Calendar of Events



                                   

2012

January 10 & 17

SMTA WebtorialPractical Guide to Improving Lead-Free Soldering Yields on Wave Soldering  +


Bob Willis Two (2) 90 minute Sessions
Tuesday, January 10 and 17, 2012
1:00pm to 2:30pm Eastern
Presented by: Bob Willis, AskBobWillis.com

What You Will Learn:
Do we have all the answers to successful lead-free wave soldering? No, and to quote a well-known soldering metallurgist, "We don't even know all the questions." Lead-free is new to many and the wave soldering process is the most affected by the change of materials with cost increase in alloy, solder bath and copper erosion plus increased temperatures all makes process change demanding. During this workshop we will look at the practical experience to date and try to provide answers to as many questions that have come to light during early introduction. With many years of practical experience in wave soldering Bob Willis is your best guide to what works and does not improve yields in wave soldering.

Each delegate attending this webinar will receive an interactive set of inspection posters for lead-free solder joints.

Topics Covered:
  • Cost of lead-free
  • Soldering theory, wetting, reliability, PCB design
  • Copper erosion problems
  • Effect of tin-lead on joint reliability
  • Soldering materials
  • Spray fluxing
  • Equipment settings, pre heat, fluxer, wave settings
  • PCB board support
  • Lead-free soldering parameters
  • Inert soldering
  • Solder bath erosion
  • Effect of bath contaminates
  • Quality control checks
  • Soldering defects, causes and cures
    - Fillet lifting
    - Secondary reflow
    - LF solder shorts
    - damaged components

    Instructor Bio:
    Bob Willis currently operates training and consultancy business based in England and has created one of the largest collections of interactive and online training material in the industry. Although a specialist for companies implementing lead-free manufacture Mr Willis provides world-wide consultancy in most areas of electronic manufacture over the last 25 years. This is based on working contract assembly, printed board manufacture, failure analysis and environmental test facilities. This earned him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has also been presented with the SMTA International Leadership Award, IPC Committee Award for contribution to their standards and awards from SMART Group and Institute of Circuit Technology

    He has worked with the GEC Technical Directorate as Surface Mount Co-Ordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. Over the years Bob has been Chairman and Technical Director of SMART Group and holds the title of Honorary Life Vice President for his contributions to the group since its inception.


  • January 12

    Webinar: Material and Process Optimization for Head-in-Pillow Elimination  +


    Tim Jensen, Indium Corporation Thursday, January 12, 2012
    11:00am to 12:30pm Eastern
    Presented by: Tim Jensen, Global Product Manager for PCB Assembly Materials, Indium Corporation

    Overview:
    The Head-in-Pillow (HIP) defect is an open solder joint in a BGA or CSP where the solder paste deposit doesn’t coalesce to the ball on the component. The result is an apparent solder joint with a hairline gap between the solder reflowed to the PCB paste and the solder ball itself. In this webinar, we will discuss the changes in the electronics industry that have made HIP defects much more prevalent than in the past. We will review why this defect is so much more troublesome than other process defects. Process and material selection can have a significant impact on the potential for HIP defects. We will discuss the printing and reflow processes to analyze ways that optimization can help to significantly reduce the potential for HIP. Although the focus will be on the SMT process, there will be some overview of the BGA component manufacturing process and how it can impact HIP. Solder paste selection plays a major role in HIP prevention and this webinar will discuss the critical solder paste attributes that can help minimize HIP.

    Bio:
    Timothy Jensen is the Product Manger for PCB Assembly Materials in Indium Corporation’s Solder Products Business Unit. He is an SMTA-Certified SMT Process Engineer.

    Tim has spent over a decade troubleshooting and optimizing SMT process lines. He works closely with Indium’s Technical Service, Research & Development, and Sales Teams to ensure that Indium continues to offer cutting edge products to meet unique challenges in the electronics assembly industry.

    Having worked directly on hundreds of surface mount lines, and building thousands of different products, Tim understands each customer’s unique requirements, and tailors Indium’s products and services to meet or exceed those needs.

    Tim has a Bachelors degree in Chemical Engineering from Clarkson University. He has authored several technical publications and numerous process and technical guidelines. He is a member of the SMTA and participates actively in several IPC standards development committees.


    January 19

    LA/Orange County DFX Chapter Tutorial Program Material Properties and How They Affect Electronic Devices  +

    Location
    Henkel
    Irvine , CA 92606



    Instructor: Brian J. Toleno, Ph.D., Henkel
    January 19, 2012
    8:30 a.m. - 4:00 p.m.
    Henkel
    14000 Jamboree Road
    Irvine, CA 92606
    Price:
    Members $200 (US)
    Non-Members $275 (US) a one-year individual SMTA membership is included in the non-member price.
    LA/Orange County Chapter Officers $100

    Introduction:
    Adhesives, polymers, and soldering materials play an important role in manufacturing electronic devices. When looking at a technical data sheet for these materials it is important to understand how the properties defined on these data sheets affect the performance and reliability of the final end product. Furthermore, understanding how these properties are measured and what can and should be compared between data sheets. We will also look at how the process conditions play a role in these properties. We will discuss properties such as glass transition temperature (Tg), coefficient of thermal expansion (CTE), modulus, decomposition temperature (Td) and other material terms often used in technical data sheets. Attendees are encouraged to bring example technical data sheets and/or questions for discussion.

    What you will learn:
    After this training course attendees will have a better understanding of how these material properties affect reliability performance, the relationship between process and properties and understand what properties can be compared between data sheets. We will then apply what had been discussed to look at one specific type of adhesives used in surface mount technology - Methods and Selection of Circuit Board Protection. We will discuss the differences between potting, conformal coating, and other methods of protecting printed circuit boards and the advantages and disadvantages of each approach.

    About the Instructor:
    Brian J. Toleno, Ph.D. is the Director of Technical Service and Application Engineering for Henkel in Irvine, California. Brian obtained a Ph.D. in analytical chemistry from Penn State University, and his B.S. in chemistry from Ursinus College. Brian is an active member of IPC serving as the underfill handbook committee (J-STD-030) chairperson and vice-chair of the Solder Paste Standards Committee (J-STD-005). Brian is also a frequent speaker and contributor to SMTA, and was elected to the SMTA Board of Directors in 2010. Brian has written courses on underfill materials, Pb-free soldering, and failure analysis. He has also authored many publications for trade journals and peer reviewed publications on various aspects of materials in electronics, and two chapters for electronic engineering handbooks on adhesives and materials.

    Contact Karen Frericks at 952-920-7682 with questions.


    February 7

    Dallas Expo & Tech Forum  +

    Location: Richardson Civic Center
    Richardson, TX


    Exhibitors

    Tuesday, February 7, 2012
    Richardson Civic Center
    411 W. Arapaho Rd.
    Richardson (Dallas), TX 75080
    Show Hours: 10 a.m.-3:30 p.m.

    Exhibitors

    Exhibit Space for 2012 has SOLD OUT! Please contact Emmy@smta.org to be placed on a wait list!

    Important Exhibitor Materials:

  • Show Details
  • Advertising and Sponsorship Opportunities
  • Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.

    Attendees

    Online registration is now closed. Please register on site.

    Free Technical Program & Schedule:

    9:30-10:00

    Flex Circuit Design Guidelines

    Speaker: Steve Kelly – PFC Flexible Circuits Limited


    10:30-11:00

    How Flying Probers Optimize Test Strategy

    Speaker: John Oaf – TEXMAC Inc


    11:30- 12:00

    Quality,Reliability and Metallurgy of ENEPIG Board Finish & Tin Lead Solder Joints

    Speaker: Mike Wolverton – Raytheon


    1:00 – 1:30

    Evolving Counterfeit Component Threats and Industry Mitigation Efforts

    Speaker: Stephen Schoppe – Process Sciences Inc



    February 9

    Webinar: PCB Depaneling with Lasers: A Comparison of Laser to Traditional Depaneling Methods  +


    Josh_Brown, LPKF Laser and Electronics Thursday, February 9, 2012
    11am - 12:30pm Eastern
    Josh Brown, LPKF Laser & Electronics

    Overview:
    Depaneling of modern circuit boards can be a difficult task. Smaller, more complex PCBs are creating a demand for more sophisticated depaneling solutions. This webinar will walk you through the advantages and disadvantages of laser depaneling in comparison to more traditional methods of depaneling such as routing, die cutting and dicing saws. By the end of the webinar you will have a better understanding of laser depaneling and if it is a viable solution for your needs.

    What you will learn:
  • A full comparison of depaneling methods
  • Smaller boards, less stress and more precision
  • Cost reduction: an unveiling of the costs involved in all methods
  • Versatility: is your depaneling technology giving you an edge?

    Who should attend:
  • PCB Engineers/Designers
  • Manufacturing and Production Engineers
  • Production Managers

    Presenter bio:
    Josh Brown is a Marketing Development Representative with LPKF Laser & Electronics, a manufacturer of laser depaneling systems. Josh's objective is to provide educational content to engineers and managers to help them make informed decisions on some of the latest PCB production technologies.


  • February 9

    Houston Expo & Tech Forum  +

    Location: Stafford Center
    Stafford, TX


    Exhibitors

    Thursday, February 9, 2012
    Stafford Centre
    10505 Cash Road
    Stafford, TX
    Show Hours: 10 a.m.-3:30 p.m.

    Exhibitors

    The cost to exhibit for corporate members is $400/$500 (early/late) and $475/$575 (early/late) for non-corporate members. The cost to exhibit includes: one 8x10 booth, one 6ft draped table, two chairs, company sign, reception, directory listing and attendee list. Electricity is an additional $25 per outlet. Earlybird pricing expires December 20th, 2011.

    Important Exhibitor Materials:

  • Show Details
  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.

    Attendees

    Online registration is now closed. Please register on site.

    Free Technical Program & Schedule:

    11:00AM

    Flex Circuit Design for Reliability

    Speaker: Steve Kelly, PFC Flexible Circuits


    1:00PM

    Advances & Challenges in High Temperature Component Attachment

    Speaker: Cheryl Tulkoff, DfR Solutions, LLC (Austin)


    2:00PM

    How Flying Probers Optimize Test Strategy

    Speaker: John Oaf, TEXMAC Inc.



    February 14 & 21

    SMTA Webtorial Tin Whiskers - A 2012 State of the Industry Assessment  +



    Two (2) 90 minute Sessions
    Tuesday, February 14 and 21, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Dave Hillman, Rockwell Collins Inc.

    What You Will Learn:
    Tin Whiskers were investigated and "solved" in the 1950s so why are we talking about them in 2012? The objective of this tin whisker course is to : (1) Provide a basic understanding of a tin whisker phenomena; (2) Provide data and resources allowing an attendee to create a tin whisker mitigation protocol applicable for their product/use environment; (3) Provide an update of some of the latest industry investigations and results.


    Topics Covered:
  • Tin Whiskers 101
  • Tin Whisker Mitigations that You Don't Control
  • Tin Whisker Mitigations that You Do Control
  • Tin Whisker Mitigation Plan Basic Tenets
  • Current Industry Tin Whisker Investigations

    Instructor Bio:
    David Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins Inc. in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his present assignment he serves as an "expert of call" to manufacturing on material and processing problems. He served as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009. He has published numerous technical papers with the 2010 SMTA International Conference on lead-free thermal cycle test results presentation being selected as “Best of Conference”.


  • February 14 - 16

      +

    Location
    Sheraton Poipu Resort
    Kauai , HI



    February 14 - 16

    Pan Pacific Conference Sponsor Opportunities  +

    Location
    Sheraton Poipu Resort
    Kauai , HI



    March 6

    Webinar:RoHS Product Eco-compliance - with all the changes, where do we stand now?  +



    Krista Crotty, Alberi EcoTech Tuesday, March 6, 2012
    11am - 12:30pm Eastern
    Presenter: Krista Crotty, Alberi EcoTech

    Overview:
    RoHS Recast and REACH updates and Conflict Minerals, Oh My! The RoHS Recast has been published, new SVHCs are being added to REACH every six months, and now the US is regulating conflict minerals used by public companies. Bring your questions about the use of the CE mark to mandatory declaration of conformity to open scope in RoHS, to which newest SVHC are used in electronics, to the latest from the SEC on the guidance ruling on conflict minerals. The session will also discuss enforcement practices, industry compliance best practices and lessons learned for general product eco-compliance.

    What you will learn:
    The latest information on the RoHS Recast, REACH SVHCs, and Conflict Minerals.

    Who should attend:
    Engineers, Compliance engineering, project managers... anyone dealing with materials information gathering – from component engineering to executive – can benefit from this update.

