Calendar of Events


June 2003

June 4


Location: 3M Company
3M Center
St. Paul, MN
Show Hours: 8:30AM - 3:00PM

June 9


SMTA Boston
Boston , MA 02125

June 9


Bayside Convention Center
Boston , MA

June 10


Bayside Convention Center
Boston , MA

ET is Finally Pulling Us Upward

Dr. Ken Gilleo, Cookson Performance Solutions
Wednesday, June 11: 12:00PM - 1:30PM

The doldrums seem to linger on endlessly. Yes, there are bright spots to be sure. But there are also black holes that siphon off energy and extinguish the embers. Can emerging technologies (ET) help pull us out of the hole and launch us back to more a stellar orbit?

Perhaps! This presentation will shine light on ET and help demystify some of the elements. Ken will take a broad-brush sweep to visualize emerging areas of new materials, devices and systems. He’ll delve into issues and analyze some of the potentially important areas that can catalyze truly new businesses.

We seek answers. Is nanotechnology really new, just or a hyped-up version of chemistry 101? What about MEMS? Has a single company really sold 100 million MEMS chips? And if this is true, is MEMS the next big thing in the world of tiny technology?
Is the cinema going entirely "filmless", as digital technology sweeps over the movie business? Today, you can see a digital movie in any one of dozens of theaters, but how does it work and what does it foretell about future home entertainment?

Will Blockbuster rent videos through the Internet to play in your MOEMS home theater or on your PDA? Did you download your favorite author’s e-book for the trip? You can do it today.

We will survey the most unusual, fascinating and far-reaching members of the ET family and then predict the future. So come join us to find out why the best is yet to come and the limit is your imagination.

FREE OFFERING AOI Panel Discussion
Panel Moderator: Phil Zarrow, ITM, Inc.
Wednesday, June 11: 1:30PM - 2:30PM

This panel discussion will permit participants to interact in real-time with industry leaders on what is currently one of the hottest discussion topics in our industry.

Learn about the four hardware/software strategies AOI suppliers use to detect defects and the advantages and disadvantages of each. Please bring your AOI questions and join us for what promises to be a dynamic, information-filled session.
Automated Optical Recognition
  • Is this tool right for you?
  • Will it add value to your operation?
  • How is it used most effectively?
  • What can it do for you?
  • What can’t it do for you?
  • Can it replace ICT?

  • Co-located ESD Workshop
    Dispelling Common ESD Myths

    Moderator: Ernest Tousigant, ESD Association
    Wednesday, June 11: 8:00AM - 12:00PM

    In this highly interactive workshop you will learn about misunderstandings about ESD. They often result in unnecessary expenditures, device failures, higher operating cost or dissatisfied customers.

    Get the correct answers to all of your questions such as:
  • Do I need to comply with ANSI/ESDA S20.20?
  • If so, what do I need to do?
  • Does air flow cause charging?
  • Is shielding essential?
  • Do I need smocks?
  • Is possible to damage a sensitive device while wearing a wrist strap?
  • What is the Charged Device Model?
  • Registration for all of these events can be done on-line from the Academy Page.

    SMTA Boston 2003 Under the direction of conference chairman Dr. Paul T. Vianco, Sandia National Labs, the SMTA is organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 10-11 at the Bayside Convention Center in Boston, MA)

    The focus of the SMTA Flip Chip and BGA Technologies Workshop is to provide a forum for attendees to understand the fundamental aspects, current practices, and future trends in the rapidly advancing area of flip chip and BGA technologies.

    Interconnect design, solder pastes, printing, underfill materials and practices, as well as reflow profiles are critical to the successful manufacture of flip chip and BGA assemblies.

    Area array interconnects also present a number of unique challenges towards achieving adequate solder joint reliability for products that are being placed in a growing variety of service environments.
  • This event is being held in conjunction with SMTA Academy courses.
  • Read about other special events below, including the SMTA General Meeting, AOI Panel, and co-located ESD Workshop.
  • Registration for these events is being taken through the Academy page.

  • SMTA Certification Programs for SMT Processes and SMT Systems are also being held in Boston (June 9-11).

    Go to detail on-line regarding NEPCON East These SMTA events will be held in conjunction with NEPCON East/Electro and Assembly East.

    Technical Conference Chair
    Dr. Paul Vianco, Sandia National Labs

    SMTA VP of Technical Programs
    Dr. Ken Gilleo, Cookson Electronics

    Technical Committee Members
    Dr. Jean-Paul Clech, EPSI, Inc.
    Dr. Daniel Baldwin, Engent, Inc.

