Calendar of Events


October 2003

October 3


Featuring Rob Rowland of RadiSys Corporation

Low Volume Surface Mount Assembly
Rob Rowland, RadiSys Corporation
Wednesday, November 19
Tektronix, Beaverton, OR
8:30AM - 5:00PM
Registration: $160/$220/$50
SMTA members / non-nembers / student members

Lunch and course handouts are included in the price of the Chapter Training Program.

What You Will Learn
Low volume surface mount assembly processes are unique and challenging. This workshop identifies and examines the critical success factors associated with low to medium volume, high mix surface mount assembly. Participants will examine low volume assembly from multiple viewpoints including assembly processes, process control, manufacturing operations and related industry standards. When these topics converge successfully a robust low volume assembly operation has been established.

The morning session is devoted to semi-automated and automated equipment and processes related to standard, fine pitch and ball grid array components on simple and complex single or double-sided mixed technology assemblies. The following printed circuit board assembly (PCBA) processes will be covered: printing, dispensing, placement, reflow soldering, wave soldering, selective soldering and cleaning. A four step approach, which includes theory of operation, recommended operating parameters, process control and related industry standards, will be used to explain each assembly process. Subject matter related to adhesive, solder, flux, solder paste and stencil design will also be covered in detail.

The afternoon session covers printed circuit board (PCB) surface finishes and moisture sensitive components and their impact on the assembly process. The discussion continues with an overview of manufacturing operations related topics including assembly line design, continuous flow assembly, lot size considerations, inspection methods (optical and x-ray) and performance measurement.

A critical subject will be rapid setup and changeover methods, which includes a case study example. A list of assembly equipment suppliers is also included with the course material.

  • Low volume assembly processes and equipment
  • Adhesive and solder paste application
  • Component placement, including BGA
  • Reflow, wave and selective soldering
  • Adhesive, solder, flux and solder paste
  • Cleaning and no-clean applications
  • PCB surface finish and moisture sensitive devices
  • Assembly line layout and material handling
  • Visual factory management techniques
  • Optical and x-ray inspection methods
  • Process control and process quality planning
  • Rapid setup and changeover methods
  • Related industry standards (IPC, EIA, SMEMA)

  • Rob Rowland of RadiSys Corporation About The Instructor
    Rob is currently the Process and Supplier Engineering Manager at RadiSys Corporation in Hillsboro, Oregon. Rob has focused on surface mount and through-hole mount manufacturing technology for the past 20 years. He is an active member of the Surface Mount Technology Association (SMTA), where he served 2 terms as a chapter president and 4 terms as technical director of SMTA International. In 1999 he received the Founders Award from the SMTA.

    He was also an active member of the Surface Mount Council (SMC) where he served as editor of the Status of the Technology, Industry Activities and Action Plan. Rob is a frequent author and speaker at industry trade events. He also writes a monthly manufacturing column for SMT magazine in addition to serving on the editorial advisory board. Rob is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University.
    Who Should Attend
    This workshop is intended for individuals who are starting a new surface mount assembly operation or individuals who are interested in fine tuning their existing surface mount assembly operations. The information presented in this workshop will be beneficial to anyone involved with surface mount assembly including manufacturing, process and quality engineers, engineering and manufacturing managers or supervisors, and equipment operators. Some basic knowledge of surface mount technology is helpful but not essential.

    Contact SMTA education & chapter coordinator Espi MacMillan with any further questions.

    October 3


    Location: Addison Conference Center
    Addison, TX
    Show Hours: 10:00AM

    October 16


    Skyworks Solutions, Inc.
    Irvine , CA 92612

    October 17


    Location: Northeast Conference Center
    4140 Executive Parkway
    Westerville, OH 43081
    Show Hours: 11:00AM

    October 17


    Northeast Conference Center
    Westerville , OH 43081

    October 29


    Exploring devices, components, packaging, and assembly technologies

    Cosponsors Circuits Assembly and SMT magazines The SMTA is pleased to announce plans for a new Medical Electronics Symposium that will take place May 19-20 at the Marriott Minneapolis Airport Hotel in Bloomington, MN. The program is co-sponsored by Circuits Assembly and SMT magazines.

    Note: Hotel Room Block at the Marriott Minneapolis Airport Hotel expires April 27, 2004.

