Calendar of Events
Reliability of Lead-free Solders in Microelectronic Assemblies
Puligandla Viswanadham, Nokia Research Center
Thursday, June 10, 8:00AM - 12:00PM
Addison/Quorum Courtyard Marriott, Addison, Texas
$100/$160 SMTA member/non-member
The non-member price includes a one-year individual SMTA membership.
| Course Description |
Lead-free solders as interconnection materials of choice in microelectronics are finally becoming a reality, with an ever increasing number of studies shedding light on their properties. While the industry has been able to address several critical issues associated with the assembly process, the understanding of the lead-free solder interconnection reliability under a variety of thermal and mechanical loads, and the metallurgical aspects, is still far from complete.
Owing to the proliferation of portable consumer electronic hardware with higher levels of package integration and miniaturization, traditional views of reliability are gaining a new perspective in light of increased emphasis on mechanical loading the product experiences.
In this short course, several reliability issues related to the lead-free package-to-board interconnection will be addressed. Lead-free interconnection reliability will be reviewed in comparison to conventional tin-lead solder joint reliability.
The topics include aspects such as interconnection reliability under different thermal and mechanical loading conditions, and interaction of the lead-free interconnection material with the component termination finishes and printed wiring board finished. Also to be discussed in this course will be several microstructural features, and the failure modes and mechanisms unique to the tin-silver-copper solder joints.
| About the Instructor |
Puligandla "Viswam" Viswanadham is a principal scientist at Nokia Research Center in Irving, Texas. He is involved in the development and deployment of emerging and maturing technologies into Nokia products. Prior to joining Nokia he worked at Raytheon Systems Company and Texas Instruments as Senior Member of the Technical Staff, and at International Business Machines Corporation as an advisory engineer.
He has authored or co-authored over 100 publications in the areas of microelectronics packaging, six book chapters, and a book entitled Failure Modes and Mechanisms in Electronic Packages published by Chapman and Hall.
He holds seven patents and 15 invention disclosures. He received the Third IBM Invention Achievement Award, an Excellence Award, and a Fourth Level Author Recognition Award. During 1974-78 he was on the faculty of Ohio Dominican College, (Columbus, Ohio) as assistant professor.
Puligandla Viswanadham has a Ph.D. in chemistry from University of Toledo and M.Sc. degree in chemistry from Saugor University, India. He is a member of IEEE, IMAPS, and Surface Mount Technology Association.
In addition to the Chapter Tutorial Program, a Vendor Day and technical paper sessions will be held in the afternoon at the Addison Convention Center.
| Tuesday, October 26 |
Radisson Hotel Columbus
Show Hours: 11:00AM - 3:00PM
|Exhibit space is nearly sold out. Please contact Kristin Nafstad for more information on exhibiting or to register. The cost to exhibit is $350, which includes an 8x10 space, one table, two chairs, company sign, listing in show directory, attendee listing and lunch.|
Attendee registration is FREE using the following form.
Co-located Chapter Tutorial Program
Topic: "Materials, Processing, and Reliability of Lead Free Solder Solutions"
Instructor: Daniel Baldwin, Engent, Inc./Georgia Institute of Technology
For more details and to register, please go to the Chapter Tutorial Page at http://www.smta.org/education/chapter_tutorials/chapter_tutorials.cfm
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