    Registration Fee for the Flip Chip & BGA Packaging Technologies Workshop:
    $400 for SMTA Members and $500 for Non-Members
    Register before May 13th and save 10%

    Session 1: Technology Overview
  • Lead-Free Flip Chip Process Technology and Reliability Qualification, Dr. Daniel Baldwin, Engent
  • Stretching the Stud Bump: Microposts for Flip Chip Arrays, Dr. George Riley, FlipChips Dot Com
  • 3-D IC Package Solutions for High Performance Memory, Vern Solberg, Tessera Technologies

  • Session 2: Advanced Designs for Area Array Packaging
  • Underfill Adhesive Films for Flip Chip and CSP Packages, David Gagnon, 3M Company
  • Design Principles for Chip Scale BGA Package Technology, Vern Solberg, Tessera Technologies
  • Improving the Acceptance of Flip Chip, John Davis, Solectron

    What Is or Is Not Driving Flip Chip and Wafer Level Package Adoption
    Peter Elenius, E&G Technology Partners
    Understanding what is driving the adoption of flip chip (FC) and wafer level package (WLP) technology is critical to planning for your future. The conversion to a new technology will always be delayed by advances in the incumbent technology. However as with the automobile versus the cart and buggy the automobile won the race due to better meeting the market demands.

    The market needs for FC and WLP will be presented and highlighted versus the technology conversion responses of wire bonding technology and standard IC packaging technology. These conversion responses may slow the adoption of FC and WLP for some applications in the short term but will have minimal effect in the long term.
    Peter Elenius is a managing partner with E&G Technology Partners (E&G). E&G provides technology, market and business development services to companies in the semiconductor packaging industry.

    Peter was formerly the VP of technology and CTO for Flip Chip Technologies (FCT). At FCT, Peter was instrumental in the development and commercialization of both flip chip bumping and WLP (wafer level package) technology.

    Session 3: Assembly of Area Array Packages I
  • Soldering for Flip Chip and BGA Packaging Technologies, Dr. Ning-Cheng Lee, Indium Corporation of America
  • Solder Application for Flip Chip and CSP, Thorsten Teutsch, Pac Tech USA
  • Tolerable Limit of Substrate Warpage for Assembly of Area Array Solder Bumped Packages, Chunho Kim, Georgia Institute of Technology

  • Session 4: Assembly fo Area Array Packages II
  • Technology Roadmap for the High Density Interconnects with Flexible Substrates, Dominique Numakura, DKN Research
  • Consequences of IC Radiation Exposure Due to X-Ray Inspection of BGA Solder Joints, J. Scott Nelson, Harris Corporation
  • A Comparison of Cleaning Formulations for Flip Chip Die Attach Defluxing, John Sanders, Petroferm

    Session 5: Reliability Issues in Area Array Packaging I
  • Solder Joint Failure Modes in BGA and Flip Chip Packages, Robert Darveaux, Amkor Technology
  • Qualifying Area Array Packaging for Military Air- and Space-Bone Applications, Thomas Buschor, Harris Corporation
  • Title TBA, Gerry Minogue, Cookson

  • Session 6: Reliability Issues in Area Array Packaging II
  • Effect of Package and Board Pad Size on Optimum Flip Chip Ball Grid Array (FCBGA) Package Thermal Mechanical Performance, Shaw Fong Wong, Intel Technology
  • Solder Joint Deformation as a Function of Time: Reliability of Flip Chip Joints in a Stressful World, Frank Stepniak, Delphi Delco Electronics
  • Mechanical testing of BGA assemblies and Empirical Life Predictions under Vibration Loads, Dr. Jean-Paul Clech, EPSI

  • June 16


    In conjunction with technical sessions


    Friday, March 5, 2004
    Sam Houston Race Park
    7575 North Sam Houston Parkway West
    Houston, TX 77064
    12:00PM - 5:00PM

    Exhibitor Information

    Exhibit Space is limited and may sell out so register early.

    Booth Cost: $325 if you register by January 31, 2004 and $400 if you register after January 31.

    Booth cost includes 10x10 pipe and drape space, draped table, company sign, listing in the show directory and attendee list.

    Exhibitors can register by line by clicking on the "register now" box above. Exhibitors can also request a paper registration form by contacting SMTA director of education Kristin Stromberg.
    Attendees are admitted FREE using the form available at the top of this page- click on "Exhibit Attendees for Any Current Show Register Here- Free".

    Plan to attend now and visit with representatives from the major suppliers to the industry, have a chance to win great door prizes and enjoy the reception and races following the show!

    Technical Program

    1:00pm: Comparing Digital and Analogue X-Ray Inspection for BGA, Flip Chip and CSP Analysis, Hal Hendrickson, Dage Precision Industries

    2:00pm: SIPAD ssd, From Lead Free to VIP (via in pad), Matt Kehoe, SIPAD Systems, Inc.

