Calendar of Events
Understanding the Lead-free Impact on Printed Circuit Board Fabrication and Assembly
WHEN: January 18, 2005; 8:30AM - 4:00PM
WHERE: Lucent Technologies; Westford, MA
COST:$95 for SMTA members, $155 for non-members,$25 for SMTA student members
Please Note: This program is now full.
If you are interested in additional programming on Lead Free, please consider the SMTA Boston Conference which will be held May 3-5 in Boston. Details will be available on this site shortly.
8:30 - 9:00 am Registration and Check-In
9:00 - 9:15 am WEEE and RoHS Overview
Title of Presentation: "Updates and Latest Developments with the EU WEEE and RoHS Directives"
Presenter(s): Todd McFadden, Mabbett and Associates
The WEEE and RoHS Directives are in crucial stages of implementation, and the electronics industry is scrambling to get ready for the August 13, 2005 WEEE deadline, and the July 1, 2006 RoHS deadlines. This brief presentation will highlight the latest implementation developments throughout the European Union, and will describe what some leading companies have done (and are doing) to prepare.
Todd recently joined Mabbett and Assoc., where he helps the electronics industry with WEEE and RoHS implementation issues and lead-free transition programs. He comes from the Toxics Use Reduction Institute (TURI), where he coordinated the Massachusetts Lead-Free Electronics Research Consortium and worked on supply chain issues for the electronics and metal finishing industries. Previously, Todd worked for five years for the Montana Pollution Prevention Program. He is Team Leader for the National Electronics Manufacturers Initiative (NEMI) Roadmap Committee and has served on the Board of Directors for the National Pollution Prevention Roundtable. Todd has a B.A. in political science from the University of Colorado at Boulder, and a Master of Science degree in chemical engineering from the University of Massachusetts.
9:15 - 10:00 am Pb Free Overview & Process Capability
Title of Presentation: "Implementing Lead Free- The Other 90%"
Presenter(s): Phil Zarrow and Jim Hall, ITM, Inc.
If your company markets its products in the EU, then Lead-free is, most likely, fairly inevitable. More and more companies are coming out of denial and are trying to figure out how to deal with it. Of course, this supposedly ecologically "greener" material change comes with a price. Lead-free assembly has many equipment, material and process implications.
While other courses and workshops focus solely on the metallurgical aspects of lead-free alloys (and waste a lot of time doing so), this lecture examines what lead- free and the aforementioned alloys mean to the electronic assembler at the process and logistics level. This lecture is intended to give the participant an indepth understanding of SMT assembly using lead-free solder alloys. The lecture will contend with the implications of lead-free on the SMT assembly process. Interactions with substrate finishes and components will be discussed as will the far-reaching implications and process adaptations that must be made to accommodate no-lead soldering. The impact upon printing, placement, reflow and inspection will be examined as well as the adaptations that will have to be made by the purchasing, quality assurance and product development groups. The situations confronted by both OEMs and CEMs will also be examined.
Phil Zarrow has been involved with PCB assembly and fabrication for more than twenty-nie years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics, Universal Instruments Corporation, and GSS/Array Technology, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world.
W. James Hall is a consultant to the SMT Assembly Industry on the staff of ITM Corporation in Durham, NH. One of the pioneers of reflow technology, Mr. Hall has been actively involved in Electronic Assembly technology for over 22 years. Prior to joining ITM, Jim was Manager; SMT Process Technology for Vitronics-Soltec, a supplier of reflow and wave soldering systems. During his tenure at Vitronics-Soltec, he assumed responsibility for the design of improvements to the existing convection-IR reflow product line. Jim Hall's engineering expertise lies in process development and integration, fluid and thermodynamics, and computer control systems.
10:15 -11:00 am Boards / FAB / Finishes
Title of Presentation: "Overview and Selection of Final Finishes"
Presenter(s): Joe Renda, Cookson Electronics, Enthone
The presentation will review basic requirements for board finishes and show current market trends and cost comparisons. The impact of lead free on board finishes will be discussed showing industry concerns which may influence their acceptance. The presentation will look at HASL, immersion tin, ENIG, immersion silver as well as the latest in organic coatings. Conclusions will be drawn as to which finishes will most likely be the leaders in the lead free transition.
Joe has a BSEE from Northeastern University. Over twenty years experience in electronics manufacturing and business development. Worked for Motorola, Equipment Sales and Advanced Electronics. Joe has most recently been with Cookson and for ten years has traveled extensively introducing customers to Cookson products and services.