    Bio: Krista Crotty, Chief EcoGeek
    Krista Crotty holds a BS in Mechanical Engineering and a MS in Production and Operations Management. As Chief EcoGeek and managing partner of Alberi EcoTech, she helps clients face tough issues involving environmental compliance with determination and brutal honesty. As the author of several white papers and workshops on the subject of RoHS, REACH, and other key environmental initiatives, Krista has established her revolutionary perspective as the gold standard for businesses seeking assistance with product environmental compliance.

    Before breaking out of the corporate world and founding her own companies, Krista spent several years with working for IBM in multiple divisions: Storage Systems (hard disk drives), Microelectronics (ceramic substrate manufacturing), and Corporate Procurement (electronic components). In Corporate Procurement at IBM from 2003-2005, Krista specifically focused on IBM’s compliance program for EU RoHS.

    In addition to running Alberi, Krista co-chairs IPC's 2-18 Supplier Declaration committee, which is responsible for the 175x series of standards. The 175x series is most known for the 1752 Materials Declaration Standard. Prior to relocating to Las Vegas, Krista was instrumental in forming the Sustainability Forum sub-committee for the North Shore Technical Council (NSTC). She has also served as the SMTA Boston Chapter web master of the Surface Mount Technology Association (SMTA).

    Outside the office, Krista relaxes by participating in the Sin City Mini Club, riding motorcycles, traveling with her husband, and racing a Swift DB-1 Formula Ford 1600.


    Mar 6 - Jul 5

    Practical Guide to Modern Multilayer Manufacture  +



    This series of webinars have been designed for those new to the circuit industry and ideal for design and assembly engineers and purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step by step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble free assembly. Even if you can't attend all four dates don't worry you will not miss out by booking the complete series, the recordings will be available online The topics addressed in this webinar series will include:

    Tuesday 6th March (14.30 GMT)
  • Laminate types
  • Resist Application
  • Imaging/Striping
  • Etching & AOI
  • Oxide Treatment

    Tuesday 3rd April (14.30 BST)

  • Lay up
  • Lamination procedures
  • Drilling including laser
  • De smearing
  • Metallisation
  • Monday 11th June (14.30 BST)
  • Resist Application
  • Imaging/Etching
  • Copper Plating
  • Solder Mask
  • Solder finishes

    Thursday 5th July (14.30 BST)

  • Legend
  • Routing
  • Electrical testing
  • Inspection and QC
  • PCB storage
  • Four highly experienced PCB engineers will offer their advice in each webinar SMART Group price is £200+VAT for all four webinars, presentation material and access to each of the online webinar recordings. A single webinar can be booked at £65+VAT. To support the webinar content each delegate booking all four webinars will also receive two sets of training charts covering PCB manufacture and typical PCB related failures for company reference.


    March 20 & 27

    SMTA WebtorialAdvanced Component Packages and Processes   +


    Two (2) 90 Minute Sessions
    Tuesday, March 20, 2012
    1:00pm to 2:30pm Eastern
    Tuesday, March 27, 2012
    11:00am to 12:30pm Eastern
    Presented by: S. Manian Ramkumar Ph.D., Rochester Institute of Technology

    Overview:
    This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages. Discover the advantages and disadvantages of each component type as well as their implementation requirements. High density interconnection, thermal management requirements and microvia technology will be discussed, and the details of the assembly process when using these devices, in both lead-based and lead-free assembly will be covered.

    What Will You Learn:
  • Electronics packaging and levels
  • Thermal management in advanced packaging
  • Substrate properties for advanced packaging
  • IC packaging trends, packaging evolution
  • Area array packaging - BGA, CSP, WL-CSP and flip chip
  • Self-centering of area array packages
  • Assembly process for area array packages
  • Rework and repair of area array packages
  • Need for underfill and encapsulation
  • Ceramic column grid array (CCGA)
  • Chip-on-board (COB) technology
  • Tape automated bonding (TAB)
  • Multi-chip-module (MCM)
  • PoP and 3D packaging, MEMS, etc.

    Bio:
    Dr. Ramkumar is a Professor at the Rochester Institute of Technology (RIT) and is the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Center and the Automation laboratories at RIT. The electronics packaging Center is equipped with assembly and failure analysis equipment, to support hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects. He has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for various companies on-site.


  • March 20

    Indiana Expo & Tech Forum  +

    Location: Ritz Charles
    Carmel, IN


    Exhibitors

    Tuesday, March 20th, 2012
    Ritz Charles
    12156 N Meridian St
    Carmel, IN 46032-4578
    Show Hours: 10am-3pm

    Exhibitors

    The cost to exhibit for corporate members is $350/$450 (Early/Late) and $450/$525 (Early/Late) for non-corporate members.(click here for membership information) The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Earlybird pricing has been extended to February 10th, 2012! Only a few booths remain! INDIANA EXHIBITOR SPACE HAS SOLD OUT

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.

    Attendees

    Online registration is now closed. Please register on site.

    Free Technical Program & Schedule:

    9:30-10:00AM
    Speaker: Chris Mather, Managing Director, Lorain County Community College
    Topic: The Richard Desich Smart Commercialization Center for Microsystems: A NEW Model to Drive Industry Development

    10:30-11:00AM
    Speaker: Carol Handwerker, Reinhardt Schuhmann, Jr. Professor of Materials Engineering, and Environmental and Ecological Engineering, Purdue University
    Topic: Electronics, E-Waste, and Sustainability

    11:30-12:00
    Speaker: Paco Solis, Lead Investigator, Foresite
    Topic: Dependant and Interdependent SMT Package Failures, Part II

    FREE LUNCH 12:00 - 1:00PM

    1:00-1:30
    Speaker: Bob Wetterman, President, BEST, Inc.

    Topic: Techniques in the Rework of High Thermal Mass Boards

    2:00-2:30
    Speaker: Chris Mather, Managing Director, Lorain County Community College
    Topic: Training Gaps and Opportunities in Electronics Manufacturing


    March 28 - 30

      +

    Location
    Logic PD
    Eden Prairie , MN



    April 12 & 19

    SMTA Webtorial Solder Pad Cratering  +



    Two (2) 90 minute Sessions
    Thursday, April 12 and 19, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Cheryl Tulkoff, DfR Solutions

    What You Will Learn:
    Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities. During this webtorial, you'll learn the key drivers, measurement and detection protocols, and preventive tactics for this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless, bottom termination components are also vulnerable.

    Topics Covered:
  • Pad Cratering Defined
  • Is Pad Cratering a Pb-free issue?
  • At risk components
  • Drivers
  • Finer pitch components
  • More brittle laminates
  • Stiffer solders (SAC vs. SnPb)
  • Presence of a large heat sink
  • Detection and Failure Analysis Procedures: Which ones are effective & why
  • X-ray
  • Dye-n-pry
  • Ball shear
  • Ball pull
  • Mitigation Practices & Solutions to Pad Cratering
  • Board Redesign
  • Solder mask defined vs. non-solder mask defined
  • Limitations on board flexure
  • 750 to 500 microstrain, Component dependent
  • Specification and Procedure Discussion
  • Strain Gage Testing Protocols
  • ICT Fixture Evaluation
  • Assembly Process Evaluation
  • Process Specifications
  • More compliant solder
  • SAC305 is relatively rigid, SAC105 and SNC are possible alternatives
  • New acceptance criteria for laminate materials
  • Intel-led industry effort
  • Attempting to characterize laminate material using high-speed ball pull and shear testing, Results inconclusive to-date
  • Alternative approaches
  • Require reporting of fracture toughness and elastic modulus

    Targeted Audience:
    Design, Manufacturing, and Failure Analysis Engineering

    Instructor Bio:
    Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Ms. Tulkoff had an active leadership role both within her employer's companies and among regional and national electronics and reliability organizations. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR's office located in Austin, Texas, which opened in February 2009. B.S., Mechanical Engineering (Georgia Institute of Technology)


  • April 17

    Space Coast Failure Analysis Chapter Tutorial Program "Universal Instruments Corp’s APL Failure Analysis: Lessons Learned in Manufacturing"  +

    Location
    The Knowledge Exchange
    Palm Bay , FL 32905



    Instructors: Martin Anselm, Ph.D. & Denis Barbini, Ph.D., Universal Instruments Corporation

    April 17, 2012
    9:00 a.m. - 4:30 p.m.
    The Knowlege Exchange
    5151 Babcock Street
    Palm Bay, FL 32905

    Price:
    Members $200 (US)
    Non-Members $275 (US) a one-year individual SMTA membership is included in the non-member price.
    Space Coast Chapter Officers $100

    Introduction:
    Universal Instruments Corp’s Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP, 01005 defects, and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.

    What You Will Learn:

  • What are the major difficulties in lead-free reliability testing?
  • Mixed alloy assembly best practices
  • Troubleshoot BTC design and manufacturing problems
  • PCB plating considerations
  • Analytical testing techniques and what they can identify root causes for production failures.
  • Lead-free laminate selection and testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies


    Suggestion:

    Please bring specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. In my experience many problems can be solved with a brief discussion of the issues.


    Who should attend?

  • Quality Engineers
  • Failure Analysis Engineers
  • Reliability Engineers
  • Procurement Specialists
  • Design Engineers
  • Process Engineers
  • Project Managers


    About the Instructors:

    Martin Anselm, Ph.D.
    Since 2002 Martin has been working within Universal Instruments Corporation's Advanced Process Lab. He began his career in electronics Failure Analysis and began Managing the Failure analysis activities in 2006. In January of 2012 Martin was promoted to the Manager of the Advanced Research in Electronics Assembly (AREA) Consortium. Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.

    Denis Barbini, Ph.D.
    Denis is the Associate Director of the AREA Consortium for Universal Instruments. His current focus is identifying the critical needs in emerging technologies and assembly processes in order to develop specific projects for the AREA consortium. Denis has travelled the electronics manufacturing world providing guidance and solutions to countless companies. In addition, he speaks directly with those companies to ascertain what they see as the challenges that lie ahead. Over the past 15 years, Denis has led research programs focused on the impact of materials on assembly process windows and the associated reliability of the final product. He earned his Doctorate from Binghamton University in New York.




    Contact Karen Frericks at 952-920-7682 with questions.


  • April 18 - 20

      +

    Location
    Penang Malaysia


    "The extensive participation of experts from around the world provides for a comprehensive educational experience and the SMTA reputation ensures high quality technical information that can be applied immediately."

    -Marie Cole, Distinguished Engineer
    IBM Corporation
    SMTA VP Technical Programs

    Online registration now closed, please register on site.

    The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

    The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

    Sessions and topics in our 2012 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.

    SE Asia Technical Conference

    CLICK HERE to view the full conference schedule

    Please share this message and link with your co-workers and industry colleagues. Your help is much appreciated.

    Sessions over the two days will cover:
  • Soldering Processes and Materials
  • Soldering Challenges - Including Head in Pillow
  • Business and Supply Chain
  • Harsh Environments
  • Soldering - Through Hole Processes
  • Substrates and Printed Circuit Boards
  • Components and Advanced Packaging

    Why Should You Attend:
  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

    Accommodations
    Eastin Hotel Penang
    1 Solok Bayan Indah
    Queens Bay, 11900 Bayan Lepas, Pulau Pinang, Malaysia
    04-6121111

    Book your hotel reservations online:
    http://www.eastinhotel-penang.com/ppc/?gclid=CPCu7tj69qYCFcjsKgod3gEhDg


  • Supported by Persatuan Surface Mount Technology P. Pinang.

    SE Asia Technical Conference

    Special recognition is given to the Technical Committee for their many contributions in developing this outstanding program.

    Technical Committee
    Conference Chair:
    LyGuat Lee, Ph.D, Flextronics

    KL Lim, Plexus

    Lian-Huat Ng, Plexus

    Teng Hoon Ng, Celestica, Inc.

    Jona Sjoberg, Flextronics

    AK Tan, Robert Bosch Sdn Bhd

    David Vetharudge, Listech Technology

    Media Partner
    GlobalSMT SE Asia

    Registration: Online registration now closed, please register on site.

    Your Conference (Two Day) registration fee will include a CD Conference Proceedings, coffee breaks, and lunches. Conference fees are "HRDF Claimable."

    Two day conference fee is approx. RM455 (US$150) members / RM607(US$200) non-members
    One day conference fee is approx. RM303 (US$100) members / RM379 (US$125) non-members
    Speaker fee is approx. RM303 (US$100)

    Members: log on to receive the discounted rate!

    Your Training Course registration fee will include a course handout and coffee breaks.
    Half-Day training course is approx. RM303 (US$100) members / RM607(US$200) non-members


    Group Discounts: Register four people for the Technical Conference and pay for only three! The four people must be from the same company, and registrations must be submitted consecutively. The discount will be processed at SMTA headquarters, and is not available on-site. Contact Patti Hvidhyld at patti@smta.org, for more details and to register.