    Once viewed as an orphan, the resilient medical electronics field (now approaching $50 billion) is a high-tech manufacturing industry that is still based primarily in the United States. Continual progress results from the close relationship between industrial segments, universities, and state, federal and private institutions, making medical electronics a unique area. Technical sessions include:

  • Design/Reliability
  • Manufacturing - Techniques and Requirements
  • Process and Quality Control
  • Packaging
  • Sensors/MEMS
  • Business/Regulations

  • The cost to attend is $395/$495 for SMTA members/non-members. All attendees who are non-members will receive a one-year SMTA individual membership, and current individual members will receive a one-year renewal.

    Register by April 16 and save 10%!


    Jeff Kennedy of Celestica 8:30AM - 8:45AM
    Opening and Welcome Statement
    Jeff Kennedy, Conference Chairman

    8:45AM - 9:30AM
    Plenary Session: Nemi Medical Sector Roadmap
    Terry Dishongh, Intel Corporation

    9:45AM - 11:15AM
    Session 1: Design and Reliability
    Chair: Anthony Primavera, Guidant Corporation Medical electronics technology
  • Implantable Medical Electronics Assembly - Quality and Reliability Considerations
    Peter Borgesen, Universal Instruments, and Eric Cotts, Binghamton University
  • Development and Assembly of an Implantable Retina Prosthesis
    Daniel Baldwin, Keck Pathammavong, and Paul Houston, Engent, Inc.; and Doug Shire, VA Center for Innovative Visual Rehabilitation / Boston Retinal Implant Project
  • Design for High Reliability - Meeting the Goals of High Yield and Reduced Field Failures during the Medical Product Development Process
    Chris Rozewski, Plexus Technology Group

  • 11:30AM - 1:00PM
    Keynote Presentation and Lunch
    Developing New Products and Processes
    J. Doug Field, Segway

    As vice president of product development and chief engineer for Segway Company, J. Douglas Field represents the guiding principles and dedicated passion behind the creation of Segway PT, the world's first self-balancing, electric powered personal transporter. Field is responsible for management of the core Segway PT development team as well as the unified discipline driving Segway PT's performance. He developed a dynamic work culture at the company coupled with a design philosophy based on honesty, simplicity, and dedication, which brings us to today's Segway PT - safe, intuitive, durable, and beautiful in its simplicity.

    Field also worked for DEKA Research and Development for over five years, leading the prototype design and project management for the IBOT Mobility System. His lifelong obsession with wheels and adult passion for accomplishing something meaningful led him through a career of managing and developing new products and manufacturing processes for the automotive and medical industries.
    Doug Field aboard the Segway Field met Dean Kamen during his tenure as manager of process development for Johnson & Johnson Medical, Inc. While at the company, Field led the development of advanced manufacturing strategy with major university and technology partners, earning two Johnson & Johnson Champion Awards.

    Prior to that, Field led product development at Ford Motor Company, focusing on customer perceived noise, vibration, and sound quality as well as introducing computer aided engineering to improve ride and handling on the 1990-92 Taurus SHO and Lincoln Continental. Field was a fellow in the dual degree Leaders for Manufacturing Program, a partnership between the MIT School of Engineering, the MIT Sloan School of Management, and 13 major U.S. manufacturing firms, where he was awarded a masters degree in mechanical engineering and a masters degree in management.

    1:00PM - 2:30PM
    Session 2: Manufacturing - Techniques and Requirements
    Chair: Scott Theune, Plexus Electronic Assembly Medical electronics technology
  • Low Force Placement Solution for Delicate and Low IO Flip Chip Assemblies
    Jason Higgins, Universal Instruments, and Robert Hemann, Medtronic Microelectronics Center
  • Medical Device Assembly using Jet Dispensing for Underfill and Encapsulants
    Todd Woods, Plexus Corporation, and Steven Adamson, Asymtek
  • Improving Signal Quality and Test Reliability in EEG Measurements Using Integrated High-Density Surface Mount Electronics
    Benjamin Schnitz, MicroNova Technology

