Calendar of Events



      Mar                             

March 2005

March 1

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Technical sessions, tabletop exhibits, and workshops


Conference chairman Jeff Kennedy of Celestica The 2005 SMTA Medical Electronics Symposium will be held April 25-27 at the Marriott Minneapolis Airport, MN. In addition to technical sessions, two half-day workshops, and plenary sessions, this event will include tabletop exhibits.

The conference chairman is Jeff Kennedy, Celestica, Inc., and the technical program will focus on medical electronic devices, components, packaging and assembly for medical applications.

The resilient medical electronics field is a high-tech manufacturing industry that is still based primarily in the United States. Technology improvement results from the close working relationships between industrial segments, universities, and state, federal and private institutions, making medical electronics a vibrant interactive technical community. We will explore the various challenges embedded in manufacturing the medical products. We expect to participate together to find techniques and principles from the mainstream SMT that can be adopted. We will also look ahead into the future where advances in semiconductors, optoelectronics, MEMS and Nanotechnology will be applied.


MONDAY, APRIL 25
T1: Electronics Assembly and the Impact of Lead-free Materials
Tony Primavera, Guidant Corporation
1:30PM - 5:00PM

Course Description
This overview course will focus on lead free assembly from a materials and process standpoint. Emphasis will be places on transition to lead free, interaction between materials, and differences in assembly between lead free and eutectic Sn/Pb soldering. When applicable specific medical product needs will be discussed pertaining to lead free. The class will begin with an overview of lead free solder materials and conclude with a discussion on reliability found in mixed and pure lead free assemblies.

Topics
  • Solder Paste Materials
  • Standard Printed Circuit Boards
  • Assembly Processes and Tools
  • Solder Reflow Methods and Considerations
  • Wave Soldering Considerations
  • Quality Processing


  • Who Should Attend
    The course is ideal for engineers and technical process staff trying to implement lead free into their product line. In addition, it is intended to highlight some of the more subtle details of lead free assembly and materials interaction. A background in materials or mechanical engineering is suggested, but not required.
    T2: Corrective and Preventive Actions -CANCELLED
    Doug Older, Techlogic, Inc.
    1:30PM - 5:00PM

    Course Description
    This seminar addresses the ISO and FDA QSR requirements for implementing effective corrective action and preventative action processes. The objective is to provide closed loop corrective / preventive action (CLC/PA) systems to ensure that appropriate corrective / preventive actions are taken and are effective.

    This seminar addresses the "big picture" approach to preventing problems before they occur. Emphasis is placed on the use of proactive measures, such as analyzing data, identifying trends and opportunities for improvement before problems occur.

    Topics
  • Differences between corrective and preventive action system
  • Preventive action as the cornerstone of a good Cost of Quality system
  • Using corrective action to eliminate the "root cause" of problems
  • Using preventive actions to avoid problems
  • Process mapping your corrective and preventive action systems


  • Who Should Attend
    Top management, quality systems representatives, problem solving team members, team leaders and facilitators, process managers, and regulatory specialists.


    TUESDAY, APRIL 26

    8:30AM - 8:45AM
    Opening and Welcome

    Jeff Kennedy, Celestica, Conference Chairman

    8:45AM - 9:30AM
    Plenary Session: Medical Electronics Roadmap

    Terry Dishongh, Intel Corporation
    Description
    Medical electronics equipment production is expected to be $39.5Bn in 2004, accounting for about 4% of the global electronics industry. This market is expected to continue to increase at an average rate of 4.9% per year through 2008. The medical electronics industry is one of the few major electronics system market segments where production is still concentrated in North America. Prismark estimates that 62% of medical electronics equipment will be assembled in the Americas in 2004. The medical product sector group is new to the iNEMI Roadmap for 2004.

    The product sector encompasses implantable medical devices, information technology used for patients' records, medical diagnostic tools, and monitoring devices. iNEMI (International Electronics Manufacturing Initiative) established a new PEG (Product Emulator Group) to identify the technical and business needs of Medical OEMs for the 2004 iNEMI Roadmap. This presentation will describe the process used by iNEMI and identify some of the specific medical electronics driver issues and gaps resulting from the 2004 roadmap process.

