Calendar of Events

   2019      

                                   

2019

November 19

Indiana Chapter: SMTA Indiana's Final 2019 Symposium  +

Location
8225 E 56th St, Indianapolis, IN 46216



SMTA Indiana's Final 2019 Symposium

Our final symposium of 2019 takes place on November 19th, 2019 at Indesign Product Engineering and Development LLC. The purpose of this symposium is to delve into topics related to DFM for PCBs. The symposium will cover topics:
  1. DFM in PCB prototyping - by Michael Kidd - Mike is a PCB designer with over 30 years’ experience in new product development as a Senior Electrical Designer at Indesign and as a Member of the Technical Staff at AT&T Bell Labs.  He has experience in multi-layer, double-sided, single-sided, blind and buried via printed circuit board technologies, as well as carbon inks, silver inks, flex circuits and surface mount technologies (Fine-pitch, BGAs).  Mike also has experience with Cadence Allegro, OrCAD CIS and Mentor Graphics systems.  He has designed PCBs for manufacture in many factories around the world and is well-versed in DFM and DFT.  He is the team leader for Indesign’s ECAD group and serves at as the Engineering Services manager at Indesign.  He has an A.S. degree in Industrial Drafting from Vincennes University.  Mike is a Certified Interconnect Designer – CID.
  2. Low Temperature Solder: Developing a Mixed Alloy for property fusion - by Claire Hotvedt - Claire Hotvedt is a Product Development Specialist for the PCB Assembly business unit based at Indium Corporation Headquarters in Clinton, NY. She is responsible for facilitating the transition of new solder paste products from developmental stages into fully launched and marketable solutions. Claire al¬¬so oversees product characterization and creation of marketing material to assist the sales team.
    Prior to joining Indium Corporation in 2018, Hotvedt held two engineering positions one at Orthogonal, Inc. and one at Bristol-Myers Squibb.
  3.  Lean Six Sigma in relation to Continuous Improvement - by  Tom Watson - Tom is the Continuous Improvement Manager at the Kimball Electronics Jasper, Indiana facility. Kimball Electronics is a leading contract manufacturer of durable goods electronics serving a variety of industries on a global scale.Tom will be speaking about how Kimball Electronics uses Lean Six Sigma to drive productivity improvements throughout the company. Tom has a Bachelor of Engineering in Marine Engineering from the State University of New York Maritime College and an MBA from Regis University. Tom is a Certified Master Black Belt.Tom is also the Chair of the Evansville-Owensboro Chapter of ASQ and holds the ASQ Certified Quality Engineer Certification.

In addition, we will get a chance to tour Indesign's Indianapolis facility. See our itinerary below:
 
Symposium Itinery
Time Subject Speaker
10:00 AM – 10:05 AM Chapter Welcome Mike Young
10:05 AM – 10:30 AM InDesign Welcome Ron Kern
10:30 AM – 11:10 AM DFM in PCB prototyping Michael Kidd
(Indesign LLC)
11:10 AM – 11:20 AM Break
11:20 AM – 12:00 PM Durafuse LT: Developing a mixed alloy process for property fusion Claire Hotvedt
(Indium Corporation)
12:00 PM – 12:40 PM Lunch
12:40 PM – 1:20 PM Lean Six Sigma in relation to Continuous Improvement Tom Watson
(Kimball Electronics)
1:20 PM – 1:30 PM Break
1:30 PM – 2:00 PM Indesign Facility Tour

To RSVP please click here or copy the link below into your browser. Once you have RSVPed you will be redirected to PayPal. Once at PayPal you can use your personal PayPal account or pay via credit card as a guest.  Please see the table below for the cost of attendance.  
Cost of attendance and payment
 
Before November 17, 2019 Early Registration
Members $20.00
Non-members $30.00
After November 18, 2019 Late Registration
Members $25.00
Non-members $35.00
 

Please RSVP first and once you have done so you will be redirected to PayPal.

