Calendar of Events

   2019      

                                   

2019

October 23 - 24

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2019 After April 30, 2019
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.

 

Click HERE for the Guadalajara Expo Live Floor Plan



Attendees

Register for the Guadalajara Expo: CLICK HERE!
 

 

Thank You to our Sponsors:

      

     

     

  

  

 


October 24

San Diego Chapter: Octoberfest  +

Location
KARL STRAUSS BREWING COMPANY-SORRENTO MESA 9675 Scranton Rd San Diego, CA 92121




Join

SMTA San Diego Chapter
 
IPC Designers Council San Diego Chapter
&
IMAPS San Diego Chapter
at
Octoberfest
KARL STRAUSS BREWING COMPANY-SORRENTO MESA
Thursday, October 24, 2019 | 5:30-7:30 PM
Re-connect with old friends and make new connections in San Diego electronics industry!  Look for the SMTA/IPC/IMAPS sign to find us.
 
This is a “No-Host -Pay Your Own Way” event.
RSVP HERE 
 



October 24

Additive Electronics Conference: PCB Scale to IC Scale  +

Location
DoubleTree by Hilton San Jose
San Jose , CA 95110


Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices. 


October 29

Great Lakes (Chicago) Chapter: SMTA Great Lakes Solder Paste Roundtable Event  +

Location
Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089







 
SMTA Great Lakes Chapter Meeting
Tuesday, October 29th, 2019
 
Location: Plexus
  2400 Millbrook Drive
  Buffalo Grove, IL  60089
 
 
Time:  
5:00-5:30 pm Registration/Networking
5:30-6:00 pm Dinner
6:00-7:30 pm Presentations
7:30-8:00 pm Adjournment
   
Cost:  
Members $30.00
Non-Members $35.00
   
  **Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)
 
 
 
SMTA Great Lakes Solder Paste Roundtable Event
 
 
“Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount Technology”
 
By Dr. Mark Currie – Henkel Corporation
Authors and acknowledgements to:
Dr. Neil Poole/Doug Dixon (Henkel Electronic Materials, Irvine, CA, USA)
Chrys Shea (Shea Engineering Services)
 
 
Consumer demand has accelerated the pace of the electronics miniaturization trend, compelling assemblers to develop robust capabilities for 01005 components and 0.3 mm pitch array packages to remain competitive.  The process of acquiring these capabilities can be complex, as they involve numerous interactive factors.  To optimize the stencil printing and reflow portions of SMT assembly given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.
 
The evaluation toolkit incorporates PCB design, a complete and costed bill of materials, full documentation for programming, setup and test methods, and step-by-step directions for a designed experiment.  It is the product of a cooperative effort among industry specialists that draws on their materials expertise, statistical know-how and process engineering skills, and was specifically developed to make solder paste testing as easy as possible for the PCB assembler.
 
This paper details the development of the turnkey solder paste evaluation concept from a laboratory test vehicle to the complete off-the-shelf kit.  It discusses:
 
•             Component selection to reflect the current state of the market and support a 2-3 year miniaturization roadmap
•             Sample size consideration for statistical significance
•             DFM of the PCB to manage costs
•             Design for solder paste inspection (SPI)
•             Nesting of tests to evaluate 22 paste properties in 4 hours or less
•             Stencil design considerations
•             Full database for programming entire SMT line
•             PCB support design, development and testing
 
The discussion details both user and supplier perspectives on testing methods and highlights key considerations for assemblers.  It concludes with opportunities and plans for potential future developments to expand the kit’s analytical capabilities.
 
“Lead-free Solder Paste Development for Ultra Fine-Pitch Printing and Reflow of 03015 and 0201 Metric Chip Components”
 
By Shantanu Joshi - Koki Solder America Inc.
 
 
Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
 
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
 
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
 
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 51 (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
 
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.
 
 
“The Effects of Surface Finish on Solder Paste Performance”
 
By Tony Lentz – FCT Assembly
 
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process (SMT).  Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing.  Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP).  What is the overall effect of surface finish on solder paste performance?  Which solder paste is best for each surface finish?  It is the goal of this paper to answer these questions.
 
In the initial work, several different surface finishes were tested in the surface mount process including:  HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver.  Several different types of solder pastes were tested along with each surface finish including:  lead-free no-clean and water soluble, and leaded no-clean and water-soluble solder pastes.  Each combination of surface finish and solder paste was evaluated for print performance, wetting, solder balling, graping, and voiding.  The results of this testing were quantified and summarized.  Recommendations pairing the optimal solder paste with each surface finish were given.    
 
Subsequent work explored some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters.  Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver).  Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste.  Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile.  Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured.  Reflow performance was measured and quantified including wetting, solder balling, and graping data.  Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads. 
 
All of the test results, including data from the first study, are summarized, compared and contrasted.  Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters.  Recommendations are made for optimal combinations of surface finish and solder paste.
 
 
About the Speakers:
 
 
Dr. Mark Currie – Henkel Corporation
 
Mark works at Henkel Corporation, and is based in Irvine California as Global Business Director for Solder, and is responsible for their technical development direction across all focus market electronic assembly sectors - dealing with Global OEM’s, Tier 1 and EMS accounts. Mark draws from his experience of having visited over 1000 customers, lived in 7 different countries, presented at many established international conferences since 1993, and authored over 100 papers. Mark graduated with both a Manufacturing Engineering degree and PhD from the University of Salford, UK. His undergraduate final year project introduced him to solder, which enticed him to follow with ESPRC industry funded Phd on the same subject matter.  As such, Mark has been familiar with solder for 28years.  In that period, Mark joined Multicore (soon thereafter to be Henkel) and has gone from Academia, to a Research Scientist, to a Process Engineer, and then onto Global Technical, Marketing, Product and Business development positions with Henkel.
 