    To pay by check, (checks are payable to SMTA) please mail payment to:
    SMTA
    5200 Willson Road, Suite 215
    Edina, MN 55424-1316
    USA

    To pay by wire transfer or if an invoice is needed please contact Krissy Ohnstad, krissy@smta.org.

    Training Workshops (Note: Training workshops are not included with two-day conference registration)

    WS1: 9:00am – 12:00pm
    Reliability of Lead-Free Solder Joints

    Instructor: Ning-Cheng Lee, Ph.D., Indium Corporation

    What You Can Learn From This Course:
    This course covers the reliability of lead-free solder joints. The reliability discussed includes the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history, and novel alloys with reduced fragility will be presented. Corrosion, and tin whisker will also be discussed. The emphasis of this course is placed on the understanding of how the various factors contributing to the reliability.

    Course Content:
    A. Thermal Cycle Reliability of Lead-free Solder Joints
    1). Effect of Thermal Cycle Test Condition
    2). Effect of PCB Surface Finish Cu vs Ni
    3). Effect of Reflow Temperature
    4). Reliability of Reworked SMT Joints

    B. Fragility
    1). Fragility of Lead-Free Solder Joints
    2). Effect of Component Finish
    3). Effect of Alloy, PCB Surface Finish, Reflow History, and Strain Rate
    4). Effect of IMC Thickness
    5). Effect of Isothermal Aging
    6). Effect of Thermal Cycling
    7). Effect of Intermetallic Morphology
    8). Novel Alloys with Reduced Fragility
    a. Mn, Ti, (Bi, Ce, Y) Dopants on SnAgCu
    b. SnAgNiP, SnAgCuP
    c. Ni, In Dopants on Sn1.0Ag0.1Cu
    d. Co, Pt, Ni Dopants on SnAg

    C. Reliability – Corrosion
    1). SAC405
    2). Corrosion Resistance of PWB Finishes

    D. Tin Whisker

    Who Should Take This Course:
    Any one who wants to know the reliability lead-free solder joints under various applications and like to know the best options should take this course.

    Abut The Instructor:
    Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

    WS2: 9:00am – 12:00pm
    Workshop Title: Designing for Reliability - Cleaning Basics in the Age of High Density Interconnects

    Instructors: Mike Bixenman and Jason Chan, Kyzen Corporation

    Workshop Overview
    As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is ever more necessary. Low residue no-clean flux residues did not require cleaning on assemblies with larger spacing between conductors. As the distance between conductors narrow, residues under component gaps pose a greater reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow temperatures. Traditional cleaning agents and cleaning equipment may not be able to remove these harder to clean flux residues from extremely small geometries.

    Increased circuit functionality is accomplished using bottom termination surface mount components. As components reduce in size, the distance from the board to the underside of the component reduces. Flux residues bridge conductors making cleaning highly difficult. One of the most challenging issues is the selection of an appropriate cleaning process that will clean flux residues under these extremely tight geometries.

    Designing for reliability requires repeatability and reproducibility studies during engineering and manufacturing development from pass test to good design. Full operational testing is needed to prove that electronic assemblies and packages operate as specified. Discovering failures after products are designed causes scheduled delays and increases in life-cycle cost. The cleaning workshop will teach about contamination and its effect on reliability, cleaning in an HDI world, designing the cleaning process, integrating the cleaning agent and machine, and controlling the process.

    Topics People Will Learn from Attending the Workshop:

  • Electronic Assembly Failure Mechanisms
  • Cleaning in an HDI World
  • Designing the Cleaning Process
  • Integrating Cleaning Agent and Cleaning Machine
  • Controlling the Process

    Who Should Attend the Cleaning Workshop?

  • Circuit Assembly Designers
  • Process Engineers
  • Quality Control Engineers
  • Environmental Engineers

    WS 3: 1:30 pm – 4:30pm
    Electromigration – The Hurdle For Miniaturization and High Power Devices

    Instructor: Ning-Cheng Lee, Ph.D., Indium Corporation

    What You Can Learn From This Course:
    Electromigration is migration of metal materials driven by the high current density. With the continuous miniaturization and increasing versatility and speed of electronic devices, the current density of miniaturized solder joints is getting so high that the solder joint integrity deteriorates rapidly due to electromigration. This is particularly true for high power devices. This course covers all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration , pad design, pad composition, current density, temperature, and current polarity. Electromigration behavior within redistribution layer is also reviewed and discussed. Most importantly, recommendation will be provided about how to achieve long life under high current-stressed conditions for solder joints and redistribution layer through optimized designs.

    Course Content:

  • EM mechanisms
    Effect of current density and temperature
    EM path through solder, Al, and Cu
    Effect of solder grain orientation
    Effect of solder composition
  • EM resistance of solder joints
    Sn vs Pb
    Pb-containing vs Pb-free
    Relative resistance of solder, Cu, Ni, and IMC
    Effect of solder volume
    Relative performance of solder joints with variation in metallurgy and configuration
    Recommended designs of solder joints for superior EM resistance
  • EM resistance of RDL
    Effect of via diam, pad opening, Cu thickness of UBM, size of taper trace, configuration of RDL vs via location and solder location
  • Who Should Take This Course:
    Any one who wants to know the electromigration phenomenon in details and wants to know how to prevent electromitration within their products should take this course.

    Abut The Instructor:
    Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.


    April 19

    16th Annual Atlanta Expo  +

    Location: Gwinnett Center
    Duluth, GA



    Exhibitors

    Thursday, April 19, 2012
    Gwinnett Civic Center
    Gwinnett Civic Center/Convention Center/Hall A
    6400 Sugarloaf Parkway
    Duluth, GA 30097
    View Map
    Show Hours: 9:30am-4pm

    Exhibitors
    The cost to exhibit is $400/$500 (early/regular) for corporate members. The cost to exhibit for non corporate members is $475/$575 (early/regular).(click here for membership information). The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. **Electricity is a separate fee of $55 per 20 AMP electric hook up, please make sure to indicate this if needed during registration.** Early bird pricing has been extended to March 16th!

    Consider donating a prize for the raffle! - View prizes and sponsors
    This year's designated charity is Camp Kudzu, a non-profit 501(c)(3) organization providing education, recreation and peer-networking programs for Georgia's children living with type 1 diabetes. Led by dedicated volunteers, medical professionals and a small professional staff, Camp Kudzu hosts week-long overnight Summer Camps, Family Camps and other diabetes education and management programs throughout the year. www.campkudzu.org. Raffle Sponsor ($25 minimum value)

    Important Exhibitor Materials:

  • Show Details
  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Expo Promo
  • Please contact: SMTA Director of Exhibitions Seana Wall with exhibitor related questions or contact Frances Stewart, VP Expo Atlanta Chapter, 678-817-1286, fstewart@upmediagroup.com.

    Special Thank You to our 2012 Sponsors:
    Special thanks to World Micro, Inc. as our Expo lunch sponsor. for sponsoring the Lunch Break
    Special thanks to SIPAD Systems, Inc. as our Expo coffee sponsor. for sponsoring the Coffee Break

    Attendees

    Online registration is now closed. Please register on site

    Free Technical Program & Schedule:

    Expo Keynote 9:30AM - 10:00AM:
    Steve Pudles, CEO, Spectral Response; chair of the IPC board of directors.
    Steve has more than 25 years of electronics industry experience and has been instrumental in leading EMS companies through tremendous growth phases. Steve has his master of science in management and bachelor of engineering from Stevens Institute of Technology.

    11:00-11:30AM
    Solder Paste Dipping for PoP Assembly

    11:30-12:00AM
    State-of-the-art Test Capabilities

    12:00-1:30PM
    Free Lunch and Networking on the Show Floor!

    1:30-2:00PM
    Recognizing the Microeconomics of Counterfeit Electronic Mitigation Efforts

    2:00-2:30PM
    Designers' Roundtable

    2:00-2:30PM
    Electronics Miniaturization via SiP Technology


    April 24 - 26

    SMTA China East 2012  +

    Location
    Shanghai China



    May 7

    Webinar:Troubleshooting the Stencil Printing Process  +



    Chrys Shea, Shea Engineering Services Monday, May 7, 2012
    11am-12:30pm Eastern
    Presented by Chrys Shea, Shea Engineering Services

    Overview:
    Do you want to:

  • Increase your solder paste print yields?
  • Improve end of line yields?
  • Develop your workforce's knowledge of the printing process?
  • Learn troubleshooting skills to resolve printing problems?

    This webinar begins with a review of the basic mechanics of solder paste printing, the key elements of a robust process, the principles of automated inspection, and typical methods of process control. It continues with the general steps used to check a process that is not producing good prints, and then moves into specific defects like solder bridges, insufficient deposits, and poor print definition, showing images of the defects and discussing the most common causes of them in a typical production environment.

    What You Will Learn:
    Printing
    - Solder paste properties
    - Key elements of the process

    Inspecting
    - Phase Shift Interferometry
    - Typical Control Methods
    - SPI SPC and other applications

    Overall system check
    - Will identify root cause 80% of the time

    Investigating specific defect modes
    - For the other 20%

    Who should attend:
    This one-hour webinar is designed to provide practical, useful troubleshooting skills for beginner to intermediate level SMT process engineers, technicians or production support personnel.

    About the presenter:
    Chrys Shea is the founder and owner of Shea Engineering Services, a consulting firm that serves the electronics manufacturing industry. Prior to launching Shea Engineering, Chrys spent nearly 20 years working in various PCB assembly process engineering and management roles for Compaq Computer, Texas Instruments, Siemens, Motorola, and Cookson Electronics.

    Chrys began publishing her research on wave soldering in 1998. Since then, her work has spanned a wide range of SMT, wave soldering and PCB fabrication topics. With over 200 technical publications to her credit, Chrys is a frequent presenter and instructor at SMTA functions and IPC international conferences.

    Chrys is an active member and former president of the Philadelphia SMTA chapter. She holds a B.S. in Mechanical Engineering from the University of Massachusetts and an M.S. in Manufacturing Engineering from the University of Rhode Island.


  • May 8 - 10

      +

    Location
    Lightspeed Manufacturing
    Haverhill , MA 01835



    May 15 - 18

    International Conference on Soldering & Reliability 2012  +

    Co-located with Lead-Free Academy & SMTA Toronto Expo

    Location
    Crowne Plaza Toronto Airport Hotel
    Toronto , ON



    May 15 - 18

    Toronto SMTA Expo & Tech Forum (In conjunction with the International Conference on Soldering & Reliability)  +

    Location: Crowne Plaza Toronto Airport Hotel
    Toronto, ON



    Exhibitors

    Wednesday, May 16th, 2012
    Crowne Plaza Toronto Airport Hotel
    33 Carlson Court Toronto (Etobicoke)
    ON M9W 6H5, Canada
    Show hours: 10am-3:30pm

    Exhibitors

    EXHIBIT SPACE HAS SOLD OUT FOR 2012

    The cost to exhibit for corporate members is $350/$450 (early bird/regular) and $425/$525 (early bird/regular) for non-corporate members. (click here for membership information) The cost to exhibit includes: one tabletop exhibit space, access to electricity for an additional $25 per outlet, one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Early bird deadline is April 6th, 2012.

    Important Exhibitor Materials:

  • Application to Exhibit
  • Sponsorship Opportunities
  • Exhibitor Details

  • Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.

    Attendees

    Registration is now closed, please register on site.

    Technical Sessions: View detailed session info

    Tech Sessions take place in the Bronte Room located on the first level. Location signs will be in place for directions.

    9:15-10:00AM
    Nano Coated Stencils For Optimized Solder Paste Printing
    Eric Moen

    10:30-11:15AM
    Troubleshooting the Defects in the SMT Process
    Frank Andres, Alpha Cookson Electronics

    FREE Lunch 12:00–1:00PM

    1:30-2:15PM
    Using Automated Solder Paste Inspection To Improve Print Yields
    Chrys Shea, Shea Engineering Services

    2:15-3:30PM
    Networking Social on Show Floor



    May 17

    Webinar:A Study of Surface Finishes for IC Substrates and Wire Bond Applications  +



    Lenora Toscano, MacDermid Thursday, May 17, 2012
    11am-12:30pm Eastern
    Presented by Lenora Toscano, MacDermid

    Overview:
    The combination of performance enhancements and increased precious metal costs within the electronics industry have left fabricators and OEMs questioning what the best surface finish is for cost-effective, high reliability applications. Currently, the IC substrate market relies heavily on electroless nickel/electroless palladium/immersion gold as a solderable and superior wire bondable finish. The use of this finish has allowed manufactures to avoid reliability concerns associated with electroless nickel/immersion gold. Yet, with the increased prices of gold and palladium it needs to be determined if the industry can sustain these high metal prices. In the mid 1990's electroless nickel/electroless palladium/immersion gold was used as a surface finish for printed circuit boards. The price of palladium soared to an all time high and the market turned to alternate surface finishes. In today's market, specifically over the last year, we have watched the price of gold increase 1.3x and the price of palladium double. In this webinar Lenora will present the use of lower cost, alternate surface finishes for IC substrate applications.