Company Location

Indesign is located on the NE side of Indianapolis at 8225 East 56 Street. See map below


 

Lodging


November 19

Advanced Electronics Assembly Conference  +

Location
Novotel Budapest Centrum
Budapest 1088 Hungary



November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL


Exhibitors

SOLD OUT! Please contact Hannah Terhark to be put on a waitlist!

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

Book a discounted room rate at the Hilton Melbourne Rialto Place!

200 Rialto Place, Melbourne, FL 32901

Group Code: SMTA 

321-768-0200

Book Rooms Today!  



Attendees

Exhibit Hours:
Wednesday, November 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:

THANK YOU TO OUR TECHNICAL SESSIONS SPONSOR:

Specialty Coating Systems

7:45AM
Registration Opens

8:00AM
Student and Young Professionals Breakfast

9:00AM – 10:00AM
Industry 4.0 the Next Industrial Revolution - The Smart Factory
Speaker: MB Allen, KIC

Industry 4.0, IIoT, IoT, Smart Factory, Made in China 2025. It’s all the buzz but what are these trends?
Do they relate to me and my manufacturing environment? Is this something we Must implement? What
would the benefit be to my company? How does it all come together? These questions and more will be covered during this presentation and will include an example of ‘Smart Factory’ technology.

10:00AM
Expo Opens

10:45AM - 11:30AM
Understanding Reliability of Low Temperatures Solders and New Developments in Low Temperature Solder Materials
Speaker: Kim Flanagan, Indium Corporation 

From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Low-temperature solders are being used to minimize the heat input to a PCBA, thereby reducing high energy costs and the risk for board and component warpage. Furthermore, low-temperature solders can be advantageous for applications where thermally sensitive components are present as well as step soldering applications. Up until recently, eutectic Bi-Sn and Bi-Sn-Ag alloys have been the primary low-temperature solders of choice, mostly due to their cost efficiency when compared to other low-temperature solders. However, with a renewed focus on solder joint reliability, the brittle nature of these Bi-Sn alloys has caused concern for this reliability requirement specifically for applications that will experience drop shock environments. As a result, many efforts have gone into researching and developing other low-temperature solder options to address the reliability concerns and environmental limitations of Bi-Sn alloys. These advancements include In-containing alloys and also a new, low-temperature alloy, Durafuse™ LT.

11:30PM - 1:00PM
Lunch

THANK YOU TO OUR LUNCH SPONSOR:

Excelta

THANK YOU TO OUR REFRESHMENT SPONSOR:

Eltek USA, Inc.

4Front Solutions

12:30PM - 1:15PM
Reliability of Robotics for Electronic Manufacturing 
Speaker: Bubba Powers, Weller Professional Tools

Reliability of electrical or electronic soldering has always been paramount for the success of long-term market share and presence for electronics manufacturers. Process control is the key to ensuring manufacturers produce high quality and reliable products within their respective fields. In today’s environment of automation and high tech electronic controls, high reliability in electronics manufacturing is now more critical than ever before. 
Automation is one approach to achieving the pinnacle of high reliability in electronics manufacturing, as repeatability and traceability are two keys to maintaining optimum process control. However, it is the responsibility of every employee to maintain and control these processes whether they are automated or manual. 
In a world of trending automation and artificial intelligence in all of our surroundings, one slight miss can mean the difference in the success or failure of any electronic product. A failure in the manufacturing process could be insignificant if it is a cell phone, a play station or a television, but it can be of major consequence if it affects the electronics in the car that your family is in, the flight that your spouse is on or the technology that your military member is utilizing.
Join us for an overview of the process of automation in the soldering workplace and a discussion of what factors are just as critical for high reliability electronics regardless of whether you are working with a manual or an automated manufacturing environment.  
 

1:00PM
Soldering Competition on Show Floor

PRIZES AS FOLLOWS

1-55" 4k Television
2- Samsung pad
3- $100 Gift card
4- $100 Gift Card
5- $100 Gift Card

THANK YOU TO OUR SOLDERING COMPETITION SPONSOR:

JBC Tools

L3 Harris

2:00PM - 2:45PM
Cleaning for Reliability in Electronics
Speaker: Emily Peck, MicroCare Corporation 

Emily's presentation examines how cleaning can be an important tool for enhancing reliability in a production engineer’s toolbox. Successful critical cleaning involves first identifying the contaminant and then selecting the best combination of cleaning fluids and methods to effectively remove it. Balancing these factors properly can enhance cleaning reliability.

