Bixenman, Kyzen Corporation 

    2:45   A Process for Improved QFN Reliability
                John Ganjei, Ph.D., MacDermid, Inc.

    Coffee Break – 3:15 – 3:30

    Session 8:   Emerging Technologies

    Chair: Jonas Sjoberg, Round Roots

    3:30    Inspection Strategies for More Accurate, Faster and Smarter Inspection
                Dick Johnson, CyberOptics Corporation

    4:00   The Use of Micro/ATR FTIR in PCBA CRD Smearing Failure Analysis
               Kong Hui Lee, Cisco Systems (Malaysia) Sdn. Bhd.

    4:30   Package on Package (POP) Process Characterization and Capability Study 
               Kenny Chiong, Motorola Solutions


  • April 8 - 10

    SMT Processes Certification - April 8-10, 2014 (Garden Grove, CA)  +

    Location
    Paradigm Contract Mfg. LLC
    Garden Grove , CA 92841


    Time: 8:30am - 5:00pm


    April 15 & 22

    SMTA Webtorial: Higher Density Packaging: Manufacturability & Reliability  +


    Cheryl Tulkoff Two (2) 90 minute Sessions
    Tuesday, April 15 and 22, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Cheryl Tulkoff, DfR Solutions

    What You Will Learn:
    For higher density packaging, one of the most common drivers for failure is inappropriate adoption of these new technologies. The path from consumer products with relatively high volume and short lifetime to high reliability products is not always clear. Obtaining relevant processing information can be difficult since information is often segmented by industry. And, the focus is always on the opportunities and not the associated risks. Some of the alphabet soup of higher density package names and descriptions you’ll see include TSVs (through silicon vias), Stacked Die packages, PoP (package on package), MEMS (Micro-electromechanical systems), SiP (system in or on a package) , SoC (system on a chip), 3D packaging, CSP (chip scale packaging), integrated passives and so on. Examples of the packages to be reviewed and discussed from both manufacturability and reliability perspectives during this webtorial are described below. This webtorial will help you wade through the rhetoric to the details important to your product.

    Package on package was developed initially to meet more performance and functionality in smaller space like mobile devices where high density substrates and small single chip packages were not enough. The benefits of PoP packaging are well known.
    They include:

  • Less board real estate
  • Better performance (shorter communication paths between the micro and memory)
  • Lower junction temperatures (at least compared to stacked die)
  • Greater control over the supply chain (opportunity to upgrade memory and multiple vendors)
  • Easier to debug and perform F/A (again, compared to stacked die or multi-chip module or system in package)
  • Ownership is clearly defined: Bottom package is the logic manufacturer, the top package is the memory manufacturer, and the two connections (at least for one-pass) are the OEM

    Companies in small volume, high reliability industries have to understand the limitations and challenges of PoP though in terms of both manufacturability and reliability.

    Through Silicon Vias (TSV) are the next generation technology for SiP (system in package) devices. They are similar to plated through holes in a PCB. TSV Promised advantages include thinner packages and a greater level of integration between active die. Rather than by cost reduction, TSV usage will be justified by increased performance through increase in inter-die I/O, increase in bandwidth, and decrease in interconnect length. TSV processes still being optimized and overall cost must be reduced for widespread adoption.

    There are several factors that influence the reliability of MEMS (Micro-electromechanical systems) devices. The types of materials used and the shape of the device affect the probability and type of failure.

    The three types of failure mechanisms that can be encountered are:

  • Packaging defects. Cracks in the package can allow moisture in which will contaminate the MEMS device.
  • Packaging interfering with the device. The gap between the package and the device could collapse, interfering with the function of the device.
  • Device defects. Finally, the device can have flaws that lead to residual stress build up, eventually causing bowing and shorting. Proactive hard work will minimize issues when integrating any higher density packaging into designs.

    Instructor Bio:
    Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.

    Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She had held leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years and is also an ASQ Certified Reliability Engineer.


  • April 17

    Intermountain (Boise) Expo & Tech Forum  +

    Location: Boise State University
    Student Union Building Simplot Ballroom
    1910 University Drive
    Boise, ID 83725
    Show Hours: 10:00am - 3:00pm



    Exhibitors

    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on March 27th, 2014!

    Important Exhibitor Materials:

  • Exhibitor Floorplan
  • NEW to 2014! Exhibitors pick your own booth location!

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

  • Parking Information
  • Free Technical Program & Schedule:

    10:00AM
    Registration opens

    10:15AM – 11:00AM
    Eric Moen Advances in Stencil Technology to Facilitate Ultra-Fine Pitch Printing
    Eric Moen, Director of Sales and Marketing - North and Central America, LaserJob USA Inc.

    In the assembly and interconnection technology for electronic devices, miniaturization has become a key driver in the development of highly integrated systems. Although more than 50% of defects occur within the screen printer, higher production economies and yield improvements are often forfeited due to the fact that the stencil is seen as a “generic” tool instead of a high-precision instrument. No matter how advanced the capability of the screen printer, every aperture is subject to the quality, uniformity, and release characteristics of the foil and the stencil.

    This presentation will highlight advances in stencil coatings, high-accuracy multi-step materials, and aperture parameter comparisons which will give the attendee data-driven details on the newest advances in stencil technology.


    11:30AM – 12:15PM
    Greg Wade How to Get the Absolute Most Out of Your Stencil Printing Process
    Greg Wade, Technical Support Engineer - Global Accounts, Indium Corporation

    This presentation will cover the latest techniques in creating a robust process Including: Proactive maintenance, Tooling Dos and Don’ts, Stencil Technology and 3D Statistical Analysis.


    12:15PM - 1:30PM
    Free Lunch on Show Floor!

    1:30PM – 2:15PM
    Ram Wissel Bottom Termination Component Design Considerations to Improve Cleaning
    Ram Wissel, Engineering Services Manager, Kyzen Corporation

    Bottom Termination Components (BTC’s) are the fastest growing package types in the electronics industry. BTC packages range from fine-pitch BGA’s which attach using a solder ball to leadless components such as QFN’s and LGA’s that sit directly on solder paste. Flux residues often under fill the BTC package during reflow, creating a packed obstacle course this is one of today’s toughest cleaning challenges. Left un-cleaned or partially cleaned, these trapped residues have the potential to be both hydroscopic and conductive. Concentrated ionic levels lower dielectric strength and can result in dendritic growth and eventual device failure.


    April 17

    Oregon Chapter Tutorial Program on Lead-Free Reflow, Wave and Selective Soldering Yield Improvement  +

    Location
    Axiom Electronics
    Beaverton , OR



    Instructor: Rob Rowland, Axiom Electronics
    April 17, 2014
    9:00 a.m. - 4:30 p.m.
    Axiom Electronics
    Beaverton, OR

    Price:
    Members $200
    Non-Members $275 (A one-year Individual SMTA Membership is included in the non-member price)
    Oregon Chapter Officers $100
    Student Members $50
    Student Non-Members $55 (A one-year Student SMTA Membership is included in the non-member price)

    Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch each day, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    What You Will Learn:
    Surface mount and through-hole soldering processes are challenging and Pb-free soldering added another level of complexity. Soldering profiles should be based on the physical and chemical parameters that influence the soldering process; they should not be developed by trial and error. This workshop identifies and examines the critical process parameters associated with Pb-free and SnPb reflow, wave and selective soldering. The subjects include theory of operation, operating parameters, monitoring and measuring concepts and related industry standards. This workshop also covers mixed alloy (Pb-free/SnPb) reflow soldering.

    A soldering profile methodology must be developed and documented. Soldering profiles are a delicate balance between time and temperature; achieving the right balance can be challenging. All time/temperature profiles are influenced by substrates, components, fluxes and solder alloys. These influences must be well understood and factored into all soldering profiles. This workshop covers how substrates, components, fluxes and solder alloys influence a solder profile. Topics include zone and preheat parameters, solder pot temperatures, conveyor speed calculations, profiling methods and profiling equipment.

    The reliability of Pb-free substrates and solder joints are key concerns. In particular, substrate (PCB) reliability has been impacted by the transition to Pb-free soldering. Case studies will address defects and reliability concerns such as PCB delamination and cracking, moisture related delamination, pad cratering and head-on-pillow. Failure analysis techniques like optical inspection, dye and pry, x-ray and cross sectioning will also be discussed. Another interesting Pb-free topic, tin whiskers, will also be covered in detail.