    What you will learn:
    Experimentation will center on wire bond capabilities and solderability. She will also discuss simpler process cycles and costs associated with these new finishes. These alternate finishes will be compared against the conventional electroless nickel/electroless palladium/immersion gold.

    Who should attend:
    This webinar will benefit fabricators and OEMs who are looking for cost reductions to ENIG projects. Also those who want to pursue new alternatives to ENEPIG. Discussion is applicable to process engineers, assemblers, quality control, technical and commodity managers.

    About the presenter:
    Lenora Toscano is the Product Manager for Final Finishes in the Electronics Division of MacDermid. Her research includes advances in all final finish applications including immersion silver, immersion tin, ENIG and high temperature organic solderability preservatives. Her efforts focus on developments that address the compatibility between a surface finish, assembly conditions and the end use applications. Lenora has been published in industry technical conferences and has a number of patents. She graduated from the University of Connecticut with a Bachelor's Degree in Chemistry and received her Master's Degree in Chemistry.


    May 22 & 29

    SMTA WebtorialCleaning Agent and Cleaning Equipment Innovations Needed to Clean Highly Dense Assemblies  +



    Two (2) 90 Minute Sessions
    Tuesday, May 22 and 29, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Mike Bixenman, Kyzen Corporation

    Overview:
    As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is ever more necessary. Low residue no-clean residues did not require cleaning on assemblies with larger spacing between conductors. As the distance between conductors narrow, residues under component gaps pose a reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow temperatures. Traditional cleaning agents and cleaning equipment may not be able to remove these harder to clean flux residues from extremely small geometries.

    Increased circuit functionality is accomplished using bottom termination surface mount components. As components reduce in size, the distance from the board to the underside of the component reduces. Flux residues bridge conductors making cleaning highly difficult. One of the most challenging issues is the selection of an appropriate cleaning process that will clean flux residues under these extremely tight geometries.

    Cleaning agents must be designed to remove strong covalent (hydrophobic) and weak ion (hydrophilic) bonds. Cleaning machines must be designed to move the cleaning agent to the source of the residue and either extract or create a flow channel to remove residues under component gaps. Recent solvent and aqueous cleaning agent and cleaning equipment innovations have been developed to bridge this gap.To achieve the process objective, cleaning agent and cleaning equipment suppliers collaborate with assemblers to develop improved cleaning processes.

    Topics Covered:
  • Chemical Properties of Residues
  • Solvent and Aqueous Cleaning Agents Innovations Designed to Remove Residues
  • Cleaning Equipment Innovations Designed to Remove Flux Residues under Bottom Termination Components
  • Integrating Cleaning Agent and Cleaning Machine
  • Controlling the Process

    Who Should Attend:
  • Circuit Assembly Designers
  • Process Engineers
  • Quality Control Engineers
  • Environmental Engineers

    Instructor Bio:
    Mike is one of the joint founders and CTO of Kyzen Corporation. He is an active researcher and innovator in the precision cleaning field. Mike chaired the IPC Cleaning & Alternatives Handbook, IPC Stencil Cleaning Handbook, and two IPC/SMTA Cleaning and Conformal Coating Conferences. Mike has published over 100 tech papers and received a number of awards in his field of expertise. Mike holds four earned degrees, including a Doctorate of Business Administration from the University Of Phoenix School Of Advanced Studies.


  • May 23

    Carolinas Expo & Tech Forum  +

    Location: UNC Charlotte
    Charlotte, NC


    Exhibitors

    Wednesday, May 23rd, 2012
    University of North Carolina - Charlotte
    Barnhardt Student Activity Center
    9201 University City Blvd.
    Charlotte, NC 28223
    Show Hours: 10am-3pm
    Map of the UNC Campus

    Exhibitors

    The cost to exhibit for corporate members is $350/$450 (Early/Late) and $425/$525 (Early/Late) for non-corporate members.(click here for membership information) The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 27th, 2012!

    Special Thank-You to our Lunch Sponsor Source Technologies

    Important Exhibitor Materials:

  • Show Details
  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Please contact SMTA Exhibition Coordinator Emmy Garner with questions or for additional information.

    Attendees

    Online registration is now closed, please register on-site.

    Free Technical Program

    10:30am - 11:00am
    Speaker: Chris Torrioni, President, Sensible Micro
    Topic: Counterfeit Mitigation

    11:15am - 11:45am
    Speaker: David Cox, Sales Development Manager, Cree Corporation
    Topic: System and Power Supply Design Consideration - LED Lighting

    FREE LUNCH 12:00 - 1:00PM Sponsored by Source Technologies

    1:00pm - 1:30pm
    Speaker: Robert Simon, President, USTEK
    Topic: Al Substrates

    1:45pm - 2:15pm
    Speaker: Matt Kehoe, President, SIPAD Technology
    Topic: SiPad Technology - An Alternative

    2:15pm - 2:45pm
    Speaker: Scott Lewin, Director of OEM Sales, Cookson Electronics
    Topic: Low Voiding Reliable Solder Interconnects for LED Packages on Metal Core PCBs


    June 7

    Upper Midwest Expo and Tech Forum  +

    Location: Hilton Minneapolis/Bloomington Hotel
    3900 American Boulevard West
    (494 & France Avenue)
    Bloomington, MN 55431
    Show Hours: 10am-3pm



    Exhibitors

    The cost to exhibit for corporate members is $350/$450 (early/regular) and $425/$525 (early/late) for non-corporate members (click here for membership information). Exhibit package includes: one tabletop exhibit space, access to electricity for an additional $25, one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Earlybird pricing expires May 4th, 2012.

    Important Exhibitor Materials:

  • Show Details
  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.



    Attendees

    Attendee Registration is now closed, please register on-site.

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:
    Time: 9:30AM-10AM
    Speaker 1: Oliver Chu, Henkel Electronic Materials, LLC.
    Title: Electronics Forecast: Hot and Getting Hotter.

    Time: 10:30AM-11AM
    Speaker 2: Randy Schueller, Ph.D., DfR Solutions.
    Title: Pad Cratering

    Time: 11:30AM-NOON
    Speaker 3: Daniel F. Baldwin,Ph.D., Engent, Inc.
    Title: 3D-WLCSP Package Technology: Processing and Reliability Characterization

    12:00PM-1:00PM Free Lunch on Show Floor!

    Time: 1:30-2PM
    Speaker 4: Todd Henninger, DDI Global.
    Title: Surface Finishes

    2:00PM-3:00PM Cookie Networking on Show Floor!


    June 12 - 14

      +

    Location
    Mentor , OH



    June 12

    Oregon DFX Chapter Tutorial Program - Beaverton, OR Location DFX Project Setup, Measurement Definition, and Elements: From Introduction to Advanced DFX Analysis  +

    Location
    Tektronix
    Beaverton , OR 97077



    Instructor: Dale Lee, Plexus
    June 12, 2012
    8:30 a.m. - 4:00 p.m.
    Tektronix
    14200 SW Karl Braun Drive
    Beaverton, OR 97077
    Price:
    Members $200 (US)
    Non-Members $275 (US) a one-year individual SMTA membership is included in the non-member price.
    Oregon Chapter Officers $100
    Student Chapter Members $50

    Introduction:
    Electronic system designs are increasingly dependent upon capabilities of multiple skilled individuals and electronic software tools for the creation, simulation, design, manufacture and test. In the past, companies were vertically integrated with internal design, manufacturing, inspection, test and in some cases component manufacturing. With these capabilities in a single facility, DFM issues or questions could be resolved with a review of an internal guideline, a few simple phone calls or meetings with the appropriate organization. As design complexity increased, the use of design specialists and specialized EDA and CAD tools increased at the same time when many corporations were beginning to outsource manufacturing, test and physical design of their products to service providers.

    As product technology continued to decrease in size (length, width, thickness), interconnection density per unit area increased (thinner PCB's, smaller lines & spaces), functional performance increased (thermal, mechanical, electrical), the complexity of "ability" design increased in importance and specialized.

    As a result, traditional DFM programs have transformed into DFX to address this increase in scope to topics and specialization. Depending on the complexity of the product under design, these programs can consist of a few key individuals or organizations working together to formalize complex teams spanning many organizations and companies.

    This course will provide an introduction into the major elements for establishing a DFX program, major elements of mechanical and printed circuit board design, assembly process design, inspection/test design and software verification tools including examples of opportunities and demonstrations.

    What you will learn:

  • Introduction
    Elements of Design Process
  • Establishing a DFX Program
    DFA Program Structure, How To Measure Success
    DFX Types/Listing - Concurrent vs Serial
    Definition of Program Parameters - Volumes, Location, Etc.
    DFM Global Impacts - Electronics, Plastics, Metals, Coatings
    Assembly Process Definition - PCA, HLA
  • Global Product Design Elements
    Manufacturing Environment, Design Documentation, Cultural
  • Component Selection
    Package Types, Assembly Process
  • PCB Design Impacts
    PCB Fabrication Panel Utilization
    PCB Material Selection, Component/PCB Warpage, SMT Pad Size & Escape Routing, Via/Micro-via, Solder Mask Opening
    Location (Via in Pad), PCB/Component Lead Finish Issues, High Density Design
  • Through Hole Solder Design Impacts
    Lead Free Solder, Thermal Connections, Pad Shape, Thieving Pad Design, Lead Protrusion,
    Solder Mask, Tooling Design, Copper Dissolution
  • SMT Solder Design Impacts
    Thermal Balance, Trace Routing, Equipment Limitation/Tolerance, PCB/PCB Array Tolerance, Process Tooling Design
  • Process Control Impacts
    Paste Volume, Thermal Shock SMT & PTH, Reflow Process Warpage
  • Cleaning Impacts
    Compatibility Issues, Low Stand-off Components


  • Who should attend:
    This event is ideally suited to new and experienced PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and any members of staff tasked with looking at yield monitoring and process improvements. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.

    About the Instructor:
    Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.

    Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.

    Dale has authored, instructed and spoken frequently on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association's "Excellence in Leadership" award.

    Contact Karen Frericks at 952-920-7682 with questions.


    June 14

    Oregon DFX Chapter Tutorial Program - Redmond, WA Location DFX Project Setup, Measurement Definition, and Elements: From Introduction to Advanced DFX Analysis  +

    Location
    Physio-Control
    Redmond , WA 98073



    Instructor: Dale Lee, Plexus
    June 14, 2012
    8:30 a.m. - 4:00 p.m.
    Physio-Control
    11811 Willows Road NE
    Redmond, WA 98073
    Price:
    Members $200 (US)
    Non-Members $275 (US) a one-year individual SMTA membership is included in the non-member price.
    Oregon Chapter Officers $100
    Student Chapter Members $50

    Introduction:
    Electronic system designs are increasingly dependent upon capabilities of multiple skilled individuals and electronic software tools for the creation, simulation, design, manufacture and test. In the past, companies were vertically integrated with internal design, manufacturing, inspection, test and in some cases component manufacturing. With these capabilities in a single facility, DFM issues or questions could be resolved with a review of an internal guideline, a few simple phone calls or meetings with the appropriate organization. As design complexity increased, the use of design specialists and specialized EDA and CAD tools increased at the same time when many corporations were beginning to outsource manufacturing, test and physical design of their products to service providers.

    As product technology continued to decrease in size (length, width, thickness), interconnection density per unit area increased (thinner PCB's, smaller lines & spaces), functional performance increased (thermal, mechanical, electrical), the complexity of "ability" design increased in importance and specialized.

    As a result, traditional DFM programs have transformed into DFX to address this increase in scope to topics and specialization. Depending on the complexity of the product under design, these programs can consist of a few key individuals or organizations working together to formalize complex teams spanning many organizations and companies.

    This course will provide an introduction into the major elements for establishing a DFX program, major elements of mechanical and printed circuit board design, assembly process design, inspection/test design and software verification tools including examples of opportunities and demonstrations.

    What you will learn:

  • Introduction
    Elements of Design Process
  • Establishing a DFX Program
    DFA Program Structure, How To Measure Success
    DFX Types/Listing - Concurrent vs Serial
    Definition of Program Parameters - Volumes, Location, Etc.
    DFM Global Impacts - Electronics, Plastics, Metals, Coatings
    Assembly Process Definition - PCA, HLA
  • Global Product Design Elements
    Manufacturing Environment, Design Documentation, Cultural
  • Component Selection
    Package Types, Assembly Process
  • PCB Design Impacts
    PCB Fabrication Panel Utilization
    PCB Material Selection, Component/PCB Warpage, SMT Pad Size & Escape Routing, Via/Micro-via, Solder Mask Opening
    Location (Via in Pad), PCB/Component Lead Finish Issues, High Density Design
  • Through Hole Solder Design Impacts
    Lead Free Solder, Thermal Connections, Pad Shape, Thieving Pad Design, Lead Protrusion,
    Solder Mask, Tooling Design, Copper Dissolution
  • SMT Solder Design Impacts
    Thermal Balance, Trace Routing, Equipment Limitation/Tolerance, PCB/PCB Array Tolerance, Process Tooling Design
  • Process Control Impacts
    Paste Volume, Thermal Shock SMT & PTH, Reflow Process Warpage
  • Cleaning Impacts
    Compatibility Issues, Low Stand-off Components


  • Who should attend:
    This event is ideally suited to new and experienced PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and any members of staff tasked with looking at yield monitoring and process improvements. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.