4:00PM
Expo Closes

5:00PM - 7:00PM
After Expo Networking Social at The Mansion:

1218 E New Haven Ave, Melbourne, FL 32901

THANK YOU TO OUR AFTER EXPO NETWORKING SOCIAL SPONSORS:

Electronic Assembly Products (EAP Florida)

MicroCare Corporation

Plasmatreat 

JBC Tools

Brady Corporation

4Front Solutions

Tropical Stencil 


November 21

Great Lakes (Chicago) Chapter: SMTA Great Lakes – Fuji America Corporation Tour & Head-In-Pillow Presentation  +

Fuji America Corporation, 171 Corporate Woods Parkway, Vernon Hills, IL 60061




 
SMTA Great Lakes Chapter Meeting
Thursday, November 21st, 2019
 
Location: Fuji America Corporation
  171 Corporate Woods Parkway
  Vernon Hills, IL  60061
 
 
 
Time:  
2:30-3:00 pm Registration/Networking
3:00-3:30 pm Fuji America Corporation Tour/Demo
3:30-4:00 pm Presentation:  “Test Method for Head in Pillow” – Gene Dunn
4:00-4:30 pm Presentation:  “Recent Advances in the 2d and 3d X-ray technology for detection of Head-In-Pillow and other common SMT defects” – Evstatin Krastev, Ph.D.
4:30-4:45 pm Adjournment
   
Cost:  
Members $30.00
Non-Members $35.00
   
  **Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)
 
 
 
SMTA Great Lakes – Fuji America Corporation Tour & Head-In-Pillow Presentations
 
“Test Method for Head In Pillow”
 
By Gene Dunn – Plexus Corporation
 
In this presentation, the work done by the HDPUG consortium on a standardized test procedure for simulating and observing head in pillow formation and defects will be covered.
 
About the Speaker:
Gene Dunn is a Sr. Staff Process Engineer at Plexus and is Regional Subject Matter Expert for SMT Equipment and Process.  His main responsibilities include equipment and material selection, process development and yield improvement.  Previous Gene worked at Panasonic and AT&T in various SMT and Microelectronic engineering and management roles.  He holds a BS in Engineering from Univ. of Illinois- Urbana & an MBA from Northwestern.
 
“Recent Advances in the 2D and 3D X-ray technology for detection of Head-In-Pillow and other common SMT defects”
By Evstatin Krastev, Ph.D. – Nordson Dodge
 
 
The need to non-destructively inspect electronic components and assemblies is the main driver behind the development and advancements of the X-ray inspection technology for the electronics industry. In many cases, X-ray inspection is the only available technique for non-destructive inspection of optically hidden solder joints like BGA, QFN, Through Hole components. In this talk we will discuss the latest developments in the 2D and 3D X-ray technology for detecting Head-In-Pillow and other common SMT defects. Real life examples and cases will be discussed in detail. 
 
About the Speaker:
Evstatin Krastev, Ph.D.
Director of Applications
Nordson Dage
 
 
Dr. Krastev is Director of Applications at Nordson Dage responsible for the X-Ray and Bondtester lines.  He holds a Master degree in Electrical Engineering and Ph.D. in Physics from Michigan State University. He has also valuable experience working as a software engineer and hardware design engineer.
During the last 25 years Dr. Krastev has been actively involved in the fields of testing and inspection for the microelectronics and NDT industries. During the last 14 years at Nordson Dage, Evstatin was instrumental building a strong global applications team supporting customers and sales.
Evstatin has published numerous articles in leading magazines discussing advanced topics in the spheres of bond testing, 2D and 3D X-ray inspection. He is a well-known expert in the industry and is working closely with key customers and consortia developing new standards and testing techniques.
 
 
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.
 