 
Shantanu Joshi - Koki Solder America Inc.
 
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from State University of New York at Binghamton and Bachelor of Engineering degree in Production Engineering from Pune University, India. He is currently pursuing Ph.D in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from State University of New York at Binghamton. He is published over dozen papers in various national and international conferences over the years. His current work extends from optimizing printing parameters for the stencil printing process to root cause analysis of complex electronic assemblies by understanding the material science of lead-free solder alloys.
 
 
Tony Lentz – FCT Assembly
 
Tony Lentz has worked in the electronics industry since 1994.  He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years.  Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer.  Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products.  Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards.  He has published and presented many papers at industry events.  Tony is a speaker of distinction with SMTA.  Tony holds B.S. and M.B.S. degrees in Chemistry.  
 
 
 
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.



October 29

Intermountain Utah Expo & Tech Forum  +

Location: Weber State University - in Ballroom A
3910 W. Campus Drive
Ogden, UT 84408



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 30th, 2019!


Important Exhibitor Materials:

 



Attendees

Free Parking Information for Attendees and Exhibitors:

Park in the Pay Lot, which is right by the Student Union where the expo is located. You will receive a business card from a SMTA staff member when you leave. You will then take the card and the stub you get when you pulled in and put them in the yellow envelope that will be on your car. This will give you FREE parking, if you do not follow this then you will have to pay $8.

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Tuesday, October, 29, 2019
10:00AM–4:00PM

8:00am
Registration Opens 

9:00am-10:00am
Oven Reflow and X-Ray Best Practices, for Preprogrammed Flash Memories
Speaker: Dave Rohona, Data I/O Corporation 

Abstract: Today’s modern luxury cars are governed by around one hundred million lines of code, and that number is likely to soar for connected and autonomous cars.  According to Neil Shah, partner and  research director, Counterpoint Research, “Storage is one of the fastest growing semiconductor applications in a connected autonomous car. The advanced in-vehicle infotainment (IVI), AI, and sensor driven autonomous driving systems generate large amounts of data that need to be processed and stored locally at the edge. The average capacity of storage required per vehicle is expected to balloon beyond 2TB by 2022.” 

To support this explosive growth in software and data, automotive manufacturers are transitioning their storage architecture from the eMMC interface to Universal Flash Storage (UFS) and PCI express (PCIe/NVMe) to take advantage of the higher capacity, power efficiency, and higher performance that these memory technologies have to offer.  Preprogramming is the preferred method used in automotive today, delivering the lowest total cost of programming.

Preprogrammed flash memories processed through oven reflow and X-ray inspection require production line managers follow recommended best practices. This presentation will discuss the impact of thermal heat and dose radiation on preprogrammed Flash Memories along with Data I/O’s recommended best practices to ensure data retention post oven reflow and X-ray.

Bio: Dave Rohona, Senior Product Marketing Manager, brings over 36 years of expertise in customer applications, system service, product marketing and semiconductor relations in the device programming industry. During his tenure, Dave has developed a deep understanding and technical knowledge of device programming technologies and customer’s manufacturing applications and processes. Dave has a degree in Business finance and has attended the Stanford AeA Executive Institute’s, Technology Management program.

10:00am
Expo Opens 

11:00am-12:00pm

Failure Analysis – Using Ion Chromatography and Ion Chromatography Mass Spec (IC/MS)
Speaker: Terry Monson, Foresite

Abstract: Since the 1980s the electronics industry has utilized ion chromatography (IC) analysis to understand the relationship of ions, and some organics, to product reliability.  From component and board fabrication, to electronic assemblies and their end-use environment, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.  Typical ions accounted for have included chloride, bromide, nitrate, sulfate, weak-organic acid (WOA), sodium and ammonium. Environmental and other concerns have driven the industry to adopt myriad flux formulations, which has created a need to further differentiate weak-organic acids beyond what a typical IC system can provide.

By utilizing an Ion Chromatography/Mass Spectroscopy (IC/MS) system optimized for organic separation, we can use the same column technology for the typical suite of anion/organic species, then run the sample through a quad-pole mass spectrometer which provides the molecular weight assessment of residues for over two dozen channels. This capability is critical to our failure analysis work at Foresite, as it allows for identification of specific organic acids and flux activators. This information can aid in identifying specific residue sources (e.g. board fabrication, SMT paste flux, waver solder liquid flux, hand solder flux or a completely different flux pen, or bottle or paste flux.)

Key Words:  Ion Chromatography, IC/MS, chloride, sulfate, weak organic acid, spot extraction.

Bio: Owner and founder of Foresite Inc. a forensics laboratory for electronic assemblies and systems. Terry has 27 years of experience developing new techniques to better understand fabrication and assembly cleanliness issues and their impact on field performance. Prior to founding Foresite, Terry was employed with Delco Electronics where he applied ion chromatography analysis techniques to wafers, plating samples, and PCB / PCBAs, an industry first. He presented the new analysis techniques to the industry at IPC Expo 1990 in San Diego. As Senior Consultant, Terry directs a team of 20 staff members with four lead investigators supporting client. 