11:00 - 11:45 am Board Material
Title of Presentation: "The Impact of Pb-Free Assembly on Base Material and PCB Reliability"
Presenter(s): Ed Kelley, Cookson Electronics, Polyclad Laminates
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have been the standard in printed circuit assembly processes. Lead-free solders currently being used and developed for printed circuit assembly require higher processing temperatures that can degrade the base materials commonly used in printed circuits, resulting in decreased long-term reliability. Following a brief discussion of the regulations and lead-free materials and processes, this paper will discuss several base material properties and present test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.
The properties that will be discussed include the glass transition temperature, time to delamination performance, coefficients of thermal expansion, and decomposition temperature. A discussion on why higher values for the glass transition temperature are not always better, especially when considering Pb-free assembly, will be presented. This paper will also describe why the decomposition temperature is a critical property to understand when converting to Pb-free assembly.
Thermal analysis data on laminate materials showing how properties can change after thermal cycling will be presented, along with basic reliability tests on multilayer printed circuits manufactured with various types of laminate materials. This data will be used to compare material types and draw conclusions regarding the critical base material properties.
Please check back for speaker biography.
12:45 - 1:30 pm Solder Paste
Title of Presentation: "Implementing Pb-free in Your Factory"
Presenter(s): Timothy Jensen, Indium Corporation of America
This presentation will cover-why Sn/Ag/Cu is the alloy of choice and which Sn/Ag/Cu alloy is best, an overview on how Motorola Corporation developed and implemented a Pb-free process and have manufactured over 15 million pb-free phones to date, common Pb-free manufacturing issues and solutions as well as specific Challenges in Pb-Free wave soldering.
Timothy Jensen is a Senior Technical Support Engineer with the Indium Corporation of America. He has a Bachelors degree in Chemical Engineering from Clarkson University. Tim has spent over seven years troubleshooting and optimizing SMT process lines. In addition, he acts as a liaison between the customer and Indium Corporation's Research & Development team to ensure that the customer's current and future product requirements are met. Having worked directly on hundreds of surface mount lines, building thousands of different products, he understands each customer's unique needs and tailors Indium's products and services to meet them. Tim has authored technical publications and numerous process and technical guidelines. He is a member of professional societies such as the SMTA and participates actively in several IPC standards development committees.
1:30 - 2:15 pm Components
Title of Presentation: "Lead Free Implementation Experiences at Skyworks"
Presenter(s): Roger Benson, Skyworks Solutions
Skyworks Solutions (Formally a part of Conexant Systems) has been utilizing no-lead solder in their hybrid MCM-L Power Amplifier products since 1998. The solder is applied for the attachment of surface mount (SM) components, such as 0201 or larger form factors of resistors, capacitors and inductors. Subsequent to the SM attach process, die attach, wire bond, encapsulation with molding compound and singulation is conducted. In an epoxy encapsulated (over molded) package, the thermal expansion mismatch between the solder joint and the surrounding epoxy creates a high stress condition onto the melted solder and forces it to flow. The flowing and wicking of solder may short the different terminations leading to functional failure. To solve this problem, a lead (Pb) -free soldering system has been developed for the over molded hybrid MCM-L packages. In addition, the removal of lead from our modules addresses the requirement of the RoHS initiative. In this presentation, the effectiveness of this lead-free soldering system for the over molded hybrid MCM-L packages will be discussed. Factors such as lead contamination, moisture levels and processing temperatures that may influence the solder joint stress condition and solder melting temperature will also be discussed. More recent improvements in the process and materials will be touched upon as well.
Roger has completed twenty-one exciting years in the semiconductor packaging business, in a variety of capacities. Currently he is designing and developing MCM-L packages for RF wireless applications at Skyworks Solutions. His previous experiences include: (1) flipchip design, development, and application support at Flipchip Technologies, (2) Material development and testing of underfills, conductive and non-conductive adhesives at Emerson & Cumming, (3) Ceramic package design and evaluation at Digital Equipment Corporation and (4) Military packaging development at Raytheon Company. Roger's knowledge and experiences have been communicated in numerous published articles. He has also shared his experiences with the industry at various committees, conferences and workshops. Roger holds a B.S.degree from Northeastern University, as well as a F.A.A. Powerplant and Airframe license.
2:30 - 3:15 pm Inspection and Rework
Title of Presentation: "Lead-Free Hand Soldering and Rework"
Presenter(s): Charley Dennehy, Circuit Technology Center
The speaker will connect the larger lead-free themes with component rework. The broader topics of metallurgy, flux and the overall manufacturing processes are receiving well-deserved attention, however the impact lead-free solders will have on hand soldering and rework is still to be fully appreciated. This segment will focus on practical applications of component soldering, board rework and repair.
Charley has been involved with electronics rework and repair for over 20 years first as an officer in the U.S.Navy and then as General Manager and President of Circuit Technology Center. He has written many articles and has developed and instructed courses in through-hole, SMT and BGA rework and repair.
3:15 - 4:00 pm Open Panel Discussion