Calendar of Events

   2019      

                                   

2019

January 24

Oregon Chapter: January Technical Meeting, Wearables & Implantables: How Technology Transforms Health Care … How Health Care Transforms Technology  +

Axiom Electronics, 9845 NE Eckert Dr. Suite 200, Hillsboro, OR 97006



Wearables & Implantables:  How Technology Transforms Health Care … How Health Care Transforms Technology

Matthew K. Hudes

CEO bdlBilologx, Vancouver, Washington/USA, mhudes@bdlbio.com

Summary

Digital Health is driving the uptake of wearable and implantable devices replete with biometric sensors.  These new technologies are enabling health care to become more immediate, more effective, and more personalized.  Health care applications of technology bring greater demands for privacy, safety, and security, with corresponding regulatory oversight. In turn, health care is influencing how Digital Health technologies are developed, manufactured, and commercialized.

I. Introduction and Motivation
Wearable and implantable technology, when combined with web and email, mobile technology and social networking, data management and analytics, results in a new paradigm called “Digital Health.”  Tools that connect patients, physicians, payers, and life sciences companies can transform the delivery of health care.  But in order to realize such a fundamental transformation of the health care system, changes are required on the part not only of health care providers but also of life sciences manufacturers and of patients/consumers.  Essential technologies such as wearable and implantable devices in Digital Health become subject to medical regulations and medical technology product development processes as they are utilized not only to monitor but also to directly affect human health.
II. Technical Approach or Experimental Procedure
This presentation provides a survey of trends in Digital Health, focused on the role of wearable and implantable technology.  Consumer, market, and financial data is examined to understand how these technologies are changing health care and how health care is changing the business of developing, manufacturing and commercializing these technologies.

III. Results and Discussion
While the results are generally positive to the market opportunity for wearable and implantable technologies, there are unintended consequences and unforeseen results that are emerging as the market develops.  It is likely that further transformation is required to fully realize the potential for health care as well as for the technology business addressing these needs.
 
IV. Brief Biography

Matthew Hudes is the Founder and CEO ofbdlBiologx, a company devoted to helping the products of innovative companies reach patients more quickly. 
bdlBiologx provides 1) on-demand services to stimulate company growth 2) leading-edge Business Development and Licensing (BDL) processes and systems, and 3) capability-building to support the growth of a BDL function within a company. For the prior 11 years, Matthew was the BioPharma practice leader for Deloitte.  In this role, he provided guidance and direction to clients and to the firm’s Audit, Tax, Consulting, and Advisory Services practices.  Deloitte is recognized as the leading full-scope professional services firm in Life Sciences. During the course of his long career, Matthew has provided strategic professional services to leading Biotechnology, Pharmaceutical, and Medical Technology companies, as well as Academic Research Centers and regional centers for Life Sciences.  He has worked with leading Life Sciences innovation centers in the U.S. and globally.   He speaks frequently about such topics as digital health, fostering innovation, personalized medicine, the use of technology for innovating clinical research, finance transformation, manufacturing and quality, regulatory compliance, and supply chain.  He was a member of the Board of Directors of BIOCOM, a faculty member and executive sponsor of the UC Berkeley BioExec Institute, a member of the Board of Directors of the Bay Area BioEconomy Initiative, and he was the executive sponsor of Deloitte’s unique innovation collaboration with the University of California. Previously, he was the Chairman and CEO of Accélère, a software company that developed a system to find patients (and investigators) for clinical trials and to improve researchers’ access to information typically “trapped” in laboratory and medical systems. Formerly, Matthew led the global Capgemini Life Sciences Biotechnology and R&D practice.  As a former Partner with Ernst & Young LLP, he founded the firm’s Life Sciences Consulting practice and led the firm’s Biotechnology Consulting practice. He served as a strategic advisor to leading-edge companies in Life Sciences and Technology over a period of more than 17 years. Matthew received an MBA from Santa Clara University and a BA from the University of Connecticut.
 




February 5

Oregon Chapter: Chapter Tutorial  +

Axiom Electronics, 9845 NE Eckert Dr. Suite 200, Hillsboro, OR 97006



AOI & X-Ray Masterclass

 

A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.

 

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.

 

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.

from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.

 

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.
 

AOI and X-Ray Masterclass

 

Keith Bryant

Chairman

SMTA Europe

 

Course Outline

 

The first half of the course will cover all aspects of X-Ray inspection, we will cover the basics of the Technology, in-line, off-line and at-line comparisons, looking at the positives and negatives of each. The latest hardware and software developments, 2D, 2.5D, and 3D (CT) will be explained and compared, together with images of demanding applications.