12:00pm
Complimentary Lunch

 

THANK YOU TO OUR LUNCH SPONSOR:

Datest Corporation 

 

1:00pm-2:30pm

Cleaning Process Do's and Dont's...Avoiding Common Pitfalls 
Speaker: Debbie Carboni, KYZEN Corporation  

Abstract: The cleaning approach and technology has significantly evolved over the last 10 years.    What use to work may not be enough to meet the new standards, or new assemblies.   Understand the capabilities of your cleaning process is critical to establish process stability.   
Cleaning expert Debbie Carboni will present:

  • Modern Cleaning advancements. 
  • Modern equipment Advancements
  • Design considerations 
  • Environmental Myths
  • Common Machine Set Up Blunders
  • Common Process Control Blunders.
  • Common Board Fixturing Blunders
  • Rinsing is not just DI Water
  • How to effectively clean modern assemblies to meet the new standard, and more importantly, be reliable and prove it. 

All attendees will see:

  • Videos illustrating different nozzle and pressure impact on the cleaning rate
  • New test coupons for qualifying, optimizing and monitoring cleanliness
  • Passed and Failed test coupons  

An open Question and Answer session will enable attendees to discuss their specific process needs and changes to successfully implement or maintain a robust cleaning process

Bio: Debbie Carboni’s involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes.  Having been with KYZEN for over 10 years, Debbie is dedicated to provide customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions.  Her extensive real-world experience helps guide engineers during qualification to ensure success in production conditions.   

Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations and is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo.  

After attending Northern Arizona University, Debbie remains knowledgeable through numerous technical conferences and leading-edge research. Debbie has authored and co-authored several papers related to cleaning solutions and regularly presents at and attends industry events such as; SMTA International, Cleaning and Coating Symposium, ICSR and APEX among others.  Always willing to share, Debbie is an excellent resource with extensive experience and passion. 

3:00pm-3:45pm

Consumer Electronics Industry Trends 
Speaker: Claire Hotvedt, Indium Corporation 

Abstract: You are invited to take a walk through the 2019 Consumer Electronics Show as seen through the eyes of Indium Corporation’s PCB Assembly Product Development Specialist, Claire Hotvedt.  You will be introduced to the latest consumer electronics including medical wearables, 5G, autonomous vehicles, displays, and smart home appliances.

Bio: Claire Hotvedt is a Product Development Specialist for the PCB Assembly business unit based at Indium Corporation Headquarters.. Claire also oversees product characterization and creation of marketing material to assist the sales team.  Prior to joining Indium Corporation in 2018, Claire held two engineering positions one at Orthogonal, Inc. and one at Bristol-Myers Squibb. Claire earned her bachelor’s degree in chemical engineering, with a minor in Mandarin Chinese, from the University of Rochester.

4:00pm
Expo Closes and Door Prize Drawing 


October 30

FREE Webinar: Advances in X-Ray for Demanding Applications  +

Organized by SMTA Penang Chapter

Location
Penang Malaysia



Wednesday 30th October @ 2:00pm Penang Time UTC+8
(2:00am US Eastern Time UTC-4)

Presenter: Keith Bryant, Chairman SMTA Europe

Free for all – only members will get access to slides and recorded presentation!

Overview

The taking of x-ray images goes back over 100 years, since then there have been numerous advances in x-ray tube and detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been driven partly by the continued reduction in circuit board, device and feature size and the movement to using lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.

However, due to the solar and battery advances, where heat transfer is critical and voiding is a huge problem, we are also seeing an increasing amount of high-density and thick materials which need to be imaged and worse still, low-density materials in combination with high-density ones. In order to meet these most recent challenges and those in the future, there have been a number of key improvements to the vital components within x-ray systems, which will be covered in the presentation.
 
The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for electronics inspection is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This presentation will look at both ends of the spectrum of demanding applications, low-power applications using LED's as a subject and high-power applications showcasing IGBTs. 

 

About the Presenter

Keith Bryant

A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews. 

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years. 

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.


November 1

Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA's and PCBF's

Speaker: Robert Boguski, President, Datest

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on November 1, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choicein many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.

This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numerous examples will be shown, with an emphasis on PCBA and PCBF failure analysis and defect detection. 


Biography

Robert Boguski, President, Datest
 

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS). Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE. Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC). Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.

 




November 5

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025


Exhibitors

Exhibit Space is currently SOLD OUT!

Please contact Courtney Kalb to be placed on a waiting list.

Your booth registration includes:



Attendees

Book Your Discounted Hotel Room before Monday, October 21!

Best Western Escondido Hotel

1700 Seven Oaks Road, Escondido, CA 92026

Phone: 760-740-1700 

Click Here to book online using the group code "SMTA"
 

Technical Presentation Schedule:

8:00am

Registration Opens

 

9:00am

Identifying Defects on BTC Assemblies with X-Ray Analysis; 

Speaker: Dr. Bill Cardoso, Creative Electron, Inc.

The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to become an integral part of the quality assurance function of modern electronic manufacturers.

However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. For example, what level of resolution is necessary for a specific application? Is an open tube or sealed source the most appropriate technology to deploy?

The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. Instead of focusing on the x-ray technology per se, this work starts from the application needs of the electronic industry and ties it back to the available technology offerings available in the market today. The goal is to set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.

 

10:00am

Expo Opens
 

11:00am

Avoiding the Pitfalls of Voiding in PCB Assemblies; 

Speaker: Joe Bahou, Indium Corporation
 

12:00pm

Complimentary Lunch
 

1:30pm

Optimization of the Reflow Process to Minimize Voiding; 

Speaker: MB Allen, KIC

Void reduction is a significant concern and controversial topic in electronic assembly.  Voiding impacts electrical, thermal, and mechanical performance.  There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.
 