 


November 21

Oregon Chapter: SMTA Oregon Chapter: November Technical Meeting. Tolerance Mistaken  +

Axiom Electronics, 9845 NE Eckert Dr. Suite 200, Hillsboro, OR 97006



Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations
 
Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume.  The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces.  However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products.  This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.
Outline:
I. Industry Standards Limitations (IPC/JEDEC)
II. Component Package Technology
  A. New Packaging Technologies
  B. Units of Measure (Metric vs Imperial)
  C. Land Pattern Design
III. PCB Design
  A. Laminate Limitations
  B. Via hole closure
  C. Copper etching effects (pad/trace size)
  D. Solder mask design
IV. Leadless Component Packages (DFN, QFN, LGA, Chip)
  A. Solder mask/silk screen
  B. Thermal balance
  C. Thermal expansion/shrinkage
V. Assembly Technology
  A. Material compatibility
  B. Tolerances - assembly/tooling
  C. Clean/No-clean


Dale Lee. 
Senior Staff DFX Strategy Engineer
Plexus Engineering Solutions
BIO:
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
 
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions.  These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of Chip Scale Package (CSP) & Ball Grid Array (BGA) packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices. 
 
Dale has authored multiple technical articles and papers and is a frequent instructor/presenter globally on topics including PCB and SMT design, assembly, cleaning, and DFM/DFX.  He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award.  He has been or is very involved with multiple industry associations (SMTA, IPC, INEMI), industry standards development, and symposium/ conference technical development committees.

 


November 21

Advanced Electronics Assembly Conference  +

Location
Romania
Oradea 410051 Romania



November 25

Webinar: Overcoming Challenging X-Ray Problems  +

Organized by SMTA Europe



Monday 25th November @ 2:30pm - 4:00pm UK Time
(9:30am - 11:00am US Eastern Time)

Presenter: Keith Bryant, Chairman SMTA Europe

Overview

As with all inspection technology, x-ray has to evolve to keep pace with the advances in components and products. Most recently, this has been driven by the continued reduction in board, device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components and dies becoming thinner and thinner. But we also see an increase at the other end of the spectrum with IGBTs, super capacitors and battery applications requiring high power and high-resolution images for Failure Analysis and inspection. 

In order to meet these challenges and those in the future, there have been a number of recent key improvements to the vital components within x-ray systems. In particular, there is a new x-ray tube type that permits high magnification inspection at improved resolution yet retains high tube power and stability under these conditions, allowing good x-ray flux for inspection of the smallest features and excellent repeatability of measurements and auto inspections.
 
This presentation will look at various x-ray tube and detector types that are available and explain the implications of these choices in terms of what they provide for inspection regarding image resolution, magnification, tube power, and detector pixel size, amongst others. We will look at x-ray images at both ends of the spectrum, high power with high-resolution and low power with high-resolution, using IGBTs and LEDs as examples.

 

About the Presenter

Keith Bryant

A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews. 

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years. 

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.


December 2

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures  +



Bob WillisMonday 2nd December @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

New components often provide challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far. Any large area component with a low stand off which needs to be reflow soldered to a substrate can be a challenge but at ever decreasing pitch the need for good process validation and correct design is vital for high yields.

Having had hands on experience with these parts since conducting design reviews, setting up processes, conducting failure analysis we may not have all the answers, but we do know the right questions to ask in manufacture.

Provided FREE with this webinar are Bob Willis QFN inspection and quality control wall charts to use in your own manufacturing and training facility.

 

Topics include:

  • Design options to reduce failures
  • Process improvements in design and assembly
  • Void reduction
  • Improvements in joint reliability
  • Simple 5min solderability assessment
  • Improved cleaning performance
  • Results in cleaning and SIR on QFN packages
  • Process results from vapour phase and convection reflow
  • Solder joint reliability
  • IPC design and process guidelines

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. If you have a process example you would like covered in the webinar it will need to be provided in advance of the session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


December 3

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter Golf Tournment  +

Spring Valley Golf Course Milpitas, CASMTA



SMTA Silicon Valley Golf Tournament Shotgun Start at Noon


December 4

Silicon Valley Expo & Tech Forum  +

Location: Bestronics Box Build Facility
2243 Lundy Avenue
San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 8th, 2019!