    Who Should Attend:
    This workshop is intended for individuals who are involved in Pb-free and SnPb reflow, wave and selective soldering. The information presented in this workshop will be beneficial to process, manufacturing and quality engineers, production operators and engineering or production managers. Some basic knowledge of PCBA assembly and soldering is helpful but not essential.

    Topics – this workshop covers:

  • Steps to creating reflow, wave and selective soldering profiles
  • Component peak temperature
  • Component ramp up and ramp down rates
  • Component surface finish
  • Tin whisker theory and risk
  • Moisture sensitive devices
  • PCB glass transition temperature
  • PCB coefficient of thermal expansion
  • PCB material decomposition temperature
  • PCB time to delamination
  • PCB surface finish
  • Flux activation temperature and time
  • Rosin, water soluble and no-clean flux
  • Flux classification per J-STD-004
  • SnPb and Pb-free solder alloy options
  • Pb-free solder joint appearance
  • SnPb and Pb-free soldering scenarios
  • Mixed alloy (Sn/Pb and Pb-free) soldering
  • Pb-Free BGAs with SnPb Solder
  • Solder paste basics per J-STD-005
  • Stencil apertures and wetting after reflow
  • Reflow, wave and selective soldering phases
  • Reflow, wave and selective soldering profiles
  • Conveyor speed calculations
  • Reflow oven zone settings
  • Pb-free solder pots
  • Pb-free substrate (PCB) reliability
  • Pb-free solder joint reliability
  • Voiding and head in pillow defects
  • Pad cratering and CAF defects
  • Related industry standards
  • About the instructor:
    Rob is currently the Manufacturing Engineering Manager at Axiom Electronics in Beaverton, Oregon. Rob has 30 years of experience with surface mount manufacturing technology. He is an active member of the Surface Mount Technology Association (SMTA). Rob has been the Technical Program Director of SMTA International for 12 years. He is a recipient of the SMTA Founders Award and the SMTA Member of Technical Distinction Award. Rob is also a recipient of Distinguished Committee Service Awards for his contributions to IPC-7095 and IPC-7093. He is a frequent author and speaker at industry trade events. Rob is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University.



    Contact Karen Frericks at 952-920-7682 with questions.


    April 22 - 25

    SMTA China East 2014  +

    Location
    Shanghai China



    April 28

    Indiana Expo & Tech Forum  +

    Location: Clarion Waterfront Plaza Hotel & Conference Center
    2930 Waterfront Parkway West Drive
    Indianapolis, IN 46214


    Exhibitors

    Please contact SMTA Director of Exhibitions Emmy Ross or Nick Mates with questions or for additional information.



    Attendees
    Attendees Register Now

    Please see the Indiana Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 6 & 13

    SMTA Webtorial: PCB Cleaning: Applications, Analytics and Solutions  +


    Umut Tosun, ZESTRON AmericaTwo (2) 90 minute Sessions
    Tuesday, May 6 & 13, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Umut Tosun, ZESTRON America

    Overview:
    If the reliability of your electronic assemblies is critical, removing impurities from the printed circuit board surface as well as underneath the components is necessary. This is truer today than ever for a variety of reasons including the change from eutectic to lead-free soldering process, climatic influence on PCB reliability and cleanliness requirements for bonding and conformal coating processes. These issues will be reviewed in-depth providing the background for a detailed discussion of electronic assembly cleaning processes.

    Solvent, surfactant and micro phase cleaning agent technologies will be reviewed including the benefits of each. This will be followed by a detailed discussion of commercially available cleaning equipment options such as Spray-In-Air, Ultrasonic, Spray-Under-Immersion and Immersion Air-Supported including their operating principle, optimization techniques and ideal cleaning agent types for each. As rinsing is critical to all aqueous cleaning processes, water treatment processes will also be reviewed.

    Once a cleaning process is implemented, one must understand the options available to assess the substrate cleanliness. Numerous indirect and direct measurement techniques will be discussed including recommended IPC test methods and standards. Cleaning issues associated with No-clean and Water Soluble flux systems will be discussed and three user case studies will be presented whereby product reliability issues were traced to insufficient cleaning processes.

    The impact of PCB design, geometry and component standoff height on the effectiveness of the cleaning process will be presented and suggested solutions provided. And finally, cleaning agent selection and considerations for material compatibility with regard to substrate surface, components and labels will be reviewed. .

    Course Outline:
    Part 1:

    • Introduction
    • Reasons for PCB Cleaning
      • Eutectic to Lead-free Process
      • Climatic Reliability
      • Coating
      • Bonding
    • Cleaning Agents
    • Cleaning Equipment
    • Surface Analytics
    • Questions and Answers

    Part 2:

    • Defluxing in a No-clean World
      • Case Study A: Cleanliness Assessment for Class III Lead-free No-clean Assemblies
    • Defluxing in an OA World
      • Case Study B: Solving Product Reliability Issues - Full Service EMS Provider
      • Case Study C: Solving Product Reliability Issues - Midsize OEM
    • Difficult to Clean Parts and Solutions
    • Material Compatibility
    • Questions and Answers

    Who should attend:
    This webinar is designed for production operators, managers and process engineers that would would like to gain a working knowledge of PCB cleaning applications, analytical methods and best practice solutions

    Your Instructor:
    Umut Tosun, M.S.Ch.E., is the Application Technology Manager at ZESTRON America. He has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. He has authored and published numerous technical articles in leading electronics manufacturing magazines such as Circuits Assembly, SMT Magazine, Global SMT & Packing and US Tech.

    Mr. Tosun graduated with a Bachelor’s and Master’s Degree in Chemical Engineering from the Technical University of Hamburg, Germany. He joined ZESTRON in 2000.


    May 7

    Atlanta 18th Annual Expo  +

    Location: Gwinnett Civic Center
    6400 Sugarloaf Parkway
    Duluth, GA 30097


    Exhibitors

    The cost to exhibit is $400/$500 (early/regular) for corporate members. The cost to exhibit for non corporate members is $475/$575 (early/regular).(click here for membership information). The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on April 18th, 2014!


    Important Exhibitor Materials:

  • Exhibitor Floorplan
  • NEW to 2014! Exhibitors pick your own booth location!

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details



  • Exhibitors! Download our postcard to send to your customers! Make sure they know you will be at the show! Atlanta Expo Postcard

  • Meet and Greet with the Best in the Business!

    Join us after the show for an Exhibitor Networking and Celebration at Arena Tavern!
    2000 Satellite Blvd NW, Duluth, GA 30097



    Enjoy a beer and appetizers on our After Party Sponsor:TTM Technologies Booth #804


    Please contact SMTA Director of Exhibitions Emmy Ross with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    The Atlanta Chapter is holding a charity raffle again this year! Drawings for great prizes throughout the day, and a Grand Prize Drawing at 3:30pm!

    Veterans Empowerment Organization will be this year’s beneficiary. They cover temporary to permanent housing, mental & physical healthcare, substance abuse, education, and help finding work.

    Exhibitors are invited to donate raffle prizes and raffle tickets will be sold the day of the Expo, with all proceeds matched by the Atlanta Chapter and benefiting Veterans Empowerment Organization. Donate today!


    See a Complete List of the Raffle Prizes Here



    Free Technical Program & Schedule



    Special Thank You to Our Technical Program Sponsor Printed Circuits Corp.




    9:30AM – 10:15AM
    Keynote: "FIRST Robotics - A Resource for our Future Leaders"
    Connie Haynes, Regional Director, Georgia FIRST Robotics

    Connie HaynesThe electronics community often finds itself wondering where we will find our next generation of engineers, technicians, chemists, technologists and managers. FIRST Robotics is one such group that can help groom and encourage our future leaders. FIRST Robotics was developed to inspire young people to be science and technology leaders by engaging them in exciting mentor-based programs that build science, engineering and technology skills, that inspire innovation, and that foster well-rounded life capabilities, including self-confidence, communication, and leadership. FIRST is a not-for-profit public charity that designs accessible, innovative programs that motivate young people to pursue education and career opportunities in science, technology, engineering, and math, while building self-confidence, knowledge, and life skills.

    Plus, see live demos on the show floor from Georgia FIRST Robotics!