2:30pm

New X-Ray Technologies for Enhanced Void Investigation; 

Speaker: Keith Bryant, Keith Bryant Consultancy

There are many forward thinking companies who invest time, effort and cost into up front work to fix snags which would lead to poor yield during production, this paper outlines the efforts of a company who take this thinking further.

With increasing pressure on cost reduction within our industry, companies are looking ever more closely at their manufacturing process. In order to remain globally competitive and even to succeed in their local market every dollar saved here helps the bottom line. However in many areas there is a danger that lower price equals lower quality and therefore actually higher costs in the end.

The approach here involves spending a little more money than normal at the start of project but less than hundreds of dollars and the results show savings of many times more than this outlay. However it is acknowledged that this does take a little more time to get the job onto the shop floor.

The key to this methodology is that it needs the time and effort of a skilled team and time on a production line before the job is started. But as the paper shows it really does improve yield, reduce cost, save the potential issues around repair and gives better reliability.

In essence the results of the printing process are analyzed, after the components are placed, using x-ray and these results compared to the results after reflow soldering. The resultant pre reflow solder paste shapes are impossible to see with the naked eye or by lifting the components, as the paste would not release evenly. This allows the engineer to determine how differences in printed paste shape and volume react when components are placed on them and how ultimately this affects product quality.

Post reflow problems including mid chip solder balls were found to be common faults, as were issues under BGA’s including insufficient solder and shorts.

The product is run on a “real line” and the results evaluated. Improvements are then made to the stencil design and other key process parameters to ensure that when in production the board is producing acceptable yields.

 

4:00pm

Expo Closes


November 6

Wisconsin Chapter: WI SMTA comes to Madison area ! Pro Active Engineering hosts Dale Lee on Wednesday November 6th  +

The Round Table 1611 N. Bristol St. Sun Prairie, WI 53590



Hello WI SMTA Members and Friends,

The WI SMTA Officer team is excited to be bringing a technical presentation and tour to the Madison area!  Please join us on Wednesday November 6th when we welcome Dale Lee to present on BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive .  

The  detailed agenda is below.  Please note that dinner and the technial presentation  is off site from Pro Active at The Round Table and the facility tour will take place after (around 7pm)
  • 4:30pm    Registration and Networking
  • 5:00 pm   Welcome and Dinner
  • 6:00pm   BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive, Presented by Dale Lee
  • 7:00 pm   Facility Tour at Pro Active Engineering (350 Business Park Dr.  Sun Prairie WI)
  • 8:00 pm   Meeting adjourned

Please spread the word for this great Technical Presenter and come see the Pro Active Engineering facility!
 


November 6

Ohio Valley Chapter: Encapsulates and Coatings Technical Meeting  +

Location
Lorain County Community College (DEC 132 A/B - 151 Innovation Dr, Elyria, OH 44035)



Building: Desich Entrepreneurship Innovation Center
Room: DEC 132 A/B
Date: Wednesday, November 6th 2019

https://www.lorainccc.edu/about/map-and-directions-to-lccc/

Proposed Schedule:
- 9:00 am - 9:30 am      Registration Check-in
- 9:30 am - 10:30 am    Mike Skinner of Dow : General Overview of Tech. in Coatings
- 10:30 am - 11:30 am  Jeff Bowin of Henkel:  Low Pressure over mold
- 11:30 am - 12:30 pm  Lunch
- 12:30 pm - 1:30 pm   Jim Stockhausen of ELANTAS PDG Inc: Trends and Developments in Electronic Protection Materials
- 1:30 pm - 2:00 pm     Johnny Vanderford : MEMS Programs and Updates
- 2:00 pm - 3:00 pm     Facility Tour: LCCC Electronic Assembly Manufacturing Center (Sneak Peak)

Hotels and Accomodations:
- Homewood Suites by Hilton on RT 254, just call reservation and mention you are visiting LCCC. 
- The Hampton Inn & Suites by the old Midway Mall is a sister property of the Homewood Suites so they may offer extended pricing for LCCC involved travelers.  Mention -LCCC they should receive our rate or if they are a public organization a government rate may be available. 
- A more ‘active’ area the DoubleTree by Hilton in Westlake provides good rates we work with Kim Barker and she can be reached at kim.barker@hilton.com or 440-617-2361. 
- Stocker Center uses the Country Inn & Suites (Griswold Rd) for performers and they can be reached at cx_elyr@contryinn.com or 440-324-0099.


November 6

Massachusetts (Boston) Chapter: Evening Meeting at Raytheon Company in Andover, MA  +

Location
Raytheon Company, 350 Lowell Street, Andover, MA 01810



SMTA Boston Chapter, IEEE Reliability Chapter, and IMAPs NE cordially invites you to an evening meeting on Wednesday, Nov. 6th, 2019 at Raytheon in Andover, MA.
Secure Location Logistics: Pre-registration is required (remember to use full name include middle name as appear on ID when registering) to attend this event and open to US citizens only, no walk-ins are allowed.  Must have either state issued driver’s license or passport to gain access to facility.  Last factory tour starts at 5:15 PM and must be in the café by this time so arrive early if you plan on attending the factory tour (visitor are required to wear closed toe and heel footwear are required for the tour).  Must arrive at the security gate at Raytheon, Andover by 5:45 PM or will be turned away.
 
