Calendar of Events

   2019      

                                   

2019

September 18

San Diego Chapter: SMTA San Diego Chapter Meeting  +

Location
Technology Career Institute 2075 Las Palmas Drive Carlsbad, CA 92011



Topic:   Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard
Speaker:  Mike Konrad, Aqueous Technologies


The widely anticipated revised cleanliness testing standard is now active. What’s next? This presentation will cover the requirements of the new IPC J-STD001-G Amendment 1 cleanliness testing standard. What’s new, what stays the same? This presentation will uncover the details of the new standard, especially the “Objective Evidence” requirement of the new specification.

Mike's Bio:
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the Surface Mount Technology Association (SMTA) in 2017.

Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992. Mike is also the host of the Reliability Matters podcast, available on iTunes, Spotify, and Spreaker.com.

Registration:  4:45 PM
Social/Dinner:  5:00 PM
Technical Session:  5:30 PM

Can't join us in Carlsbad? Sign up for our virtual meeting!




September 18

Connecticut Chapter: SMTA on Tap!  +

City Steam Brewery, 942 Main St., Hartford CT



        



Calling all beer lovers!  Wine or mixed drink lovers too!
 

Come join the SMTA-Nutmeg chapter for a fun evening of drinks, games and networking with your fellow SMTA industry peers. The City Steam Brewery in downtown Hartford is a historical building that now brews beer with – you guess it – steam! With your event registration we are offering a brewery tour, a City Steam brew (beer or wine), heavy hors d/oeuvres and the chance to win some great door prizes simply by completing a quick survey to help plan future events that would be of interest to you! 

When: Wednesday September 18, 2019 at 5:30pm-8:00 pm (approx)

Where: City Steam Brewery, 942 Main St, Hartford, CT  06103

Registration:  SMTA Members $20 / Non-SMTA Members or expired memberships $25
REGISTER NOW AT:  https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4751


A few other important notes:

·         Must bring valid ID to be served alcohol at the brewery

·         Must be 21 or older to be granted a complementary drink ticket (wine/beer only)

·         Cash Bar available for additional libations

·         Park at Market Street Garage or Temple Street Garage (both within a short walk of brewery)

It’s sure to be an evening of fun and friendships, so mark your calendars and take a moment to register now at     https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4751
 

We look forward to seeing you soon - please feel free to contact the undersigned with any questions.


Best regards,
Jenny Hopewell, President

HOPEWELL COMPANIES

Manufacturing Services and Solutions
Office: 508 488-6402 | Cell:  617 970-5957 | Email:  Hopewell@HopewellCompanies.com | LinkedIn: http://www.linkedin.com/in/jennyhopewell/

 

  

 




September 18

Empire (Rochester, NY) Chapter: September Networking With Ambrell Induction Heating Solutions  +

Location
Ambrell Corporation



What:  SMTA Empire Chapter Technical Event
Where:  Ambrell Corporation, 1655 Lyell Avenue, Rochester, NY 14606
When:  Wednesday September 18, 5:30pm - 8:00pm

Details:
You may have heard of cutting edge induction food cooking, where electromagnetic coils under the glass cooktop surface transfer energy into metal objects that produce heat.  The cooking vessel is heated while the cooktop itself stays cool.  Ambrell Corporation specialize in making the industrial version of such induction heating appliances, capable of heating a solid steel bar from room temperature to 2220°F (1204°C) in just 20 seconds!  Come join us to learn about Ambrell’s fascinating induction heating technology and tour their new 80,000 square foot $2.1 million facility.  We’ll also provide discussion about various programs available offering grants and funding to facilitate local business growth opportunities.

This event is sponsored by your local SMTA Empire Chapter.  We welcome both SMTA members and industry professionals to attend at this no charge venue.  Courtesy pizza, wings, and beverage will be supplied.

Agenda:
5:30pm: Registration, Networking, Food & Beverage
6:00pm: Welcome / Introductions
6:10pm: “The Ambrell Makeover”*, Mitch Szydlowski, Director of Operations, Ambrell Corp.
6:45pm: “SBIR / STTR Funding Opportunities”, Dr. Martin K. Anselm, Director CEMA Lab, RIT
7:20pm: Ambrell Facility Tour and Demonstrations
8:00pm: Event Closes

*Title subject to change

RSVP
Please register to attend by clicking on the RSVP link below by Tuesday September 17, 2019 6:00pm.  We will contact you to confirm your participation and update you with event notifications.

For more information about Ambrell: https://www.ambrell.com/
 



September 22 - 26

SMTA International 2019  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


September 24 - 25

SMTA International Electronics Exhibition  +

Location: Donald E. Stephens Convention Center
Rosemont, IL


Exhibitors Register Now
Exhibitors

SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


September 24 - 26

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • September 24 - Course (8:30-5pm)
  • September 25 - ½ day of course + exam
  • September 26 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


September 25 - 26

Arizona-Sonora Chapter: Double Feature Meeting with Phil Zarrow and Facility Tour  +

Tucson, AZ & Tempe, AZ




SAVE THE DATE!
The SMTA Arizona/Sonora Chapter invites you to attend
Double Feature:
Presentation and Facility Tour
Join us for our first meeting of the year, hosted by
DATAFORTH INC. in Tucson and MEDTRONIC INC. in Tempe.
World-renowned speaker Phil Zarrow from
ITM Consulting will present “The Deadly Sins of SMT”.
We will tour the facilities and dinner will be provided.

 
Wednesday, Sept. 25th, 2019
4:00pm
DATAFORTH INC.
3331 E. Hemisphere Loop
Tucson, AZ, 85706

Thursday, Sept. 26th, 2019
4:00pm
MEDTRONIC INC.
2343 W. Medtronic Way
Tempe, AZ 85281

 
More details to follow.