    Join us for a cup of coffee following the Keynote Speaker. Special Thanks to Our Coffee Break Sponsor:StenTech Ltd. Booth #100

    Morning Sessions

    11:00AM – 12:00PM
    Flex-Rigid Circuit Board Techniques for High-Tech Applications
    Paul Handler, North American Sales Manager, Schoeller Electronics
    Markus
    Modern electronic systems possess very high functionality and at the same time they are very compact in the design and type of construction. The amount of space that device designers make available for the electronic equipment is always limited and therefore needs to be utilized in the best possible way. The electronic components have an increasingly higher density and larger number of connections. For those reasons, circuit boards need to have a high interconnection density, must be very reliable and should utilize the available space in an optimum degree. Flexible circuit boards are one possibility, but the most reliable technology is offered by the flex-rigid circuit board.{Click Title for Full Abstract}

    11:00AM – 12:00PM
    Miniaturization Challenges - Investigations into 0.3mm Pitch Assembly and Reliability
    Denis Barbini, Ph.D.,
    Associate Director, AREA Consortium, Universal Instruments


    Denis Barbini0.3mm pitch Wafer Level and Chip Scale Package assemblies utilizing printing and dipping processes were evaluated for high-yield, high-throughput lead-free applications. Multiple stencil thickness, aperture sizes, paste/flux types, printer and placement machine settings were evaluated and the optimum, or near optimum, parameters were used to assemble components to multilayer test boards. Package designs evaluated included a 256 I/O standard array CSP, a 400+ I/O staggered array CSP and a 100 I/O WLCSP. Motherboards with open and copper filled microvia-in-pad were included in the comparisons. The completed test vehicles were subjected to mechanical shock (i.e. drop) testing, cyclic four-point bending, and/or thermal cycling in order to perform comparative reliability analyses. {Click Title for Full Abstract}




    Be sure to pick up your lunch ticket at our Lunch Sponsor
    I. Technical Services Booth #400!




    Afternoon Sessions

    1:30PM – 2:30PM
    Failure Analysis: Lessons Learned in Manufacturing and Field Reliability With a Focus on Failure Analysis of Assembly Case Studies
    Denis Barbini, Ph.D.,
    Associate Director, AREA Consortium, Universal Instruments


    Denis BarbiniWhen reviewed in conjunction with research, failures provide a unique perspective on design for manufacturability and reliability. This presentation will provide valuable lessons learned from practical experience through discussion of material selection, current electronics research and failure analysis case studies. Design considerations for advanced assembly processes and analytical techniques for materials characterization will also be covered. In addition, a review of lead-free laminate selection and testing procedures will shed light on the question, “Can your board withstand 9x reflow?”{Click Title for Full Abstract}

    1:30PM – 2:30PM
    PCB Designers' Roundtable
    Moderated by Andy Shaughnessy, managing editor of PCB Design007 and The PCB Design Magazine, and co-editor of SMT Magazine

    Andy Shaughnessy
    Join us for an interactive session with industry leader, Andy Shaughnessy. A journalist for over 20 years, Andy previously served as editor of Printed Circuit Design and Manufacture and conference chair for the PCB Design Conferences.


    Stop by our Snack Sponsor Engent's Booth for an afternoon treat!


    May 7

    Oregon Expo & Tech Forum  +

    Location: Tektronix Building
    38 Conference Center
    Beaverton, OR


    Exhibitors

    The cost to exhibit is $350 for one tables and $650 for two tables. The cost to exhibit includes: one 5ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Please note: This year both tabletops and booths will be available. Those purchasing a table top please refrain from using banners, screens etc.

    Please contact SMTA Director of Exhibitions Emmy Ross or Dave Larson with questions or for additional information.



    Attendees
    Attendees Register Now

    Please see the Oregon Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 13 - 15

    International Conference on Soldering & Reliability 2014  +

    Co-located SMTA Toronto Expo

    Location
    Four Points By Sheraton Toronto Airport
    Toronto , ON L4V 1E4 Canada


    Electronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive components are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. The following are the dates for compliance: July 22, 2014 – medical devices and monitoring and control instruments; July 22, 2016 – in vitro diagnostic medical devices; July 22, 2017 – industrial monitoring and control equipment; and July 22, 2019 – electrical and electronic equipment which falls outside the scope of the original RoHS Directive. Soldering and reliability professionals need to come together to share their knowledge and their vision for addressing these challenges.


    May 13

    Wisconsin Expo & Tech Forum  +

    Location: Milwaukee Airport Crowne Plaza
    6401 S 13th St,
    Milwaukee, WI 53221


    Exhibitors

    The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

    Please contact SMTA Director of Exhibitions Emmy Ross or Mike Gerner with questions or for additional information.



    Attendees
    Attendees Register Now

    Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


    May 15

    Toronto SMTA Expo & Tech Forum  +

    In conjunction with the International Conference on Soldering & Reliability (ICSR)

    Location: Four Points By Sheraton Toronto Airport
    6257 Airport Road
    Toronto, ON M9W 1J5


    Exhibitors

    Exhibit Hours:
    May 15, 2014: 10:00am – 3:30pm

    Please note that exhibit traffic will be minimal while symposium is in session.

    The exhibit floor has SOLD OUT! Please contact Patti Coles at 952-920-7682 for Sponsorship Opportunities.

    Download Exhibitor Details

    Sponsorship Opportunities:
    Click here to download more information.

  • Lanyard Sponsor $400/$900
  • Bag Sponsor - $400/$900
  • Coffee Break Sponsor - $550
  • Lunch Sponsor - $1000

    Special Thank You to our Sponsors:

    Special thanks to Comtree Inc. as our Expo coffee break sponsor. Coffee Break Sponsor



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    May 15, 2014: 10:00am – 3:30pm

    Free Technical Program & Schedule:

    9:00am
    Registration Opens

    9:15am – 10:00am

    Dale Lee Cleanability by Design: Design Guideline for Aqueous Cleaning
    Dale Lee, Plexus Corporation

    Design complexities and functionality requirements are continually decreasing spacing between conductors. As devices decrease in size, contamination can lead to unavoidable and unwanted malfunctions. Contamination trapped under components can result in electro-chemical migration, leakage currents and stray capacitance in an electronic circuit due to high voltage and frequency.

    Cleaning is used on many designs to mitigate this issue. However, very little to no consideration is accounted for this during the product development process to address the cleaning process. Cleaning process is almost always a throw it over the wall issue for manufacturing to address as part of their process design. Factors such as the density of components, component layout, thermal heat requirements, and standoff height/clearance are key considerations. This presentation will highlight research performed on passive, BGA and QFN packages to identify the effects of solder mask clearance and land pattern design on ability to remove flux residues and improve cleanliness of solder electronic assembly.

    10:00AM
    Expo Opens


    11:00am – 11:45am
    Mukul Luthra Process Considerations and Challenges in Merging Array Devices into Mainstream SMT
    Mukul Luthra, Waterfall Technologies

    Array Packaging such as Ball Grid Arrays (BGAs) and their smaller counterparts Chip Scale Packages (CSPs) and Wafer Level Packages (WLPs) have become ‘defacto’ standards driven by handheld and mobility products requiring small form factor, high-density and light weight. “Package level scaling” the placing of multiple dies and passives all within a package has been and continues to be a major driver for Array Device market growth.

    Array device assembly, however, requires specialized process considerations and poses unique spin-offs in process issues and challenges. In a very limited time this presentation reviews key process considerations and controls in BGA & CSP assembly. The focus is on interactive variables impacting key issues such as voids, CNDPs, Joint stretching, HiP, dumbbell formation and joint cracking. Mitigation options using real life examples are presented.

    The session summarizes the key success factors for yield and reliability and provides references for further development.

    11:45am - 1:00pm
    Free Lunch on Show Floor!

    1:00pm - 1:45pm
    Matt Kelly Plasma Stencil Treatments: A Statistical Evaluation
    Matt Kelly, IBM Corporation

    As printed circuit board complexities continue to increase, packing more functionality into smaller physical dimensions has become increasingly important. As a result, a wider variety of electronic components are being incorporated into product bills of materials. Large body ASICs (logic) and sub-system docking connectors generally drive large SMT pad designs, while fine pitch devices such as flip chip QFNs, 0402, and 0201 chip passives are now commonplace within electronic circuitry.
    Integration of these large and small body components onto a single printed circuit board assembly (PCBA) with ever increasing population densities and tighter placement spacings, drives the need for consistent solder paste print deposits to ensure maximum first pass assembly yields and highest product quality / reliability levels.