Date: Wednesday, November 6, 2019
Time: 4:00 PM to 9:00 PM
Location: Raytheon Company
350 Lowell Street, Andover, MA 01810
Cost: SMTA/IEEE/IMAPs Members $25; Non-Member  $30

Meeting Agenda:
4:00 – 6:00 PM 
Registration and Sign in, Socializing, Networking
Coffee, water and snacks
4:15 – 6:00 PM 
Factory Tours: (every 15 min; duration 45 min.)
  1. CCA SMT lines and soldering robots
  2. CAVE
  3. Materials Lab Area
  4. FA Lab, ETL, and Keyence Booth in Cafe
6:00 – 7:00 PM  Dinner and Announcements (SMTA/IEEE/iMAPS)
7:00 – 7:15 PM  Raytheon Welcome by John Powers – Ops Mgr.
7:15 – 7:35 PM  Failure Analysis Capabilities - Recent Case Studies
7:35 – 8:00 PM  Using IPC Standards to Mitigate Counterfeit Risks
8:00 – 8:45 PM  Technical Presentation: QFN Voiding
8:45 PM  Q&A
9:00 PM  Raffle - Adjourn

Our meeting sponsor:

Presentation:  Failure Analysis Capabilities - Recent Case Studies
Speaker:   Prisco Tammaro, at Raytheon
Bio:  
 
Presentation:  Using IPC Standards to Mitigate Counterfeit Risks
Speaker:   Cameron Shearon, Principal Materials Engineer at Raytheon
Bio:  Cameron Shearon is a Principal Materials Engineer at Raytheon’s IDS Division, co-chair of IPC 1782, and a SMTA Distinguished Speaker.  Cameron has given invited speeches at many international events.  He earned a BS and MS in Materials Science and Engineering from North Carolina State University.  He obtained a Physics minor for his BS and a Solid State Science minor for his MS.
Cameron initiated and chaired the development of IPC 1782, a global component traceability standard that contains four traceability levels for materials and four independent traceability levels for the process that was completed in record time with the help of many outstanding contributors, IPC Staff support, and his leadership.  As a result of his contribution to this standard, Cameron received a Committee Leadership Award from IPC at IPC APEX EXPO 2017.
Prior to his current role, he has worked as a Process Engineer in a Wafer Fab, Failure Analysis Engineer and Product Safety Engineer in an R&D Environment, a Lead Quality Engineer with AT&T’s Global Supply Chain, and a Reliability Engineer with AT&T Labs.
 
Technical Presentation:  QFN Voiding
Speaker:   Norman Armendariz, Ph.D. Engineering Fellow at Raytheon
Bio:  Dr. Armendariz is an Engineering Fellow at Raytheon responsible for materials engineering design, materials analysis, process equipment development, and production support associated with the manufacturing of CCA- circuit card assemblies used in missiles, smart munitions, ground based radars, and mobile sensors across multiple US and international sites. Norm has over 20 years of industrial experience, having worked for Lockheed/NASA, Motorola, TI and Intel, and as Director of Labs / Asst. Engr. Prof. at American University. He holds an interdisciplinary PhD in Chemical Engr. from New Mexico State University, MS in Materials Science Engr. from the University of Illinois at Urbana-Champaign, and BS Metallurgical Engr. from Colorado State University, with 9 US patents and 27 peer-reviewed publications. 

Our 2019 Expo Sponsors:



Our 2018 Expo Sponsors:
   


For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22
 
To register for this event visit: Click Here or copy this address to your browser:  https://smta.org/chapters/rsvp.cfm?BEE_ID=4790
Please use your full name when registering including your middle name in the first name block of the registration form.  Registration dead line is Friday, Nov. 1st, 2019.

Additional Info:   Safety eyewear are required to be worn in specific areas (safety glass will be provided for use while in these areas).


November 7

Atlanta Chapter: Chapter Meeting & Social  +

Location
Anderby Brewing



Atlanta SMTA Patrons we want to say THANK YOU for your patronage and Non-Members we have a special just for YOU!
 
Come join us on November 7, 2019 at the latest addition to Atlanta’s growing Brew Masters Anderby Brewing https://anderbybrewing.com
 
This will be a social gathering and our technical presentation will be presented by Preston Smelt on Brewing and DRINKING Beer!
 
The Event:
Individual Members this event is 100% FREE, you will get 2 Pints of your choosing from their taps and snacks.
Non-Member we would love to have you come join us. If you prefer to stay a Non-Member that’s okay, the event is $25 BUT if you sign up on or before the event to become an Individual Member, well you guessed it IT’S FREE! Sign up to be an individual member at https://www.smta.org/membership/
 
The Date and Time:
November 7, 2019 4:30-8PM
 
The Place:
Anderby Brewing
110 Technology Parkway
Suite 200
Peachtree Corners, GA 30092
 





November 7

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 18, 2019!



Attendees

Technical Presentation Schedule:

 

9:00am

Registration Opens

 

10:00am

Expo Opens

 

11:00am-11:30am

PART I - Why Are We Cleaning No-Clean?

Speaker: Mike Konrad, Aqueous Technologies

No-Clean flux, once a reliable alternative to cleaning is quickly becoming the most common type of flux being removed. This presentation will discuss the reasons so many assemblers have implemented a cleaning protocol for assemblies reflowed with no-clean flux. While many assemblies maintain a high tolerance for post-reflow residues and do not benefit from a cleaning process, many others experience residue-related failures. This presentation will outline factors that affect residue tolerance and methods to predict an assembly’s residue tolerance.