    3:00pm: Peggy Sue Skipper, Hand Analyst, Life Coach and Author will be speaking on the topic of her new book: The Art of Conscious Evolution. Find out how to determine if you are on track with what you are supposed to be doing with your life. If you have ever asked yourself the question, "Is that all there is?" this presentation is for you!

    Technical sessions are FREE to all attendees.


  • 3M Company
  • 3M Engineered Adhesives Division
  • ABC Assembly
  • AIM, Inc.
  • All-Tech Associates
  • APE Corporation
  • Assembleon America Inc.
  • ASYS Automation LLC
  • Atlan Dyess Inc.
  • Austin American Technology
  • BEST Inc.
  • Chip Supply, Inc.
  • Circuit Connect
  • Contek Sales & Marketing Inc.
  • Coretec, Inc.
  • Dage Precision Industries
  • DeForest Sales Company
  • DG Marketing
  • DiagnoSYS Systems, Inc.
  • Die-Tech, Inc.
  • Dow Corning Corporation
  • Dymax
  • Eagle Contract Services
  • Efore
  • Electrotek Corporation
  • Florida Cirtech, Inc.
  • GE Silicones
  • Global Stencil
  • Henkel Loctite Corporation
  • Hisco Inc.
  • Hisco Precision Converting SW
  • Indium Corporation of America
  • InterMetro Industries
  • IPS Group
  • JMW Enterprises, Inc.
  • Krayden, Inc.
  • KSE-Texas, Inc.
  • Kyzen Corporation
  • Niltronix, Inc.
  • Orbotech, Inc.
  • PAC, Inc.
  • Palomar Technologies
  • Photo Etch Technology
  • PlainsCapital Leasing
  • Precision Converting- A Hisco Company
  • Prime Distributing Company
  • Rich Sales
  • Scanlon, Hughes and Associates
  • Sealed Air
  • SIPAD Systems
  • SMC Inc.
  • Southwest Systems Technology Inc.
  • Sovereign Circuits
  • Spectra Sales Corporation
  • Technical Systems Integrators (TSI)
  • Tecnomatix Unicam, Inc.
  • TEXSource Sales
  • Torenko and Associates
  • Uniform Technology
  • Universal Instruments
  • Valor Computerized Systems
  • Vision Engineering

  • June 24


    Harsh Environment Electronics Workshop
    Dearborn , MI 48126

    June 27


    Implementation experience - Do you have what it takes?

    Covina , CA

    June 27
    8:00am to 5:00pm
    Embassy Suites
    Covina, California

    $149 before June 13
    $199 after June 13
    Student registration just $99!
  • California State Polytechnic University School of Business - Technology & Operations Management (Pomona, CA)
  • Surface Mount Technology Association
  • American Society for Quality

  • Contact SMTA director of education Kristin Stromberg or education & chapter coordinator Espi MacMillan with any questions.

    Workshop Registration Fee includes full day workshop, handout material, lunch and coffee breaks. Fee does not include SMTA membership. When completing on-line registration please complete membership information but please note that this is not included in registration fee.

    ISO 9000 is due for a major makeover. Revision 2000 takes a process view of the ISO standard. Two new elements have been included in this revision: Measuring and Improving Customer Satisfaction and Implementing Continuous Improvement. Both these business strategies have now been formally endorsed by the ISO standard.

    Companies that have already been certified ISO 9000 under the 1994 revision standards have to make the transition to the 2000 revision by December 14th 2003. Lead auditors and RAB organizations have started auditing companies to this standard, and it is estimated that less than 20% of the companies registered under the old standards have what it takes for the new standard.
    The proverbial rush to meet the December deadline will happen, which makes it imperative to understand the new requirements from those that have implemented the standard and more importantly from the lead auditors and RAB personnel who will most certainly have interesting experiences to relate on this subject.

    Rounding off the paper sessions will be an interactive roundtable, specifically intended to address issues that participants bring up for discussion. A panel has been organized, consisting of experts who have made the transition to the 2000 revision. Attendees can send SMTA these questions prior to the conference to be addressed during the roundtable Q&A session.

    Conference Chairman
    N.T. "Bala" Balakrishnan, CFPIM, CQE
    California State Polytechnic University

    N.T. Bala Balakrishnan N.T. "Bala" Balakrishnan is quality control manager at Standard Abrasives and is a member of the adjunct faculty at Cal Poly Pomona. He is an ASQ certified quality engineer and certified at Fellow level in Production and Inventory Management by APICS.

    He has over 25 years experience in manufacturing and quality management in the electronics industry and has authored 30 papers in manufacturing and quality disciplines. He has a BSME and MSIE from the Indian Institute of Technology and an MBA from UCLA.
    Arrangement Chair
    Patty Worsham
    Riverside Community College, Norco

    Patty Worsham Ms. Worsham is tenure track instructor of Business Administration at the Norco Campus of Riverside Community College.