Important Exhibitor Materials:

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

Book a discounted room rate at the Holiday Inn & Suites : Silicon Valley - Milpitas by November 22, 2019.

1100 Cadillac Court, Milpitas, California 95035

Group Code: SMTA

408-240-8000

Book Rooms Today!  

Search for the dates 12/3/19 - 12/5/19 and type in the Group Code: SMT



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:30PM

Free Technical Program & Schedule:

8:30am

Registration Opens

9:30am-10:15am
Trends in 5G and the Impact on the Electronics Industry
Speaker: E. Jan Vardaman, TechSearch International, Inc.

Abstract: Projections call for 5G to drive growth in the electronics industry.  This includes advanced packages for mobile handsets such as antenna-in-package and the infrastructure to support 5G such as PCBs.  This presentation examines the status of the 5G rollout and the packaging requirements to support it.  Included are discussions on the material requirements for new packages and boards.   

Bio: E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She is the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer.  She is a member of SEMI and IMAPS.  She is an IMAPS Fellow.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.    

10:00am
Expo Opens

11:00am-11:45am
Ceramic Capacitors-Recent Failures & Mitigations 
Speaker: Dock Brown, ANSYS

Bio: Dock Brown has more than 30 years of electronics reliability experience. He won the best paper award at the 2018 Pan Pacific Microelectronics conference and is currently co-chair of the IPC DfX Committee. Prior to joining ANSYS/DfR Solutions, he spent 20 years at Medtronic where he most recently concentrated on reliability aspects of material science in the design and supply chain for harsh environment Class III medical devices. Earlier in his career, he also worked in technology management positions at Sundstrand Data Control where he led the implementation of the Boeing AQS program and at Olin Aerospace as a program manager and engineering manager. As a volunteer, he has been involved with ASQ, IEEE, IPC, and SMTA. He has taught classes in DfX, tin whiskers, statistics, design of experiments, and has contributed to standards development.

 Abstract: The presentation will review recent failures and mitigations in ceramic capacitors in terms of construction and manufacturing, electrical properties,  mechanical properties, failure characteristics, counterfeit indications and qualification tactics.

11:45am - 1:00pm

Complimentary Lunch

THANK YOU TO OUR LUNCH SPONSORS:
Zero Defects International and Viscom, Inc.

12:45pm - 1:30pm
Contamination, Harsh Environments, and a New IPC Cleanliness Testing Standard - The Perfect Storm of Change
Speaker: Mike Konrad, Aqueous Technologies 

Abstract: Why Are We Cleaning No-Clean? No-Clean flux, once a reliable alternative to cleaning is quickly becoming the most common type of flux being removed. This presentation will discuss the reasons so many assemblers have implemented a cleaning protocol for assemblies reflowed with no-clean flux. While many assemblies maintain a high tolerance for post-reflow residues and do not benefit from a cleaning process, many others experience residue-related failures. This presentation will outline factors that affect residue tolerance and methods to predict an assembly’s residue tolerance.

Bio: Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 34 years. Mike has designed several automated cleaning and cleanliness testing machines, has published technical articles on the subject of cleaning and cleanliness assessment and has been a member of Editorial Boards for several industry publications.

Mike served on the US Navy’s EMPF manufacturer’s committee and is a speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the Surface Mount Technology Association (SMTA). He is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992. 

2:00pm - 2:30pm
Cleaning for Reliability in Electronics
Speakers: John Hoffman, MicroCare Corporation

Bio: John Hoffman has specialized in the field of critical cleaning for more than 50 years. He helps companies update their critical cleaning processes to improve productivity, and boost quality in a safe, economical and environmentally-acceptable manner. He is an expert on vapor degreasing, modern cleaning fluid technologies and thermodynamics. He helps companies enhance their cleaning processes in industries as diverse as electronics, metal finishing, transportation, photonics, medical devices, and aerospace.