 

The second half of the event will cover all aspects of AOI technology, from basic 2D through to advanced 3D technology and the technologies between. Looking at the latest 3D advances launched at APEX the week before this event and contrasting them to earlier systems.

 

We will finish with an overview of Industry 4.0 for Inspection and the related Management Information Systems which take inspection into the realms of the SMART Factory of the Future.

 

All those attending will have the option to download my guide ‘BGA and Area Array Process Defects - Causes & Cures’, when it is released later in February

 




February 11

Webinar: Solder Paste Evaluation & Simple Tricks of the Trade  +



Bob WillisMonday 11th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.

There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

  • Solder paste type
  • Low & high temperature alloys
  • Solder beading
  • Solder slump
  • Reflow spitting
  • Flux condensation
  • Printing trials & test boards
  • Common paste & print failures

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


February 11 - 14

Pan Pacific Microelectronics Symposium 2019  +

Location
Kauai Marriott Resort
Kauai , HI


The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.


February 12

Central Texas (Austin) Chapter: CTEA Electronics Symposium at Virtex  +

Virtex Enterprises at 12234 N. I 35 & W. Yager Lane, Bldg A



Central Texas Electronics Association

 
Electronics Design, Manufacturing & Test Symposium 
Tuesday, February 12, 2019
Virtex Enterprises at 12234 N. I-35 & W. Yager Lane, Bldg A
 
Program:
 
2:00  -   Registration Begins
 
2:30  -   Welcome and Virtex Enterprises Factory Overview
 
2:35  -   Virtex Enterprises Factory Tours
 
3:35  -   " Cybersecurity Considerations in a Manufacturing Environment
               Brad Heath,  CEO,  Virtex Enterprises
                    
4:05  -   " When Artificial Intelligence (AI) Meets Human Intelligence (HI): A Road to World Wide
                Intelligence (WWI)
    Adil Dalal, Solution Architecture Director, Hitachi Global Digital Holdings   
   
4:35  -   Break & Networking
 
4:50  -   " Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?
               Greg Caswell, Sr Member of Technical Staff, DfR Solutions
 
5:20  -   " Running Reliably: The World Through the Lens of a Globetrotting Reliability Engineer "
               Cheryl Tulkoff, Corporate Quality & CI Director, National Instruments
 
5:50  -   Door Prizes Drawing & Closing Remarks
 
6:00  -   Food & Refreshments Served and More Networking
 
 
Registration:
 
RSVP to Bob Baker at:  rjbakeratx@austin.rr.com
 
No charge for SMTA and IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
                            Students can also attend for FREE!
 
 
Event Location:
 
Virtex Enterprises at 12234 North I-35 & W. Yager Lane, Bldg A, Austin, Texas
See Map at:   (Map to Virtex)
 
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
 


February 12

Webinar: BGA and Area Array Process Defects - Causes & Cures - FREE for Members!  +



Tuesday, February 12, 2019 | 2:30pm GMT (9:30am US Eastern Time)
Keith BryantPresented by: Keith Bryant, SMTA Europe

Free for members!


What You Can Learn From This Course:

This webinar is FREE for members to attend and is provided by SMTA Europe. The webinar will be presented by Keith Bryant and will also include a brand-new guide to defects produced by Keith and available to SMTA members. During the presentation the methods of detecting defects in manufacture will be discussed and the growing need for more advanced methods.

With many years working in PCB manufacture and assembly Keith has investigated most defect types. As component and substrate technology becomes more advanced, new issues require modification to inspection methods which will be considered during the session.

The BGA & Area Array Defect Guide is a colour booklet featuring both optical and x-ray examples of common and not so common defects. The examples may be cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures. This guide is one of many guides being made available from SMTA.

