Calendar of Events




October 25

Atlanta Chapter: Atlanta Chapter SMTA Meeting  +

Prime Technical Services

New Speaker Announcement

Timothy O'Neill

Technical Marketing Manager
Aim Solder presents;

Solder Alloy Evolution and Development

RoHS and REACH will be fully implemented in 2019.  With this development, a second generation of lead-free alloys are making their way onto production lines and into electronic assemblies.  This discussion will review the existing alloy market and what advantages and liabilities the new materials represent.

Sign in 4:30
Dinner 5:00
Presentation 5:45


October 29 - 31

SMT Processes Certification - October 29-31, 2018 (Querétaro, Mexico)  +

Querétaro , JA Mexico

  • Day 1- Course (8:30-5pm)
  • Day 2- ½ day of course + exam
  • Day 3- All day exam (8:30-5pm)
  • Instruction: English/Spanish
    Test: English
    Instructor: Iván Castellanos, Indium Corporation

Oct 31 - Nov 1

Embedded Systems Conference (ESC) Minneapolis  +

The Midwest's Only Embedded Systems Conference

Minneapolis Convention Center
Minneapolis , MN

Embedded Systems Conference (ESC) Minneapolis is the premier conference for chip, board and systems design engineers, deep dive into testing and measurement equipment, system boards, debugging software tools, security products, and more. 

Save 20% on the All-Access Conference pass by using promo code: SMTA

Get details and register here!

ESC 2018

November 1

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815


The LA/OC Expo is Sold Out! Please contact Courtney Kalb to be placed on the waitlist.

Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:


Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, November 1, 2018


Registration Opens


Thank You to Our Coffee Sponsor:


Expo Opens



Material Management 4.0

Speaker: Bill Cardoso, Ph.D., Creative Electron

Over the past years the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production - thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield rates increase.

In this presentation, we'll introduce Material Management 4.0. More than a set communication protocol between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, Material Management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits in efficiency unleashed by Industry 4.0. 



Complimentary Lunch



Challenges in PCB Design

Speaker: Vern Wnek, C.I.D., Mentor Graphics

The PCB Design process can be as simple as drawing schematics, doing the layout of the board, and providing the fabrication information to the manufacturing vendor. In this session, we will discuss a few topics that illustrate how technology and the complexity related to the PCB Design process has evolved in recent years and how Mentor solutions can help to overcome the challenges in PCB Design. 



An Intelligent DFM Approach to PCB Manufacturing

Speaker: Patrick McGoff, Mentor

PCB complexity continues to accelerate. It seems we used to be able to speak in terms of a simple progression of technology, but today we know there are advances in materials, construction, manufacturing processes and component technology that multiply the complexities of PCB manufacturing. With such a myriad combination of factors, it makes for very challenging PCB design reviews for manufacturability.

However, just as the PCB technology has advanced, so has the Design for Manufacturing (DFM) software. Best practice companies use the intelligence in the PCB design data to drive their DFM analysis for more accurate, comprehensive and consistent results across users. In this session we will discuss how to use the intelligence in the design data to your PCB manufacturing advantage.



Expo Hall Closes

November 6

Ohio Valley Chapter: Solder Roundtable - North  +

Corporate College East Warrensville Heights, OH

Technical and product presentations from:
  • Shea Engineering Chrys Shea presents: Stencil and solder paste inspection for miniaturized SMT components
  • Henkel Dr. Mark Currie presents: Development of a solder paste test vehicle for miniaturized surface mount technology
  • Indium Corporation Brook Sandy-Smith presents: Avoiding the Pitfalls of Voiding in PCB Assemblies
  • FCT Assembly/Blue Ring Stencils Tony Lentz presents: How does PCB surface finish affect printing
  • AIM Tim O’Neill presents: Evolution of lead free solder alloys
  • Alpha Assembly Solutions Jason Fullerton presents: Cleanliness testing and its relationship to flux reliability
  • KOKI Solder America Inc. Shantanu Joshi Presents: Solder paste for super fine pitch components

November 7

Wisconsin Chapter: Selective Soldering Workshop  +

Radisson Hotel Menomonee Falls N88 W14750 MAIN ST , MENOMONEE FALLS, WI 53051

The SMTA Wisconsin cordially invites you to attend:
Selective Soldering Workshop
7 Speakers!!!