    About the Instructor:
    Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.

    Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.

    Dale has authored, instructed and spoken frequently on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association's "Excellence in Leadership" award.

    Contact Karen Frericks at 952-920-7682 with questions.


    June 19 & 26

    SMTA WebtorialPWB Reliability Failure Modes  +



    Two (2) 90 Minute Sessions
    Tuesday, June 19 and 26, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Paul Reid PWB Interconnect Solutions Inc.

    Overview:
    The three hour Webtorial will cover the concept of reliability and the effect of lead free assembly on printed wire boards (PWBs). The class will focus on PWB failure modes that are induced by thermal excursions associated with accelerated testing, assembly and rework to include PTH (barrel), interconnect, buried via and microvias failures for a total of 10 failure modes. The Webtorial will include failure modes associated with complex interconnect structures including stagger and stacked microvias and microvias on buried vias which embrace and additional five failure modes unique to these HDI structures. Animations, illustrations and micrographs of specific failure modes will be reviewed. The class will include a quick overview of material failures that have become more common with lead free assembly and rework. The role of surface finishes on circuit board reliability, specifically hot air leveling and finishes which incorporate Nickel will be reviewed.

    Who Should Attend:
    The attendee will learn the limits and advantages of quality requirements and reliability testing. How to use reliability testing as a tool for PWB procurement, a method to rank variables like fabrication and assembly process, design, materials and PWB fabricators, an acceleration test to establish object field life predictions. The attendee will learn to review microsections from the point of view of understanding influences on reliability, the effects of surface finishes and the challenge of the Restriction of Hazardous Substances (RoHS) on PWB reliability.


    June 26 - 28

    Symposium on Counterfeit Electronic Parts and Electronic Supply Chain  +

    Location
    Colony Ballroom, Stamp Student Union
    College Park , MD


    Symposium on Counterfeit Electronic Parts and Electronic Supply Chain Technical Symposium: June 26 - 28, 2012
    Workshops: June 28, 2012
    Expo: June 26-27

    University of Maryland College Park, MN

    SMTA and CALCE @ University of Maryland are pleased to announce the east coast venue for the Symposium on Counterfeit Electronic Parts and Electronic Supply Chain. The program will be held June 19-21 at the Marriott Inn & Conference Center next to the University of Maryland. Don't miss this opportunity to learn from and share your insights with government, industry and academia who are addressing the counterfeit problem.

    Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

    Topics will include:
  • Impact of supply chain changes on the component management practices: quality, reliability, manufacturability
  • Electronic parts distribution: current stage and evolution
  • Authentication techniques for securing electronic part supply chain
  • Federal procurement practices and its impact on electronic supply chain
  • Inspections tools and techniques for detecting counterfeit parts
  • New areas of counterfeit concerns: materials, energy storage
  • Industry and international working groups and standards on electronic part supply chain and counterfeit electronic parts


  • The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium will be valuable to quality and reliability manager, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


    June 26 - 28

    Counterfeit Electronic Parts Symposium East   +

    College Park, MD



    Exhibitors

    Technical Symposium: June 26 - 28, 2012
    Workshops: June 28, 2012
    Expo: June 26 & 27, 2012
    University of Maryland Campus, College Park, MD

    Exhibit Hours:
    June 26: 10:00am – 3:00pm
    June 27: 10:00am – 3:00pm
    Please note that exhibit traffic will be minimal while symposium is in session.

    Exhibit space at the Counterfeit Electronics Parts and Electronic Supply Chain Symposium entitles you to:
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings
  • Register Online
    or download a hard copy of the registration form

    Cost to exhibit:

    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $425 $525
    One table
    no access to Electrical Outlet
    $400 $500


    Sponsorship Opportunities:
    Click here to download more information.

    Coffee Break Sponsor - $500 (per day)
  • Signage on-site near registration and breaks
  • Company name/logo listed in final program and handout

    Lunch Sponsor - $750 (per day)
  • Signage on-site near registration
  • Powerpoint slide to be displayed during lunch
  • Company name/logo listed in final program and handout

    Contact Patti Hvidhyld at 952-920-7682 to purchase a sponsorship.


  • June 28

    Webinar:Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere  +



    Ning-Cheng Lee, Ph.D., Indium Corporation Thursday, June 28, 2012
    11am - 12:30pm Eastern
    Presenter: Ning-Cheng Lee, Ph.D., Indium Corporation

    Overview:
    Assembled BGA/CSP devices with SnAgCu (SAC) solder joints are vulnerable upon drop due to the fragility of solder joints. Although reducing the Ag content of SAC alloy does help, the crack resistance upon drop is still considerably poorer than eutectic SnPb system, thus new alloy with improved drop test performance is greatly desired. In this work, SAC105 doped with Ti (SAC105Ti) as BGA/CSP sphere was studied for its drop test reliability. Four different solder combinations were evaluated: 1) SnPb paste with SnPb balls, 2) SnPb paste with SAC105Ti balls, 3) SAC305 paste with SAC105Ti balls, and 4) SAC305 paste with SAC105 balls. The number of completely fractured interconnects was counted for each type of component after a total 100 drops. Presence of Ti improved the drop test performance significantly, despite the voiding side effect caused by its oxidation tendency. It is anticipated that the voiding can be prevented with the use of a more oxidation resistant flux. Wide pasty range of SAC105 with SnPb paste was reported to cause significant voiding. In view of this, use of SAC105 BGA with SnPb solder paste is not recommended, with or without Ti addition. High reflow temperature drove fracture to shift to interface at package side, presumably through building up IMC thickness beyond the threshold value. A lower reflow temperature is recommended. Electrical response is consistent with complete fracture data. But, complete fracture trend is inconsistent with that of partial fracture trend, and neither data can provide a full understanding about the failure mode. By integrating complete fracture and partial fracture into "Virtual Fracture," the failure mechanism becomes obvious and data sets become consistent with each other.

    Who should attend:
    Technical staff who need a better drop test reliability for their portable devices.

    What you will learn:
    The attendee will learn about (1) what new BGA solder sphere alloy will yield a superior drop test performance, (2) how to analyze the dye and pry reliability drop test data, (3) how the process and package design affect the reliability.

    Biography:
    Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.


    July 12

    Ohio Valley Expo and Tech Forum  +

    Location: Doubletree Hotel
    6200 Quarry Lane
    Independence (Cleveland), OH
    Show Hours: 10am-3pm



    Exhibitors

    EXHIBIT SPACE HAS SOLD OUT FOR 2012!

    The cost to exhibit for SMTA Corporate members is $350/$450 (early/regular). The cost for non-corporate members is $425/$525 (early/regular) (click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list, and electricity for an additional $25 per outlet. Early Bird expires June 1st!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Special Thank-You to our Coffee Sponsor Panasonic Factory Solutions of America


    Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:
    Registration 8:30 AM
    Technical Sessions begin at 9:15
    Expo opens at 10:00AM


    9:15am–10:00am
    Mitigate Your Counterfeit Component Risk
    Speaker: Scott Sudnick, President, EMSNET

    11:20am-12:00pm
    Pick and Place vs. LEDs
    Speaker: Eric Haney, Regional Applications Engineer, Cree Inc.

    12:00pm-1:00pm
    FREE LUNCH!

    1:30pm-2:10pm
    Lessons Learned from Failure Analysis
    Speaker: Denis Barbini, Ph.D., Universal Instruments
    SMTA Board of Directors

    2:20pm-3:00pm
    Brownie Social & Raffle on the Show Floor!


    July 19 & 26

    SMTA Webtorial Failure Analysis: Lessons Learned in Manufacturing  +


    Two (2) 90 Minute Sessions
    Thursday, July 19 and 26, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Martin Anselm, Ph.D., Universal Instruments Corp.

    Overview:
    Universal Instruments Corp's Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP, 01005 defects, and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.

    Topics Covered:
  • What are the major difficulties in lead-free reliability testing
  • Mixed alloy assembly best practices
  • PCB plating considerations
  • Analytical testing techniques and what they can identify root causes for production failures.
  • Lead-free laminate selection and testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Suggestion:
    Please bring specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. In my experience many problems can be solved with a brief discussion of the issues.

    Instructor Bio:
    Since 2002 Martin has been working in electronics Failure Analysis and currently oversees all the failure analysis projects for the Universal Instruments Corporation's Advanced Process Lab (APL). Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.


  • August 2 - 7

    Webinar: PCB Inspection and Inspection Strategies  +


    PCB Inspection Webinar: Thursday, August 2, 2012 | 10-11am Eastern
    Presenter: Tammy Grefkowicz, BEST

    Q&A: Tuesday, August 7, 2012 | 11am Eastern
    Moderator: Bob Wettermann, BEST

    Due to a last minute time conflict, this webinar will now be presented on Thursday, August 2. If you cannot attend at that time, you will receive a recording and are invited to attend the Q&A session on Tuesday, August 7, when Bob Wettermann will address the questions from the live event.

    Overview:
    This webinar will provide the participants with an inspection strategy to physically review the product to determine whether or not it meets the IPC-A-610 requirements.

    What you will learn:
    The participants will learn how to find the problem areas on the assemblies with a focus on improving product yields.

    Topics include:

  • Visual Inspection Strategies
  • Handling Electronic Assemblies
  • Magnification and lighting
  • Through hole inspection
  • Wire and terminal inspection
  • SMT inspection and BGA inspection
  • Pre-Requisite:
    Attendees should have good working knowledge of IPC A-610 specification.

    Who should attend:
    This webinar is intended for personnel inspecting printed circuit assemblies or any employee who is involved in vendor qualification or incoming inspection of PCBs.

    About the presenter:
    Tammy Grefkowicz (tgrefkowicz@solder.net) Tammy brings a wealth of practical experience in support of her training credentials being in the electronics industry for 20+ years. She started as a PCB rework and repair specialist at Cray Computers followed by a stint at Celestica, a top EMS provider. She then was trained at UW-Stout in technical education and training while being a full time trainer at Celestica Inc. She holds IPC trainer credentials as MIT in all IPC certifications.


    August 14 & 21

    SMTA Webtorial Counterfeit Electronics - Risks and Mitigation  +


    Bhanu Sood Two (2) 90 Minute Sessions
    Tuesday, August 14 and 21, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Bhanu Sood, Center for Advanced Life Cycle Engineering (CALCE)

    Overview:
    Center for Advanced Life Cycle Engineering (CALCE) provides efficient and cost-effective failure analysis services, counterfeit parts inspection, design reviews, reliability audits, and warranty cost analysis assessment assistance for all interested parties. In the parts procurement process, the purchase of an electronic part from a part manufacturer or its authorized supplier presents very low risk. However, parts are often purchased from unauthorized sources such as independent distributors and part brokers for a variety of reasons, including part obsolescence, lead time, or unavailability of parts from authorized sources. There is a need for authentication and screening of the parts purchased from such sources to verify their authenticity. CALCE provides component authentication and screening services through its Test Services and Failure Analysis Laboratory to verify the authenticity of parts.

    What Will You Learn:
    This two-part webtorial on parts inspection and materials characterization begins with a brief primer on the diverse counterfeit electronic part creation techniques, including the recently discovered “media-blasting” method. The webtorial then discusses the effectiveness of various non-destructive techniques and destructive processing steps for inspecting suspect counterfeit components that are created using diverse techniques. The case studies illustrate the use of an array of analysis techniques to assist in determining the authenticity of an electronic part. Inspection techniques that are discussed in the webtorial include:
  • Optical microscopy
  • X-ray microscopy
  • Acoustic microscopy, decapsulation, die inspection
  • X-ray fluorescence (XRF) spectroscopy
  • Scanning electron microscopy (SEM) / energy dispersive spectroscopy (EDS)
  • Materials characterization tools (FTIR, IC, TGA, DSC, etc.)
  • Electrical testing

    Who Should Attend:
    Component engineers, failure analysis engineers, reliability engineers, engineering managers, procurement managers, quality assurance personnel, contracts personnel, and anyone who is involved in policy-making activities in the fields of marketing or procurement of electronics parts and assemblies.

