Calendar of Events

   2018      

                                   

2018

November 24

India -Bangalore Chapter: Reliable Electronics Process Design and Manufacturing  +

L&T Training Center, Mysore




SMTA EVENT IN MYSORE, INDIA!!!


Reliable process design is crucial for ensuring product reliability and repeatability in manufacturing. Starting  from design verification for manufacturing, material selection and qualifying the process for the various types of manufacturing key elements to ensure  electronics manufacturing process is adequately set. In this Technical event the key elements of Design verification, Material selection and Process Selection will be covered by industry experts.

Audience: Engineering Managers, Process Engineers, Quality Engineers, DFM Engineers and Program Managers
 
Certificate: Participation certificate will be provided from SMTA India Chapter
 
Date: 24th November (Saturday)
 
Duration: Half-day (11AM to 4PM)–lunch included
 
Registration Fees:  Rs.750/-
 
Register by RSVP to:  smtaindiachapter@gmail.com (payment method will be shared)
 
Venue: L&T Training Center, Mysore
 
Technical Speakers:
 
Amba Prasad
 
Veteran PCB Designer and architect with>30year s of experience in designs for telecommunication industry.  He is also a trainer  for Certified IPC Designer and Advanced
Certified IPC Designer courses.
 
Dr. Morgana Ribas
 
Leader of Materials & Metallurgy is a coveted speaker in SMT domain.  She provided technology leadership on materials development, including conceptualization,testing,
deployment and field customer support through her team through chemical, mechanical, thermal and microscopic analyses.
 
Ankan Mitra
 
Manufacturing process and design expert, had been Master IPC Trainer and Certified IPC Designer.Conducts advanced manufacturing trainings and process audits.


Thanking You 


November 26

Webinar: ESD Electrostatic Discharge Guide for Everyone  +



November 26 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenters: Jeremy Smallwood & Charles Cawthorne from SMTA Europe Explain All

Overview

When handling most of today’s electronic components, printed circuit assemblies (PCAs) or equipment that contains electronics, special consideration must be given to the potential damaging consequences resulting from static electricity. Electrostatic discharge (ESD) can result in PCAs or higher level equipment failing test in the factory, or worse still, it can result in latent defects that can cause subsequent failure in the field. So what is electrostatic discharge and how is electrostatic discharge damage prevented?

This webinar provides an elementary guide to the principles of ESD control, looking at the basic theory behind the subject and the practical methods that can be adopted used to enable components, PCAs and equipment to be handled without the risk of incurring electrostatic related damage. The webinar is aimed at personnel who are new to the industry, including design and process / manufacturing engineers, technicians, trainers and also at those who support manufacturing indirectly (i.e. purchasing, account managers, sales staff, etc.)

Topics include:

  • What is ESD and why is it important
  • How static charges are generated
  • How static charges can be transferred to electronic components
  • Illustration of the damage that can be sustained by electronic components following electrostatic discharge
  • What is an Electrostatic discharge Protected Area (EPA)
  • How to set up an EPA within a factory
  • What practical controls are required to prevent electrostatic damage
  • How to store / transport electrostatic sensitive components / PCAs
  • How to handle electrostatic sensitive equipment out in the field

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


November 28

Silicon Valley Expo & Tech Forum  +

Location: Bestronics Box Build Facility
2243 Lundy Avenue
San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on October 26th, 2018!

Click here for Ad and Sponsorship opportunities! Important Exhibitor Materials:

 

Book a discounted room rate at the DoubleTree by Hilton San Jose by November 5, 2018.

Group Code: SMT

408-437-2126

www.sanjose.doubletree.com



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, November 28, 2018
10:00AM-3:00PM

Free Technical Program & Schedule:
8:30AM
Registration opens

9:30AM – 10:15AM
The Journey Towards Industry 4.0
Speaker: Hassan Aluraibi, Flex


Abstract: With ever-growing demand from customers and consumers, manufacturers are taking a closer look at the innovations that have shaped industries around them, and planning for the forthcoming, 4th industrial revolution, also known as Industry 4.0. This industry wide initiative seeks to integrate the latest in digital and manufacturing technologies, across a wide variety of solutions relating to simulation, machine communication, cloud computing and 3D printing, revolutionizing the way we manufacture. We’ll share a high-level view of this initiative, define key technologies, use cases and opportunities for growth as we usher in this exciting new initiative.

10:00AM
Expo Opens


11:15AM-12:00PM
Electronics and Textiles – Partners in Ubiquity
Speaker: Stephanie Rodgers, Apex Mills


Abstract: It’s happening folks! Successful outcomes of the first and third industrial revolutions are converging together as we begin the fourth; a hybrid of technology and humanity through textile applications.  Yarn has become the next invention and electronics are a topic of laundering performance and next level ubiquity.  Learn about the building blocks of advanced e-textile development, best practices for success, standards development and participation in Manufacturing USA.