Abstract: The presentation examines how cleaning can be an important tool for enhancing reliability in a production engineer’s toolbox. Successful critical cleaning involves first identifying the contaminant and then selecting the best combination of cleaning fluids and equipment to effectively remove it. Balancing these factors properly can enhance cleaning reliability.

2:35pm - 3:15pm
Reliability of Robotics for Electronic Manufacturing 
Speaker: Bubba Powers, Weller Professional Tools

Bio: Bubba Powers is Manager, Technical Services for Weller Professional Tools - North America serving customers in the US, Canada and Mexico. Mr. Powers has been with Weller in varying positions of leadership for almost four decades. For the past three decades, he has primarily been involved in technical and application support roles for the electronics market. He has authored several white papers and hosted webinars pertaining to industry challenges, standards and applications. Mr. Powers served as a committee chairperson on the ESD Associations Standards team for ANSI/ESD S13.1-2015 Electrical Soldering / Desoldering Hand Tools. He holds a certification as an IPC 7711/7721 CIT Instructor and continues to support the industries many challenges for automation and hand soldering applications in the market place.

Abstract: Reliability of electrical or electronic soldering has always been paramount for the success of long-term market share and presence for electronics manufacturers. Process control is the key to ensuring manufacturers produce high quality and reliable products within their respective fields. In today’s environment of automation and high tech electronic controls, high reliability in electronics manufacturing is now more critical than ever before.

Automation is one approach to achieving the pinnacle of high reliability in electronics manufacturing, as repeatability and traceability are two keys to maintaining optimum process control. However, it is the responsibility of every employee to maintain and control these processes whether they are automated or manual.

In a world of trending automation and artificial intelligence in all of our surroundings, one slight miss can mean the difference in the success or failure of any electronic product. A failure in the manufacturing process could be insignificant if it is a cell phone, a game console station or a television, but it can be of major consequence if it affects the electronics in the car, during flight or the technology that the military is utilizing.

The presentation will overview the process of automation in the soldering workplace and discuss what factors are just as critical for high reliability electronics regardless of whether you are working with a manual or an automated manufacturing environment.

 

THANK YOU TO OUR TECHNICAL SESSIONS SPONSOR:

Out of the Box Manufacturing

3:15pm - 4:30pm
Reception on the Show Floor

Thank You to Our Refreshment Sponsor:

Datest Corporation

3:30pm
Expo Closes - Raffle on Show Floor

Thank You to Our Tote Bag Sponsor:

Datest Corporation

 

View more photos from the last Silicon Valley Expo
See more photos from last year on the Silicon Valley Chapter page.

 


December 5

Massachusetts (Boston) Chapter: SMTA Evening Meeting on Thursday, Dec. 5th, 2019 at Benchmark Electronics Inc. in Nashua NH  +

Location
Benchmark Electronics Inc. 100 Innovative Way, Nashua, NH 03062



SMTA Boston Chapter cordially invites you to an evening meeting on Thursday, Dec. 5th, 2019 at Benchmark Electornics Inc. in Nashua, NH.
 
Date: Thursday, December 5, 2019
Time: 4:30 PM to 8:45 PM
Location: Benchmark Electronics Inc.
100 Innovative Way, Nashua, NH 03062
Cost: SMTA Members $25; Non-Member  $30
Meeting Agenda:
4:30 – 6:00 PM  Registration and Sign in, Socializing, Networking
4:30 – 6:00 PM  Factory Tours
6:00 – 7:00 PM  Presentation - Dinner and Announcements
7:00 – 7:45 PM  EIT Oven Evaluation
7:45 – 8:30 PM  Presentation - Profiling and Reflow Process Control in Production:  Problems and Solutions
8:30 PM  Q&A
8:45  Adjourn
 