    Medical electronics 9:45AM - 11:15AM
    Session 1: MEMS and Medical

  • MEPS - MEMS Electromechanical Power Supplies: A Solution for Integrated Power for Microsystems
    Jenniffer DeGreef, TPL, Inc.
  • MEMS Impact on Medicine
    Dr. Ken Gilleo, ET Trends LLC


  • 11:30AM - 1:00PM
    Keynote Presentation and Lunch: Trends in the Medical Device Industry
    How the University of Minnesota and Medical Alley are Tied to Future Success

    Dr. Arthur Erdman, University of Minnesota

    Medical electronics What roles will University faculty and students play in this explosion of new medical devices aimed at improved health care?

    History tells us that universities will continue to make major contributions to new medical product and instrument development based on merging our core disciplines (materials, design, controls, manufacturing, sensors, etc.) with the needs of our medical colleagues.

    Description
    Using the University of Minnesota as an example, it has a rich history of medical first's including the first gastrointestinal suction(1931), first open heart surgery (1952), the first pan-creas transplant (1966), first pacemaker for the heart (1959). In most cases, the medical tools that result from the collaborations between physicians and engineers are chiefly responsible for making these milestones possible. The University of Minnesota was responsible for launching the "Medical Alley" which refers to both the trade association, and the rich corridor of health care organizations that extends from Rochester through the Twin Cities to northern Minnesota, which is expanding into Canada, Wisconsin, Iowa, Illinois and the Dakotas.

    Medical Alley is home to over 800 medical device manufacturers and thousands of allied health care-related or-ganizations, employing approximately 250,000 people in Minnesota alone. Medical device companies in the Twin Cities area range from small start-ups to large multi-billion companies such as Medtronic, Guidant (soon to be part of J & J), Boston Scientific, 3M. Research at the UMN has spawned many of these companies.

    The future of minimally invasive procedures is dependent on innovations in device designs that merge technology with unmet clinical needs. Specifically, innovation in minimally invasive devices is largely a function of "transitional" research. In contrast to basic research in medicine and bioengineering, which are traditionally conducted at universities, transitional research is specifically focused on evolving basic science into commercially and clinically realizable technologies.

    Unfortunately, most of the transitional research effort today in the US is done within individual companies specific to the product family of interest, primarily due to the near term need to commercialize the technology. This represents a significant gap between industry and academic research in that there is a technological as well as temporal lag in innovation relative to the advances in basic science. As a result, innovations often do not address the opportunities to advance overall, the practice of minimally invasive procedures. This talk will review some of the past relationships and look at the challenges for future success.

    Speaker Biography
    Dr. Erdman currently has a number of ongoing projects of which many are related to medical device design. His current interests include product development related to medical devices and instrumentation, prototyping, kinematics and dynamics. Arthur G. Erdman, P.E., is the Richard C. Jordan Professor and a Morse Alumni Distinguished Teaching Professor of Mechanical Engineering at the University of Minnesota, specializing in mechanical design, bioengineering and product design.

    Dr. Erdman has had research collaborations with faculty in Ophthalmology, Neuroscience, Urology, Epidemiology, Orthopedics, Surgery, Dentistry and Sport Biomechanics. Dr. Erdman has published over 275 technical papers, 3 books, holds over 30 patents, and shares with his former students 9 Best Paper Awards at international conferences. He has received a number of awards including ASME Machine Design Award and the ASME Outstanding Design Educator Award.

    Medical electronics 1:00PM - 2:30PM
    Session 2: Medical Business Challenges

  • Beyond ISO 14971 to Business Risk Management
    Edwin Smith, Hart InterCivic
  • Driving Continuous Improvements Together
    Travis Cline, Respironics, Inc.
  • Trends in Microelectronic Assembly for Implantable Medical Devices
    Robert Erich, Medtronic Microelectronics Center


  • 3:15PM - 4:45PM
    Session 3: Enabling Technologies for Medical Products

  • Fabrication and Assembly of Fluidic Microprocessors
    Dr. Daniel Baldwin, Engent, Inc.
  • Heart Sound Measurement and Analysis in Cardiovascular Disease Assessment
    Valerie Eveloy, CALCE Electronic Products and Systems Center
  • Regulatory Expectations for Process Validation
    Jim Shultz, Benchmark Electronics


  • Medical electronics 5:00PM - 6:00PM
    Reception with Exhibitors



    WEDNESDAY, APRIL 27

    8:00AM - 8:45AM
    Plenary Session: Medical Business Challenges

    Raman Monga, Frost & Sullivan
    Please check back for presentation description.