 

During the webinar the following will be discussed:

  • Area Array Inspection methods
  • Inspection criteria

Selected defect types include:

  • Opens
  • Shorts
  • Voids
  • Head on Pillow
  • Solder wicking
  • Solder beads
  • PCB plating variations
  • Plating voids


February 13

San Diego Chapter: 02/13/2019 Chapter Meeting "Arthur C Clarke, Conscious Competence, and ESD"  +

Location
HME, 2848 Whiptail Loop Carlsbad, CA 92010



Arthur C Clarke, Conscious Competence, and ESD
Presented by Gregg Heckler Regional Sales Manager DESCO

Date: 02/13/19
Registration:
 5:30PM
Dinner: at 5:45PM
Presentation: 6:45PM
HME Factory Tour: 7:45PM

$5 Members and $15 Non Members (Cash or check at the event)
Location: HME 2848 Whiptail Loop Carlsbad, CA 92010

RSVP Link: smta.org/chapters/rsvp.cfm?BEE_ID=4629
 


February 13

Heartland (Kansas, Missouri) Chapter: Voiding under BTCs / Solder Preforms  +

Location
Zarda Bar-B-Q 11931 W 87th St Pkwy, Lenexa, KS 66215



We are excited to announce the SMTA Heartland Chapter's 1st event of 2019!
It will be on Feb 13th, 2019 at Zarda BBQ in Lenexa, KS and feature guest speaker, Kim Flanagan, Technical Support Engineer at Indium Corporation. Kim will discuss two topics: Voiding under BTCs and Solder Preforms. The meeting will also include a meal catered by Zarda BBQ.

Doors will open at 5pm and the meeting will start at 5:30pm.
Price is $15 for members and $25 for non-members.
Please RSVP as soon as possible.


Speaker Bio:

Kim Flanagan is a Technical Support Engineer based at the Indium Corporation who serves customers in the South-West and South-East US, and also Eastern Canada and Puerto Rico.

Kim provides technical support, including guidance and recommendations to customers related to process steps, equipment, techniques, and materials. In addition, she delivers technical training to staff and industry partners.

Kim is a Certified SMT Process Engineer recognized by the Surface Mount Technology Association. She has a background in Physics and has held previous positions in Quality Engineering.




 


February 14

Space Coast (Melbourne FL) Chapter: Study of Void Formation During Soldering  +

Location
Mack Technologies 7505 Technology Drive Melbourne, FL 32904



   
SMTA Space Coast Chapter
Is proud to present a Technical Meeting
"Study of Void Formation during          Soldering"
 
 Understanding how voids in solder joints are formed is important for predicting the long-term reliability of solder interconnects. This presentation discusses the formation of voids in soldering processes including SMT assembly and packaging. Root causes contributing to void formation are identified and classified, and an in-situ observation during reflow is used to recognize the formation mechanism. Additionally, solutions to prevent future void formation are suggested.
 
 
 
The Presenter:
Mr. Watson Tseng of Shenmao Technology
 
 
Watson Tseng
Mr. Watson Tseng has been with Shenmao Technology since 2001 and is the Vice President of R&D and General Manager of Shenmao America. He has more than 17 years of experience in the development of flux, alloy, and solder paste for the SMT and semiconductor industries. Mr. Watson received both his master’s and bachelor’s degrees in Chemical Engineering from the National Taiwan University
 
 
 
 
 
 
Come join us February 14, 2019 at 11:00am at
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993
 
Lunch is included in the admission price.
Members: $10 • Non-Members: $20
Registration fee will be waived if you join SMTA during this event.
Click Here to Join!!!

 
 SCHEDULE

TIME:             11:30AM                     LUNCH
                       12-1:00PM                  Presentation           
                                             
  
RSVP to Jack Reinke or call (404) 290-6744
 
 
 
 
 
 

 


 


February 15

Space Coast (Melbourne FL) Chapter: 2019 Winter Golf Classic  +

Location
Duran Golf Club



February 15th,  2019- Duran Golf Club                             Duran Golf Club 
8:30 am Shotgun Start
Scramble Format
$ 85   Per Player
$340  Per Foursome

Delicious Lunch following the event

The links style characteristics and wide open playability allows golfers to "Play golf" rather than beating the bushes looking for stray golf balls.  Check out the course details on the link above.  Consider being a sponsor for this event !
Be a Sponsor.   Don't miss the opportunity to get your name in front of over 100 SMTA members.  Secure your team spot or sponsorships today.
Please contact Eileen Hibbler at:
email:
 EileenHibbler@gmail.com
cell: (813) 335-7455



February 19

Capital (DC) Chapter: SMTA Capital Chapter Meeting - Presentation and Live Demo on “Non-Destructive BGA/Area Array Component Rework”  +

Location
PACENTER Training Facility



Date: February 19, 2019 @ 5pm
 
Speaker:
Aaron Caplan
Director of Marketing & Training
PACE Worldwide
 
Location:
PACENTER Training Facility
6605 Selnick Drive #C
Elkridge, MD 21075
  

Agenda:
  • 5:30 – 6:15: Registration/Dinner
  • 6:15 – 7:15: Presentation
  • 7:15 – 7:45: Demonstration

 “Non-Destructive BGA/Area Array Component Rework.”
 