    Balancing solder paste printing of large and small print deposits has been reported to be enhanced using various surface treatments on laser cut stencils. This study focused on examining the effects of a plasma coating compared to conventional stainless steel, laser cut technology. Printing performance on a variety of components was evaluated including five different BGAs, flip chip QFNs, SMT electrolytic capacitors, 0805, 0402, and 0201 chip passives. Lead-free no clean and water soluble paste chemistries were included, along with two different aperture ratio (A/R) design points for all components studied. For assessing the durability of the plasma coating production volume cleaning simulations were conducted with twenty four different solvents.

    Statistical analysis was conducted to evaluate any observed differences between conventional stencil technology and a plasma treated alternative. A design of experiments was conducted to evaluate main effects and interactions, helping to make data generated decisions to answer the question: Do plasma treated stencils offer benefits over conventional technology stainless steel laser cut stencils?


  • June 3 - 5

    SMT Processes Certification (Lawrenceville, GA)  +

    Location
    Lawrenceville , GA


    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • June 11

    Free Webinar: Printed Electronics Technologies  +


    Free for members!
    Wednesday, June 11th, 2014
    Presenter: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory, California Institute of Technology

    Offered at Two Convenient Times!
    Attend this webinar at either 12-1pm Eastern (for attendees in Americas and Europe) or 8-9pm Eastern (for attendees in Asia)

    Overview
    Printed electronics technologies and 2D/3D conventional/rapid printing of organic/nonorganic electronic devices on various small/large substrates are projected to grow exponentially in commercial industry, providing an opportunity for members of the surface mount technology association to tap into this rapid growth. To achieve this goal, this presentation provides knowledge gathered on the current status of organic and printed electronics technologies. It reviews three key industry roadmaps: OEA, ITRS, and iNEMI on this subject, each with different name identification for this evolving technology. The presentation is followed by a brief review of the status of the industry on standard development, including IEEE and IPC specifications. The talk concludes with key technologies and applications and provides a technology hierarchy similar to those of conventional microelectronics for electronics packaging.
    Key Words: printed electronics, organic electronics, large area electronics, packaging hierarchy

    Who should attend
    Even though this presentation is intended for surface technology association members; others who are involved in electronics industry will also benefit. It is intended for audiences from various disciplines including scientist, R&D engineers, packaging engineer, specification participant engineers, visionaries, and managers who are looking to learn and expand research and business activities covering aspects of this rapidly growing technology.

    About the Presenter
    Dr. Reza Ghaffarian has more than 30 years of industrial and academic experience. For the last 20 years at NASA/JPL, he led R&D reliability and quality assurance activities in advanced electronic packaging and has been a consultant resource for most JPL projects including Mars Curiosity Rover. He received numerous awards including the NASA Exception Service Medal for outstanding leadership and industrial partnership. He has authored more than 150 technical papers, co-editor of a CSP book, and numerous book chapters including two in the Encyclopedia of Thermal Stresses (Dec. 2013). He serves as technical Advisor/Committee to SMTA, IPC, Microelectronics Journal, IMAPS, and IEEE IEMT/CPMT. He received his Ph.D. in 1982 from University of California at Los Angeles (UCLA).


    June 12 & 19

    SMTA Webtorial: PCB Surface Finishing Overview: Getting the Most Out of Your Surface Finish  +


    Two(2) Part 90 Minute Sessions
    Thursday, June 12 & 19, 2014
    11:00am to 12:30pm Eastern
    Presented by: Lenora Toscano, MacDermid

    Overview:
    The performance expectations of printed circuit board surface finishes are greater than just solderability preservation. Historically, final finishes were designed solely to protect copper from oxidation prior to the soldering of components. This included any storage and transportation from board manufacture to the assembly facility. Now the expectations are much greater; superior solderability, contact performance, wire bondability, corrosion resistance, extended end use life in aggressive environments and all this must be achieved at low cost. Designs have changed, lines and spaces are reduced, solder types and flux chemistries are different, there are a higher percentage of no clean assemblies, number of assembly cycles has increased, and many PCBs require multiple SMT steps and are followed by a selective or wave solder step. In addition to all these changes, there is a significant amount metal area left exposed in the end-use applications. This Webtorial will detail the process cycles, performance advantages and disadvantages of all surface finishes offered in the electronics market today. Sessions will be split by resultant solderjoint type; those that create Cu-Sn and those that create Ni-Sn solderjoints. A portion of the time will discuss areas of focus during fabrication to ensure the greatest performance from each individual finishes. This will not only benefit the line engineer but also supplier quality managers and the designers putting various finishes into their specifications.

    Outline:
    1. Review of surface finish needs 2. Surface finishes available on the market 3. Process Cycles 4. Pros and Cons of each finish 5. Considerations for success with all surface finishes. 6. Part 1 will review nickel free surface finishes. Part 2 will focus on nickel containing finishes.

    Who Should Attend:
    Anyone who deals with surface finishes specifications and/or defect analysis. Those responsible for choosing the surface finish for end use products. Process engineers and supplier quality managers.

    About The Instructor:
    Lenora Toscano is the Director Final Finishes in the Electronics Division of MacDermid. Her responsibilities include innovation and marketing for all surface finishing specific to printed circuit boards. She also takes part in the development of new surface finishes outside of the conventional electronic markets. Her efforts have focused on developments that assess the compatibility between final finishes and different assembly and end-user applications. In addition, as the Director of OEM applications, Lenora works closely with fabricators, EMS and OEMs to understand customers’ needs for all MacDermid’s product lines. By narrowing the communication gaps within the electronic supply chain, Lenora is able to satisfy fabricators and OEM needs.

    Lenora has been working for MacDermid for 15 years and has been published in numerous industry technical conferences. She holds four patents. She graduated from the University of Connecticut with a Bachelor’s Degree in Chemistry and received her Master’s Degree in Chemistry.


    June 24 - 26

    Symposium on Counterfeit Electronic Parts and Electronic Supply Chain  +

    Location
    Marriott Inn & Conference Center
    College Park , MD


    Symposium on Counterfeit Electronic Parts and Electronic Supply Chain Technical Symposium: June 24 - 26, 2014
    Workshops: June 26, 2014
    Expo: June 24-25

    University of Maryland, College Park, MD

    SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Electronic Parts and Electronic Supply Chain. The program will be held June 24-26 at the Marriott Inn & Conference Center next to the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.

    Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

    Topics will include:
  • Impact of supply chain changes on the component management practices: quality, reliability, manufacturability
  • Electronic parts distribution: current stage and evolution
  • Authentication techniques for securing electronic part supply chain
  • Federal procurement practices and its impact on electronic supply chain
  • Inspections tools and techniques for detecting counterfeit parts
  • New areas of counterfeit concerns: materials, energy storage
  • Industry and international working groups and standards on electronic part supply chain and counterfeit electronic parts


  • The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


    July 15 & 22

    SMTA Webtorial: Failure Analysis: Lessons Learned in Manufacturing  +


    Martin AnselmTwo (2) 90 Minute Sessions
    Tuesday, July 15 and 22, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Martin Anselm, Ph.D., Universal Instruments Corp.

    Overview:
    Universal Instruments Corporation’s Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.

    Topics Covered:
  • What the major difficulties in lead-free reliability testing are
  • Mixed alloy assembly best practices
  • PCB plating considerations
  • Analytical testing techniques and what they can identify root causes for production failures
  • Lead-free laminate selection and testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies
  • FA Tools and Techniques to be discussed include the following:
    Thermogravimetric Analysis & IR Ion Chromatography Ion Contamination Shadow Moire SEM/EDS Wetting Balance/Solderability Acoustic Microscopy White Light Interferometry Mechanical Testing Optical Microscopy Mechanical Strain Gauge Analysis & Strain limits X-Ray Inspection Environmental Testing Solder Paste Print Transfer Efficiency Micro Hardness Testing Dye Penetration Testing Micro Sectioning Cross-section Etching

    Suggestion:
    Please think of specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. In my experience many problems can be solved with a brief discussion of the issues.