October 4

Dallas Chapter: Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard

Speaker: Mike Konrad, Founder and President, Aqueous Technologies

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on October 4, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

This presentation covers the requirements of the new IPC J-STD001-G Amendment 1 cleanliness testing standard. What’s new, what stays the same. This webinar will uncover the details of the new standard, especially the “Objective Evidence” requirement of the new specification.

Biography

Mike Konrad, Founder and President, Aqueous Technologies
 

Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 34 years. Mike has designed several automated cleaning and cleanliness testing machines, has published scores of technical articles on the subject of cleaning and cleanliness assessment has been a member of Editorial Boards for several industry publications.
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the electronic assembly trade association’s Surface Mount Technology Association (SMTA) in 2017.
 
Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992.
 
Mike is the Founder and President of Aqueous Technologies and is also the host of the Reliability Matters podcast, available on iTunes, Spotify, and iHeart Radio, Reliability.fm
 




October 8

Wisconsin Chapter: WI SMTA Technical Meeting and SMT Facility Tour- JW Speaker Corporation  +

JW Speaker N120W19434 Freistadt Rd. Germantown, WI 53022



 WI SMTA Technical Meeting and Tour at JW Speaker 

Please join the WI SMTA as Eric Van Cuyk of Circuit Check
will be presenting on Function Testing Simplification / Flexibility
Cost is $20.00 per SMTA member / $25.00 non- members

 Schedule as follows: 
4:15pm-  Registration
5:00pm-  Welcome / Dinner
6:00pm- Presentation
7:00pm- Facility & Mfg Tour
8:00pm- Meeting Adjourned


 


October 8

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes

  • One 10ft pipe & draped booth
  • 1 Table
  • Two chairs
  • Company sign
  • Lunch
  • Directory listing
  • Registrant list.

    Discounted registration rates expire on Friday, September 13, 2019!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up.

      Book Your Hotel with the SMTA Discount: Click Here Use the code "SMTA"



Attendees

Free Technical Program & Schedule Coming Soon!

 

Thank You to Our Lunch Sponsor:

 

Thank You to Our Refreshment Sponsor:

 

Thank You to Our Technical Sessions Sponsor:

 

Thank You to Our Tote Bag Sponsor:

 

7:00AM

Registration Opens
 

7:30AM - 8:10AM 

The Basics of SIR and ECM

Speaker: Meagan Sloan, Indium Corporation

SIR (Surface Insulation Resistance) and ECM (Electro chemical migration) test the electrically conductive and corrosive nature of a flux residue after being exposed to heat and humidity. These tests are important in the electronics industry and are increasingly being used by paste and electronics manufacturers to determine the long-term reliability of flux residues.

SIR and ECM tests can be used for all types of fluxes including wave flux, solder paste, and rework flux. They are also commonly used for compatibility testing for multiple products that will be combined with different vendors’ products. 

Preparation of the coupons for testing is key to obtaining the results that solder material providers have outlined. If not prepared correctly, the results will differ significantly from the paste manufacturer’s results. Contamination can come from a variety of sources and adversely affect the testing.

Knowing the procedures for SIR and ECM, the test parameters for both, and the difference between the revisions of the tests helps ensure accuracy of the results that determine if the flux residue passes or fails the testing. 

 

8:10AM - 8:50AM

Reliability of Robotics for Electronics Manufacturing

Speaker: Bubba Powers, Weller Professional Tools

Reliability of electrical or electronic soldering has always been paramount for the success of long-term market share and presence for electronics manufacturers. Process control is the key to ensuring manufacturers produce high quality and reliable products within their respective fields. In today’s environment of automation and high tech electronic controls, high reliability in electronics manufacturing is now more critical than ever before.

Automation is one approach to achieving the pinnacle of high reliability in electronics manufacturing, as repeatability and traceability are two keys to maintaining optimum process control. However, it is the responsibility of every employee to maintain and control these processes whether they are automated or manual.

In a world of trending automation and artificial intelligence in all of our surroundings, one slight miss can mean the difference in the success or failure of any electronic product. A failure in the manufacturing process could be insignificant if it is a cell phone, a play station or a television, but it can be of major consequence if it affects the electronics in the car that your family is in, the flight that your spouse is on or the technology that your military member is utilizing.

Join us for an overview of the process of automation in the soldering workplace and a discussion of what factors are just as critical for high reliability electronics regardless of whether you are working with a manual or an automated manufacturing environment.  

 

8:50AM - 9:30AM

Perfecting a Cleaning Process for Hi-Rel Electronics

Speaker: Tom Tattersall, MicroCare Corporation

Reliability is a continuum of performance based on product complexity and anticipated product life-span. To be successful over the long-term, hardware with demanding performance requirements (e.g., military and medical) or with long service lives (e.g., aerospace, transportation and telecom) need to be engineered from the start with a focus on reliability.

Cleaning enhances reliability, but not every product needs maximum reliability. This means cleaning becomes an important tool in the production engineer’s toolbox. Cleaning offers a simple economic trade-off: it adds manufacturing costs but can speed throughput, slash waste, minimize warranty expenses, extend product service lives or enable new capabilities. Balancing these options properly can enhance profitability.