Abstract:
In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
 
 
About the Speaker:
Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
 




February 19

Webinar: BGA Reballing- Theory and Hands On  +



Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

Bob Wettermann What You Can Learn From This Course:

This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach.  Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.

This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.


February 20

Empire (Rochester, NY) Chapter: Member Appreciation Annual AHL Hockey Game  +

Location
Blue Cross Arena (Rochester, NY)



The SMTA EMPIRE Chapter has again secured tickets for "Party Deck" glass level viewing of the Rochester Americans AHL Hockey Team as they take on the Cleveland Monsters.  Join us for this social mid-week gathering where you will literally come face to face with players crashing the boards!!

A limited number of FREE tickets are available.  Claim yours today using the RSVP link below!


February 21

Rocky Mountain Expo & Tech Forum  +

Location: West Club at Mile High Stadium
1701 Bryant Street
Denver, CO 80204



Exhibitors

Mark your calendars and plan to attend what is expected to be the Rocky Mountain event of the year. The SMTA Rocky Mountain Chapter is now taking registration for their 2019 Expo. We are expecting a sold out event, connecting exhibitors, and bringing the latest technology to the Rocky Mountain region while presenting impactful and meaningful technical sessions for your continued professional growth. Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 1:00pm.

Click Here for Parking Information



Attendees

Exhibit Hours:

Thursday, February 21, 2019

10:00am-3:00pm

 

THANK YOU TO OUR TOTE BAG SPONSOR:

 

Free Technical Program & Schedule:

8:30am 

Registration Opens

 

THANK YOU TO OUR REFRESHMENT SPONSOR:

 

9:00am-10:00am

Materials Selection for High-Speed PCB Stackup Design

Speaker: Bill Hargin, Z-zero

Everything that happens in the production of a PCB works against signal quality.  The purpose of this session is to introduce design teams to the process of evaluating and selecting the right laminates early in the design process, prior to signal-integrity simulation, creating PCB stackups that meet the requirements of multi-layer boards that work right the first time, with reproducible results across multiple fabricators.

Attendees will be introduced to PCB laminate tradeoffs, the laminate-materials market, and will be exposed to cost-effective strategies for controlling loss and glass-weave skew. 

 

10:00am

Expo Hall Opens

 

10:30am-11:30am 

The Impact of MicroBGA Technology on SMT Processes

Speaker: Chip Spangler, Ph.D., Aspen Microsystems, LLC

Micro BGA technology has reduced the size of the die package to be only slightly large than the die itself.  At the heart of Micro BGA technologies is a combination of advanced materials combined with more wafer-level processing.  While each of the major semiconductor assembly companies has their own variation on Micro BGA technology, many can be grouped into Fan-In or Fan-Out Wafer-Level Packaging (FI/FOWLP). The primary difference in these technologies is related to the size of the die vs the number and density of BGA solderballs. This paper reviews some of the major approaches to manufacturing MicroBGAs and discusses how these differences impact their use in an SMT process.

 

12:00pm-1:00pm

Complimentary Lunch

 

THANK YOU TO OUR LUNCH SPONSORS:

 

1:00pm

Tour of the Stadium

 

1:30pm-2:30pm

The Continuing Miniaturization of SMT

Speaker: Jason Fullerton, Alpha Assembly Solutions

As the demands from users push the electronics in the direction of “smaller, faster, better” in a number of applications, hardware designs are requiring SMT processes to use devices with continually decreasing pitch. This presentation will discuss the devices that are considered ultra-fine pitch technology, including leaded and leadless packages, area array packages, and passive devices. The effects on assembly materials and PCB technology will be discussed, as well as how these devices impact traditional SMT processes and advanced assembly processes that can be used in combination with or in lieu of traditional SMT.

 

3:00pm

Expo Hall Closes

 

3:00pm-4:00pm

Hosted Happy Hour by SMTA and the SMTA Rocky Mountain Chapter.

Cash Bar to follow from 4:00-4:30pm. Everyone is welcome!

 


March 12 - 14

SMT Processes Certification (Guadalajara, Mexico)  +

Location
Guadalajara , JA Mexico


Co-located with Guadalajara Expo.