    She has also worked as adjunct faculty for the Management of Human Resources Department at Cal Poly Pomona.

    She has 10 years of experience in finance in high tech industry. She has BA from UCSB and MBA from Cal Poly Pomona.

    Registration and Continental Breakfast
    7:30am - 8:00am
    Welcome and Introductions
    8:00am - 8:10am

    Keynote Address
    8:10am - 8:40am
    Developing a Winning Business Strategy - Focus on the Customer
    Dr. Howard Fuller, Corporate Vice President of Quality for Solectron Corporation

    During this presentation, an integrated approach to managing multiple customer certifications across multiple locations is presented. Emphasis is given to leveraging existing quality management systems to facilitate ease of implementation. Use of a single registrar to ensure consistency, manage information, and drive strategic programs is also discussed.

    Speaker Biography
    Dr. Howard T. Fuller is the corporate vice president of quality for Solectron Corporation. Previously, he was the corporate director of Design for Six Sigma (DFSS), Six Sigma Master Black Belt and principal quality/reliability engineer at Seagate Technology. He was also the manager of the QA/Statistical Support Group at LifeScan, a Johnson & Johnson company.

    His responsibilities have primarily included the development and implementation of worldwide quality management systems, such as Six Sigma for both manufacturing and design, quality scorecards, regulatory systems, Malcolm Baldrige, 5S and quality training. Fuller has a BS in math and MS in statistics from Southern Illinois University. He also has a Ph.D. in quality engineering from the University of Wisconsin and has published over 25 papers in leading journals.

    Session 1
    8:40am - 10:50am
  • Six Sigma Quality and Productivity = Customer Satisfaction, Dr. Bill Kovacs, President of Reliability Management Associates
  • A Strategic Approach for Implementing Quality Management Systems, Dr. Phil Rosenkrantz, Chair of the IME Dept. at Cal Poly Pomona
  • How to Manage Continuous Improvement, Nick Vyas, General Manager of Sears Logistics Services
  • From Customer Satisfaction to Loyalty, N.T. "Bala" Balakrishnan, Quality Control Manager of Standard Abrasives
  • Case Study: Strategic Quality Management, Kim Victorine, Senior Consultant for CMTC

  • Session Two
    11:00am - 12:45pm
  • ISO 9000: Customer Focus Process, Hermann Ries, Lead Auditor for TUV Essen
  • Tips & Techniques for Attaining ISO 9000 Certification, Burjor Mehta, President of America 2000
  • Case Study: ISO 9000 Medical Manufacturer, Bob Guziak, Principal of Procana
  • New Training Technology Taps the Hidden Potential for Managing Continuous Quality Improvement, Teno Cipri, Senior Consultant for Effective Training Solutions

  • Lunch Break
    12:45pm - 1:30pm

    Session Three
    1:30pm - 3:15pm
  • Continuous Improvement by Aligning Performance with Strategic Plan and Vision, Dr. Rhonda Rhodes, Professor in the TOM Dept. at Cal Poly Pomona
  • Objective Customer Satisfaction, Narith Yos, Senior Consultant for Technology Forecasters
  • Case Study: Customer Satisfaction Index, Phil Laure, Quality Control Manager of Luxfer Gas Cylinders
  • Why Some Teams Succeed and Others Fail, Patty Worsham, Business Instructor at Riverside Community College - Norco

  • Coffee Break
    3:15pm - 3:30pm

    ISO 9000: Revision 2000 - Roundtable Discussion
    3:30pm - 4:30pm

    Concluding Remarks and Speaker Evaluations
    4:30pm - 4:45pm

    Special thanks to America 2000
    America 2000 is a dynamic and rapidly growing organization that focuses on providing auditing, consulting, and training services to organizations seeking to improve business processes. As a global organization, America 2000 has offices in Los Angeles, San Francisco, Boston, Denver, Hong Kong, and London.

    America 2000 Mission Statement
    To provide value-added consulting, auditing, and training resources at highly competitive rates. Read more about America 2000...

    America 2000 Contact Information
    Los Angeles Office: 310-390-7945
    San Francisco Office: 415-235-3543
    Boston Office: 978-368-9998
    Denver Office: 303-840-9006

    Workshop Registration Fee includes full day workshop, handout material, lunch and coffee breaks. Fee does not include SMTA membership. When completing on-line registration please complete membership information but please note that this is not included in registration fee.

    June 27


    ISO 9000- Embassy Suites
    Pomona , CA

    Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone +1 952.920.7682
    Fax +1 952.926.1819