    8:45AM - 10:15AM
    Session 4: Designing for Excellence

  • Implementing an ISO- Compliant FMEA Program
    Doug Older, Techlogic, Inc.
  • Assembling Medical Electronics- Risks, Rewards and Readiness
    Tom Borkes
  • Optimizing DFX Input the Product Development Process Through Medical Device OEM and EMS Supplier Partnering
    Dale Lee, Plexus Corporation


  • Medical electronics 10:30AM - 12:00PM
    Session 5: Medical Product Reliability

  • Reliability Considerations for Implanted Medical Electronics
    Anthony Primavera, Guidant Corporation
  • Processing and Reliability of High Performance Flip Chip on Flex Modules for Medical Applications
    Dr. Daniel Baldwin, Engent, Inc.


  • 1:00PM - 2:30PM
    Session 6: Advanced Packaging for Medical Applications

  • Miniature IC Package Innovations for Advanced Medical Electronic Applications
    Vern Solberg, Tessera
  • Optical Fiber Packaging for Medical Applications: Processing vs. Reliability
    Peter Borgesen, Universal Instruments Corp.
  • Laser Ribbon Bonding: A Novel Interconnect Method
    David Ruben, Medtronic Microelectronics Center


  • Medical electronics 2:45AM - 4:15PM
    Session 7: Assembly techniques - Ensuring Manufacturing Performance

  • Plasma Processing for Optimal Medical Device Manufacturing
    Les Wood, March Plasma Systems
  • Reflow Profile qualification, thermal process traceability and control
    Mark Pulis, KIC
  • Automation of Medical Device Manufacturing- Perspectives from both the Equipment Supplier and Manufacturers
    Ken Stanton, Universal Instruments Corp.


  • Technical Committee
    Jeff Kennedy, Celestica, Conference Chairman
    Gerry Adams, Dade Behring
    Bill Barthel, Plexus Corp.
    Robert Erich, Medtronic Microelectronics
    Casey Nolden, 3M Company
    Anthony Primavera, Guidant Corporation


    March 18

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    Location: Sam Houston Race Park
    7575 N. Sam Houston Parkway West
    Houston, TX 77064
    Show Hours: 12PM - 5PM



    March 18

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    Location
    Sam Houston Race Park
    Houston , TX




    March 29

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    Featuring suppliers of semiconductor packaging and testing



    Exhibitors

    Go to the International Wafer-Level Packaging Congress event Web site Sponsored jointly by the SMTA and Chip Scale Review magazine, the second annual IWLPC will explore cutting edge semiconductor packaging with presentations on topics that include chip scale packaging, 3D packaging, system-in-package, system-on-chip, system-on-package, and wafer-level packaging. In addition to a two-day technical program, two days of exhibits will feature the leading suppliers to the semiconductor packaging and testing industry.

    EXHIBIT SPACE IS SOLD OUT

    Set Up and Dismantle Times
    Thursday, November 3: 8:00AM - 10:00AM
    Friday, November 4: 1:00PM - 5:00PM

    Exhibit Hours
    Thursday, November 3: 10:00AM - 6:00PM
    Friday, November 4: 10:00AM - 1:00PM
    Cancellations from Exhibitors: A letter of cancellation must be sent to the address shown on the page footer below. No refunds after August 31.

    An exhibitor list is available below, and more information on the technical program can be found by visiting the "Browse" sections of the event Web site.


    Graciously Sponsored By:
    Go to Amkor on-line Go to Semitool on-line Go to Technic on-line






    Go to LINTEC on-line Go to Tessera on-line







    Exhibitor Listing
    Updated October 4, 2005
    Ablestik Laboratories
    Alcatel Micro Machining Systems
    ALLVIA, Inc.
    Amkor Technology
    Asahi Glass Company
    ASI
    Asymtek
    Chip Scale Review
    DEK USA
    E-tec Interconnect
    ECI Technology
    Electronic Trend Publications
    ELES Semiconductor Equipment S.p.A.
    EV Group
    Frontier Semiconductor
    GPD Global
    Heraeus, Inc.
    Hesse & Knipps, Inc.
    IC Interconnect
    Indium Corporation of America
    Lintec Advanced Technologies USA
    March Plasma Systems
    Matrix Metrologies
    MCSP
    Meco Equipment Engineers B.V.
    MEPTEC
    Mühlbauer, Inc.
    Nikon Instruments
    Pac-Tech USA Packaging Technologies
    Phoseon Technology
    Precision Process Equipment & UIC
    Pure Technologies
    RD Chemical Company
    Sandvik Osprey
    SemiGrind Corporation
    Shinko Electric America
    Spectra-Mat, Inc.
    Stentech
    Technic
    TechSearch International
    Tessera
    Thermalworks
    XIA, LLC
    Zymet, Inc.


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