  • March 12- Course (8:30-5pm)
  • March 13- ½ day of course + exam
  • March 14- All day exam (8:30-5pm)

  • Instruction: English/Spanish
    Test: English
    Instructor: Ivan Castellanos


March 13

San Diego Chapter: 03/13/19 SMTA Chapter Meeting  +

Location
PSemi, 9369 Carroll Park Dr San Diego, CA 92121



More details coming
Sign In: 5:30PM Dinner: 5:45-6:45PM Presentation: 6:45PM
Members $5
Non-Members $15


March 18

Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects  +



Bob WillisMonday 18th March @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

  • Design of lands and apertures for fine pitch SMT & BGA
  • Through hole printing requirements
  • Selection of stencils
  • Evaluation of solder pastes
  • Practical machine set-up and trial prints
  • Elimination of board wash-off
  • Assessment of paste and stencil combinations
  • Solder paste inspection, measurement and quality control
  • Stencil Inspection and quality control
  • Cleaning stencils
  • Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


March 19

Capital (DC) Chapter: SMTA Capital Chapter Tutorial -  +

BWI Airport - More to come



Think Big...Think Small,,,Think Beyond!!!  Everything you want to know about PCB Manufacturing to help you design and assemble a better circuit card assembly!!!
 
  • Solderability Issues from the PCB Fabrication Perspective
    • Speaker – Yaad Eliya
      • Synopsis:
        • The speaker will discuss the PCB Manufacturing process and how it has a direct effect on the solderability process.
        • Items such as plating technique (DC plating vs. Reverse plating), Final finished and other processes that effect the assembly.  
  • Design for Reliability
    • Speaker – Yaad Eliya
      • Synopsis:
        • The speaker will discuss how design aspects can directly affect the reliability of the raw card at the assembly level
        • Items such as Non-functional pads, via-fill, cross hatched grounds, conductor routing, PTH preparations etc.… and their effects on reliability  
  • RF/Microwave Design Considerations and Options
    • Speaker – Yaad Eliya
      • Synopsis:
        • The speaker will discuss the Do’s and Don’ts for RF & Microwave success -
        • Items such as materials, lamination cycles, Single vs. double cavities and “Air Cavity” for varying frequencies will be discussed. 
  • Thermal Mitigation Options at the Raw Card Level
    • Speaker – Jim Barry
      • Synopsis:
        • The speaker will discuss the options available for Thermal mitigations at the raw card level.
        • As designs get smaller and faster, high temperature is becoming a big issue – we will look at Materials, Heatsinks and Coins to help mitigate heat. 
  • DFM at the PWB Stage
    • Speaker – Shlomi Danino
      • Synopsis:
        • The speaker will discuss what happens with the PCB Design once it reaches the PWB Manufacturer – the “upfront process”
        • We will review how design decisions can affect reliability, IPC Classifications, cost and lead-time. 

Other possible topic discussions:
  • Enhanced Flex Materials
  • Cavity Applications
  • Improved PCB Processing tools
  • Stacked Via process and reliability



March 19

Mexico - Querétaro Chapter: Technical Meeting - Students Chapter - SMT Processes Basics  +

Location
UTEQ



Este evento esta enfocado a estudiantes de Ingenieria, convocatoria abierta a todas las Universidades Locales.
Evento sin costo, Cupo limitado. Reserva tu asistencia !! 


March 19 - 21

SMT Processes Certification (Dallas, TX)  +

Location
Plano Center
Plano , TX 75074


  • March 19 Course (8:30-5pm)
  • March 20 ½ day of course + exam
  • March 21 All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


March 19

Dallas Expo & Tech Forum  +

Location: Plano Event Center
2000 E. Spring Creek Pkwy
Plano, TX 75074



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on February 16th, 2019!

Important Exhibitor Materials:


Plano Convention Center - Dallas See You at the Plano Centre! 2000 E. Spring Creek Pkwy, Plano, TX 75074

 

 

Book a discounted room rate at the Hilton Garden Inn Dallas/Allen by February 25, 2019.

705 Central Expressway South, Allen, Texas, 75013, USA

Group Code: SMTA GROUP

214-547-1700

Book Rooms Today!  



Attendees

Free Technical Program & Schedule:

More information to follow...

7:30am

Registration Opens

Thank you to our Technical Sessions Sponsor:

10:00am

Expo Opens

 

3:00pm

Expo Closes

 

Thank you to our Door Prize Sponsor:

 

 

Thank You to Our Lunch Sponsor:

 

Thank You to Our Tote Bag Sponsor:

Element Materials


March 21

Houston Expo & Tech Forum  +

Location: The Stafford Centre
10505 Cash Road
Stafford, TX 77477



Exhibitors

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $50 per booth. Early bird expires on February 21, 2019!