Most companies are unaware that modern solvent cleaning systems are extremely cost-effective and environmentally benign. This section of the Reliability Workshop will focus on understanding the cost-benefit trade-offs which underpin critical cleaning. In this workshop, the Cleaning Experts from MicroCare will discuss:

1.       Quantifying the Reliability Requirements for a Product

2.       Understanding the Various Types of Contamination and Their Effects

3.       Modern Cleaning Choices Compared

4.       The Hidden Costs of Bad Cleaning

5.       Measuring Cleanliness and Performance

 

10:00AM

Expo Opens

 

11:30AM

Complimentary Lunch

 

12:00PM - 1:00PM

KEYNOTE: Collaborative Robot Use Cases in Electronics Manufacturing

Speaker: Eric Cowan, Stanley Black & Decker

Automate - focused on I40 from an automation perspective.
1. What is I40 and why is it important. Labor is a major issue facing US manufacturing. We can’t hire enough people.
2. SBD I40 organization and Journey
3. How I40 impacts operations Examples of (IIOT, Apps, Analytics, Additive, Cobots/Mobile)
4. Upskilling and what the new manufacturing environment looks like (Manufacturing jobs are High Tech jobs)

 

2:00PM - 3:30PM

Triple Jeopardy Electronics - Are You Game?

Speakers: Chrys Shea, Shea Engineering Services

Dr. Mark Currie, Henkel Electronics

Dr. Neil Poole, Henkel Electronics

The electronics industry is faced with challenges that often require immediate, yet long term reliable solutions. From a handheld device to a defibrillator, an automobile, or even a space station, each form factor in each of its respective markets expects robust manufacturing processes that create reliable products and sustainable solutions that match the customers’ expectations.

Implementing new, or off the shelf solutions can raise flags. Why? Lack of experience with any given technology naturally generates risk aversion, and in many cases, rightly so. To effectively adopt new solutions for high reliability applications, the strategy should be:

1)   understand external forces,

2)   overcome the lack of experience (that in essence have made us forget how to transition and improve and implement new technology), and

3)   Implement solutions once we understand the application, while avoiding mistakes or oversights at all costs.

Triple jeopardy will seek the questions to answers on topics such as: Regulations; Whiskers; Failure Modes; Process Metrics; Compatibility; Sustainability; Inspection, Reliability; Qualifying new materials, Do’s and Don’ts, and many others, in an interactive session, where the audience understands the symptoms, and the doctors will advise on root cause solutions.....

 

4:00PM

Expo Closes


October 10

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting: Operations Factory Tour: Lockheed Martin RMS, Oldsmar, FL  +

Location
Oldsmar, FL



SMTA Tampa Bay Chapter presents
Lockheed Martin RMS Oldsmar, FL Operations Factory Tour
Providing affordable CCA’s, Cables, Rack Integration, and Consoles for over 45 years.

Our meeting this quarter will be held at the following address:
Lockheed Martin
3655 Tampa Rd.
Oldsmar, FL 34677



Thursday October 10th:
5:30- Registration/ Meet and Greet
5:30- Dinner
5:45- 6:00-  Introduction factory overview presentation.
6:00-7:00- Factory Tour Presentation
7:15-7:30- Question and answer wrap up.

Cost of Meeting:
Members- $15.00
Non-Members- $20.00

We hope to see everyone at the meeting!



  ******RSVPs required in advance, attendees must be US Citizens or US Permanent Residents.  (Deadline to register is 10/7/19 at 5PM)  All participants will have to bring a government issued photo ID for entry.  The following forms of Photo ID are permissable:  Passport, US Permanent Resident Photo ID, US State Issued Driver’s License or US State issued ID card.  We can not accept any student IDs, company issued IDs or library cards. No walk-ups will be permitted. ******


 


October 10

Capital (DC) Chapter: SMTA Capital Chapter Meeting - October 10, 2019  +

The Test Connection Inc.



The SMTA Capital Chapter is hosting a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at The Test Connection Inc., Hunt Valley, MD. Will Webb, Aster Technologies, will be presenting “Enhanced Manufacturing Services 4.0.” 
 
This presentation will provide an overview of the opportunities for test data to be gathered and looked at from design, manufacturing inspection, manufacturing process test, and functional validation testing. This processes yield some great sources of process feedback that design and production with connection of machines, sensors, devices and people. We will look at convert data into information and explore the Digital Simulation: Create a virtual copy of the physical world. Play with “Whatif” scenarios in the virtual word in order to identify the optimized physical flow. Use theoretical results to control the physical world. Finally, we will aggregate raw data from cyber-physical systems to build and visualize comprehensive information that allow humans to make decisions based on facts.

Will Webb has worked in the manufacturing test industry for over 20 years and is now employed by ASTER Technologies as the Technical Director of the ASTER USA office. Will is responsible for technical support and creating new business opportunities for the ‘TestWay’ Electrical DFT and Fault Coverage Analysis tools. Prior to working for Aster Technologies, Will has worked for a number of different OEMs and CM’s in the manufacturing test field, responsible for DFT analysis, test coverage analysis, test development and overseas deployment of manufacturing tests.

The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation

The SMTA Capital Chapter Meeting Location:

The Test Connection Inc.
112 Lakefront Drive
Hunt Valley, MD 21030

Register NOW!


 


October 14

Webinar: Practical Failure Analysis Methods in Printed Board Assembly  +



Bob WillisMonday 14th October @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.

 

Topics include:

  • Optical and X-ray inspection
  • Solder joint crack detection
  • Microsectioning
  • Component opening techniques
  • Surface analysis
  • Shear testing
  • Question and answer session

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


October 15

Europe Chapter: Selective Soldering Workshop  +

Location
Henkel, Hemel Hempstead, UK



Lead-Free & Tin/lead Selective Soldering, Design, Quality Control & Practical Defect Solutions

Bob WillisInstructed by: Bob Willis, SMTA Europe

For many organisations, through-hole components will remain a reality for many years. More and more surface mount components are used in design and through-hole is in decline; however, the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution for through-hole soldering in a lead-free environment? 

Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys?

This workshop will look at systems, materials and process but also design for manufacture along with the most common defects and cures. Delegates can bring thier boards or example defects for discussion.

Topics Covered:
  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Flux contamination and corrosion issues
  • Automated through hole inspection
  • Soldering defects on selective - Causes and Cures

Price to Attend:
SMTA Member price is £85 plus VAT
Non member price is £175 plus VAT

Book Delegate Places Here!

The workshop will be held at Henkel, Technologies House, Wood Lane End, Hemel Hempstead HP2 4RQ
Tuesday 15th October starting at 10.00am with coffee and tabletops from 9.30am

Table Tops Exhibition Space
Table Top Booking price is £350 +VAT for SMTA Corporate or Global members and £500 + VAT for non members
A limited number of tables are available. 

Register for a table top space here!

 

Additional Training Opportunities:
Online Training
During the workshop delegates will be able to see examples of the latest online training courses offered by SMTA and ask questions on their use by members

Onsite Training
Onsite training is also available from SMTA Europe. For a list of the topics covered and the costs contact Ryan Flaherty SMTA ryan@smta.org

Thank you for supporting SMTA Europe.


October 15

SMTA Europe Selective Soldering Workshop  +

Location
Henkel
Hemel Hempstead UK



October 15 - 17

SMT Processes Certification (Melbourne, FL)  +

Location
Mack Technologies
Melbourne , FL 32904


 

  • October 15 - Course (8:30-5pm)
  • October 16 - ½ day of course + exam
  • October 17 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 15

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15, 2019!

 



Attendees

 

Thank You to our Beer Cart Sponsors:

 

8:00am

Registration Opens

 

9:00am

"Preparing for 5G and Collaborative Technologies in Austin"

Speaker: Fawzi Behmann, TelNet Management Consulting

Modern cities and municipalities are confronted with an increasing need for real-time response and advanced measures to provide a smart & safe environment and provide residents with well-being and a quality of life.

Collaboration, standards, and a risk-based approach leveraging disruptive technologies such as 5G, IoT, Analytics are becoming the future platform for launching an innovative and collaborative approach for smart connectivity, capabilitie,s and smart solutions targeting key use cases.

This presentation will address key technological concepts of disruptive technologies and applications spanning sensing & surveillance, intelligent software and services, high-speed communications networks to harmonizing multi-source systems, and AI/data analytics for key verticals. This will transform the city/municipality towards a scalable and sustainable Smart and Safe environment.   Several examples and benefits will be highlighted followed by an outline for successful implementation, deployment, and adoption.

 

9:30am

"Identifying Defects on BTC Assemblies with X-Ray Analysis"

Speaker: Bill Cardoso, Ph.D., Creative Electron, Inc.

The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to become an integral part of the quality assurance function of modern electronic manufacturers.

However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. For example, what level of resolution is necessary for a specific application? Is an open tube or sealed source the most appropriate technology to deploy?

The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. Instead of focusing on the x-ray technology per se, this work starts from the application needs of the electronic industry and ties it back to the available technology offerings available in the market today. The goal is to set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.

 

10:00am

Trade Show Opens

 

11:00am

"A Strategic Approach to Innovation - Yes, You Can Find Opportunities without Wasting Time or Money"

Speaker: Steve Pearson, Pearson Strategy Group

Innovation is often exciting and profitable, but it also can be expensive and distracting.  Does every new idea send you and your colleagues fleeing runaway brainstorms, out-of-control costs, and unrealistic expectations?  What if there was a logical, organized approach to your company’s innovation process?  Not surprisingly, many successful large companies have instituted a system to manage innovation processes for the highest return.  Tools include competitive intelligence, tech scouting, stage-gates and innovation pipelines.  These strategic components help them avoid surprises, wasted effort, extra expenses, and erratic cash flows.  The best news is that these tools can be used by any size company, even by individuals.

In this presentation, we will answer questions about these methods and systems including:  How do these tools work?  What are their specific benefits?  Would they benefit your company and how?  How would you implement some or all of these methods?

 

12:00pm

Complimentary Lunch

 

1:00pm

Door Prize Drawings and More Networking

 

1:30pm

"Not Just for Software - Innovation Frameworks for the Hardware/IoT"

Speaker: Shawn O'Keefe, 1st Assembly Supply

From design thinking to lean startup to agile methodologies, a number of innovation processes have become standard operating procedure for many who are building software companies.  But what if your product or service involves hardware?  Come learn how the latest tools and frameworks can be adapted to meet the needs of the hardware and IoT sector.

 

3:00pm

Trade Show Closes


October 16

Massachusetts (Boston) Chapter: Joint Meeting ESD and Fires and Explosions at BAE Systems in Nashua, NH  +

Location
BAE Systems, 65 Spit Brook Road, Nashua, New Hampshire 03060



SMTA Boston Chapter, ESDA, IEEE Rel Chapter, and iMAPS jointly cordially invites you to an evening meeting on Wednesday, Oct. 16, 2019 at BAE Systems in Nashua, NH.
“ESD AND FIRES AND EXPLOSIONS”
 
Abstract:  Many of us understand the hazards of electrostatic discharge to electronics. This talk covers the basics of electrostatic ignition, its sources and methods for prevention. It will also cover the issues of personnel comfort/ dangers around extreme charging situations such as moving webs. Case studies of fires, explosions and personnel injuries will be included. It is intended to present the issues of dangers from ESD. The result of attending this talk should be a safer environment both in the workplace and at home.