    Bio:
    Bhanu Sood (bpsood@calce.umd.edu) is the Director of the Test Services and Failure Analysis Laboratory at CALCE. Bhanu’s research areas at CALCE include development of analysis methodologies for component- and PCBA-level failures, materials characterization techniques for counterfeit parts identification, and investigating failure mechanisms in printed circuit boards. Prior to joining CALCE, Bhanu worked at the Naval Research Laboratory in the areas of embedded electronics, embedded batteries, and laser-assisted micro-fabrication techniques. Bhanu holds a US Patent for a laser-based technique for the transfer and embedding of electronic components and devices.


  • August 16

    Webinar: Implementing TSV for 3D Semiconductor Packaging  +


    Vern Solberg Thursday, August 16, 2012
    11am - 12:30pm Eastern
    Presenter: Vern Solberg, STC Madison

    Overview:
    The current market driver for semiconductor package technology is to provide more functionality and improve performance without increasing package size. Vertically configured 3D package technology addresses this issue for a broad number of enterprise products. Initially, the 3D package contained two or more semiconductor die elements mounted on top of one another most often interconnected using a common substrate interposer. Adapting through silicon via (TSV) technology for die-on-die interface on the other hand has the potential to further improve both package performance and package assembly efficiency. Progress in this area has accelerated through the cooperation and joint development programs between a number of government, industry and technical universities. An early high volume application for TSV was for the small CMOS image sensors used in wireless handsets to enable the vertical joining of the sensor and related logic element.

    Although the TSV process is touted as the 'next big thing' in semiconductor packaging, capabilities and methodologies for providing wafers and die elements for stacking currently vary a great deal between suppliers. Although TSV technology has the potential to revolutionize semiconductor packaging, it currently remains hostage to a very limited homogeneous family of products; MEMS, memory and image sensors. In addition, there are a number of processes and methodologies that are considered proprietary and may require licensing agreements and additional fees for their use. Industry roadmaps, however, continue to point toward the eventual use of TSV in developing new generations of high performance system-in-package products.

    What You Will Learn:
    This webinar will explore two basic approaches to TSV formation, via-first and via-last: Via-first integration forms very small via holes in the wafer during front-end processing. Via-last integration may occur before or after bonding wafers or joining individual die elements to one another (Die-on-Die). Due to the increased thickness of pre-joined die, the via-last process typically provides somewhat larger via holes than the via-first variation.

    Who Should Attend:
    This Webinar has been developed specifically for product and circuit design professionals, systems engineers as well as assembly and test engineering specialists for OEM, ODM and EMS providers.

    About the presenter:
    Vern Solberg is a technical consultant for Invensas Corporation specializing in SMT and microelectronics design and manufacturing technology. Vern is a US delegate to the JISSO International Council (JIC) and is currently an active member of IEEE, SMTA, IMAPS and the IPC. He has served the industry for more than thirty years in areas related to both commercial and aerospace electronic products and is active as an author and educator. Solberg holds several patents for 3D semiconductor packaging innovations and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology and furnishes the 'Designers Notebook' column for SMT magazine.


    August 16

    Michigan Expo & Tech Forum  +

    Location: Prince Conference Center
    Calvin College
    1800 East Beltline SE
    Grand Rapids, MI 49546
    Show Hours: 10am-3pm



    Exhibitors

    The SMTA Michigan Expo and Tech Forum is officially SOLD OUT! We encourage you to attend this widely popular and industry leading event!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Exhibitor Details
  • Special Thank-You to our Sponsors

    Coffee Break - Panasonic Factory Solutions of America

    Door Prize - MicroScreen

    Lanyards - StenTech

    Please contact SMTA Exhibition Coordinator Emmy Garner with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    9:30am-10:00am
    Speaker: Debbie Carboni - Kyzen Corporation
    Title: Cleaning of No Cleans and Other Cleaning Issues

    11:00am-11:45am
    Speaker: Chris Mather - Lorain County Community College
    Title: The SMART Commercialization Center for Microsystems - A New Model for Industry Development and Training Gaps and Opportunities in Electronics Manufacturing

    12:00pm-1:00pm Free Lunch on Show Floor!

    1:00pm-1:30pm
    Speaker: Bob Heller - Saline Lectronics and Fleetwood Group
    Title: QFN/Leadless Device Placement and Other Advanced Package Challenges

    2:00pm-2:30pm
    Speaker: Eric Camden - Foresite
    Title: Cleaning Strategies and Issues

    2:00PM-3:00PM Networking on Show Floor!


    August 23

    Capital (DC) Expo and Tech Forum  +

    Location: Johns Hopkins University/Applied Physics Lab
    11100 Johns Hopkins Rd.
    Laurel, MD 20723
    Show Hours: 9am-3pm


    Exhibitors

    Exhibit space has SOLD OUT for this show. To be on the waitlist, please contact seana@smta.org

    The cost to exhibit for corporate members is $350/$450 (early bird/regular) and $425/$525 (early bird/regular) for non-corporate members (click here for membership information). The cost to exhibit includes: one tabletop exhibit space, access to electricity for an additional $25 per outlet, one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Early bird deadline is July 13th, 2012.

    Important Exhibitor Materials:

  • Show Details
  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Please contact SMTA Director of Exhibitions Seana Wall with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Drawings for Kindle E-Readers will take place at 10:30 am, 12:30 pm and 2:30 pm in the expo hall! Must be present to win!

    Free Technical Program & Schedule:

    9:00am-10:00am
    EXPO OPENS!

    11:00am-11:30am
    Craig Hillman, DfR Solutions
    Title: Design for Manufacturability

    12:00pm-1:00pm
    Free Lunch on Show Floor!

    1:00pm-1:30pm
    Robert Simon, USTEK Inc.
    Title: PCB Heat Dissipation Options

    2:00pm-2:30pm
    Alan Hardy, Specialty Coating Systems
    Title: Parylene Coating for Enhanced Reliability of Electronics

    2:30pm-3:00pm
    Networking on Show Floor!


    September 6 & 13

    SMTA Webtorial Mastering Selective Soldering Processing and Manufacturability  +


    Two (2) 90 Minute Sessions
    Thursday, September 6 and 13, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Bob Klenke, ITM Consulting

    Overview:
    This workshop teaches the essentials of selective soldering and describes process variables serving as guidance to enhance the flexibility, reliability and quality provided by the selective soldering equipment. Selective soldering with lead-free alloys will be discussed in detail including differences in process parameters compared to tin-lead solder such as solderability aspects, wetting behavior of lead-free alloys, and higher operating temperatures. Numerous case studies based on the instructor’s experience will be presented. The workshop is based on real-world consulting practice defining the proper understanding of component limitations, clearance restrictions, thermal requirements and solder joint reliability issues that will insure complete knowledge of the selective soldering process.

    Topics Covered:
    1)Fundamentals of Through-Hole Soldering
  • Capillary action and through-hole vertical fill
  • Solder joint formation and vertical force model
  • Component thermal mass differential and process parameters
  • Thermal processing and intermetallic layer formation
    2) Solderability
  • Oxidation layers and surface wetting
  • Zero force wetting time and bare board cleanliness
  • Post-soldering iconic contamination levels and dross abatement
  • Manual soldering and component re-tinning
    3) Solder Alloys
  • Tin-lead and lead-free alloys and surface wetting characteristics
  • Alloy characteristics and copper dissolution
  • Melting point and HMP alloys
  • Solder nozzle and solder pot temperature correlation
    4) Flux Deposition and Flux Activation
  • Liquid flux chemistries and thermal aspects of flux activation
  • Preheat temperature and typical thermal profile
  • Time-temperature limitations
  • No-clean thermal processing and mitigation of flux residues
    5)Thermal Profiling
  • Thermal transfer characteristics
  • Thermocouple location selection criteria
  • Instrumentation techniques and preheating methodologies
  • Preheat selection and sustained preheat
    6)Through-Hole Design Guidelines
  • Lead-to-hole aspect ratio and lead projection
  • Lead pitch and DFMA guidelines
  • Adjacent component clearance and critical keep-out areas
  • Interlayer construction, ground planes and thermal relief design rules
    7)Quality Measurement
  • Solder joint inspection criteria
  • Post-soldering inspection protocols and inspection methodologies
  • Pareto analysis of defect type
  • Defect frequency and location
    8)Troubleshooting Guideline
  • Defect condition and root cause analysis
  • TH solder defect cause and effect matrix
  • Defect resolution
  • Prevention of re-occurrence
    9)Process Optimization
  • Optimization of process parameters
  • DPMO and OFD quality measurement
  • DoE methodologies and validation run
  • Defect mapping techniques
    10)Preventative Maintenance
  • Maintenance procedures, practices and frequency
  • Solder nozzle maintenance
  • Solder alloys contamination levels

    Who Should Attend:
    This workshop is intended for equipment operators, shop floor technicians, process engineers as well as manufacturing and quality personnel who are experienced in SMT and through-hole assembly who want to further their expertise in implementing and troubleshooting the processes, equipment and materials involved in modern electronic assembly technology. Most importantly it will give attendees a perspective on how to implement and optimize the selective soldering process in an effective manner.

    Bio:
    Bob Klenke is a consultant to the printed circuit board assembly industry and a staff member of ITM Consulting. His area of responsibility includes working with OEM's and CEM’s to solve assembly problems and optimize facility operations. His expertise includes process optimization, process troubleshooting and value-added defect resolution strategies. Bob also holds the position of Managing Director with ITM Marketing, a full service technical marketing and market research firm.


  • September 11

    FREE Webinar Package on Package (POP) Design & Assembly  +



    Bob Willis SMTA Instructor Tuesday, September 11, 2012
    11:30am - 12:45pm Eastern Time

    Presented by Bob Willis and members of the SMTA International POP Center Team

    Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up.

    Package on Package (POP) PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.

    PoP Center Sponsors Topics covered:

  • What is Package on Package (PoP)?
  • Component standards
  • PCB design rules
  • Application of tack flux or dip paste
  • Optical and X-ray inspection
  • Rework and repair
  • Question and answer session
  • Find out more about SMTA International and the Package On Package (PoP) Design and Assembly Center.


    September 26

    Webinar: Stencil Printing Technology and Troubleshooting  +

    Location
    Right at your desk!



    Wednesday, September 26, 2012
    11am - 12:30pm Eastern
    Presenter: Peter Biocca P.E., Technology Manager / Solder Paste, Kester ITW

    Overview
    If you've been involved in the electronics assembly industry, you are probably aware of the huge costs associated with rework of SMT defects. Several engineering reviews have stated that printing can account for over 50% of soldering defects. A solid understanding of the printing process is the first step to reduce the amount of rework necessary to stay productive and competitive. This webinar addresses the impact of important printer settings, stencil design criteria and solutions for troubleshooting common printer-related defects.

    What You Will Learn
    The webinar will cover these areas related to stencil printing technology and troubleshooting:

  • Examples of Print Defects
  • SMT Overview
  • Solder Paste
  • Substrate-PCB
  • Stencil
  • Squeegee Blades
  • Printing Equipment
  • Printing Parameters
  • Process Development and Control
  • Defect Prevention
  • Terms and Definitions

    Who Should Attend
    This webinar is useful for engineering personnel involved in the SMT assembly process and will prove a very useful training tool for all engineers, supervisors and key operators at the SMT process as well as manufacturing and quality personnel seeking to reduce defects and increasing first pass yields. It will also benefit maintenance personnel responsible for the optimum printing process.

    About The Presenter
    Peter Biocca presently holds the position of Technology and Sales Manager for the EMS segment for the Kester ITW company based in Itasca, Illinois. He is a Senior Electronic Assembly Engineer, a Certified SMT Process Engineer, and Chemist and has 30 years experience in soldering technologies and electronic assembly. Previously he held key positions at Loctite and Multicore in technical marketing and application engineering positions. He has worked over ten years developing fluxes and lead-free alloy systems and 15 years with lead-free process development and reliability testing. He is the author of several hundred technical papers and articles on process optimization and presented at many symposiums around the world.


  • September 26 - 27

    2012 Medical Electronics Symposium  +

    Location
    Arizona State University
    Tempe , AZ


    September 26-27, 2012
    Arizona State University


    Medical Electronics Technology, Personal Health and the Economy -- Drivers for Positive Business Growth

    Presented by:
    MEPTEC


    In Association with ASU's School of Biological and Health Systems Engineering

    MEPTEC and SMTA are again partnering to present a two day Medical Electronics symposium which will cover a broad spectrum of topics highlighting innovative technologies and related issues in medical electronic applications and devices.   There is significant economic momentum and interest in the areas of personal healthcare and the global healthcare industry in general, which continue to drive positive business trends.
     
    This symposium will bring together technical and business professionals from the medical electronic and relevant industries to present current perspectives on the economic and industry trends as well as state-of-the-art technologies for medical applications.  Current enabling technology advancements that will be utilized to improve the next generation of existing medical electronic products, along with the challenges associated with the complex regulatory and reliability requirements, will be presented by industry experts. 
     