    Instructor Bio:
    Since 2002 Martin has been working in electronics Failure Analysis and currently oversees all the failure analysis projects for the Universal Instruments Corporation's Advanced Process Lab (APL). Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.


  • September 10

    Free Webinar: Power and High Temp Electronics Manufacturing  +




    Wednesday, September 10, 2014 @ 12:00 PM Eastern
    Presenters: Dr. Chris Hunt, NPL
    Bob Willis, NPL Defect Database Coordinator

    Overview
    SMTA will be running the "Power & High Temperature Manufacturing Experience" at SMTA International in September but before that we are running a pre-show webinar on high temperature solders which have long been used in hierarchical soldering for attaching silicon die within components. There is an increase in the demand for high temperature interconnect solutions with recent introductions of high power semiconductors. Application areas for these new devices include the electric vehicle and renewable energy. Characterization of electronic interconnect properties operating at temperatures above 200ºC, has not been undertaken in great detail. These new materials form different interconnection joints, dimensionally, structurally, and with different bond strengths. Understanding the degradation mechanism for these material solutions is in its infancy.

    We will also outline some of the existing interconnection methods and materials used for organic printed circuit substrates for high temperature operation up to 200ºC. Although there are many applications and companies running these processes there is very little literature in the public domain on PCB assembly.

    You will have the opportunity to obtain a copy of the latest NPL report on "High Temperature materials" produced by the NPL Electronics Interconnection Group.

    High Temp Electronics

    Topics covered include:

  • What is high temperature and what does it mean?
  • Application and Design Requirements
  • Use of liquid solder and sintered pastes
  • Reliability testing and characterising of joints
  • Assembly processes for high temperature PCBs
  • Process and design defects

    The feature and webinar are supported by SMT magazine.


  • September 11 & 18

    SMTA Webtorial: Evaluating the Performance of Conformal Coatings   +



    Doug Pauls, Rockwell CollinsTwo (2) 90 minute Sessions
    Thursday, September 11 & 18, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Doug Pauls, Rockwell Collins

    Overview:
    Conformal coatings should be chosen based upon how well they protect the electronic circuit against the challenges of the end use environment. The difficulty is that not many people know how to make that evaluation. What kinds of tests can be used? What parameters should be chosen? How should the data be interpreted? This course covers various tests that are used to do base material characterizations, as well as tests which cover more functional aspects of conformal coating. While much of the testing will be from a Class 3 Avionics perspective, the methodologies covered can be extended to other industry segments.

    Course Outline:

    1. Uses of conformal coatings
    2. Materials characterization tests for coatings
      • IPC-CC-830
      • MIL-I-46058
      • ASTM
    3. Performance specifications for coatings
      • J-STD-001
      • UL-746
    4. End Use Environments Overview
    5. Testing of Conformal Coatings
      • Fluid Susceptibility
      • Flammability
      • Fungus resistance
      • Salt spray and salt fog
      • Sand and dust testing
      • Humidity testing – static and condensing
      • Waterproofness testing
      • Thermal cycling and thermal shock
      • Vibration
      • Heat flow
      • RF testing
      • Material compatibility
      • Process effects
    6. What defects are found in these tests and what they mean
    7. Illustrative Case Studies
    8. Question and Answer Session

    Who should attend:
    This course is written for individuals responsible for choosing or evaluating conformal coatings for use on electronic assemblies in harsh end use environments.

    Your Instructor:
    The instructor for the course is Doug Pauls, a Principal Materials and Process Engineer at Rockwell Collins, Cedar Rapids, IA. Doug is the Chairman of the IPC Cleaning and Coating committees.

    Doug holds a B.A. in Chemistry and Physics from Carthage College, Kenosha, Wisconsin, and a B.S. in Electrical Engineering from the University of Wisconsin, Madison. He worked for the Naval Avionics Center in Indianapolis, Indiana for nine years as a Materials Engineer. Doug spent 8 years as the Technical Director of Contamination Studies Laboratories, performing process troubleshooting and optimization from a residue analysis perspective. Doug is an active IPC Chairman (General Chairman - Cleaning and Coating, Bare Board Cleanliness, Solder Mask) and presently chairs the IPC Technical Activities Executive Committee. Doug is most notably known for his expertise in surface insulation resistance testing, cleaning and cleanliness assessment, conformal coatings, and how to qualify manufacturing processes. Doug moved to Rockwell Collins in 2000, serving as their corporate expert on conformal coating materials and processes. He received Rockwell’s Arthur A. Collins Engineer of the Year award in 2004.

    Doug is known to have a pathological fear of free time, has been happily married for 28 years. He has 3 children and so has little free time, but does some woodworking, woodcarving, and occasionally sneaks away to do some hunting and fishing.


    September 18

    Empire Expo & Tech Forum  +

    Location: Radisson Hotel Rochester Airport
    175 Jefferson Road
    Rochester, NY 14623
    Show Hours: 11:00 AM


    Exhibitors

    The cost to exhibit is $225 for corporate members. (click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

    Please contact SMTA Director of Exhibitions Emmy Ross or Jodi Wahl with questions or for additional information.



    Attendees
    Attendees Register Now

    Please see the Empire Chapter Page for More Information on Technical Sessions and Expo Materials.


    September 18 - 19

    Medical Electronics Symposium 2014  +

    Location
    Marylhurst University
    Portland , OR


    INEMI, MEPTEC, and SMTA have joined forces to host this international conference, focusing on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. Previously, MEPTEC's and SMTA's conferences were held in Phoenix, Arizona and Milpitas, CA, respectively, drawing technology experts, entrepreneurs and service providers that work in this niche technology space. Typical applications within this space involve implantable defibrillators, neurostimulators and drug delivery, interventional catheters, pillcams, ultrasound transducers, hearing aids, biosensors, microfluidics, wireless communications, as well as future diagnostic and treatment solutions that may use stretchable electronics, microelectromechanical systems (MEMS) or nanoelectromechanical systems (NEMS).

    We would like to thank Oregon Bioscience Association, whose Board invited the three groups to bring their conferences to Marylhurst University, where their annual conference is held (click here for information on the OR Bio conference.) Through cross attendance and the combined attendees of iNEMI, MEPTEC and SMTA's previous Medical Electronics events, we are expecting 200+ professionals nationally and internationally to be in attendance.

    Session topics include:

    Track 1: Components and Designs for Higher Density Functionalities
    This track will focus on advances in electronics components and designs that can make current medical electronics ever more miniaturized with more functionality and at lower power. The trend in consumer electronics is driving more capabilities in smaller, mobile products and the medical field is pursuing a parallel path with mobile healthcare products (both implanted and external), particularly for chronic disease management, that need to solve for dramatically lower cost of care and improved patient outcomes.

    Track 2: Solutions for Best-in-Class Assembly and Volume Manufacturing
    This track will focus on critical methods and protocols to ensure that the production of Class II and III medical electronics is conducted in the most effective, efficient and quality-controlled way with full traceability and zero defects. Medical devices are the subject of ever-expanding global regulatory scrutiny, as well as deeper reimbursement price pressures and new taxation (in the US). The true costs of any lapse in quality can be enormous and the industry continues to seek better ways to ensure perfection in medical device design and manufacturing at lower costs. Manufacturing automation and stringent supply chain controls are relevant topics.

    Track 3: Next Generation Microelectronics for Changing Healthcare Markets
    This track will focus on advances in next generation, revolutionary microelectronics for medical devices and applications that solve technology challenges and are aligned with solutions for new healthcare models. Technologies such as wireless body area networks, stretchable electronics, biosensors embedded in drugs, microfluidics, microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) may be discussed.

    Come to the MSEI Open House

    September 17, 2014 | 3:00 PM - 5:30 PM
    6024 SW Jean Road, Lake Oswego, Oregon (Event held in Bldg A.)

    Micro Systems Engineering, Inc. invites you to visit their Lake Oswego campus to learn about implantable electronics products and capabilities. The open house will feature a presentation covering their product line and MST capabilities, followed by factory tours of their electronic module manufacturing facility. Refreshments will be served!
    View the flyer for more details.


    Sep 28 - Oct 2

    SMTA International 2014  +

    Location
    Donald Stephens Convention Center
    Rosemont , IL


    Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, and Quality and Reliability.