Speaker:   Stephen L. Fowler of Fowler Associates, Inc.
Bio:   Stephen L. Fowler - President, Fowler Associates, Inc.
With over 50 years of electrical engineering experience, 45 years of radiation engineering experience and 35 years of electrostatic engineering experience.  Mr. Fowler is considered a leading international expert in electrical engineering, radiation processing technology, radiation safety, electrostatic control and packaging.  He attended the University of South Carolina and graduated, cum laude, with a BS in Electrical Engineering.  Mr. Fowler served with the United States Air Force during the Vietnam War in electronic communications.
 
He has published papers, given speeches, seminars and lectures on radiation engineering, radiation safety, packaging, static control and static test methods. He is used by
several television programs (such as Inside Edition and Dateline) as an expert in electrical and radiation engineering.
 
Mr. Fowler was previously the Electrostatic Plastics Marketing Manager for the Cryovac Division of W.R. Grace and Company.  He was also the Manager of Radiation
Engineering for Cryovac.
 
Mr. Fowler is the holder of several patents. He is or has been a member of the ASTM, EIA, ESD Association, AATCC and the Health Physics Society.  He is
Chairman of the AATCC Static Committee (RA-32) and Past Chairman of the Electronic Industries Association's Packaging ESD Committee (PEPS)
 
Mr. Fowler holds registrations in North Carolina, South Carolina, New Jersey and Oregon to provide radiation consultation and training. He is a NARTE Certified ESD Control
Engineer no. ESD-00010-NE, a Registered Radiation Protection Technologist (NRRPT) and a Registered Radiation Safety Officer (IRRSO)
 
Steve has been used by media outlets as an expert in electrical, electrostatic and radiation issues:
Dateline:
Russian Spy Death from Polonium 210
Gasoline Refueling Fire
 
Inside Edition:
Gasoline Refueling Fires
Electrocutions in the Streets
Cell Phone Electrocutions in the Bath Tub
E-Cigarette Explosion
Hover Board Fires
Foot Bath Fakes
Night Hawk Minerals Radioactive Rocks Cure for Cancer
Hand Sanitizer Burns in the Hospital
Lights in Children Shoes Fires
 
Date: Wednesday, Oct. 16, 2019
Time: 5:00 PM to 8:00 PM
Location: BAE Systems
65 Split Brook Road, Nashua, NH 03060
Meeting Agenda:
5:30 PM Registration, Networking, and Refreshments
6:00 PM Opening and Announcements
6:10 – 7:45 PM Technical Presentation
7:45 – 8:00 PM Q&A
8:00 PM Adjourn
 
Our 2019 Expo Sponsors:


Our 2018 Expo Sponsors:
   

For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22

This event is open to active members only and please have your membership number handy when you register for this event.
(if your membership expires between and the event, please renew your membership before this event or your registeration will be rejected)
To register for this event visit: click here to register for this event or copy this URL to your browser:  https://events.vtools.ieee.org/event/register/203485
Note:  Registration is required and no walk-ins are allowed at this event.  Event is being held in the un-secure area of BAE Systems so any active member can attend this event but registration is required for all visitors.  Seating is limited to 80 seats so each engineering organization are limited to 20 seats each first come first served.
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190


Future Events:

Sept. 11, 2019, 5:30-7:30PM, IEEE – Introduction to Thermal Imaging using Infrared Technology, Jeff Steele – FLIR Systems at MIT Lincoln Laboratory 3 Forbs Road, Lexington, MA 02421.  For more info visit: http://ewh.ieee.org/r1/boston/rl/events.html

Sept. 30 to Oct. 3, 2019  iMAPS – 52nd International Symposium on Microelectronics at the Boston Hynes Convention Center, Boston, MA.  http://www.imaps.org/imaps2019/

SMTA – Tuesday, Oct. 8, 2019 – New England Expo & Tech Forum at the Boxboro Regency, Boxborough, MA   https://www.smta.org/expos/#newengland
iMAPS NE – Tuesday Oct. 11, 2019 – at the Boxboro Regency Hotel & Conference Center, Boxborough, MA


October 17

Long Island Expo & Tech Forum  +

Location: Melville Marriott Long Island
1350 Walt Whitman Road
Melville, NY 11747


Exhibitors

Please contact Sharon Dietrich with questions or for additional information.



Attendees
Attendees Register Now

Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.

 


October 21 - 23

Mexico - Guadalajara Chapter: SMT Processes Certification / 21-23 Oct 2019  +

Location
Hotel RIU Gdl




                                   


Informes: 
Iván Román (ivan.roman@continental-corporation.com)
Zoe Anguiano (zoe.anguiano@smartsol.mx)


October 21

Carolinas (NC, SC) Chapter: 2019 SMTA Carolinas Golf Tournament  +

Mill CreekGolf Club



2019 SMTA Carolinas Golf Tournament
Registration begins at 8:30 am - Shotgun Start: 10:00 a.m.

Mill Creek Golf Club
1700 St Andrews Way
Mebane, NC 27302

All golfers receive:
• Box Lunch on course                                                                     • 1 raffle ticket for prizes (unless you buy Mulligan Package)     
• Free range balls for warmup                                                          • Chance to win Closest to the pin and long drive contest        
• Goodie Bags                                                                                  • Dinner after play
• Chance to win Closest to the pin and long drive contest               • Free Beer and Wine during play and after (No Liquor included)