 
Technical Presentation:  EIT Oven Evaluation
Abstract:  EIT CORPORATION is a contract manufacturer with headquarters in Virginia and 4 manufacturing sites, including one in Salem, NH. The plant in Salem had a new potential customer with a challenging pcb to thermoprofile.. A large mass pcb with a wide variety of temperature sentive components that had to be run with lead free solder. Using their current 8 zone ovens they were unable to accomplish a profile that would adequately reflow the solder joints without overheating the components on the pcb. The decision was made to purchase either a 10 or 12 zone oven and the engineering staff was assigned the task of qualifying the best oven for the application and ensuring that it could accomplish the new job. The engineering staff had no sample product to run the evaluation so that they had to devise a method that would satisfactorily accomplish the experiment. This presentation will show you the unique way that the experiment was designed and the it’s surprising results.
Speaker:   Adam V. Gnek, Senior Process Engineer for EIT Corp.
Bio:  Currently employed as the Principle Process Engineer at EIT Corp. in Salem, NH.  Over 20 years of experience in Electronics PCB production at Columbia Tech,Osram Syslvania, Vicor and Plexus.
Education:
1995             Bachelor of Applied Science (Computer Science)                 
                        Brigham Young University, Provo, UT
1991             High School Diploma     (Basic Study)
                        A.A Stagg High School, Stockton, CA
Certified       Lean/Six Sigma Black Belt Certification (LSSBB)
Certified         Aegis software training certificate – NPI Specialist (Circuit Cam & Factory Logix) 

 
 
 
Technical Presentation:  Profiling and Reflow Process Control in Production:  Problems and Solutions
Abstract:  SMT has taken a change in the US somewhat due to off-shoring.   NPI, advanced technology, densely populated and challenging PCBs are common.  Military, medical, aerospace, hi-reliability products remained.  BTCs are expanding (have you seen 01005 BTC’s?).  With this comes the challenges of setting up reflow profiles for an entire assembly, not just the solder paste.  Add to this the requirement for confirmation that all reflowed PCBs are built in accordance to tight process windows for the paste AND the components.  Solutions for reduction of downtime for the initial process of setting up an optimized profile and the elimination of unknown changes, obstacles and human error during the reflow process, are imperative.  This discussion will provide solutions for quick, easy and precise setup and continued process control for the reflow process.  We will also delve into the automation of useful reflow product data collection and smart factory integration.
Speaker:   Marybeth (MB) Allen, Applications & Sales Manager for KIC
Bio:  . MB Allen is a Manager for KIC’s Applications & Sales in the Americas and
Europe. Formerly as Product Manager she coordinated the advancement of new
products and features to accommodate customer needs as KIC added to its
portfolio for the electronics industry. Her technical expertise, relationships with
valued partners and customers, and many years of sales experience aid KIC in
the future development, improvement and sales of the company's product
offerings.
MB has worked in the electronics industry for 31 years and been associated with
KIC for 30 years with both national and international positions.


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December 14

Dallas Chapter: SMTA Dallas Member & Guest Appreciation Dinner/Theatre!  +

Location
Addison Stone Cottage 15650 Addison Road, Addison, TX 75001 



SMTA Dallas Member & Guest Appreciation Dinner/Theatre!


Date: Saturday, December 14, 2019 @ 6:00pm 

Location: Addison Stone Cottage 15650 Addison Road, Addison, TX 75001 

Who: SMTA Members and spouse/guest

What: We have a catered dinner planned for the Addison Stone Cottage from 6:00 PM to 7:30 PM, and then we will walk over to the Addison Water Tower Theater and see the show "Cirque Holidays" at 8:00 PM   (the menu and more details will be sent on a future invitation to all Dallas members).

WaterTower Theatre, in partnership with Lone Star Circus, will celebrate the holidays from around the world through a magical collaboration of theatre and circus with Cirque Holidays! Featuring international stars alongside Dallas’ amazing and entertaining circus talent, audiences of all ages will be treated to incredible acts, ranging from hula-hoops to death defying trapeze stunts all tied together with a charismatic host and hilarious clowns.


Schedule:
  • 6:00pm - Catered Dinner
  • 7:30pm - Walk to Addison Tower Theatre
  • 8:00pm - Cirque Holidays 

 


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819