Calendar of Events



            May                       

May 2010

May 2

Go Greener in Your Cleaner! - Cleaning Process Benchmarking Webinar  +

Held in conjunction with Virtual PCB


Green Cleaning Available On Demand until May 4, 2010
Presented by Dr. Harald Wack, ZESTRON America


Over the past decade, the cleanliness requirements for manufacturers have increased significantly. This is primarily due to higher performance expectations, higher component densities and newer materials being used. The North American electronics assembly market consists mainly of military, aerospace, medical, and automotive manufacturing industries, all of which require a guaranteed life time product reliability. With higher cleaning performance requirements and increased environmental regulations the cleaning process has become a focal point for many companies. RoHs and REACH, but also stricter, local waste water regulations and VOC limits, have forced numerous, recent process re-qualifications.

This study was prepared to focus on cleaning process benchmarking. In other words, how can one compare established cleaning processes with newer process technologies? The authors will present recent cleaning challenges including the removal of flux residues under challenging low standoff components such as 0603 chip capacitors, while using pH-neutral de-fluxing agents as well as alkaline chemistries with reduced VOC levels. The objective was to assess their effectiveness, demonstrate any limitations while adhering to higher environmental standards. To further demonstrate the challenge of increasing VOC limitations, the study also highlights experimental findings on vapor recovery methods used presently in the industry. This will allow users to benefit from experimental comparison data to further enhance their respective cleaning process while conforming to the latest environmental regulations.


May 2

Root Cause Failure Analysis of Printed Circuit Board Assemblies Through Analysis of Product and Tooling Design webinar  +

Held in conjunction with Virtual PCB


Design for Manufacturing Available On Demand until May 4, 2010
Presented by Dale Lee, Plexus Corporation


Failure analysis of printed circuit board production failures traditionally focused on supplier quality and/or manufacturing process issues. With the goal to reduce or eliminate assembly defects, determination of a failure’s root cause is critical to prevention of future failures. During the late 1980s and early 1990s, the Department of Defense focused failure analysis on mechanical failures instead of electrical failures. The goal was to address not only material failures but failures induced through product and/or assembly process tooling design.

With today's component packaging technology decreased size (length, width, thickness), increased interconnection density per unit area (thinner PCB’s, smaller lines & spaces), increased functional performance (thermal, mechanical, electrical) at the same time as assembly processes are changing to lead-free assembly and other legislated requirements, root cause failure analysis of printed circuit board assemblies is critical to achieving a high first pass yield manufacturing process. This presentation and discussion will introduce the element of root cause failure analysis through the correlation of product and tooling design with assembly defects. The presentation will include examples of actual product design, manufacturing tooling design, and SMT & PTH assembly process issues matched to actual product failures.


May 17 - 20

International Conference on Soldering & Reliability (ICSR)  +

Co-located with Lead-Free Academy & SMTA Toronto Expo

Location
Hilton Toronto Airport Hotel
Toronto , ON Canada


ICSR May 17-20, 2010
Hilton Toronto Airport Hotel
Toronto, Ontario


The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies. In addition, the European Union’s RoHS directive has now been joined by those of REACH, the dimethyl fumarate ban and the new Canadian Management plan on substances of concern for electrical and electronic equipment complicating matters considerably. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component assembly are among the concerns being addressed. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.

To register for the conference or academy tutorials please click on the "Register Now" button on the right side of the page.


PROGRAM OUTLINE
SMTA Lead-Free Academy
Mon. May 17 - Tues., May 18, 2010

Click on the tutorial titles below to view the full descriptions.

Monday, May 17
T1: True Design for Reliability - Understanding What is and What is not DfR

Craig Hillman, DfR Solutions: 1:30p.m. – 5:00p.m.

T2: cancelled

Tuesday, May 18
T3: The Reality of Pb-Free Reliability
Craig Hillman, DfR Solutions: 8:30a.m. - 12:00p.m.

T4: Reliability Issues of Lead-Free Solder Joints for Portable Devices
Ning-Cheng Lee, Ph.D., Indium Corporation: 8:30a.m. - 12:00p.m.

Conference Schedule
Tuesday, May 18, 2010

Hours: 1:00p.m. - 5:45p.m.
Wednesday, May 19, 2010
Hours: 8:50a.m. - 5:30p.m.
Thursday, May 20, 2010
Hours: 8:50a.m. - 4:30p.m.

The 2010 ICSR speakers include:

  • Jack Richtsmeier, Sonoscan
  • Keith Howell, Nihon Superior
  • Jae Pil Jung, University of Seoul
  • Hua Lu, Ryerson University
  • Andreas Thumm, IBL-Lottechnik GmbH
  • and many more...
  • Click here to view the technical line-up.

    Special Events
    Keynote Presentation
    Wednesday, May 19, 2010
    Roadmap of the Environmental Technologies in Electronics

    (Click here to download abstract)
    Jacklin Adams, IBM Corporation (speaker bio)

    SMTA Toronto Expo & Tech Forum
    Wednesday, May 19, 2010

    Attendance to the expo is FREE!