Sponsorship Packages:
Title Sponsor $1000 ($900 for Members) (1 Available)
Two foursomes-Sponsor name placement at the top of all banners/tournament promotional literature/cart goody bags-8 mulligans per foursomes-Hole sign with company logo-8 raffle tickets per player
Corporate Sponsor $500 ($400 for Members) (17 Available)
One foursome-Sponsor name placement on all banners/tournament promotional literature/cart goody bags-Hole sign with company logo-4 raffle tickets per player Donations/Awards: ($250)
Hole Sponsor ($300) Sign with company logo on tee box
Team Cost (4 players): $400 ($375 for members) One raffle ticket per player
Single Player: $100 ($75 for members)
Mulligan Package ($20/player additional) Includes: 2 extra raffle tickets, 1 red tee box shot on any hole, 4 mulligans (Pay at the time of registration)

All proceeds supports SMTA-Carolinas Programs




October 21 - 23

SMT Processes Certification (Guadalajara, Mexico)  +

Location
Hotel Riu Plaza Guadalajara
Guadalajara , JA Mexico


Location:

Av. Adolfo López Mateos Sur 830

Chapalita, 44500 Guadalajara, Jal., Mexico

Schedule: 

  • October 21- Course (8:30-5pm)
  • October 22- ½ day of course + exam
  • October 23- All day exam (8:30-5pm)
  • Instruction: English/Spanish
    Test: English
    Instructors: Ivan Castellanos, Indium Corporation

 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

Why You Should Participate

  • Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 22 - 24

International Wafer-Level Packaging Conference  +

Advanced Packaging in the New Connected World

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.


October 23 - 24

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2019 After April 30, 2019
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.

 

Click HERE for the Guadalajara Expo Live Floor Plan



Attendees

Attendee registration will be available onsite. 

Technical program coming soon...


Thank You to our Sponsors:

      

     

     

  

  

 


October 23 - 24

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-5:00pm
5:00pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-4:00pm
Move out: 4:00pm-7:00pm

Click here to review Sponsorships and Exhibits
IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 

Click here for the latest floorplan



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 24

Additive Electronics Conference: PCB Scale to IC Scale  +

Location
DoubleTree by Hilton San Jose
San Jose , CA 95110


Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices. 


October 29

Great Lakes (Chicago) Chapter: SMTA Great Lakes Solder Paste Roundtable Event  +

TBD







 
SMTA Great Lakes Chapter Meeting
Tuesday, October 29th, 2019
 
Location: TBD
   
   
 
 
Time: TBD
   
   
   
   
Location: TBD
   
   
 
 
 
SMTA Great Lakes Solder Paste Roundtable Event
 
 
“Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount Technology”
 
By Dr. Mark Currie – Henkel Corporation
Authors and acknowledgements to:
Dr. Neil Poole/Doug Dixon (Henkel Electronic Materials, Irvine, CA, USA)
Chrys Shea (Shea Engineering Services)
 
 
Consumer demand has accelerated the pace of the electronics miniaturization trend, compelling assemblers to develop robust capabilities for 01005 components and 0.3 mm pitch array packages to remain competitive.  The process of acquiring these capabilities can be complex, as they involve numerous interactive factors.  To optimize the stencil printing and reflow portions of SMT assembly given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.
 
The evaluation toolkit incorporates PCB design, a complete and costed bill of materials, full documentation for programming, setup and test methods, and step-by-step directions for a designed experiment.  It is the product of a cooperative effort among industry specialists that draws on their materials expertise, statistical know-how and process engineering skills, and was specifically developed to make solder paste testing as easy as possible for the PCB assembler.
 
This paper details the development of the turnkey solder paste evaluation concept from a laboratory test vehicle to the complete off-the-shelf kit.  It discusses:
 
•             Component selection to reflect the current state of the market and support a 2-3 year miniaturization roadmap
•             Sample size consideration for statistical significance
•             DFM of the PCB to manage costs
•             Design for solder paste inspection (SPI)
•             Nesting of tests to evaluate 22 paste properties in 4 hours or less
•             Stencil design considerations
•             Full database for programming entire SMT line
•             PCB support design, development and testing
 
The discussion details both user and supplier perspectives on testing methods and highlights key considerations for assemblers.  It concludes with opportunities and plans for potential future developments to expand the kit’s analytical capabilities.
 
“Lead-free Solder Paste Development for Ultra Fine-Pitch Printing and Reflow of 03015 and 0201 Metric Chip Components”
 
By Shantanu Joshi - Koki Solder America Inc.
 
 
Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
 
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
 
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
 
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 51 (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
 
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.
 
 
“The Effects of Surface Finish on Solder Paste Performance”
 
By Tony Lentz – FCT Assembly
 
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process (SMT).  Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing.  Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP).  What is the overall effect of surface finish on solder paste performance?  Which solder paste is best for each surface finish?  It is the goal of this paper to answer these questions.
 
In the initial work, several different surface finishes were tested in the surface mount process including:  HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver.  Several different types of solder pastes were tested along with each surface finish including:  lead-free no-clean and water soluble, and leaded no-clean and water-soluble solder pastes.  Each combination of surface finish and solder paste was evaluated for print performance, wetting, solder balling, graping, and voiding.  The results of this testing were quantified and summarized.  Recommendations pairing the optimal solder paste with each surface finish were given.    
 
Subsequent work explored some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters.  Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver).  Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste.  Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile.  Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured.  Reflow performance was measured and quantified including wetting, solder balling, and graping data.  Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads. 
 
All of the test results, including data from the first study, are summarized, compared and contrasted.  Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters.  Recommendations are made for optimal combinations of surface finish and solder paste.
 