    Sep 30 - Oct 1

    SMTA International Electronics Exhibition  +

    Location: Rosemont Convention Center
    Rosemont, IL
    Show Hours: 9:00am - 5:00pm


    Exhibitors

    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1000 attendees from 25 different countries.


    October 15 - 16

    SMT Processes Certification (Toronto, ON)  +

    Location
    Toronto , ON M3C 1V7 Canada


    844 Don Mills Road Toronto, ON M3C 1V7 Canada


    October 15 & 23

    SMTA Webtorial: Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies   +


    Tim Jensen Two (2) 90 minute Sessions
    Wednesday, October 15 & Thursday, October 23, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Tim Jensen, Indium Corporation

    Overview:
    This webtorial is designed to provide practical knowledge that can be applied to current processes to improve the overall reliability of assemblies. It will not focus on mathematical modeling but rather provide data and tools that can be used by process engineers to make immediate impactful changes to the process.

    This webtorial will be broken into three parts:

    Course Outline:
    1. Mechanical Reliability

  • Drop shock vs. thermal cycling vs. vibration
  • Alloys and element addition impact
  • Board and component finish impact
  • Component and board warpage
  • Graping
  • Increased solder volume

    2. Electrical Reliability
  • Cleaned vs. No-Clean fluxes
  • SIR and Electromigration – Dendritic growth
  • Impact of low stand-off components (i.e. QFNs)
  • Creep corrosion
  • Conformal coating
  • Sn whiskering

    3. Thermal Reliability
  • Types of thermal interface materials
  • Assessing thermal conductivity
  • Bond line thickness
  • Impact of pressure
  • Pump-out considerations
  • Solder joint thermal interfaces and voiding

    Who should attend:
    Process engineers, quality engineers, design engineers, and engineering management

    Your Instructor:
    Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
    Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials


  • October 30 - 31

    LA/Orange County Lean Six Sigma Yellow Belt Chapter Tutorial Program  +

    Location
    Paradigm Contract Manufacturing LLC
    Garden Grove , CA 92841-1823



    Instructor: Albert Clary, TheSixSigmaWay
    October 30 & 31, 2014
    9:00 a.m. - 4:30 p.m.
    Paradigm Contract Manufacturing LLC
    11562 Knott Street, Unit 13-14
    Garden Grove, CA 92841-1843
    PH - 714-889-7074
    FAX - 714-893-1801

    Price:
    Members $400 (US)
    Non-Members $475 (US) (A one-year individual SMTA membership is included in the non-member price)
    LA/Orange County Chapter Officers $200

    This 2-Day Course includes a FREE Lean Six Sigma Yellow Belt Certification!

    Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch each day, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    Lean six sigma methodology continues to gain popularity in various sectors. It is well documented that the tools of lean and six sigma had been used successfully to save companies and other organizations, large and small, millions of dollars and to realize breakthrough improvements in quality and cycle time. Surface mount technology companies regularly use lean six sigma tools that include value stream mapping, 5S, Pareto charts, fishbone diagrams, house of quality, and DOE.
    Nowadays, professionals are required to have at least some lean six sigma training. For instance, TheSixSigmaWay had trained professionals from the electronics industry, aerospace, healthcare, banking, hospitality, military, agriculture sector, and state and federal governments.
    Attendees of This lean six sigma yellow belt class will receive a complete overview of the five Lean Six Sigma phases (Define, Measure, Analyze, Improve, Control) with emphasis on the Define and Measure phases. An understanding of the focus differences between Lean and Six Sigma, their history, and their primary objectives. Key tools used for both Lean and Six Sigma will be discussed; however, only tools from the Define and Measure phases will be comprehensive.

    PLEASE NOTE: White Belt Certification is not a Prerequisite for this course.

    Course Objectives:
    Attendees will understand:

    Define Phase – Day 1

  • Understanding Six Sigma
  • Understanding LEAN
  • Six Sigma Fundamentals
  • Selecting Projects : Voice Of Customer (VOC)
  • Process Mapping : Macro and Micro Level
  • Pareto Charting
  • LEAN concepts : Elements of Waste
  • Wrap Up and Action Items

    Measure Phase – Day 2

  • Introduction to Process Discovery
  • Introduction to Six Sigma Statistics
  • Measurement System Analysis (MSA)
  • Cause and Effect (Ishikawa Fishbone)
  • X Y Matrix
  • Process Failure Mode and Effects Analysis (PFMEA)
  • Process Capability - Cpk
  • Wrap Up and Action items

    Analyze Phase

  • Overview of concepts discussed on Day 1
  • Details covered in the Green Belt Class

    Improve Phase

  • Overview of concepts discussed on Day 1
  • Details covered in the Green Belt Class

    Control Phase

  • Overview of concepts discussed on Day 1
  • Details covered in the Green Belt Class

    Who Should Attend:
    This course is intended for all levels of business operation personnel who are concerned about and wish to become familiar and comfortable with Lean Six Sigma and obtain a yellow belt certification. This course will be of benefit to all levels of business operations. White Belt Certification is not a prerequisite for this course.

    About the Instructor:
    Albert Clary is an experienced Master Black Belt who has been involved with teaching and deploying lean six sigma for over 15 years. He has held various engineering, management and teaching positions at companies including Nortel and Hewlett Packard.

    He is knowledgeable in areas such as:

  • Manufacturing process metrics and controls
  • Marketing process metrics and controls
  • Call center operational metrics and controls
  • Network operations metrics and controls
  • Continuous Improvement tool set (DMAIC/PDSA/DFSS/DOE)
  • Complex statistical analysis
  • Data mining on large complex data sets
  • High impact market research
  • Albert holds a Bachelor of Science in chemistry and an MBA, in addition to various certifications, including lean six sigma black belt and master black belt.



    PLEASE NOTE: Albert will be providing instruction via webinar rather than in person.

    Contact Karen Frericks at 952-920-7682 with questions.



    November 4 & 11

    SMTA Webtorial: SMT and Through Hole Defect Analysis and Process Troubleshooting   +


    S. Manian Ramkumar Ph.D. Two (2) 90 minute Sessions
    Tuesday, November 4 & 11, 2014
    1:00pm to 2:30pm Eastern
    Presented by: S. Manian Ramkumar Ph.D., Rochester Institute of Technology

    Overview:
    This workshop is aimed at providing a thorough understanding of the SMT and Through Hole defects and the various factors that influence the formation of the defects. Participants will be provided an in-depth look at the possible root causes for defects and their influence on yield. The knowledge gained from this workshop will help companies enhance product development, and manufacturing yield. Part 2 of the workshop series will use case studies to teach participants a systematic approach to solve process problems and identify the true root cause(s) for defects.

    Topical Outline
    1. SMT and THT Process

  • Assembly Types and Processes

    2. Process Defects and Definitions
  • Identifying different Defects

    3. Factors Influencing the Process Defects
  • PCB Related
  • Component Related
  • Materials Related
  • Equipment Related
  • Process Related
  • Supplier Related
  • Employee/Knowledge Related
  • Environment Related

    4. Possible Root Causes for Defects based upon Factors

    Who should attend?

  • Process, Design, Test and Quality Engineers
  • Process and Quality Technicians
  • Managers

    After completing this course, you will be able to:
    1. Understand as systematic approach to problem solving
    2. Develop the ability to define the problem clearly by repeated questioning
    3. Develop skills to address the root cause of problems
    4. Develop a methodology to find one or more solutions to address the root cause and identify a fix.
    5. Understand how the analytical methodology can be applied to many different situations.

    Bio:
    Dr. Ramkumar is a Professor and Chair of the Mechanical and Manufacturing Engineering Technology Department at the Rochester Institute of Technology (RIT). He is also the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Electronics Packaging Center and the Automation laboratories at RIT. The Center supports hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects and has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for companies on-site. His current research is in the use of a novel magnetically aligned ACA as a lead-free replacement with PCB assembly and 3D packaging.