 

11:45am-12:45pm

Complimentary Lunch

 

1:00pm-1:30pm 

X-Ray Inspection Advances for BGA's and Bottom Terminated Components

Speaker: Keith Bryant, Keith Bryant Consultancy

The presence of voids within the interfacial layers of electronics, either onto the board or within the device, has always been of concern to those charged with making good product. Specifically, voiding may impact on long, and short, term joint strength and reliability as well as effect the thermal conductivity which would otherwise allow heat to be safely dissipated away from key areas. Today, these issues become increasingly more important as more electronics need to withstand harsher operating environments and devices themselves need to be able to handle greater power. Thermal conductivity of the finished assembly is also affected by design and by bare board manufacture, these areas will also be explored, excessive voiding can be traced back to pad layout and even solder resist design and type.
X-ray inspection has long been used to non-destructively probe for these issues, both in R&D and in production. This often enables the root cause of issues to be quickly investigated without the need to cut or destroy the sample, an act which may otherwise potentially mask the real situation. The presence, quantity and location of voids can be clearly seen and measured in the X-ray results. This paper will explain the recent developments that have been made in 2D, 2.5D and 3D X-ray inspection and how they can be applied to investigating voiding. The developments to be discussed will include the use of limited angle computer tomography (CT), sometimes also called laminography, as well as the use of new 'full CT' algorithms, such as helical CT, which improve the clarity of the necessary analysis and clearly locate the source of potential voiding and joint / interfacial problems. BTC's will be used as examples of how these techniques are needed to provide the necessary analysis to clearly locate the source of potential voiding problems.

 

2:00pm-2:30pm

PART II - Why Are We Cleaning No-Clean?

Speaker: Mike Konrad, Aqueous Technologies

No-Clean flux, once a reliable alternative to cleaning is quickly becoming the most common type of flux being removed. This presentation will discuss the reasons so many assemblers have implemented a cleaning protocol for assemblies reflowed with no-clean flux. While many assemblies maintain a high tolerance for post-reflow residues and do not benefit from a cleaning process, many others experience residue-related failures. This presentation will outline factors that affect residue tolerance and methods to predict an assembly’s residue tolerance.

 

3:00pm

Expo Closes


November 11

Webinar: Low Temperature Solder Benefits and Process Concerns  +



Bob WillisMonday 11th November @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The use of low temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. It’s different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 220°C, low temperature solders reflow at under 180°C. There are some organisations predicting a large growth in low temperature materials in the next two to three years for multistep soldering.

Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive provided you consider the total cost of manufacture. We produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow, so we believe we are in a good position to help engineers achieve high yields with low temperature materials.

Topics include:

  • Why use low temperature solder
  • Benefit over lead-free alloys
  • Materials available
  • Reflow soldering and rework results
  • Reliability with mixed alloys
  • Inspection results

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


November 12 - 15

productronica 2019  +

Accelerating Innovation

Location
Messe München
Munich Germany


Future technologies, industry trends, growth markets. Investment decision-makers, industry experts. From around the world. At the right time and the right place. Only at the World's Leading Trade Fair for Electronics Development and Production. Welcome to productronica 2019.

Experience innovations up close and at a very early stage at the world’s leading trade fair. The two trend topics of this year's industry platform are Smart Maintenance and Smart Factory. 



November 14

Georgia Institute of Technology Student Chapter Chapter: Tech Talk by Eric Lange on “Engineering in Product Development”  +

MRDC 4211



Bio: Eric Lange is a design engineer at Kids 2 and Georgia Tech grad, BSME. He has seven years of end to end product development experience with consumer goods, specializing in design for manufacturing and usability. His products have been nation-wide best sellers and award winners under brands like Baby Einstein, Ford, Disney, Ingenuity, and Bright Starts. In his spare time, he acts as the Retention Chair for the Society of Manufacturing Engineers and is the Chair and Co-founder of the Toy and Game Design Association.

 

Topic Overview: Over 30,000 new products enter the market every year. The product development process guides those products from being sketches on a napkin to something sitting in your Amazon cart. Learn where to start and what steps to follow to turn an idea into a manufacturable good. 




November 19

Indiana Chapter: Indesign Product Engineering and Development LLC Symposium  +

Location
8225 E 56th St, Indianapolis, IN 46216



SMTA Indiana Indesign Symposium

Our final symposium of 2019 takes place on November 19th, 2019 at Indesign Product Engineering and Development LLC. The purpose of this symposium is to delve into topics related to DFM for PCBs. The symposium will cover topics:
  1. DFM in PCB prototyping
  2. Low Temperature Solder Paste
In addition, we will get a chance to tour their Indianapolis facility.
Tentative Schedule
Event Timeline Duration
Chapter Welcome 10:00 AM – 10:15 AM 15 minutes
Indesign Welcome 10:15 AM – 10:30 AM 15 Minutes
Speaker 1 10:30 AM – 11:00 AM 30 minutes
Break 11:00 AM – 11:15 AM 15 minutes
Speaker 2 11:15 AM – 11:45 AM 30 minutes
Lunch 11:45 AM – 12:30 PM 30 minutes
Speaker 3 12:30 PM – 1:30 PM 30 minutes
Break 1:30 PM – 1:45 PM 15 minutes
Tour 1:45 PM – 2:15 PM 30 minutes

Indesign’s expertise  are in the electrical design process and their capabilities include:
  • Architecture
  • Schematic
  • Circuit simulation
  • PCB layout
  • PCB assembly
  • PCB testing
  • Production support
 