Fountain Soldering
Ernie Grice - ERSA
Jonathan Wol - Pillarhouse
Brian Czaplicki - Air-Vac Engineering
Jim Czyzewicz - ITE-EAE
Point to Point Soldering
Will Hunter - MTA Automation
Bill Rahn - Fancort/Japan Unix
Ken Schiffer - Apollo Seiko

Click HERE to RSVP

8:00 AM to 8:30 AM - Registration/Coffee/Networking
8:30 AM to 8:45 AM - Introduction

  • SMTA Members:  $40
  • Non-Members:  $60
Cost includes a buffet style lunch
Payment by PayPal required in advance

November 8

Mexico - Juarez (Formation) Chapter: SMTA Mexico - Juarez Re-Formation Meeting and Technical Seminar  +

Centro de Convenciones Cuatro Siglos

Hello colleagues, we are having our re-formation meeting and technical seminar this Thursday November 8th, We are working on bringing several experts in the fields of Solder Paste Printing, process and Stencil Design to speak at the meeting. We will be having a networking event right after the seminar. Please reserve your time for this exciting event.

November 8

Central Texas (Austin) Chapter: CTEA Electronics Symposium at Flex, 12455 Research Park Loop, in NW Austin  +

Flex, 12455 Research Park Loop, Austin, TX

Central Texas Electronics Association

Electronics Design, Manufacturing & Test Symposium 
Thursday, November 8, 2018
Flex (aka Flextronics), 12455 Research Park Loop, in NW Austin

3:00  -   Registration Begins
3:30  -   Welcome and Introductions
3:35  -   " 3D Printing:  Current Status and Application Areas ” 
                  Dr. David Bourell, Professor, UT-Austin
4:05  -   " Chip Security Vulnerability:  How to Close Gap Between Design Software & Hardware
                  Keith Guidry, CTO, Sawblade Ventures        
4:35  -   Break for Networking
4:50  -   " High-Performance Computing (HPC), Machine Learning, & Other Engineering Problems ” 
                  Dr. Damian Valles, Assistant Professor, Texas State University
5:20  -   " DLP (Digital Light Processing) Light Engines That Cure 3D Printed Polymers
                  Jorge Moguel, Executive VP, TyRex-Digital Light Innovations
5:50  -   Door Prizes Drawing & Closing Remarks
6:00  -   Food & Refreshments Served and More Networking
RSVP to Bob Baker at:
No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
Students can also attend for FREE!
Event Location:
Flex, Welcome Center, 12455 Research Park Loop in NW Austin
Enter site via Riata Trace Pkwy or Oak Knoll Dr off Research Blvd (US-183)
See Map at:   (Map to Flex) 
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)

November 11 - 13

SMT Processes Certification (Guadalajara, Mexico)  +

Must be registered and paid by October 6th to participate in this course

Guadalajara , JA Mexico

Co-located with Guadalajara Expo.

  • November 11- Course (8:30-5pm)
  • November 12- ½ day of course + exam
  • November 13- All day exam (8:30-5pm)

  • Instruction: English/Spanish
    Test: English
    Instructor: Ivan Castellanos

November 13

Oregon Chapter: What Does Clean Really Mean and How Can It Be Achieved?  +

Axiom Electronics

What Does Clean Really Mean and How Can It Be Achieved?
Date: Nov 13th, 2018
Time: 4:30-7:00PM
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006 ]
The definition of clean has changed with time and usage application. 
The definition of clean varies with the application that it is in reference.  With electronic assemblies, this definition has evolved with component packaging technologies, solder methods, flux chemistries, cleaning solvents, legislative and end use applications.  Early electrical soldering chemicals were based on soldering technologies developed over the centuries for non-electrical products and definition of clean was determined by visual inspection of residue.  As electrical assembly processes and end product applications evolved, so has the definition for clean.  Today, the definition of clean is measured in many different ways depending on what is required by the end use application.  Over the years, producibility, manufacturability, testability, inspectability and reliability methods have been incorporated into product development methods with cleanability provide minimal thought if any at all. 
With increased design densities, component packaging technologies, higher electrical performance requirements/restrictions, not addressing cleanliness requirements into the design and the method of cleanliness of the product can have detrimental impacts to customers and/or equipment providers.  This presentation will discuss design for cleaning guideline options to meet a proposed definition for clean of electronic assemblies

Dale Lee - Bio
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions.  These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices. 
Dale has authored, instructed and presented globally on topics including advanced SMT packaging, PCB and SMT design, assembly, cleaning, DFM/DFX and rework.  He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award.  He has been very involved with multiple industry associations and activities including SMTA, INEMI and IPC.