 
About the Speakers:
 
 
Dr. Mark Currie – Henkel Corporation
 
Mark works at Henkel Corporation, and is based in Irvine California as Global Business Director for Solder, and is responsible for their technical development direction across all focus market electronic assembly sectors - dealing with Global OEM’s, Tier 1 and EMS accounts. Mark draws from his experience of having visited over 1000 customers, lived in 7 different countries, presented at many established international conferences since 1993, and authored over 100 papers. Mark graduated with both a Manufacturing Engineering degree and PhD from the University of Salford, UK. His undergraduate final year project introduced him to solder, which enticed him to follow with ESPRC industry funded Phd on the same subject matter.  As such, Mark has been familiar with solder for 28years.  In that period, Mark joined Multicore (soon thereafter to be Henkel) and has gone from Academia, to a Research Scientist, to a Process Engineer, and then onto Global Technical, Marketing, Product and Business development positions with Henkel.
 
 
Shantanu Joshi - Koki Solder America Inc.
 
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from State University of New York at Binghamton and Bachelor of Engineering degree in Production Engineering from Pune University, India. He is currently pursuing Ph.D in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from State University of New York at Binghamton. He is published over dozen papers in various national and international conferences over the years. His current work extends from optimizing printing parameters for the stencil printing process to root cause analysis of complex electronic assemblies by understanding the material science of lead-free solder alloys.
 
 
Tony Lentz – FCT Assembly
 
Tony Lentz has worked in the electronics industry since 1994.  He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years.  Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer.  Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products.  Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards.  He has published and presented many papers at industry events.  Tony is a speaker of distinction with SMTA.  Tony holds B.S. and M.B.S. degrees in Chemistry.  
 
Time: TBD
   
   
   
   
Location: TBD
   
   
Cost: TBD
 
 
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.



October 29

Intermountain Utah Expo & Tech Forum  +

Location: *NEW LOCATION* Weber State University
3910 W. Campus Drive
Ogden, UT 84408



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 30th, 2019!


Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Tuesday, October, 29, 2019
10:00AM–4:00PM

 

8:00am
Registration Opens 

 

10:00am
Expo Opens 


4:00pm
Expo Closes

 

Information on the Technical Sessions to follow...


October 30

FREE Webinar: Advances in X-Ray for Demanding Applications  +

Organized by SMTA Penang Chapter

Location
Penang Malaysia



Wednesday 30th October @ 2:00pm Penang Time UTC+8
(2:00am US Eastern Time UTC-4)

Presenter: Keith Bryant, Chairman SMTA Europe

Free for all – only members will get access to slides and recorded presentation!

Overview

The taking of x-ray images goes back over 100 years, since then there have been numerous advances in x-ray tube and detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been driven partly by the continued reduction in circuit board, device and feature size and the movement to using lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.

However, due to the solar and battery advances, where heat transfer is critical and voiding is a huge problem, we are also seeing an increasing amount of high-density and thick materials which need to be imaged and worse still, low-density materials in combination with high-density ones. In order to meet these most recent challenges and those in the future, there have been a number of key improvements to the vital components within x-ray systems, which will be covered in the presentation.
 
The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for electronics inspection is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This presentation will look at both ends of the spectrum of demanding applications, low-power applications using LED's as a subject and high-power applications showcasing IGBTs. 

 

About the Presenter

Keith Bryant

A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews. 

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years. 

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.


November 1

Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA's and PCBF's

Speaker: Robert Boguski, President, Datest

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on November 1, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choicein many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.

This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numerous examples will be shown, with an emphasis on PCBA and PCBF failure analysis and defect detection. 


Biography

Robert Boguski, President, Datest
 

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS). Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE. Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC). Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.

 




November 5

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 18, 2019!



Attendees

Interested in presenting at the Tech Forum?

Submit an abstract here



November 7

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 18, 2019!



Attendees

November 11

Webinar: Low Temperature Solder Benefits and Process Concerns  +



Bob WillisMonday 11th November @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The use of low temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. It’s different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 220°C, low temperature solders reflow at under 180°C. There are some organisations predicting a large growth in low temperature materials in the next two to three years for multistep soldering.

Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive provided you consider the total cost of manufacture. We produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow, so we believe we are in a good position to help engineers achieve high yields with low temperature materials.

Topics include:

  • Why use low temperature solder
  • Benefit over lead-free alloys
  • Materials available
  • Reflow soldering and rework results
  • Reliability with mixed alloys
  • Inspection results

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


November 12 - 15

productronica 2019  +

Accelerating Innovation

Location
Messe München
Munich Germany


Future technologies, industry trends, growth markets. Investment decision-makers, industry experts. From around the world. At the right time and the right place. Only at the World's Leading Trade Fair for Electronics Development and Production. Welcome to productronica 2019.

Experience innovations up close and at a very early stage at the world’s leading trade fair. The two trend topics of this year's industry platform are Smart Maintenance and Smart Factory. 


November 19

Advanced Electronics Assembly Conference  +

Location
Novotel Budapest Centrum
Budapest 1088 Hungary



November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

Book a discounted room rate at the Hilton Melbourne Rialto Place!

200 Rialto Place, Melbourne, FL 32901

Group Code: SMTA 

321-768-0200

Book Rooms Today!  



Attendees

Exhibit Hours:
Wednesday, November 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:
8:00AM
Registration Opens

9:00AM – 10:00AM
Industry 4.0 the Next Industrial Revolution - The Smart Factory
Speaker: MB Allen, KIC

Industry 4.0, IIoT, IoT, Smart Factory, Made in China 2025. It’s all the buzz but what are these trends?
Do they relate to me and my manufacturing environment? Is this something we Must implement? What
would the benefit be to my company? How does it all come together? These questions and more will be covered during this presentation and will include an example of ‘Smart Factory’ technology.