 

 

Discounted Hotel Rooms - Available Here:

Hampton Inn Stafford - SMTA Expo Houston



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, March 21, 2019
9:00AM–3:00PM

 

Thank You to Our Lunch Sponsor:

 


March 26

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Boise Expo  +

Boise State University



Vendor Expo and Techincal Presentations.  More Info coming.


March 26

Intermountain (Boise) Expo & Tech Forum  +

Location: Boise State University
Student Union Building - Jordan D Ballroom
1910 University Drive
Boise, ID 83725



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on Feburary 22nd, 2019!

Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
 


April 1 - 4

Electronics in Harsh Environments Conference 21% Dutch VAT is included in the listed prices. SMTA VAT ID: NL 825808960B01  +

Location
Amsterdam Netherlands


The conference will focus on building reliable electronics used in power electronics and harsh environments.


April 2 - 4

Electronics in Harsh Environments Expo  +

In conjunction with the Electronics in Harsh Environments Conference

Location: Radisson Blu Hotel Amsterdam Airport
Boeing Avenue 2
Schiphol-Rijk
Amsterdam NL-1119 PB



Exhibitors

Exhibit Hours:Download the Application

Tuesday, April 2: Afternoon

Wednesday, April 3: Full Day

Thursday, April 4: Full Day

 

Exhibitor Table Top Options:

(Inside the Conference Room - Limit 9)
$1550 | €1350

  • Utilize your time the best by being inside the room! Get in front of our attendees the whole conference and make sure you don’t miss out on the action!
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration ( a €725 value!)

 

(In the Foyer – Limit 10)
$1225 | € 1050

  • Promote your company in our private foyer! All refreshment breaks as well as the reception take place here.
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration ( a €725 value!)


Sponsorship Opportunities:

  • Premier Conference Sponsor - $2000/€1780 (limit 2)
  • Reception Sponsor - $1700/€1525 (limit 2)
  • Keynotes Sponsor -  $700/€625 (limit 1)
  • Lunch Sponsor - $500/€425 (limit 3)
  • Refreshment Break Sponsor - $500/€425 (limit 4)
  • Lanyard Sponsor $200/$400 (limit 1)


April 2

West Penn Expo & Tech Forum  +

Location: DoubleTree Monroeville
101 Mall Plaza Blvd.
Monroeville, PA 15146



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on March 1, 2019!
 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Monroeville



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Wednesday, April 2, 2019
9:00AM–3:00PM



April 9

Empire (Rochester, NY) Chapter: SMTA EMPIRE Chapter EXPO 2019  +

Location
Holiday Inn Syracuse-Liverpool (I-90 Exit 37)



DATE CONFIRMED!

IPC Hall of Famers Dave Hillman and Doug Pauls from Rockwell Collins will be the featured speakers at our 2019 EMPIRE Expo Event!  Their electronics assembly topics of wisdom include:                                                                        
  • BGA Solder Joints
  • Bottom Terminated Components
  • Voids
  • Mixed Lead Free and Tin Lead Soldering
  • New Cleanliness Standards, J-STD-001 Requirements 

Stay tuned to the SMTA Empire Chapter website for posted updates regarding this event!


April 9

Empire Expo & Tech Forum  +

Location: Holiday Inn Syracuse/Liverpool
441 Electronics Parkway
Liverpool, NY 13088



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Holiday Inn Syracuse-Liverpool by March 9, 2019.

Group Code: SMTA

315-457-1122

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Wednesday, April 9, 2019
10:00AM–4:00PM

 


April 10

San Diego Chapter: 04/13/19 SMTA Chapter Meeting  +

Location
Palomar Technologies Inc. 2728 Loker Ave West, Carlsbad CA 92010



Palomar Techologies will be presenting a white paper with a live demo and factory tour...
Date: 04/10/19
Registration: 5:30PM
Dinner: at 5:45PM
Presentation: 6:45PM

$5 Members and $15 Non Members
Location: Palomar Technologies Inc., 2728 Locker Ave West, Carlsbad CA 92010
 


April 11

Atlanta Expo  +

Location: Atlanta Technology Park
107 Technology Parkway
Peachtree Corners, GA 30092



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Hywatt Place by March 13, 2019.