    Day One
    Keynote Address:  Personal Health -- Concepts Impacting Healthcare   
    Keith Lindor, M.D., Executive Vice Provost for Health Solutions, Arizona State University
     
    General Session 
    Business Growth in the Medical Electronics Industry
    Session Chair:  Marco Santello, Arizona State University                         
     
    Innovative Implantable Technologies
    Session Chair:  Randy Crutchfield, Medtronics
     
    Emerging Trends in Components for Medical Electronics
    Session Chair:  Martin Birch, Microsemi
     
    Requirements Beyond Electronics to Bring a Product to Market
    Session Chair:  Guna Selvaduray, San Jose State University
     
    Day Two
     
    Keynote Address:  Trends in 3D micro-packaging for emerging implantable applications
    Livia Racz, Ph.D.,Division Leader, Microsystems Technologies, Charles Stark Draper Laboratory
     
    General Session
     
    Medical Standards, Regulatory & Compliance - Meeting Global Requirements
    Session Chair:  Erik Jung, Fraunhofer IZM
     
    Integrating Process Excellence into Design Control
    Session Chair: Dale Lee, Plexus
     
    Advanced Medical Electronics Packaging Technology
    Session Chair:  Don Banks, St. Jude Medical
     
    The Future of Medical Electronics Systems
    Session Chair:  Krista Crotty, Alberi EcoTech
     
    ASU Student Poster Session - SBHSE Medical Device and Diagnostics
     
    Come see ASU faculty and student poster presentations on their medical device and diagnostics that are being developed in the School of Biological and Health Systems Engineering’s Harrington Program of Biomedical Engineering.  Graduate and Undergraduates are taught about medical device design, the FDA’s quality systems regulations and marketing of these devices as well as the research process itself.  These biomedical engineering students work in a variety of subfield in BME, ranging from neurostimulation, neural prosthetics, point of care technologies, neural and cardiovascular recording instrumentation, medical imaging agents and instrumentation, cardiovascular flow models, prosthetics and rehabilitation devices, among many others.

    Visit http://meptec.org/meptec2012medica.html for more information on the event.


    October 4

    Intermountain Expo and Technical Forum  +

    Location: University of Utah
    Salt Lake City, UT


    Exhibitors

    Contact: Kent Langston, kflangston@rockwellcollins.com


    October 10

    Long Island SMTA Expo and Technical Forum  +

    Location: Islandia Marriott Long Island
    3635 Express Drive North
    Islandia, NY 11749


    Exhibitors

    Hours:

    Exhibitor Setup: 10:00 AM to 12:00 PM

    Vendor Showcase: 12:00 PM to 5:00 PM

    Technical Presentations... To be announced

    Exhibitor Show Package: $350.00

    Exhibitor Fee Includes: One 6' X 30" Draped Table and Chairs; Complete Attendee List and Show Directory


    October 14 - 18

    SMTA International 2012  +

    Location
    Walt Disney World Dolphin Resort
    Orlando , FL 32830


    Join your industry colleagues from around the globe this October for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, and Quality and Reliability.


    October 16 - 17

    SMTA International Electronics Exhibition  +

    Location: Walt Disney World Swan & Dolphin Resort
    Orlando, FL


    Exhibitors Register Now
    Exhibitors

    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1000 attendees from 25 different countries.



    Attendees

    Learn about the latest technology from 145 exhibiting companies to help you increase your productivity and profit.

    Pre-Register for access to:

  • Over 135 exhibiting companies
  • Expert advice during Rx Doctor's Hours
  • Free lunch both days
  • Package-on-Package Design & Assembly Center
  • Complimentary technical presentations
  • Enter drawing for an iPad and other great prizes!
    (must be present to win)

  • October 24

    Connecticut Expo and Tech Forum  +

    Location: Waterbury Marriott
    Waterbury, CT



    November 1

    FREE Webinar Design For Environment (DfE)  +

    8 Proven Strategies for Developing Superior, Cost Efficient, & Environmentally Compliant Products

    Location
    Right at your desk!



    Thursday, November 1, 2012
    11am - 12:30pm Eastern

    Presented by:
    Graham Adams, BSc. Ceng.MlechE, President and Founder of PlesTech Ltd.
    Pamela J. Gordon, President and Founder of Technology Forecasters Inc. (TFI.)
    Harvey Stone, Ph.D

    Design-for-Environment (DfE) is a methodology that has revolutionized the way engineers, managers and executives approach electronics products. In this webinar, you will learn eight proven strategies that are being implemented by industry-leading companies and are easily adaptable to your company and products. In particular, you will hear about tools, techniques and tips for complying with the global web of environmental regulations; increasing the efficiency of your products and customer loyalty; reducing time-to-market and Cost of Goods Sold; lowering environmental and social impacts; and advancing your professional career.

    Presenter Bios
    Graham Adams, BSc. Ceng.MlechE, is President and Founder of PlesTech Ltd. and the creator of EcoFly eco-design software. He leverages 45 years in engineering, research, quality systems, management, and eco-design at Motorola and other companies. He has assisted dozens of firms in implementing DfE practices and complying with DfE regulations.

    Pamela J. Gordon, Certified Management Consultant, is President and Founder of Technology Forecasters Inc. (TFI. She has provided research and consulting to the electronics and technology industries since 1987. She has delivered DfE training programs to Microsoft, Blue Coat, Flextronics, Tellabs and numerous other companies. She has spoken at SMTA events and consulted with SMTA member companies. She is also the author of the groundbreaking book, Lean and Green: Profit for your Workplace and the Environment.

    Harvey Stone, Ph.D, is an environmental consultant, entrepreneur and writer. He has specialized in helping corporations and government agencies to comply with RoHS, WEEE, REACH and other global regulations. He has led compliance workshops for SMTA and spoken at several SMTAI conferences. For three years, he hosted a DfE-related radio show. In 2011, his publisher released his environmental thriller novel - Melting Down.


    November 1

    LA / Orange County Expo and Tech Forum  +

    Location: The Irvine Marriott
    18000 Von Karman Avenue
    Irvine, CA 92612
    Show Hours: 10 a.m.-3:00 p.m.


    Exhibitors Register Now
    Exhibitors

    The cost to exhibit for corporate members is $350/$450 (early/late) and $425/$525 (early/late) for non-corporate members (click here for membership information). Earlybird pricing expires October 5th, 2012. Exhibit package includes: one tabletop exhibit space, access to electricity for an additional $25 per outlet, one 6-foot draped table, two chairs, company sign, lunch, directory listing and attendee list. Early bird deadline is October 5th, 2012.

    Important Exhibitor Materials:

  • Important Exhibitor Details
  • Hard Copy of Exhibitor Reg Form
  • Advertising and Sponsorship Opportunities
  • Marriott Floorplan
  • Exhibitor Floorplan
  • Special Thank-You to our Coffee Sponsor Panasonic Factory Solutions of America


    Please contact SMTA Exhibition Coordinator Emmy Garner with questions or for additional information.



    Attendees


    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    11:00am-11:30am
    Speaker: Zinnour Soultanov, Senior Test Applications Engineer - SPEA America
    Title: Boundary Scan Integration on Flying Probe Testers

    11:45am-12:45pm Free Lunch on Show Floor!

    12:30pm-1:30pm
    Panel Discussion: "To Clean or Not to Clean"
    Panelists: Barbara Kangesberg, Chairperson - BFK Solutions
    Peter Biocca - Kester, an ITW Company
    Kevin Buckner - Kyzen Corporation
    Julie Fields - Technical Devices
    Mike Konrad - Aqueous Technologies
    Naveen Ravindran - Zestron
    Gilbert Roberg - Amtech Solder Products
    Tom Seratti - Stratesys Group

    2:00pm-2:30pm
    Speaker: Brian Toleno, Ph.D., Director, Global Product Management - Henkel Electronic Materials LLC
    Title: Material Properties that Affect Underfill Performance


    November 5 - 8

    International Wafer-Level Packaging Conference  +

    Location
    DoubleTree by Hilton Hotel San Jose
    San Jose , CA


    IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


    November 7

    Wisconsin/Great Lakes Expo & Tech Forum  +

    Location: Milwaukee Wyndham Airport Hotel
    4747 S. Howell Ave.
    Milwaukee, WI 53207
    Show Hours: 9:30am - 3:00pm


    Exhibitors

    The SMTA Wisconsin/Great Lakes Expo is Officially SOLD OUT! Please contact Emmy at emmy@smta.org if you are interested in getting on the waitlist. Even if you cant exhibit, we would still love to have you attend the show!

    Important Exhibitor Materials:

  • Important Exhibitor Details
  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form
  • Special Thank-You to our Coffee Sponsor Panasonic Factory Solutions of America


    Please contact SMTA Exhibition Coordinator Emmy Garner with questions or for additional information.



    Attendees


    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    9:30am - 10:15am
    Keynote Speaker: Tom Sharpe, SMT Corporation
    Title: New Counterfeit Component Threats - An Update

    11:00am - 11:45am
    Speaker: Chris Mather, Lorain County Community College
    Title: The SMART Commercialization Center for Microsystems - A New Model for Industry Development and Training Gaps and Opportunities in Electronics Manufacturing

    12:00pm - 1:00pm Free Lunch!

    1:30pm - 2:15pm
    Speaker: Randy Schueller, DfR Solutions
    Title: Most Significant Pb-free Quality and Reliability Risks


    November 8

    Empire (NY) Expo and Tech Forum  +

    Location: RIT Radisson Hotel
    Henrietta, NY


    Exhibitors

    Contact Martin Anselm with questions. (anselm@uic.com or 607.779.5077).

    Visit the Empire Chapter page for details.


    November 13 - 15

    High Reliability Cleaning and Coating Conference  +

    Location
    Crowne Plaza Chicago O'Hare
    Rosemont , IL 60018


    Organized by SMTA and IPC

    November 13-15, 2012
    Crowne Plaza Chicago O'Hare
    Rosemont, IL


    Registration is now closed, please register on-site.

    Conference Information

    This event is intensely focused on electronic assembly reliability, and the influence of cleaning and coating upon producing reliable hardware.

    “How clean is clean?” is even more challenging to answer: conductors and circuit traces are growing narrower, and what is acceptably clean for one industry segment may be unacceptable in others.

    View the full conference program.

    Session Topics Include:

  • Nano-Coatings
  • Conformal Coating
  • Cleanliness Assessment & Process Control
  • Environmental Standards and Regulations
  • Electronics Assembly and PCB Failure Mechanisms & Reliability
  • Assembly Cleaning & Challenges

    Technical Workshop
    TUESDAY, NOVEMBER 13
  • 8:00 am – 12:00 pm

  • Conformal Coatings: Types, Uses and Specifications
    Doug Pauls, Rockwell Collins and Jason Keeping, Celestica

    What Will You Learn:
  • Conformal coating uses
  • Coating types and specifications
  • Engineering trade-offs
  • Selecting a conformal coating

    What Will You Learn:
    Doug Pauls is the Rockwell Collins expert-on-call for conformal coatings. He currently serves as Chairman of the IPC Cleaning and Coating General Committee, and has been involved in these processes for over 25 years. Pauls has been a part of MIL-I-46058 and IPC-CC-830, and the development-revision of the IPC Handbook on conformal coating, IPC-HDBK-830.

    Jason Keeping is Celestica’s subject matter expert for all ruggedized electronic processes, including underfill, potting, assembly cleaning and conformal coating. He currently serves as the co-chair of the IPC Conformal Coating Handbook IPC-HDBK-830, and has been involved in the sector for over 12 years.

    Pauls and Keeping also currently serve on several key IPC Standards within the sector such as IPC-HDBK-850, IPC-CH-65, and J-STD-030, and the qualification and specification of conformal coating materials, IPC-CC-830. Both are humorous and entertaining speakers who deliver technical concepts in easy-to-understand terms.

    CONFERENCE SCHEDULE
    TUESDAY, NOVEMBER 13 - 12:50pm – 4:45 pm
    WEDNESDAY, NOVEMBER 14 - 8:00am – 5:30pm
    THURSDAY, NOVEMBER 15 - 8:00am – 1:45pm

    The following are some of the conference speakers:
    Lee Wilmot, TTM Technologies
    Rich Kraszewski, Plexus Corporation
    Matt Kelly, MBA, IBM Corporation
    Jeff Kennedy, Celestica
    Rich Kraszewski, Plexus Corporation
    Curtis Wray, Hewlett Packard
    and more...

    SPECIAL EVENTS
    November 13, 4:00pm - 4:45pm
    Printed Circuit Board Reliability: Factors OEMs Should Consider in the Age of Miniaturization
    Dave Hillman, Rockwell Collins

    Hospitality Sponsors:
    Kyzen Techspray Zestron

    REGISTRATION
    You may register online by clicking on the "Register Now" tab above or by downloading the registration form here and faxing it to 952-926-1819.