    Please check the Tech Expo page for more information about the SMTA Toronto Expo.

    Accommodations
    Hilton Toronto Airport Hotel
    5875 Airport Road
    Toronto, Ontario
    Canada
    Tel: 800-445-8667
    Room Rate: $124CND

    Reference the Surface Mount Technology Association or Group Code: Surf10 when making your reservations to ensure receipt of the discounted rate. The discounted room block rate will expire on April 30th.


    Technical Committee
    Laura Turbini, Ph.D, Research In Motion, Conference Chair
    Bev Christian, Ph.D., Research In Motion
    Matthew Kelly, IBM Corporation
    Polina Snugovsky, Celestica, Inc.


    The International Conference on Soldering & Reliability is sponsored by the SMTA and held in co-operation with the SMTA Toronto Chapter.

    For more information on this program please contact SMTA Director of Education, Melissa Serres.


    May 18 - 20

      +

    Location
    Celestica
    , PE Malaysia



    May 18

    SMTA Webtorial Design for Testability and Test Strategy Selection  +


    Louis Ungar Two (2) 90 minute Sessions
    Tuesday, May 18 and Tuesday, May 25, 2010
    1:00pm to 2:30pm Eastern
    Presented by: Louis Y. Ungar, A.T.E. Solutions, Inc.


    Get a single-user license of the SMTA/TMAG Testability Guidelines for 1/2 price with your registration - a $25 savings!

    Part 1 – Overview of the myriad of test strategies and methods.

    Test Strategies from Birth to Death
  • Conceptual Design and Failure Mode Effects Analysis
  • Design Verification Tests: Functional Simulations, Signal Integrity, Margining and Robustness
  • Qualification and Acceptance Testing
  • Automated Inspections: Optical Inspection (AOI), X-Ray Inspection (AXI), Thermal Characterization
  • Connectivity Testing
  • Manufacturing Defects Analysis (MDA)
  • In-Circuit Testing: Bed-of-Nails Access, Flying Probe Test
  • Boundary-Scan (JTAG/IEEE-1149.x)
  • Functional Board Testing
  • Built-In Self Test (BIST)
  • System Level Test and Diagnoses
  • Field Support Testing

    Multiple-Platform Tests
  • Inspection vs. Test
  • Traditional In-Circuit followed by Functional Board Test
  • Injecting Boundary Scan and BIST into the Traditional Approach

    Strategies Towards "Non-Intrusive Board Test"

    Part 2 – Detailed review of the various guidelines covered in the SMTA/TMAG Testability Guidelines.

    The SMTA/TMAG TP-101D Testability Guidelines
  • Probing and Fixturing Guidelines
  • Flying Probe Guidelines
  • Vectorless Testing Guidelines
  • AOI Inspectability Guidelines
  • X-Ray Inspection Guidelines
  • Electrical Design Guidelines
  • Boundary Scan Guidelines
  • Analog and Mixed Signal Guidelines
  • Built-In Self Test Guidelines
  • Diagnoses and Support Guidelines

    About the instructor:
    Louis Y. Ungar enjoys a well-known reputation in the electronics testing profession. He has built, programmed, and selected Automatic Test Equipment (ATE) for a large number of clients both in the commercial and military community. Having introduced the first university course on Automatic Testing and Design for Testability at UCLA, he and his company have taught similar courses to thousands around the world in publicly held forums, at company facilities and more recently, online. He has served on international standards committees, such as the IEEE. He led the Surface Mount Technology Association (SMTA) Testability Committee to publish the SMTA Testability Guidelines in 2002 and helped in the project to revise it in 2008. He has been honored as a life-time member of the American Society of Test Engineers (ASTE) where he has served as Technical Consultant, Board Member, Treasurer and Los Angeles Chapter President. As President of A.T.E. Solutions, Inc. Mr. Ungar leads consultants who solve test and testability problems. He is the founding president of the Testability Management Action Group (TMAG), a not-for profit professional group dedicated to justify testability issues to management.


  • May 19

    Toronto Expo & Tech Forum  +

    Location: Crowne Plaza Toronto Airport
    Toronto, ON


    Exhibitors

    May 19, 2010
    Hilton Toronto Airport Hotel
    Toronto, ON
    Hours: 9:30am - 4:00pm
    The cost to exhibit for corporate members is $450 and $525 for non-corporate members. The cost to exhibit includes: one 8x10 sq. ft. exhibit space, one 6ft draped table, two chairs, company sign, lunch, directory listing and an attendee list.


  • Exhibitors

  • Exhibitors can register by clicking on the "Register Now" button above. If you prefer to complete a paper registration form please click here to download a registration form.

  • Advertising & Sponsorships

  • Sponsorship opportunities are now available. Click here for additional information.

  • Exhibitor Details

  • Click here for Show Details including set-up information, shipping instructions, hotel information, directions and travel information.

  • Attendees

  • Click here for FREE attendee registration!
    Plan to attend now and visit with representatives from the major suppliers to the industry. Pre-register to ensure your free lunch!