5600 Peachtree Parkway Norcross, Georgia, United States, 30092

Group Code: SMTA 

770-416-7655

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

 

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:

 

THANK YOU TO OUR LUNCH SPONSOR: 

ITS

THANK YOU TO OUR SNACK SPONSOR:

 

THANK YOU TO OUR RECEPTION SPONSOR: 


April 29

Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys  +



Bob WillisMonday 29th April @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 2

Carolinas Expo & Tech Forum  +

Location: DoubleTree by Hilton - Research Triangle Park
4810 Page Creek Lane
Durham, NC 27703



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 1, 2019!

 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Research Triangle Park



Attendees

Exhibit Hours:
Thursday, May 2, 2019
10:00AM–3:00PM

Free Program and Technical Schedule Coming Soon!

 


May 3

Dallas Chapter: To Be Determined  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Will be announced soon!

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on May 3, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

TBD.

Biography

TBD.


May 7

Wisconsin Expo & Tech Forum  +

Location: Milwaukee Airport Crowne Plaza
6401 S 13th St,
Milwaukee, WI 53221


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.



Attendees

Attendees can register on the SMTA Wisconsin Chapter page.

Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


May 9

Huntsville Expo & Tech Forum  +

Location: Stone Event Center/ Campus 805
2620 Clinton Avenue
Huntsville, AL 35805



Exhibitors

The cost to exhibit for corporate members is $375/$475 (early/late) and $450/$550 (early/late) for non-corporate members. The cost to exhibit includes: one 6ft draped table, two chairs, company sign, directory listing and attendee list. Electricity is an additional $30 per outlet. Earlybird pricing expires April 12th, 2019! 

Important Exhibitor Materials:

Book a discounted room rate at the Springhill Suites by Huntsville Downtown  by April 17, 2019.

 745 Constellation Place Drive SW, Huntsville, Alabama 35801 USA

Group Code: SMTA 

256-512-0188

Book Rooms Today!  

 



Attendees

Free Technical Program & Schedule:
8:00AM
Registration opens
 

More information to follow...

 

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:


May 16

Puget Sound Expo & Tech Forum  +

Location: DoubleTree by Hilton Seattle Airport
18740 International Boulevard
Seattle, WA 98188



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on April 12, 2019!

 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton Seattle Airport



Attendees

May 20

Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process  +



Bob WillisMonday 20th May @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 21

Medical Electronics Sponsorship and Table Top Exhibit  +

Elyria, OH



Exhibitors

Reasons to Participate

Click here to see why you should participate!

 

Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below. For more information contact Jenny Ng at SMTA, jenny@smta.org or call 952-920-7682.

View Sponsorship Benefits

 

Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is April 15, 2019. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above. For a printable application form, click here.

 

Exhibiting Information

The conference will include an exhibition area featuring 25+ tabletop displays that will be open during conference breaks plus after hours.

Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings

 

 

Exhibit Pricing:
Member* (*MEPTEC/SMTA): $550
Non-member: $650


Exhibit Hours:
May 21: 10:00am – 5:00pm


Please note that exhibit traffic will be minimal while symposium is in session. Please e-mail SMTA at medical@smta.org or +1-952-920-7682 for sponsorship or exhibitor information.



Attendees

 

Exhibit Hall Hours:

May 21: 10:00am – 5:00pm
To Register for the technical conference, click here.


May 21 - 22

Medical Electronics Symposium 2019  +

Location
Lorain County Community College
Elyria , OH


2019 Symposium Details Coming Soon

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

 

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

 



June 4 - 6

International Conference for Electronics Enabling Technologies 2019  +

Location
Markham , ON Canada


The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.


June 5

SMTA Ontario Chapter Expo & Tech Forum  +

In conjunction with the International Conference for Electronics Enabling Technologies (ICEET)

Location: Venture Lab
3600 Steeles Ave. East
C-C106
Markham, ON L3R 927



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on May 3, 2019!  

 



Attendees

 


June 7

Dallas Chapter: To Be Determined  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Will be announced soon!

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on May 3, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

TBD.

Biography

TBD.


June 17

Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions  +



Bob WillisMonday 17th June @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



June 25 - 27

Symposium on Counterfeit Parts and Materials 2019  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD


2019 call for abstracts and registration is now open. The program will be finalized in Spring 2019. 

 

Counterfeit Symposium Panel Discussion

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

 


 

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 



The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


June 25 - 26

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

Sponsorship Opportunities:

**All Sponsorships require an exhibit booth reservation**
 

Lanyard Sponsorship (Limit 1) - $500 - Company to provide lanyards

Provide your company lanyards and they will be the official lanyard for the conference.

You will receive logo recognition in the show directory, conference website and signage.