Their specialties include:
  • Microcontroller/DSP-based
  • Field-programmable gate array (FPGA)
  • Wireless
  • Antenna
  • Custom analog
 To RSVP please click here or copy the link below into your browser.
smta.org/chapters/rsvp.cfm?BEE_ID=4798
 
Cost of attendance and payment
 
Before November 12, 2019 Early Registration
Members $20.00
Non-members $30.00
After November 11, 2019 Late Registration
Members $25.00
Non-members $35.00
 

To pay please use the PayPal button below and do not forget to RSVP
 
 
Symposium Registration



Please use the PayPal button above to pay for attendance in advance. You can pay using your own PayPal account or as a guest once you are at the PayPal page



November 19

Advanced Electronics Assembly Conference  +

Location
Novotel Budapest Centrum
Budapest 1088 Hungary



November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL



Exhibitors

SOLD OUT! Please contact Hannah Terhark to be put on a waitlist!

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

Book a discounted room rate at the Hilton Melbourne Rialto Place!

200 Rialto Place, Melbourne, FL 32901

Group Code: SMTA 

321-768-0200

Book Rooms Today!  



Attendees

Exhibit Hours:
Wednesday, November 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:

THANK YOU TO OUR TECHNICAL SESSIONS SPONSOR:

Specialty Coating Systems

7:45AM
Registration Opens

8:00AM
Student and Young Professionals Breakfast

9:00AM – 10:00AM
Industry 4.0 the Next Industrial Revolution - The Smart Factory
Speaker: MB Allen, KIC

Industry 4.0, IIoT, IoT, Smart Factory, Made in China 2025. It’s all the buzz but what are these trends?
Do they relate to me and my manufacturing environment? Is this something we Must implement? What
would the benefit be to my company? How does it all come together? These questions and more will be covered during this presentation and will include an example of ‘Smart Factory’ technology.

10:00AM
Expo Opens

10:45AM - 11:30AM
Understanding Reliability of Low Temperatures Solders and New Developments in Low Temperature Solder Materials
Speaker: Kim Flanagan, Indium Corporation 

From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Low-temperature solders are being used to minimize the heat input to a PCBA, thereby reducing high energy costs and the risk for board and component warpage. Furthermore, low-temperature solders can be advantageous for applications where thermally sensitive components are present as well as step soldering applications. Up until recently, eutectic Bi-Sn and Bi-Sn-Ag alloys have been the primary low-temperature solders of choice, mostly due to their cost efficiency when compared to other low-temperature solders. However, with a renewed focus on solder joint reliability, the brittle nature of these Bi-Sn alloys has caused concern for this reliability requirement specifically for applications that will experience drop shock environments. As a result, many efforts have gone into researching and developing other low-temperature solder options to address the reliability concerns and environmental limitations of Bi-Sn alloys. These advancements include In-containing alloys and also a new, low-temperature alloy, Durafuse™ LT.

11:30PM - 1:00PM
Lunch

THANK YOU TO OUR LUNCH SPONSOR:

Excelta

THANK YOU TO OUR REFRESHMENT SPONSOR:

Eltek USA, Inc.

4Front Solutions

12:30PM - 1:15PM
Reliability of Robotics for Electronic Manufacturing 
Speaker: Bubba Powers, Weller Professional Tools

Reliability of electrical or electronic soldering has always been paramount for the success of long-term market share and presence for electronics manufacturers. Process control is the key to ensuring manufacturers produce high quality and reliable products within their respective fields. In today’s environment of automation and high tech electronic controls, high reliability in electronics manufacturing is now more critical than ever before. 
Automation is one approach to achieving the pinnacle of high reliability in electronics manufacturing, as repeatability and traceability are two keys to maintaining optimum process control. However, it is the responsibility of every employee to maintain and control these processes whether they are automated or manual. 
In a world of trending automation and artificial intelligence in all of our surroundings, one slight miss can mean the difference in the success or failure of any electronic product. A failure in the manufacturing process could be insignificant if it is a cell phone, a play station or a television, but it can be of major consequence if it affects the electronics in the car that your family is in, the flight that your spouse is on or the technology that your military member is utilizing.
Join us for an overview of the process of automation in the soldering workplace and a discussion of what factors are just as critical for high reliability electronics regardless of whether you are working with a manual or an automated manufacturing environment.  
 

1:00PM
Soldering Competition on Show Floor

PRIZES AS FOLLOWS

1-55" 4k Television
2- Samsung pad
3- $100 Gift card
4- $100 Gift Card
5- $100 Gift Card

THANK YOU TO OUR SOLDERING COMPETITION SPONSOR:

JBC Tools

L3 Harris

2:00PM - 2:45PM
Cleaning for Reliability in Electronics
Speaker: Emily Peck, MicroCare Corporation 

Emily's presentation examines how cleaning can be an important tool for enhancing reliability in a production engineer’s toolbox. Successful critical cleaning involves first identifying the contaminant and then selecting the best combination of cleaning fluids and methods to effectively remove it. Balancing these factors properly can enhance cleaning reliability.

4:00PM
Expo Closes

5:00PM - 7:00PM
After Expo Networking Social at The Mansion:

1218 E New Haven Ave, Melbourne, FL 32901

THANK YOU TO OUR AFTER EXPO NETWORKING SOCIAL SPONSORS:

Electronic Assembly Products (EAP Florida)

MicroCare Corporation

Plasmatreat 

JBC Tools

Brady Corporation

4Front Solutions


November 21

Advanced Electronics Assembly Conference  +

Location
Romania
Oradea 410051 Romania



December 2

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures  +



Bob WillisMonday 2nd December @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

New components often provide challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far. Any large area component with a low stand off which needs to be reflow soldered to a substrate can be a challenge but at ever decreasing pitch the need for good process validation and correct design is vital for high yields.