November 13 - 15

SMTA-IPC High Reliability Cleaning and Conformal Coating Conference  +

Chicago Marriott
Schaumburg , IL

Organized by SMTA and IPC

November 13-15, 2018
Chicago Marriott
Schaumburg, IL

"How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others. Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies. The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.


Call for Participation


November 14 - 15

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara


Please see the Guadalajara Chapter Page for More Information on Expo Materials.

The Guadalajara Expo is SOLD OUT! Please contact Courtney Kalb or Hannah Funk to be placed on our waitlist.



Click Here for the Guadalajara Hotel Room Block

Group Name: SMTA Nov 2018

Group Code: SMT


Attendee Registration is Now Open! Click Here to Register.

Please see the Guadalajara Chapter Page for more information.


Exhibit Hours (both days)



Reception to Follow (both days):



Free Technical Presentation Schedule:

Wednesday, November 14, 2018:



Introduction to SMT Process Basics and Troubleshooting (SEMINAR)

Tom Foley, ASM Assembly Systems, Fred Dimock, BTU International, Leopoldo Rovalcaba, SMarTsol Technologies


Cleaning of Electronic Assemblies, Particularly Under Low Stand-Off Components

Erik Miller, KYZEN Corporation




Thermal Shadow Moiré to Cross-Section Correlation Study

José de Jesús Gómez, Jabil



Complimentary Lunch




Lean Initiatives

Elias Albarran, Continental


Ultra-Thin Fluoropolymer Coating Characterization and Performance Over Flux Residues

Patrick Duchi, INVENTEC




FAQ's and Updates on the Industry Standards for SMT Moisture/Reflow Sensitive Devices

Steven R. Martell, Sonoscan


Optimization of Manual Process in Electronic Assemblies Using Standard Automated Equipment

Juan Montiel, Jabil




Quality First

Iván Román, Continental


Build to Last: And Aging Study

Omar Garcia & Omar Granados, Flex


Thursday, November 15, 2018:



Conformal Coating, Best Practices to Control Process

Marco Cortes, Flex


How to Add Real Time Visibility into Production

John Arena, Teradyne, Inc.




ANDON System

Carlos Sanchez, Nippon Seiki


Medición del Porcentaje de Porosodid en Componentes Soldados en Tablillas de Circuitos Impresos

Dr. Miguel Neri, CIMAV




Conformal Coating Over No Clean Flux

Tim O'Neill, AIM Solder


Balancing Automization Conformal Coating

Camille Sybert, ASYMTEK




Industry Optimization, Humans and Robots in Collaboration

Francis Huang, Techman


14.0 Big Data Analysis Proposal

Jack France, Keysight Technologies




IPC A610/J-STD 001 Automotive Addendum

José Servin, Continental


Inspecting Coating Materials and Metrology Process Control

Giancarlo de la Garza, Nordson Yestech

November 19

Webinar: Hand Soldering & De-Soldering with Lead-Free Solder  +

Bob WillisNovember 19 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe


Hand soldering and de-soldering with lead-free solders does requires higher process temperatures. This material change can impact on the printed circuit board and components used. It can also impact on the tooling leading to increased cost and maintenance in your facility.  Soldering with lead-free can be simpler than you think if staff are provided with the correct procedures and a better understanding of the process and the type of joints they will be producing.  Changes to material and processes in your factory is an ideal time to eliminate poor practices that have been used for many years leading to extra rework and cost.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

Soldering theory and what is different
Cored solder wire
Soldering operation
Soldering iron care
Tip corrosion issues with lead-free
De-soldering techniques
Lead-free inspection criteria
Typical lead-free defects

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

November 26

Webinar: ESD Electrostatic Discharge Guide for Everyone  +

November 26 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenters: Jeremy Smallwood & Charles Cawthorne from SMTA Europe Explain All


When handling most of today’s electronic components, printed circuit assemblies (PCAs) or equipment that contains electronics, special consideration must be given to the potential damaging consequences resulting from static electricity. Electrostatic discharge (ESD) can result in PCAs or higher level equipment failing test in the factory, or worse still, it can result in latent defects that can cause subsequent failure in the field. So what is electrostatic discharge and how is electrostatic discharge damage prevented?