  • 2:45PM - 4:45PM
    Session 3: Process and Quality Control
    Chair: Julie Dobbins, Medtronic Microelectronics Center Medical electronics technology
  • Inspecting Medical Microelectronic Components and Devices using Nondestructive Acoustic Micro Imaging (AMI)
    Jack Richtsmeier and Vince Giovannetti, Sonoscan, Inc.
  • Component and Assembly Traceability in Medical Electronics Manufacturing
    Jim Schultz, Benchmark Electronics
  • Facilitating Lean with MPM (Manufacturing Process Management) in the Medical Device Industry
    Eric Vermillion, Tecnomatix Technologies
  • Enhanced Traceability Solution for Printed Circuit Board Assembly
    Raghu Nippani, Universal Instruments


    8:30AM - 9:15AM
    Plenary Session: Medical Product Outsourcing and Technology Trends
    Keith Robinson, Frost & Sullivan

    9:15AM - 10:45AM
    Session 4: Packaging
    Chair: Don Banks, 3M Company Medical electronics technology
  • Lead- Free Component Finishes- Problems and Mitigations
    Joseph Zaccari, Corfin Industries LLC
  • A Multilayer Flexible Substrate for Medical Electronics Application
    Erik Larkowski, John Geissinger, Don Banks, and Robin Gorell, 3M
  • Development of a Micro-Sized, Ceramic, Surface Mount, Multiple-Chip Load Cell for Life Science Applications
    Robert Allen, MicroNova Technology

  • 11:00AM - 12:30PM
    Session 5: Sensors/MEMS
    Chair: Dr. Ken Gilleo, ET Trends, LLC
  • SMT-MEMS Integrated Process Design for Implantable Thermal Imaging Biosensors
    Joanna Suresh and Keerthi Gunasekaran, North Dakota State University
  • Precision Assembly Utilizing Microelectromechanical Systems and Nanotechnology: The Enabling of Medical Microsystems
    Gareth Hughes, Zyvex Corporation
  • Reel to Reel Mass Production for Disposable Sensors by Laser Ablation
    Nils Heininger, LPKF Laser and Electronics

  • 1:00PM - 3:00PM
    Session 6: Business/Regulations
    Chair: Gerry Adams, Dade Behring Medical electronics technology
  • Medical Device Regulatory Compliance- Overcoming the Physical and Psychological Barriers
    David Lindley, Crystalaid Group of Companies
  • Trends in Medical Device Design and Manufacturing
    Phil Salditt, Plexus Technology Group
  • Product Stewardship - OEM Programs for the Competitive Edge
    Lauren Roman, United Recylcing Industries
  • Improving Manufacturability, Reducing Cost, and Extending Product Life - Processes and Pitfalls Unique to Medical Devices
    Chris Rozewski, Plexus Technology Group

  • 3:15PM - 4:45PM
    Roundtable Discussion
    Bringing New Products to Market within a Complex Supply Chain

    Medical products outsourcing has not followed the same growth path as other segments of the electronics market. The medical electronics and manufacturing in general, requires infrastructure and skills in the technology, as well as certification and quality management of medical devices. This panel will examine trends, and challenges associated with bringing new products to market working with multiple partners in a complex supply chain.

    The panel will expose some barriers to entry to service the medical sector and some of the unique challenges associated with supporting the medical products manufacturing process. The group will address topics of qualification, validation, managing ramp cycles, and supply chain effects.
    Managing multiple players in the supply chain is both challenging and risky. Taking the first step is often ‘a leap of faith’. Come prepared to discuss taking the first step, find out how to analyze which products to outsource, learn what to look for in a "Partner", and determine how to assess the risks of your partners.

    Roundtable Participants
    Tom Borkes, The Jefferson Project
    Rodolfo Archbold, Nypro
    Stuart Breslin, Eli Lily
    Bill Burdick, GE Medical
    Mike Buseman, Celestica

    Symposium Technical Committee
    Committee Chair
    Jeff Kennedy, Celestica
  • Gerry Adams, Dade Behring
  • Dr. Daniel Baldwin, Engent
  • Donald Banks, 3M Company
  • Julie Dobbins, Medtronic
  • Anthony Primavera, Guidant Corporation
  • Scott Theune, Plexus Electronic Assembly

  • Contact SMTA director of education Kristin Nafstad for any further information.

    Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
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    Phone +1 952.920.7682
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