Having had hands on experience with these parts since conducting design reviews, setting up processes, conducting failure analysis we may not have all the answers, but we do know the right questions to ask in manufacture.

Provided FREE with this webinar are Bob Willis QFN inspection and quality control wall charts to use in your own manufacturing and training facility.

 

Topics include:

  • Design options to reduce failures
  • Process improvements in design and assembly
  • Void reduction
  • Improvements in joint reliability
  • Simple 5min solderability assessment
  • Improved cleaning performance
  • Results in cleaning and SIR on QFN packages
  • Process results from vapour phase and convection reflow
  • Solder joint reliability
  • IPC design and process guidelines

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. If you have a process example you would like covered in the webinar it will need to be provided in advance of the session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


December 3

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter Golf Tournment  +

Spring Valley Golf Course Milpitas, CASMTA



SMTA Silicon Valley Golf Tournament Shotgun Start at Noon


December 4

Silicon Valley Expo & Tech Forum  +

Location: Bestronics Box Build Facility
2243 Lundy Avenue
San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 8th, 2019!

Important Exhibitor Materials:

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

Book a discounted room rate at the Holiday Inn & Suites : Silicon Valley - Milpitas by November 22, 2019.

1100 Cadillac Court, Milpitas, California 95035

Group Code: SMTA

408-240-8000

Book Rooms Today!  

Search for the dates 12/3/19 - 12/5/19 and type in the Group Code: SMT



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:30PM

Free Technical Program & Schedule:

8:30am

Registration Opens

9:30am-10:15am
Trends in 5G and the Impact on the Electronics Industry
Speaker: E. Jan Vardaman, TechSearch International, Inc.

Abstract: Projections call for 5G to drive growth in the electronics industry.  This includes advanced packages for mobile handsets such as antenna-in-package and the infrastructure to support 5G such as PCBs.  This presentation examines the status of the 5G rollout and the packaging requirements to support it.  Included are discussions on the material requirements for new packages and boards.   

Bio: E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She is the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer.  She is a member of SEMI and IMAPS.  She is an IMAPS Fellow.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.    

10:00am
Expo Opens

11:00am-11:45am
Ceramic Capacitors-Recent Failures & Mitigations 
Speaker: Dock Brown of ANSYS

11:45am - 1:00pm

THANK YOU TO OUR LUNCH SPONSORS:
Zero Defects International and Viscom, Inc.

12:45pm - 1:30pm
Contamination, Harsh Environments, and a New IPC Cleanliness Testing Standard - The Perfect Storm of Change
Speaker: Mike Konrad, Aqueous Technologies 

Abstract: Why Are We Cleaning No-Clean? No-Clean flux, once a reliable alternative to cleaning is quickly becoming the most common type of flux being removed. This presentation will discuss the reasons so many assemblers have implemented a cleaning protocol for assemblies reflowed with no-clean flux. While many assemblies maintain a high tolerance for post-reflow residues and do not benefit from a cleaning process, many others experience residue-related failures. This presentation will outline factors that affect residue tolerance and methods to predict an assembly’s residue tolerance.

Bio: Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 34 years. Mike has designed several automated cleaning and cleanliness testing machines, has published technical articles on the subject of cleaning and cleanliness assessment and has been a member of Editorial Boards for several industry publications.

Mike served on the US Navy’s EMPF manufacturer’s committee and is a speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the Surface Mount Technology Association (SMTA). He is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992. 

2:00pm - 3:15pm
Reliability in Cleaning and Automation 
Speaker: A team from Indium, Microcare, and Weller

 

THANK YOU TO OUR TECHNICAL SESSIONS SPONSOR:

Out of the Box Manufacturing

3:15pm - 4:30pm
Reception on the Show Floor

3:30pm
Expo Closes - Raffle on Show Floor

 


December 14

Dallas Chapter: SMTA Dallas Member & Gues Appreciation Dinner/Theatre!  +

Location
Addison Stone Cottage 15650 Addison Road, Addison, TX 75001 



SMTA Dallas Member & Gues Appreciation Dinner/Theatre!


Date: Saturday, December 14, 2019 @ 6:00pm 

Location: Addison Stone Cottage 15650 Addison Road, Addison, TX 75001 

Who: SMTA Members and spouse/guest

What: We have a catered dinner planned for the Addison Stone Cottage from 6:00 PM to 7:30 PM, and then we will walk over to the Addison Water Tower Theater and see the show "Cirque Holidays" at 8:00 PM   (the menu and more details will be sent on a future invitation to all Dallas members).

WaterTower Theatre, in partnership with Lone Star Circus, will celebrate the holidays from around the world through a magical collaboration of theatre and circus with Cirque Holidays! Featuring international stars alongside Dallas’ amazing and entertaining circus talent, audiences of all ages will be treated to incredible acts, ranging from hula-hoops to death defying trapeze stunts all tied together with a charismatic host and hilarious clowns.


Schedule:
  • 6:00pm - Catered Dinner
  • 7:30pm - Walk to Addison Tower Theatre
  • 8:00pm - Cirque Holidays 
Pricing:
  • Early bird rate: $/person (BUY NOW)
  • Decide later: $/person 

Early bird discount ends on : Reserve your spot now!


 


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819