    MEMBER DISCOUNT
    SMTA members should log in before registering to get the discounted rate. IPC members should contact download the registration form, complete it, and scan-email or fax it to krissy@smta.org or 952-926-1819 to receive the discounted member rate.

    TABLETOP EXHIBITION
    SOLD OUT. PLease contact Patti Hvidhyld at patti@smta.org. Sign up for a tabletop. Get details and book your table on the expos page.

    For more information on the program or registration please contact Patti Hvidhyld.

    HOTEL INFORMATION
    A room block has been reserved for attendees and speakers at the event hotel.

    Crowne Plaza Hotel-Chicago O’Hare
    5440 North River Road
    Rosemont, Illinois 60018
    Room Rate: $162/night
    [P]: (877) 337-5793

    Reservations can be made by contacting the hotel at 1-877-337-5793. Reference the IPC/SMTA when making reservations to ensure receipt of the discounted rate. The room block rates will expire on October 13, 2012.

    Other Hotel Suggestions:
    Comfort Inn
    2175 E. Touhy Ave
    Des Plaines, IL 60018
    847-635-1300
    Rates start at $99.00
    SMTA/IPC does not offer a room block at the Comfort Inn O’Hare. Attendees can call or visit their website to make a reservation.
    2.5 miles from Crowne Plaza O’Hare
    Comfort Inn provides shuttle to Crowne Plaza, please make arrangements with the hotel for the shuttle service

    Intercontinental Chicago O’Hare
    5300 N. River Rd
    Rosemont, IL
    847-544-5300
    Rates start at $223.00
    5 minute walk to the Crowne Plaza
    SMTA/IPC does not offer a room block at the Intercontinental. Attendees can call or visit their website to make a reservation.


  • November 13 - 15

    High-Reliability Cleaning and Conformal Coating Conference - Expo  +

    Location: Crowne Plaza Chicago O'Hare
    Rosemont, IL



    Exhibitors

    SOLD OUT. Please contact Patti Hvidhyld at patti@smta.org.

    Tabletop Exhibit Cost: $1000 member/$1200 Standard rate

  • Tabletop Exhibit — one six foot table to be located in the break area
  • Logo on all electronic communications to this audience — global email broadcasts and electronic brochure linked to IPC websites
  • List of Conference participants after the event
  • Logo on all printed materials and agenda on-site
  • One complimentary Conference registration for tabletop staff
  • Additional registration at 25% discount

    For more info about the program and to register for the conference, click here.


  • November 14 - 15

    Guadalajara Expo and Tech Forum  +

    Location: TBD
    Guadalajara, JA
    Show Hours: 1000-1700hr



    Nov 27 & Dec 4

    SMTA Webtorial BGA Rework/Repair-A Primer  +

    Location
    At your desk


    Bob Wettermann Two (2) 90 Minute Sessions
    Tuesday, November 27 and December 4, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Bob Wettermann, BEST Inc.

    Overview:
    While BGAs are relatively forgiving in their placement on PCBs there is fallout requiring the rework of BGAs. This course is a primer on the the various aspects of the process from initial inspection through the site preparation, placement and final inspection. If you are just beginning to place BGAs and know that eventually you will be needing to rework them or have just begun reworking BGAs this 2 part series will guide you through the basics. We will talk about the problems in initial placement which leads to rework, the equipment set and capabilities required to adequately rework BGAs and the process steps involved.

    What Will You Learn:
    We will develop the following topics in this class:

    1.Rework Process including : part removal, site dressing, placement , reflow, cleaning and inspection

    2. Equipment-what is right for your process

    3. Material Set-flux, cleaning and paste materials

    4. Unlucky 13 "Gotchas" of BGA Rework including damaging the mask, part reballing, pad repair and others.

    Who Should Attend:
    This course is designed for the process engineer, manufacturing engineer or the repair technician working at a repair depot.

    Bio:
    The instructor for this class is Bob Wettermann of BEST. BEST is a contract rework and repair facility repairing thousands of BGAs every year. In addition BEST is an IPC Master instruction location. This class will bring to life the process through real applications.


    December 4

    Arizona Expo and Tech Forum  +

    Location: Fiesta Inn Resort
    Tempe, AZ



    December 4 - 6

    Symposium on Counterfeit Electronic Parts (West)  +

    Location
    Crowne Plaza Anaheim Resort
    Anaheim , CA 92840-4001


    Symposium on Counterfeit Electronic Parts (West) Technical Symposium: Dec 4-5, 2012
    Workshops: Dec 6, 2011
    Crowne Plaza Resort
    Garden Grove (Anaheim), CA



    SMTA and CALCE @ University of Maryland are pleased to announce a west coast venue for the Symposium on Counterfeit Electronic Parts. The first four symposia (held in College Park, MD) were an overwhelming success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals. We are pleased to offer a west coast venue again in 2012.

    A counterfeit electronic part is one whose identity (e.g., manufacturer, part number, date code, lot code) has been deliberately misrepresented. Counterfeit electronics have been reported in a wide range of products, including computers, telecommunications equipment, automobiles, avionics and military systems. Counterfeit electronics include everything from very inexpensive capacitors and resistors to costly microprocessors, completed assemblies and even systems.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

    Topics will include:
  • Electronic parts supply chain
  • Sources of counterfeit parts
  • Proven methodologies for reducing chances of being victims of counterfeit parts
  • Supply chain management tools to mitigate counterfeit part risks
  • Inspections tools and techniques for detecting counterfeit parts
  • Authentication techniques for securing electronic part supply chain
  • Trade and business issues adopted by industry
  • Law enforcement and international cooperation

    The conference is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the Crowne Plaza Resort in Garden Grove (Anaheim). This symposium will be valuable to senior management, supply chain managers, component engineers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies addressing the issue. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

    Abstracts are currently being accepted for the symposium. Visit the Call for Participation page for more information on submitting an abstract.

    Additional information about conference participation and registration will be posted in April. Contact Patti Hvidhyld if you have immediate questions.

    Event Location
    Crowne Plaza Resort
    12021 HARBOR BLVD
    GARDEN GROVE, CA 92840

    An event room block has been set up at the Crowne Plaza Resort for a rate of $112/night plus a $14 resort fee.. You can make reservations by:
    Group link below:

    Passkey Reservation System: 1888-233-9527
    Central Reservation System: 1866-442-7375
  • Phone at 1-714-867-5555 (reference group code "SMT")
  • Online web page

    Symposium Technical Committee:
    Diganta Das, Ph.D., CALCE/University of Maryland, Conference Chair
    Gary Beckstedt, World Micro Co-Chair Kevin Sink, TTI, Inc. Phil Zulueta, Jet Propulsion Laboratories


  • December 4 - 5

    Counterfeit Electronic Parts Symposium West Tabletop Exhibition  +

    Location: Crowne Plaza Anaheim Resort
    12021 Harbor Boulevard
    Anaheim, CA 92840-4001



    Exhibitors

    Exhibit Hours:
    December 4: 10:00am – 3:30pm
    December 5: 10:00am – 3:30pm

    Contact Patti for available booth space. 952-920-7682 or patti@smta.org

    Please note that exhibit traffic will be minimal while symposium is in session.
    Full conference info is available here.


    Exhibit space at the Counterfeit Electronics Parts and Electronic Supply Chain Symposium entitles you to:

  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings
  • Download a hard copy of the registration form

    Cost to exhibit:

    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $450 $550
    One table
    no access to Electrical Outlet
    $400 $500


    Sponsorship Opportunities:
    Click here to download more information.

    Coffee Break Sponsor - $250 (per day)
  • Signage on-site near registration and breaks
  • Company name/logo listed in final program and handout

    Lunch Sponsor - $550 (per day)
  • Signage on-site near registration
  • Powerpoint slide to be displayed during lunch
  • Company name/logo listed in final program and handout

    Contact Patti Hvidhyld at 952-920-7682 to purchase a sponsorship.


  • December 6 & 13

    SMTA Webtorial Preventing Production Defects and Failures  +

    Location
    At Your Desk


    Two (2) 90 Minute Sessions
    Thursday, December 6 & 13, 2012
    1:00pm to 2:30pm Eastern
    Presented by: Jennie Hwang, Ph.D., H-Technologies Group

    Overview:
    Considering the new and anticipated developments in packaging and assembly, this two-part webinar addresses “how-to” prevent failures and take remedial measures of the prevailing production defects through the understanding of potential causes. The webinar focuses on six issues/defects - PCB bare board issues, Pad cratering, BGA head-on-pillow defect, passive 01005 issues, copper dissolution and Pb-free thru-hole barrel filling problem, and tin whisker. PCB thermal properties and halogen-free PCB laminates will be discussed. New developments in tin whisker and mitigating measures will also be outlined. Attendees are encouraged to bring their issues for discussion.

    Part 1:
  • SMT production defects overview
  • PCB – thermal properties for Pb-free assembly
  • PCB bare board – thermal properties vs. defect prevention
  • PCB - halogen–free laminates
  • Pad cratering – causes, solutions, differentiation from pad-lifting
  • BGA head-in-pillow defect – causes, factors, remedies
    Part 2:
  • Copper dissolution – process factors, impact on thru-hole solder joint reliability, mitigation;
  • Pb-free thru-hole barrel filling – material, process, solder joint integrity;
  • Tin whisker – new developments, mitigation;
  • Passive 01005 assembly – process, factors, best practice;
  • Your issues.

    Who Should Attend:
    The course provides a working knowledge to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers and business decision makers; also designed for those who desire the broad-based information.

    Bio:
    Dr. Hwang, a pioneer and major contributor to the implementation of Surface Mount manufacturing since its inception as well as in lead-free electronics, brings to the webinar her 30+ years experience in hands-on production and as an advisor to OEMs, EMS and U.S. government. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to reliability issues. Dr. Hwang has received numerous honors and awards including the U.S. Congressional certificate of recognition and achievements. She authored several books and 350+ publications and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. Her formal education includes four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. Currently, she is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.


  • December 18

    Webinar: RoHS Solved Some Problems, Created Others: Reliability Reports from the Field  +



    Tuesday December 18, 2012
    11am - 12:30pm Eastern
    Presenter: Chris Muller, ASHRAE Distinguished Lecturer,Technical Director, Purafil, Inc.

    Overview
    Passage of various “lead-free” regulations have resulted in increased sensitivities of printed circuit boards, surface mounted components, hard disk drives, computer workstations, servers, and other devices to the effects of corrosive airborne contaminants. Data centers in (non-industrial) urban locations are reporting failures of servers and hard disk drives resulting in increased warranty costs and potential loss of confidence by customers. This webinar will describe the effects of gaseous and particulate contamination on electronic hardware and the monitoring techniques used to verify recommended environmental severity levels. A program for the assessment, control and monitoring of data center contamination will be detailed.

    What You Will Learn
    1. Understand the modes of recent electronic hardware failures in data centers in polluted geographies and identify locations where ambient air quality presents high risks to datacom and IT equipment.
    2. Explain the need for characterization and continuous monitoring of the ambient (outdoor) and data center (indoor) environments as they relate to electronic equipment failures.
    3. Determine the risk potential of the ambient environment toward electronic equipment using reactivity monitoring.
    4. Understand basic design considerations for mission critical environments and the use limitations of air-side economizers for free cooling.
    5. Develop an integrated contamination control program based on environmental assessment, control, and monitoring.
    6. Apply enhanced air cleaning technologies to outdoor (ventilation, makeup) air systems, and recirculating air handling systems, and through the use of standalone air cleaning systems.

    Who Should Attend
    Process Engineers, Quality Control Engineers, Reliability Engineers, Failure Analysis Engineers, Environmental Engineers, Facility Engineers, Facility Managers, Mechanical Engineers, HVAC Engineers, Design/Build Engineers, IT managers, Data Center Owners, Data Center Operators

    About The Presenter
    Chris Muller is the Technical Director and Global Mission Critical Technology Manager at Purafil, Inc. (Doraville, Georgia USA) and is responsible for Purafil’s data center business development program as well as for technical support services and various research and development functions. Prior to joining Purafil, he worked in the chemical process and pharmaceutical manufacturing industries in plant management and quality assurance/quality control. He has written and spoken extensively on the subject of environmental air quality, the application and use of gas-phase air filtration, corrosion control and monitoring, electronic equipment reliability, and RoHS and counts over 120 articles and peer-reviewed papers, more than 100 seminars, and 7 handbooks to his credit. He is one of only a handful of ASHRAE members named as a Distinguished Lecturer and has received their Distinguished Service Award. He is a corresponding member for Technical Committee 9.9 – Mission Critical Facilities, Technology Spaces and edited their handbook on Particulate and Gaseous Contamination in Datacom Environments.


    Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819