This webinar provides an elementary guide to the principles of ESD control, looking at the basic theory behind the subject and the practical methods that can be adopted used to enable components, PCAs and equipment to be handled without the risk of incurring electrostatic related damage. The webinar is aimed at personnel who are new to the industry, including design and process / manufacturing engineers, technicians, trainers and also at those who support manufacturing indirectly (i.e. purchasing, account managers, sales staff, etc.)

Topics include:

  • What is ESD and why is it important
  • How static charges are generated
  • How static charges can be transferred to electronic components
  • Illustration of the damage that can be sustained by electronic components following electrostatic discharge
  • What is an Electrostatic discharge Protected Area (EPA)
  • How to set up an EPA within a factory
  • What practical controls are required to prevent electrostatic damage
  • How to store / transport electrostatic sensitive components / PCAs
  • How to handle electrostatic sensitive equipment out in the field

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

November 28

Silicon Valley Expo & Tech Forum  +

Location: Bestronics Box Build Facility
2243 Lundy Avenue
San Jose, CA 95131


The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 26th, 2018!

Click here for Ad and Sponsorship opportunities! Important Exhibitor Materials:


Book a discounted room rate at the DoubleTree by Hilton San Jose by November 5, 2018.

Group Code: SMT



Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, November 28, 2018

Free Technical Program & Schedule:
Registration opens

9:30AM – 10:15AM
The Journey Towards Industry 4.0
Speaker: Hassan Aluraibi, Flex

Abstract: With ever-growing demand from customers and consumers, manufacturers are taking a closer look at the innovations that have shaped industries around them, and planning for the forthcoming, 4th industrial revolution, also known as Industry 4.0. This industry wide initiative seeks to integrate the latest in digital and manufacturing technologies, across a wide variety of solutions relating to simulation, machine communication, cloud computing and 3D printing, revolutionizing the way we manufacture. We’ll share a high-level view of this initiative, define key technologies, use cases and opportunities for growth as we usher in this exciting new initiative.

Expo Opens

Electronics and Textiles – Partners in Ubiquity
Speaker: Stephanie Rodgers, Apex Mills

Abstract: It’s happening folks! Successful outcomes of the first and third industrial revolutions are converging together as we begin the fourth; a hybrid of technology and humanity through textile applications.  Yarn has become the next invention and electronics are a topic of laundering performance and next level ubiquity.  Learn about the building blocks of advanced e-textile development, best practices for success, standards development and participation in Manufacturing USA.

Complimentary Lunch

X-ray and CT Scanning in the Context of Industry 4.0
Speaker: Rahul Alreja, VJ Technologies

Abstract: In today’s world, delivering quality products to end-users is absolutely critical.  Social media and the internet have made knowledge instantaneous and pervasive, and a misstep or flaw can cause catastrophic damage to a company – reputations that have taken years to make can come crashing down in days, if not hours.  The challenge is that maintaining quality is not easy – there are too many variables at play, even in the cleanest of environments.  And conditions can change almost instantaneously.  The trick, then, is to be adaptable, and emerging technologies (such as Big Data and Blockchain) are being adopted and harnesses to dynamically (and automatically) alter quality.  Drawing upon some real-world examples from different industries, this session will explore the future of quality and the role that NDE, and more specifically, x-ray plays in it.

Expo Closes 


December 11

SMTA Webinar: Inspecting PWB Assemblies for Defects  +

Tuesday, December 11, 2018 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

Bob Wettermann What You Can Learn From This Course:

This webinar is designed to help the EMS and PWB builders screen for, test and develop inspectors for PCB final assembly. The people attending this session should have familiarity with the latest IPC-A-610 inspection standard. We will review some of the more common “gotchas” found in the final inspection of PWBs. The session will also discuss the options for manual inspection equipment including but not limited to lighting, magnification aids and ESD control in the inspection area. In addition, this session will go on to discuss eyesight issues, visual acuity, color siting, hand-eye coordination and testing of these attributes. This will help in the screening process for nurturing that next inspector. Finally, there will be a real time short “test” of various devices and boards with anomalies and sample defects.  

This is intended for production personnel, process engineers and QC managers trying to hire, train up and nurture the next tier of inspectors.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819