Calendar of Events



                  July                 

July 2004

July 12

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February 10-12, Turtle Bay Resort, Kahuku, Oahu, HI




Exhibitors


July 13

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In conjunction with a Vendor Show



The Ohio Valley chapter of the SMTA would like to invite you to this exciting educational event.

WHEN: Tuesday, October 26, 2004
WHERE: Radisson Hotel Columbus - Worthington, Worthington, OH
TIME: 9:00AM - 2:30PM
TOPIC: "Materials, Processing, and Reliability of Lead Free Solder Solutions"
INSTRUCTOR: Daniel Baldwin, Engent, Inc./Georgia Institute of Technology
COST: $100 SMTA Members/$160 non-members

Course Description
This course will present a review of the materials, processes and reliability of lead free solder solutions. The course will focus on materials selection based on environmental impact, legislation, and market trends. It will also highlight lead free solutions for component lead terminations, connectors, and PCB surface finishes. Process implementation strategies and issues from printing wave soldering and rework will be presented. A discussion on backwards compatibility of lead free solder will also be included. Reliability and qualification of lead free solder solutions across multiple industrial efforts will also be reviewed.

Background
Although no country has banned lead solder completely, the European Union is calling for a phase-out in the use of the toxic substance in the design of new products. Large OEMs have lead on their ‘restricted list’ and are currently seeking alternative solutions. Waste from electrical and electronic equipment (WEEE) contains many substances that may pose a threat to human beings and the environment, making it urgent to involve the producers and to change the waste management systems. The European Commission has adopted a proposal for a European Directive on WEEE. Producers of electrical equipment will be responsible for take-back, reuse, and disposal of the product. When customers buy a new product, they can return an old product of the same type, free of charge. Producers are also obligated to provide information on the material content of the product when requested by pre-treatment operators.

Lead-tin solder is inexpensive and readily available. It has a low melting point and excellent thermal fatigue resistance in addition to good electrical and thermal conductivity. Lead-tin solder has rapid and complete wetting, is easily repaired, resists corrosion, and gives fast self-alignment during reflow. A simple drop-in replacement alloy with a melting point that is relatively close to that of Pb-Sn solder is in great demand. The lead-free solder must perform comparably for manufacturers to readily replace the standard soldering methods used in electronics assembly.

Who Should Attend
Individuals associated with low cost surface mount assembly and low cost electronics packaging are encouraged to attend, specifically, the following:  Managers. Knowledge gained through this course will allow managers to make informed decisions about the technical feasibility, implementation factors, performance benefits, reliability, and costs of implementing lead free solder processing technology.  Engineers. Manufacturing, quality, design, and packaging engineers in integrated circuit, equipment, materials, and system design who are challenged to solve tomorrow’s process solutions and next generation packaging problems.  Procurement. Course materials we introduce purchasing and supply chain management personnel to the key issues and sourcing concerns that should be addressed in the early phases of lead free solder assembly production.

About the Instructor
Dr. Daniel F. Baldwin is a founder of Engent, Inc. providing enabling process technologies and manufacturing services in the areas of electronics, optoelectronics, and MEMS. He was formerly the Vice President of the Advanced Assembly Technology Division at Siemens Dematic Electronic Assembly Systems. He also holds an Associate Professor of Mechanical Engineering position at the Georgia Institute of Technology heading the Low Cost Flip Chip Processing program for the Packaging Research Center, the Advanced Interconnect Technologies research program for the Manufacturing Research Center, and the Low Cost Assembly Processing Program for the CBAR. Dr. Baldwin has served as the General Chair and Program Chair of the International Advanced Technology Workshop on Flip Chip Technology for four years. He has also served as the Technical Program Chair for the 4th International Symposium On Advanced Packaging Materials: Processing, Properties and Interfaces. In addition, he was the recipient of the 1998 Outstanding Research Faculty of the Year Award and 1995-1996 Outstanding Faculty of the Year Award from the NSF - Packaging Research Center for his exemplary contributions in research, education, technology transfer, and infrastructure development. Prior to joining the faculty, he was a Member of the Technical Staff at Bell Laboratories, Princeton NJ working on electronic product miniaturization. Dr. Baldwin received his S.M. and Ph.D. degrees in Mechanical Engineering from MIT in 1990 and 1994, respectively. He has eleven years of experience in the electronics manufacturing and polymer processing industries, four U.S. Patents, over 100 scholarly publications, and expertise in electronics packaging, MEMS packaging, advanced materials processing and manufacturing systems design. Dr. Baldwin is on the Board of Advisors for the Society of Manufacturing Engineers/Electronics Manufacturing Division (SME/EM) and on the Board of Directors for the Surface Mount Technology Association (SMTA).


July 20

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Location
Hyatt Regency Dearborn
Dearborn , MI



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