 

Tote Bag Sponsorship (Limit 1) - $400 (if provided by company/$800 if produced by SMTA)

Provide your logo on all of the conference attendee bags! If you would like SMTA to produce the tote bags, it will

 be an extra $400. There will also be recognition in the show directory and website.



Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

 

Exhibitor Information:

Contact Jenny Ng for available booth space. 952-920-7682 or jenny@smta.org Please note that exhibit traffic will be minimal while symposium is in session.


Click here to view floor plan.

Exhibit space entitles you to:

 

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings
  • Download a hard copy of the registration form

    Cost to exhibit:
    Rates increase $100 after May 31, 2019
    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $550 $650
    One table
    no access to Electrical Outlet
    $500 $600

     

 



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks


    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


June 27

Upper Midwest Expo & Tech Forum  +

Location: DoubleTree by Hilton Minneapolis - Park Place
Park Ballroom
1500 Park Place Blvd.
Minneapolis, MN 55416



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on May 31, 2019!

Important Exhibitor Materials:

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, June 27th, 2019
9:00AM–3:00PM

 

 


July 11

Mexico - Querétaro Chapter: Table Top - Technical Forum  +

Location
Hotel Mision Juriquilla



Table Top Exhibition and Technical Forum 
Conferences to be announced soon


July 11

Queretaro Expo & Tech Forum  +

Location: Misión Grand Juriquilla, Queretaro
Blvd Villas Del Meson 56
Juriquilla, QR 76230



Exhibitors

The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $55 per outlet. Early registration pricing ends on June 10th, 2019!

Important Exhibitor Materials:

 

 

Booths are assigned in the order they are received. 

Important Exhibitor Materials:

  •  In the case of bank transfers, the dollar exchange rate must be calculated on the basis of the interbank purchase price and not the selling price. All transfers require an additional $50 USD.    
  • To pay by wire transfer please contact SMTA HQ. 1-952-920-7682 or hannah@smta.org
  • Please contact SMTA Expo Manager Hannah Funk with questions or for additional information.



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Please see the Queretaro Chapter Page for More Information on Technical Sessions.

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, July 11, 2019
11:00AM–6:00PM

 


July 15

Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process  +



Bob WillisMonday 15th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


July 18

Heartland Expo & Tech Forum  +

Location: Marriott Kansas City Overland Park
10800 Metcalf Avenue
Overland Park, KS 66210



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on June 7, 2019!

 



Attendees


August 8

Ohio Expo & Tech Forum  +

Location: Holiday Inn Cleveland Strongsville
15471 Royalton Road
Strongsville, OH 44136



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on July 8, 2019!
 



Attendees

August 12

Webinar: Conformal Coating - Successful Implementation & Quality Control  +



Bob WillisMonday 12th August @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



August 22

Capital Expo & Tech Forum  +

Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends August 2nd, 2019!

Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, August 22nd, 2019
9:00AM–3:00PM
Registration Opens at 8:00AM
 


September 22 - 26

SMTA International 2019  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


September 24 - 25

SMTA International Electronics Exhibition  +

Location: Donald E. Stephens Convention Center
Rosemont, IL


Exhibitors Register Now
Exhibitors

SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


September 24 - 26

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • September 24 - Course (8:30-5pm)
  • September 25 - ½ day of course + exam
  • Spemteber 26 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 8

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8ft pipe & draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird rates expire on September 13, 2019!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up. 

 



Attendees

Free Technical Program & Schedule Coming Soon!

 

 



October 15

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15, 2019!



Attendees

October 22 - 24

International Wafer-Level Packaging Conference  +

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.



October 23 - 24

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2019 After April 30, 2019
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.


October 23 - 24

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-4:30pm
4:30pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-4:00pm
Move out: 4:00pm-7:00pm

 


IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 28

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Utah Expo  +

TBD



Utah Vendor Expo actual date and location TBD.  Will not be at U of U this year.


November 5

San Diego Chapter: Technical Expo Nov 5 2019  +

Location
Escondido Center for the Arts Conference Center



Don't miss this event! For more details contact Courtney Kalb Exhibitions Manager SMTA....Email: courtney@smta.org Phone:(T) 952 920-7682 (F) 952 926-1819

Information for attendees will follow shortly...


November 5

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!


November 7

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!


November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

 



Attendees

Exhibit Hours:
Wednesday, January 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:
 



December 4

Silicon Valley Expo & Tech Forum  +

San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 15th, 2019!

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:00PM

Free Technical Program & Schedule:
Information to follow...



Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819