10:00AM
Expo Opens

10:45AM - 11:30AM
Indium

11:30PM
Lunch

12:30PM - 1:15PM
Reliability of Robotics for Electronic Manufacturing 
Speaker: Bubba Powers, Weller Professional Tools

Reliability of electrical or electronic soldering has always been paramount for the success of long-term market share and presence for electronics manufacturers. Process control is the key to ensuring manufacturers produce high quality and reliable products within their respective fields. In today’s environment of automation and high tech electronic controls, high reliability in electronics manufacturing is now more critical than ever before. 
Automation is one approach to achieving the pinnacle of high reliability in electronics manufacturing, as repeatability and traceability are two keys to maintaining optimum process control. However, it is the responsibility of every employee to maintain and control these processes whether they are automated or manual. 
In a world of trending automation and artificial intelligence in all of our surroundings, one slight miss can mean the difference in the success or failure of any electronic product. A failure in the manufacturing process could be insignificant if it is a cell phone, a play station or a television, but it can be of major consequence if it affects the electronics in the car that your family is in, the flight that your spouse is on or the technology that your military member is utilizing.
Join us for an overview of the process of automation in the soldering workplace and a discussion of what factors are just as critical for high reliability electronics regardless of whether you are working with a manual or an automated manufacturing environment.  
 

1:00PM
Soldering Competition on Show Floor

2:00PM - 2:45PM
Cleaning for Reliability in Electronics
Speaker: Emily Peck, MicroCare Corporation 

Emily's presentation examines how cleaning can be an important tool for enhancing reliability in a production engineer’s toolbox. Successful critical cleaning involves first identifying the contaminant and then selecting the best combination of cleaning fluids and methods to effectively remove it. Balancing these factors properly can enhance cleaning reliability.

4:00PM
Expo Closes

5:00PM - 7:00PM
After Expo Networking Social at The Mansion:

1218 E New Haven Ave, Melbourne, FL 32901

 

More on the Technical Sessions to follow...


November 21

Advanced Electronics Assembly Conference  +

Location
Romania
Oradea 410051 Romania



December 2

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures  +



Bob WillisMonday 2nd December @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

New components often provide challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far. Any large area component with a low stand off which needs to be reflow soldered to a substrate can be a challenge but at ever decreasing pitch the need for good process validation and correct design is vital for high yields.

Having had hands on experience with these parts since conducting design reviews, setting up processes, conducting failure analysis we may not have all the answers, but we do know the right questions to ask in manufacture.

Provided FREE with this webinar are Bob Willis QFN inspection and quality control wall charts to use in your own manufacturing and training facility.

 

Topics include:

  • Design options to reduce failures
  • Process improvements in design and assembly
  • Void reduction
  • Improvements in joint reliability
  • Simple 5min solderability assessment
  • Improved cleaning performance
  • Results in cleaning and SIR on QFN packages
  • Process results from vapour phase and convection reflow
  • Solder joint reliability
  • IPC design and process guidelines

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. If you have a process example you would like covered in the webinar it will need to be provided in advance of the session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


December 3

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter Golf Tournment  +

Spring Valley Golf Course Milpitas, CASMTA



SMTA Silicon Valley Golf Tournament Shotgun Start at Noon


December 4

Silicon Valley Expo & Tech Forum  +

Location: Bestronics Box Build Facility
2243 Lundy Avenue
San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 8th, 2019!

Important Exhibitor Materials:

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:00PM

Free Technical Program & Schedule:

8:30AM

Registration Opens

 

9:30AM

Speaker 1

 

10AM

Expo Opens

 

11AM

Speaker 2

 

11:45AM 

Lunch until 1:00pm

THANK YOU TO OUR LUNCH SPONSORS:
Zero Defects International and Viscom, Inc.

 

12:45PM

Speaker 3

 

2:00PM

Speaker 4

 

3:15PM

Reception on Show Floor

 

3:30PM

Raffle and Expo closes

 

4:30PM

Reception ends


More information to on the technical presentations to follow...


December 6

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter - End of Year Holiday Dinner  +

TBD



This is a big deal for everyone.  SMTA member and their spouse (significant other) invited to a great dinner at a nice restruant in the Boise area. 
The Utah Group will have their own dinner event. 

Suggestions for dinner location are being sought. 
There is an Idaho group dinner, and a Utah group dinner. 
 These will be on different days.
 In 2018, Utah group had their dinner in January. 

Would everyone like the dinner on a Friday or Saturday evening?

 


December 14

Dallas Chapter: SMTA Dallas Member & Gues Appreciation Dinner/Theatre!  +

Location
Addison Stone Cottage 15650 Addison Road, Addison, TX 75001 



SMTA Dallas Member & Gues Appreciation Dinner/Theatre!


Date: Saturday, December 14, 2019 @ 6:00pm 

Location: Addison Stone Cottage 15650 Addison Road, Addison, TX 75001 

Who: SMTA Members and spouse/guest

What: We have a catered dinner planned for the Addison Stone Cottage from 6:00 PM to 7:30 PM, and then we will walk over to the Addison Water Tower Theater and see the show "Cirque Holidays" at 8:00 PM   (the menu and more details will be sent on a future invitation to all Dallas members).

WaterTower Theatre, in partnership with Lone Star Circus, will celebrate the holidays from around the world through a magical collaboration of theatre and circus with Cirque Holidays! Featuring international stars alongside Dallas’ amazing and entertaining circus talent, audiences of all ages will be treated to incredible acts, ranging from hula-hoops to death defying trapeze stunts all tied together with a charismatic host and hilarious clowns.


Schedule:
  • 6:00pm - Catered Dinner
  • 7:30pm - Walk to Addison Tower Theatre
  • 8:00pm - Cirque Holidays 
Pricing:
  • Early bird rate: $/person (BUY NOW)
  • Decide later: $/person 

Early bird discount ends on : Reserve your spot now!


 


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819