  • FREE Technical Presentations

  • Click on the presentation title to view the complete abstract.

    10:15am
    Classification of Non-ICs for SMT Reliability with J-STD-075
    Steve Martell, Sonoscan, Inc.

    12:45pm
    Pad Cratering Under BGAs
    Gareth Parry, Interconnect Technical Advisor

    3:15pm
    Stencil Designs & Processes
    Kon Akbar, Stentech

    Please contact SMTA Director of Education Melissa Serres with questions or for additional information.

    The SMTA Toronto Tech Expo is co-located with the International Conference on Soldering & Reliability and the Lead-Free Academy.

    Toronto Exhibitors (as of 5/13/10)

    3M Canada
    Ascentec Engineering
    Comtree
    Corfin Industries
    Electrotek Corporation
    Elemental Controls-NITON Analyzers
    Genius Solutions
    Garland Service Company (GSC)
    Indium Corporation
    Kyzen Corporation

    MicroCare Corporation
    PFC Flexible Circuits Ltd
    Photo Etch Technology
    Photo Stencil
    Premier Semiconductor Services
    Research In Motion
    Seika Machinery
    SMT Industrial Supply
    Sonoscan, Inc.
    The JMJ Group



    May 20

    Upper Midwest Chapter Tutorial Program DFX Project Setup, Measurement Definition, and Elements: From Introduction to Advanced DFX Analysis  +

    Location
    Hennepin Technical College
    Eden Prairie , MN 55347



    Instructor: Dale Lee, Plexus
    May 20th, 2010
    8:30am - 4:00pm
    Hennepin Technical College
    13100 College View Dr
    Eden Prairie, MN 55347
    Price:
    Members $200
    Non-Members $275 a one-year individual SMTA membership is included in the non-member price.

    Introduction:
    Electronic system designs are increasingly dependent upon capabilities of multiple skilled individuals and electronic software tools for the creation, simulation, design, manufacture and test. In the past, companies were vertically integrated with internal design, manufacturing, inspection, test and in some cases component manufacturing. With these capabilities in a single facility, DFM issues or questions could be resolved with a review of an internal guideline, a few simple phone calls or meetings with the appropriate organization. As design complexity increased, the use of design specialists and specialized EDA and CAD tools increased at the same time when many corporations were beginning to outsource manufacturing, test and physical design of their products to service providers.

    As product technology continued to decrease in size (length, width, thickness), interconnection density per unit area increased (thinner PCB's, smaller lines & spaces), functional performance increased (thermal, mechanical, electrical), the complexity of "ability" design increased in importance and specialized.

    As a result, traditional DFM programs have transformed into DFX to address this increase in scope to topics and specialization. Depending on the complexity of the product under design, these programs can consist of a few key individuals or organizations working together to formalize complex teams spanning many organizations and companies.

    This course will provide an introduction into the major elements for establishing a DFX program, major elements of mechanical and printed circuit board design, assembly process design, inspection/test design and software verification tools including examples of opportunities and demonstrations.

    What you will learn:

  • Introduction
    Elements of Design Process
  • Establishing a DFX Program
    DFA Program Structure, How To Measure Success
    DFX Types/Listing - Concurrent vs Serial
    Definition of Program Parameters - Volumes, Location, Etc.
    DFM Global Impacts - Electronics, Plastics, Metals, Coatings
    Assembly Process Definition - PCA, HLA
  • Global Product Design Elements
    Manufacturing Environment, Design Documentation, Cultural
  • Component Selection
    Package Types, Assembly Process
  • PCB Design Impacts
    PCB Fabrication Panel Utilization
    PCB Material Selection, Component/PCB Warpage, SMT Pad Size & Escape Routing, Via/Micro-via, Solder Mask Opening
    Location (Via in Pad), PCB/Component Lead Finish Issues, High Density Design
  • Through Hole Solder Design Impacts
    Lead Free Solder, Thermal Connections, Pad Shape, Thieving Pad Design, Lead Protrusion,
    Solder Mask, Tooling Design, Copper Dissolution
  • SMT Solder Design Impacts
    Thermal Balance, Trace Routing, Equipment Limitation/Tolerance, PCB/PCB Array Tolerance, Process Tooling Design
  • Process Control Impacts
    Paste Volume, Thermal Shock SMT & PTH, Reflow Process Warpage
  • Cleaning Impacts
    Compatibility Issues, Low Stand-off Components
  • Product Acceptance Inspection
    Inspection - AOI, AXI, HVI
    Components/Assembly - MDA, ICT/Boundary Scan, BIT/BIST/Functional
    Test/Inspection Strategy
  • Software Tools
    DFF, DFA, DFT, Test Strategy


  • Who should attend:
    This event is ideally suited to new and experienced PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and any members of staff tasked with looking at yield monitoring and process improvements. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.

    About the Instructor:
    Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.

    Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.

    Dale has authored, instructed and spoken frequently on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association's "Excellence in Leadership" award.

    Contact the SMTA at 952-920-7682 with questions.


    Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone +1 952.920.7682
    Fax +1 952.926.1819