12:00PM
Complimentary Lunch


1:30PM-2:15PM
X-ray and CT Scanning in the Context of Industry 4.0
Speaker: Rahul Alreja, VJ Technologies


Abstract: In today’s world, delivering quality products to end-users is absolutely critical.  Social media and the internet have made knowledge instantaneous and pervasive, and a misstep or flaw can cause catastrophic damage to a company – reputations that have taken years to make can come crashing down in days, if not hours.  The challenge is that maintaining quality is not easy – there are too many variables at play, even in the cleanest of environments.  And conditions can change almost instantaneously.  The trick, then, is to be adaptable, and emerging technologies (such as Big Data and Blockchain) are being adopted and harnesses to dynamically (and automatically) alter quality.  Drawing upon some real-world examples from different industries, this session will explore the future of quality and the role that NDE, and more specifically, x-ray plays in it.

3:00PM
Expo Closes 

3:00PM-4:00PM
Reception


November 29

Empire (Rochester, NY) Chapter: RIT Technical Meeting Sponsored By EMPIRE Chapter  +

Location
RIT Campus, Louise Slaughter Hall, Room # TBA



Overview:
This event is intended to familiarize RIT students and community with the Surface Mount Technology Association (SMTA).  The featured guest speakers will present technical discussions describing achievements leading to improve the knowledge base concerning mass electronic component assembly operations.  RIT offers degree education curricula, co-ops, and workforce development programs specifically tailored to this substantial electronic packaging and assembly industry.  RIT have provided loyal support to the SMTA organization for many years.  A SMTA chartered RIT Student Chapter has also been established.

ALL students and community industry professionals are welcome to join us.

This event is FREE to attend!

Refreshments will be provided courtesy SMTA Empire Chapter.

Speaker Lineup:*
1.  Martin Anselm, Ph.D. - RIT Assistant Professor, Director - CEMA
2.  Prithvi Kotian - RIT Student, Manufacturing and Mechanical Systems Integration
3.  Michael McLaughlin - RIT Alumni, SpaceX

Following the technical presentations an optional guided tour of the CEMA (Center for Electronics Manufacturing and Assembly) Lab will be offered.

*Discussion topic descriptions will be added to this event notice and posted on the chapter web page at https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=26.  Check in periodically for updates.


November 29

Rochester Institute of Technology Student Chapter Chapter: RIT Technical Meeting Sponsored By SMTA EMPIRE Chapter  +

RIT Campus, Louise Slaughter Hall, Room # TBA



Overview:
This event is intended to familiarize RIT students and community with the Surface Mount Technology Association (SMTA).  The featured guest speakers will present technical discussions describing achievements leading to improve the knowledge base concerning mass electronic component assembly operations.  RIT offers degree education curricula, co-ops, and workforce development programs specifically tailored to this substantial electronic packaging and assembly industry.  RIT have provided loyal support to the SMTA organization for many years.  A SMTA chartered RIT Student Chapter has also been established.

ALL students and community industry professionals are welcome to join us.

This event is FREE to attend!

Refreshments will be provided courtesy SMTA Empire Chapter.

Speaker Lineup:*
1.  Martin Anselm, Ph.D. - RIT Assistant Professor, Director - CEMA
2.  Prithvi Kotian - RIT Student, Manufacturing and Mechanical Systems Integration
3.  Michael McLaughlin - RIT Alumni, SpaceX

Following the technical presentations an optional guided tour of the CEMA (Center for Electronics Manufacturing and Assembly) Lab will be offered.

*Discussion topic descriptions will be added to this event notice and posted on the chapter web page at https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=26.  Check in periodically for updates.


To RSVP, please click here, or copy and paste the following address into your web browser:

https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4606&BULK_EMAIL_NO=1 

SMTA uses email to distribute notices about our technical programs, events, and publications. You are receiving this because you are subscribed to this chapter's e-mail list or are a member of this chapter. If you do not wish to be on the SMTA electronic mailing list please click here.
Contact SMTA Headquarters:
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344
Phone: (952) 920-7682

 


November 30

Dallas Chapter: Member Appreciation Party  +

Location
9450 N Central Expy, Dallas, TX 75231



Location: Dave and Busters, 9450 N Central Expy, Dallas, TX 75231

Who: SMTA Members and spouse/guest

What: An evening of drinks, dinner and games at Dave and Busters with your SMTA friends


Schedule:
  • 6:30pm - Social Time
  • 7:30pm - Dinner
  • Afterwards - games and more fun! 

Pricing:
  • Early bird rate: $25/person (BUY NOW)
    ($75 value includes appetizers, dinner, games, tips and taxes)
  • Decide later: $35/person 


Early bird discount ends on November 15th!
Reserve your spot now!