  • November 6

    Huntsville Chapter Tutorial Program: ESD for Engineers & Technicians  +

    Location
    Educator Training Facility
    Huntsville , AL 35808



    Instructor: Roger J. Peirce, Simco-Ion

    November 6, 2014
    9:00 a.m. - 4:30 p.m.
    Educator Training Facility
    U.S. Space and Rocket Center
    One Tranquility Base
    Huntsville, AL 35808
    Price:
    Members - $200
    Non-Members - $275 (A one-year Individual SMTA Membership is included in the non-member price)
    Huntsville Chapter Officers - $100
    Student Members - $50
    Student Non-Members - $55 (A one-year Student SMTA Membership is included in the non-member price)

    Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    General ESD Theory and 2014 Status:

  • Static Charging and ESD
  • Q=CV
  • Sensitivity of Devices in 2014
  • Faraday Effect
  • HBM and CDM Failure Modes – Charged Board Model (CBM)
  • General Handling Principles – 4 Golden Rules – S20.20 Requirements
  • Packaging Materials
  • Ionization
  • Latent ESD Failures – Case Studies
  • Class Zero Devices
  • Most Common Causes of ESD Events
         o Electronics Manufacturing
         o Semiconductor Manufacturing
         o Case Studies
  • Most Common Problems with ESD Controls
         o Wrist Strap- Constant Monitors
         o Ionizers
         o ESD Work Surfaces
  • How to Measure ESD Controls and Events
         o Resistance Measurements
         o Voltage Measurements
         o Capacitance Measurements

    Electrostatic Attraction (ESA) Causing Particle Contamination Issues:

  • The Role of ESA in Particle Contamination
  • Eye-opening Videos of Normally Unseen Particle Attraction to Charged Surfaces
         o Airborne Particle Attraction
         o Attraction From Surfaces
  • Using Ionization to Combat ESA
  • The Importance of Ionizing Gown Up Rooms
  • Ionized Air Blow-off Techniques
  • Studies of Particle Counts versus ESA
  • Case Studies in Medical Device Manufacturing (Catheters, Syringes, etc.)

    Roger J. Peirce About the Instructor:

    Roger J. Peirce
    Roger Peirce is Simco-Ion’s Manager of Technical Services and provides ESD/ESA consulting services to the semiconductor, electronics assembly, and medical electronics markets. He is an expert in the field of ESD/ESA failure mechanisms and yield enhancements. He holds ten US patents, has authored and published more than 20 technical papers on ESD/ESA, and has traveled extensively throughout North America and Asia since 1986. He is an active member of both the ESD Association’s WG-3 Ionizer and WG-17 Process Evaluation Standards Committees.

    Prior to joining Simco-Ion, Mr. Peirce was President of ESD Technical Services from 1986 to 2006, an ESD/ESA consulting company he founded. He has provided a variety of ESD/ESA related services for more than 2,500 facilities worldwide. In 1983, Mr. Peirce co-founded Voyager Technologies. Voyager designed and manufactured industry-leading ESD monitoring and test equipment. Prior to Voyager, he worked 13 years at Bell Laboratories in Murray Hill, NJ, as an electronic research engineer.

    Roger is married with one daughter. His wife Toni is a renowned artist in Bucks County, PA, and his daughter Melissa is an established singer/songwriter in Nashville, TN…penning hits for Reba McIntire, Leann Rimes, David Nail, Eli Young Band, Joss Stone, Garth Brooks, Hunter Hayes, and Carrie Underwood to name a few.

    Mr. Peirce’s publications since joining Simco-Ion in 2006 include:

  • “ESD Hardening of Processor-Controlled Paper Bundling Equipment”, with Eric Peterson and William Moritz (Quipp Systems), Newspapers & Technology, July 2006

  • “ESD Susceptibility of Precision Film Resistors”, with Jim Colnar and Ken Ladd (General Dynamics), Surface Mount Technology, September 2006

  • “Improving ESD Program Discipline”, with James Colnar (General Dynamics), Circuits Assembly, January 2007)

  • “Limitations of ESD Gloves and Finger Cot”, with Craig Zufelt (Xerox Corporation), Surface Mount Technology, February 2007

  • “CDM ESD Failure Modes in the Semiconductor Industry”, Solid State Technology, May 2007

  • “Evolution of Clean Room Ionization and Peak Reduction Technology”, with John Gorczyca and Brad Williford (Simco Electronics), Evaluation Engineering, November 2007

  • “ESD Control For Class 0 ESDS Devices”, Circuits Assembly, April 2008

  • “Applying E78 to Semiconductor Wafer Chambers”, with Brad Williford (Simco Electronics), Conformity, November 2008

  • “ESD Hazards in Semiconductor IC Handlers”, with Brad Williford (Simco Electronics), Evaluation Engineering, Dec 2009

  • “Die Attach Equipment and ESD”, with Brad Williford (Simco Electronics), Advanced Packaging, Mar 2010

  • “Decreased CDM Ratings for ESD-Sensitive Devices in Printed Circuit Boards”, with Jim Colnar and John Trotman (General Dynamics Advanced Information Systems), In Compliance magazine, June 2010

  • “Confronting Static Attraction in Medical Plastics Manufacturing”, Medical Device and Diagnostic Industry (MD&DI), August 2011

  • “Reducing Particle Contamination via Ionization in Gown-Up and Product Transfer Rooms”, Medical Device and Diagnostic Industry (MD&DI), November 2013




    Contact Karen Frericks at 952.920.7682 with questions.



  • November 11 - 13

    IWLPC - International Wafer-Level Packaging Conference  +

    Location
    DoubleTree by Hilton Hotel San Jose
    San Jose , CA 95110


    IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


    November 11 - 12

    IWLPC- Wafer-Level Packaging Conference & Exhibition   +

    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110


    Exhibitors

    Exhibitor Information
    Exhibition: November 11-12, 2014
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, November 11th, 9:00am – 5:30pm, Exhibitor Reception 5:30pm - 7:00pm
    Wednesday, November 12th, 9:00am – 3:30pm

    All booth spaces have SOLD OUT!



    View the floor plan

    Exhibitor Details

    Exhibitor Kit

    Questions?
    Please contact your Chip Scale Review sales representative or Patti Hvidhyld - Coles from SMTA with questions or for more information.

    Sponsorship Opportunities


    View available Sponsorship Opportunities

    Show Directory Advertising Opportunities

    What type of attendees will you network with at IWLPC?
    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!



    Attendees

    Exhibition: November 11-12, 2014
    DoubleTree by Hilton Hotel, San Jose, CA

    Show Hours:
    Tuesday, November 11th, 9:00am – 5:30pm, Exhibitor Reception 5:30pm - 7:00pm
    Wednesday, November 12th, 9:00am – 3:30pm

    View the floor plan


    November 18 & 25

    SMTA Webtorial Stencil Printing - A Practical Guide to Defect Prevention and Yield Improvement  +


    Chrys Shea Two (2) 90 minute Sessions
    Tuesday, November 18 and 25, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Chrys Shea, Shea Engineering Services

    Course Objectives
    This brand new course begins with the basics of SMT solder paste stencil printing and ends with the latest research in stencil printing tools and technologies. The class starts with a quick description of printing fundamentals: solder paste characteristics and behaviors, the mechanics of the process and importance of a good setup, and the relationship between aperture sizes and paste deposit formations. It then progresses rapidly into troubleshooting techniques for both general and specific printing issues, and addresses problem prevention through proper stencil design and selection. Moving into advanced technology topics, the course reviews the last four years of independent research on stencil materials, manufacturing processes and nanocoatings, and closes with an update of automated Solder Paste Inspection (SPI) technologies, applications and special features. Attendees are encouraged to ask questions or bring specific problems to the class for suggestions and inputs.

    Topics Covered

  • Solder paste
  • Mechanics of the printing process
  • Troubleshooting process problems
  • Stencil design
  • Stencil materials and manufacturing processes
  • Automatic Solder Paste Inspection (SPI)
  • Review and Q&A

    Who should attend:

  • SMT assembly process engineers and technicians responsible for production or new product introductions processes
  • Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing
  • SMT quality personnel interested in helping improve print and end-of-line yields
  • OEM supplier quality engineers responsible for supporting and/or assessing SMT assembly contractors

    Instructor Bio:
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. With several hundred publications to her credit, Chrys leverages her 20+ years of process engineering and management experience to create documents, presentations, web pages and other items that deliver complex technical topics clearly and effectively.

    Chrys is a favorite speaker at SMTA events, and has twice received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.

    Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island, and is a past president of the Philadelphia SMTA Chapter. She launched Shea Engineering services in 2008. Contact Chrys at Chrys@sheaengineering.com or (609) 239-2995


  • November 18 - 20

    SMTA-IPC High Reliability Cleaning and Conformal Coating Conference  +

    Location
    Chicago Marriott Schaumberg
    Schaumberg , IL 60015


    Organized by SMTA and IPC

    November 18-20, 2014
    Chicago Marriott Schaumberg
    Schaumberg, IL


    "How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others.

    Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.

    The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.

    Click here to go to the full event website.

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    November 18 - 20

    High-Reliability Cleaning and Conformal Coating Conference - Expo  +

    Location: Marriott Schaumberg
    Schaumberg, IL


    Exhibitors

    Tabletop Exhibit

    Cost: $1200 IPC or SMTA member/$1500 non member

  • One six foot table to be located in the break area
  • One electrical outlet
  • Company logo on all electronic and printed promotional materials
  • Logo on all on-site printed materials
  • List of Conference participants (after the event)
  • One complimentary Conference registration for tabletop staff
  • Additional conference registration at a 25% discount

    Download the application to exhibit

    Sponsorship Opportunities

    Badge Lanyards, exhibitor provided $800 IPC or SMTA member / $1,000 nonmember

    Networking Opportunities

    Benefits Include:
  • Recognition as Event Sponsor on all electronic and printed promotional materials
  • Company logo on agenda and on-site signage
  • Recognition announced at the beginning and end of sponsored function

    Networking Reception (Tuesday) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Luncheons

    Tuesday (box lunch) $1,000 IPC or SMTA member /$1,200 nonmember

    Wednesday (seated luncheon) $2,200 IPC or SMTA member / $2,600 nonmember SOLD

    Thursday (box lunch) $1,000 IPC or SMTA member / $1,200 nonmember

    Conference Refreshment Breaks $1,500 IPC or SMTA member / $1,900 nonmember

    For more info about the program and to register for the conference, click here.


  • December 2 & 9

    SMTA Webtorial: LED, BGA, and QFN Assembly and Inspection   +


    Two (2) 90 minute Sessions
    Tuesday, December 2 & 9, 2014
    1:00pm to 2:30pm Eastern
    Presented by: Bill Cardoso and Glen Thomas, Creative Electron

    Overview:
    In this webtorial we will cover the manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The webtorial will focus on the pitfalls of manufacturing and inspecting PCBs with these devices. Presentations will provide content to solve many of the technical challenges encountered by luminaire integrators and contract manufacturers. This tutorial is targeted at manufacturing, process, and quality personnel responsible for designing, implementing and/or controlling the surface mount device application and inspection process. Those personnel responsible for training operators and technicians to perform assembly inspection or control the manufacturing process would also benefit from this Webtorial.
    We will use a library of assemblies inspected at Creative Electron’s Advanced Solutions Lab to provide attendees with real life examples of assembly issues. Attendees are welcome to send their own assemblies to Creative Electron prior to the webtorial so that the material can be used during training.

    Topics Covered:

  • How LED material handling and storage impact assembly performance
  • LED x-ray inspection: How voids cost you money
  • Case study: How lack of quality killed a successful LED company
  • Process design for BGA and QFN assembly and rework
  • BGA and QFN x-ray inspection: How to see what often goes wrong
  • X-Ray as a tool for quality process design and control

    Suggestion:
    Please think of specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. Real life examples make great teaching materials for our tutorial. Please feel free to send us your samples so we can discuss them during the live sessions.

    Bill Cardoso Your Instructors:
    Bill Cardoso, Ph.D.,
    is the Chief Executive Officer and founder of Creative Electron. A native of Brazil, Bill came to the US in 1998 as a 'guest engineer' at the US Department of Energy's renowned Fermi National Accelerator Laboratory (Fermilab), one of the leading research institutions for high energy and nuclear physics. In a nine year career at Fermilab and starting with an associate electronics degree earned in Brazil at age 13, Bill took on significant project, personnel, and budget responsibilities while at the same time earning MS and PhD degrees from the Illinois Institute of Technology (IIT) and an MBA from the University of Chicago.

    After leaving Fermilab as Department Head for Electronic Systems Engineering, Bill moved to California to become the VP of Technology at the government contracting firm he eventually acquired from the estate of the founder to create Creative Electron in 2008.
    An industry thought leader, Bill has been recognized as IIT's 2011 Outstanding Young Alumnus Awardee for his contributions to science and technology. He is also a Senior member of the Institute of Electrical and Electronics Engineers (IEEE), Surface Mount Technology Association (SMTA), American Physics Society (APS), and the International Society for Optics and Photonics (SPIE).
    Bill is a holder of several patents in the areas of radiation detection, radiography, and quality inspection.
    Bill is an active member of his community and is part of the technical committee of several conferences including the SMTA/CALCE Component Counterfeit Conference, SMTA International, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium.
    Bill serves in the G19 committee writing the standards for counterfeit detection for the aerospace and defense markets. He is also a reviewer of academic proposals for the Department of Energy, Department of Homeland Security, and National Science Foundation. He is the author of over 120 technical publications, a contributor to 2 books, and is a frequent speaker at technical conferences on radiography and optical inspection worldwide.

    Glen Thomas Dr. Glen Thomas
    is a proven veteran in the inspection market with over two decades of experience developing and marketing x-ray systems. Glen leads Creative Electron's lead generation and branding strategy. Glen also manages the company's relationship with our domestic and international sales channels. He has been instrumental in helping the company create the best x-ray inspection systems in the world by providing its customers with unrivaled value. Dr. Thomas has held executive leadership positions and was instrument at the growth of companies like Faxitron, Micro Focus Imaging, Radsource Technologies, X-Ray Imaging Solutions, and Lixi.
    Glen is the VP of Operations for the SMTA Great Lakes Chapter. Glen holds a BS in Electrical Engineering and a PhD from the University of Wisconsin in Madison.


  • December 3 - 10

    Webinar: IPC-A-610 and IPC J-STD-001 Moving From Rev. E to Rev. F  +


    Wednesday, December 3rd and December 10th, 2014
    1:00pm - 2:00pm Eastern
    Presenter: Norman Mier and James Barnhart, BEST

    Overview
    We are pleased to announce that BEST Inc. will be offering two 1-hour webinars, held over the lunchtime hour, which will discuss the significant changes instituted in the soon-to-be released 'F' revisions of the IPC-A-610 and the IPC J-STD-001. The webinars will not only give you knowledge about the revisions, it will give you the opportunity to ask questions about changes between the revisions. The BEST Master IPC Instructors will cover the significant changes in the standards during the webinars.

    Schedule
    December 3rd: IPC-A-610

    December 10th: IPC J-STD-001

    Just register once and then you will get an email to confirm your registration the Friday before each presentation.

    Who Should Attend
    Certified IPC Trainers (CITs), engineering/manufacturing supervisors, and quality assurance supervisors are encouraged to attend.

    About the Presenters
    Norman Mier is a Master IPC Trainer at BEST Inc. He is a retired veteran with over 20 years of experience in the electronics rework and repair industry. Norm originally received his training through the Navy's Micro Miniature (2M) Electronic Repair Program and has progressed through every level of rework and repair recognized in the industry. Norman has also earned the highest certifications awarded by IPC in electronics training, being certified as a Master Instructor in IPC A-610, IPC J-STD-001, IPC/WHMA-A-620, and IPC 7711/7721. Additionally, he has worked through BEST for several electronics industry leaders and created tailored courses for their equipment. This also includes providing training to technicians and engineers in surface mount and advanced surface mount technology. The knowledge Norm has brought to these companies has been invaluable to their process improvement efforts. His skill has also been a major factor in keeping BEST training at the forefront in the electronics-training field.

    James Barnhart is a Master IPC Trainer at BEST Inc. He started as a 2M Miniature/Micro-miniature repair technician and progressed to being an 'A' level instructor in the Navy's 2M program. James has worked in the electronics field since the mid 80's and trained many technicians in the repair of PCB's. During his time as a 2M instructor, he was involved in the rewriting of the 2M courses and incorporated SMT repair techniques into the program. He is a Master IPC Trainer at BEST in IPC J-STD-001, IPC-A-610 and IPC 7711/21.


    Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819