Calendar of Events
The LA/Orange County chapter of the SMTA would like to invite you to this exciting educational event.
WHEN: Thursday, October 21, 2004
WHERE: Skyworks Solutions, Inc., Irvine, CA
TIME: 9:00AM - 4:30PM
TOPIC: "An Introduction into the Materials Engineering Aspects of Pb-Free Solder Electronic Interconnections"
INSTRUCTOR: Dr. Paul T. Vianco, Sandia National Laboratories
COST: $140 SMTA Members/$200 non-members
It is crucial that design and process engineers as well as operators fully appreciate the potential impact had by the change to Pb-free interconnection materials on the manufacturability and service reliability of electronics assemblies. This course examines the materials engineering issues that underlie the use of Pb-free solders for electronic interconnections. Materials interactions are the basis of the wetting and spreading activity that is required to form the Pb-free interconnection at the time of assembly manufacture. The discussion addresses the role of solder, flux, substrate material/surface finish, and process profile on solderability and potential defects. Similarly, materials interactions determine the service reliability of the Pb-free solder joint. An overview describes the effects of intermetallic compound (IMC) layer growth and thermal mechanical fatigue (TMF) on the long-term performance of Pb-free interconnections. Although the course will concentrate on organic laminate technology, the discussion will also touch upon the use of Pb-free solders on ceramic substrate used in hybrid microcircuit (HMC) assemblies.
This course has been developed so that the technical material is of immediate value to operators, design and process engineers as well as engineering managers. Course material addresses both consumer and high-reliability (military and space) electronics applications. The presentation material will be provided in a text to the students.
The Toronto chapter of the SMTA would like to invite you to this exciting educational event.
The Toronto CTP is currently SOLD OUT. If you should have any further questions please contact Espi MacMillan at 952-920-7682. Thank you.
WHEN: Friday, November 5, 2004
WHERE: Wyndham Bristol Place Hotel, Toronto, Ontario
TIME: 8:30AM - 4:00PM
TOPIC: "The Use of Six Sigma To Design, Manage, Test and Quality Control the Surface Mount Manufacturing Line"
INSTRUCTOR: Dr. Sammy G. Shina, University of Massachusetts Lowell
COST: $160 U.S. for SMTA members, $220 U.S. for non-members
This course is designed to provide attendees with the methodologies and techniques in successfully using and applying Six Sigma principles to the Surface Mount Technology Line. Case studies will be provided in the data analysis, statistical quality control and troubleshooting of the SMT Line processes, materials, equipment and suppliers. In addition, the use of Six Sigma in the SMT line DPMO calculations, predicting defect rates and setting SMT line test strategy will also be presented.
Each participant will receive a copy of course notes and a set of detailed step by step instructions to plan, design, analyze and interpret the results of quality data analysis. In addition, a diskette containing an integrated spreadsheet based cost and quality tool set including: Six Sigma, Cpk analysis, and DoE experiments, including graphical and statistical analysis, and prediction and plotting tools for average and variability analysis. Other tools include Variable Control Charts (linked to Six Sigma studies), QFD, Cpk, Yield, ROI, Supplier Selection Matrix, GRR, and PWB manufacturing Cost estimation models.
ï‚· How to perform process capability studies and use Six Sigma, PPM, Cp and Cpk to set quality levels
ï‚· How to handle failure data, and present them in Shewhart, DPMO and MR charts
ï‚· What are the techniques for handling low volume and low defect rates PCBs
ï‚· How to complete a defect analysis for new PCBâ€™s, and predict their yield in the design stage
ï‚· How to develop a test strategy map for new electronics products and PCBâ€™s based on Cpk analysis
ï‚· How to Compare different suppliers, materials and SMT line processing techniques
ï‚· How to Conduct Machine Characterization and Machine Optimization projects
1. SIX SIGMA AND PROCESS CAPABILITY
A Understanding the Goals of Six Sigma
B Calculations for Cp, Cpk, and their limits
C How to make sure data is normal, and what to do if they are not
D How to make composite Six Sigma Calculations for PCBs
E The relationship between First time yield, dpu, ppm, and DPMO
2. PROCESS OPTIMIZATION TECHNIQUES
A Designing and Analyzing Experiments
B Factor and Level selection
C Graphical Analysis
D Statistical Analysis using ANOVA techniques
E Variability Analysis using S/N and Log variance Techniques
3. SMT LINE QUALITY ASSESSMENT
A Defect collection and tabulation for each operation
B Cpk for individual Operations
C Composite Cpk for total line
D Understanding the use of DPMO in Quality Control
4. SOLDER SUPPLIER SELECTION
A Quality Measures for Soldering
B Lead free Solder Supplier Selection
C Component Finish Selection and inter-changeability of leaded and lead free solders and components
D Comparing sets of process conditions for Solder Suppliers
E Homogenous Groups and Multiple Range tests for Solder Suppliers
5. SIX SIGMA SCREEN PRINT CASE STUDIES
A Stencil Selection based on Quality and Cost
B Process Optimization for Screen Print
C Reducing Variability of Solder deposition
6. SIX SIGMA FOR COMPONENT PLACEMENT
A Failure data for Components and Leads
B SPC and DPMO for Component Place
C GRR for placement accuracy
7. MIXED TECHNOLOGY SOLDERING AND SOLDER ENVIRONMENT
A Use of SPC/Six Sigma for Solder Wave Monitoring using Cleanliness Levels
B Solder Wave Optimization for through hole and Mixed Technology
C Use of Nitrogen for reducing defects in Reflow
8. SIX SIGMA FOR ELECTRICAL TEST
A Determining level of testing desired at different stages (visual, in-circuit and final test)
B Determining Comparative costs of quality and Final tests
C Developing a test map for New Products
ABOUT THE INSTRUCTOR
Dr. Sammy G. Shina, P.E. is the professor of Mechanical Engineering at the University of Massachusetts Lowell. He spent 25 years in high technology companies developing new products and state of the art manufacturing technologies and consulted to numerous others. He is the author of three books on concurrent engineering and Six Sigma. He has written over 80 technical papers in his fields of research. He is an international consultant on quality, product development, technology supply chains, and electronics manufacturing and quality. He is he founder of the Massachusetts Lead Free Consortium comprising. He was the speaker for the HP Executive Seminars on Concurrent Product/Process design, mechanical CAD design and test and the Motorola Six Sigma Institute. He is a graduate of MIT, Tufts and WPI.