December 4

Massachusetts (Boston) Chapter: Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.  +

Location
iRobot Corpoeration in Bedford, MA



Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.
By:  Timothy O’Neil Technical Marketing Manager for AIM Solder
Date: Tuesday, Dec. 4th, 2018
Time: 5:00 PM to 9:00 PM
Location: iRobot Corporation 8 Crosby Drive Bedford, MA 01730
Cost: Members $25 / Non-Members $30
 
Technical Topic:  The choices for solder alloys are expanding rapidly as new application requirements materialize. This presentation will highlight the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials. Whether low temperature or high reliability alloys, attendees will gain a better understanding of how implementing these materials can impact process and affect product reliability.
 
 
Speaker Bio:  Timothy O'Neill is the Technical Marketing Manager for AIM Solder.  AIM Solder is a leading global manufacturer of assembly materials for the electronics industry.  Mr. O’Neill who has 25 years of industry experience is a Certified IPC Specialist. 
Mr. O’Neill’s responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.

Agenda:
5:00 PM Registration, Socializing, Networking
5:15 – 6:00 PM iRobot Corporation Museum Tours
6:00 – 7:00 PM Dinner
7:00 – 7:15 PM SMTA Boston Welcome, Announcement, Introduction
7:15 – 8:45 PM Technical Presentation
8:45 – 9:00 PM Questions & Answers
9:00 PM Meeting Adjourn
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598

Vice President : Louis Feinstein  (DS Solidworks)
Phone: 781-810-7261

VP of Technical Programs : Joe Kwong  (Draper Labs)
Phone: 617-258-1746



December 5

Arizona-Sonora Chapter: Arizona/Sonora Chapter Meeting  +

Phoenix and Tucson



SMTA major announcement!!

The Arizona chapter of SMTA has been reorganized and rejuvenated!!!

Several SMTA members have stepped up to serve as officers and planned a new strategy for the Arizona Chapter. Historically when we have held meetings in the Phoenix area, it is too far for our members in Tucson to attend, and vice versa. Our plan going forward is to have luncheon meetings in the Phoenix area, then have the same speaker/presenter go to Tucson for a late afternoon (around 4:00 PM) presentation in Tucson.
DATAFORTH Corp in Tucson has offered their facility as a meeting location for the Tucson meetings.

Our first event will take place on Dec.5th at Mercury Systems.  We will meet at 11:30 for lunch and a presentation on “Testing products beginning with new designs, engineering prototypes, initial production, through high volume production” by Scott Mosher on Acculogic. Following the presentation, there will be a plant tour of Mercury Systems.  In Tucson, there will be sandwiches or Pizza, etc. the same presentation, then a plant tour of DATAFORTH Corp.
 



December 6

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: SMTA Upper Midwest Chapter presents Designing Flexible Circuits topic at Tin Whiskers Brewing  +

Location
Tin Whiskers Brewing




Upper Mid-west Chapter is bringing in a speaker for the following topic:

Designing Flexible Circuits with Successful Assembly in Mind
Speaker: Clark Webster, Applications Engineer at All Flex Flexible Circuits & Heaters
 
Who Should Attend:
This presentation is intended for anyone that is interested in flexible circuit design, materials, assembly, and examples of challenging flexible circuit applications.

Date:     Thursday, December 6th, 2018
Cost:      $20 Members/ $30 Non-members (make checks payable to SMTA)
 
Time/Agenda:
  • 2:00 to 2:15 PM - Registration
  • 2:15 to 2:20 PM – SMTA announcements
  • 2:50 to 3:40 PM – Clark’s Presentation
  • 3:40 to 4:00 PM – Q&A
  • After 4 PM – Social hour
 
Bar snacks will be provided.
 
RSVP by November 30th to guaranty a spot for this session.
 
Address/Directions to Tin Whiskers Brewing Company:
Tin Whiskers Brewing
125 9th St E
St Paul, MN 55101

Parking:


 
Presentation Overview:
Flexible circuits were originally designed as replacements for traditional wire harnesses.  From the beginnings to the present, growth and proliferation of flexible circuit applications in all industries has increased rapidly.  Today flexible circuits can be found in all manner of devices, products, and industries across the globe.  Along with the growth of flexible circuits, the complexity of the flexible circuits and their assembly has also increased dramatically, as well as the tools, materials, and processes used in performing their component assembly.  As assembly complexity increases, new methods must be developed to deal with special material and processing considerations of working with flexible circuits.  It becomes critical to overcome these issues by designing in assembly capabilities. 
What we will cover: 
•           A brief history of flexible circuits, with emphasis on design criteria for assembly
•           Several case studies of challenging flexible circuit design applications
•           An overview of flexible circuit design considerations for modern SMT assembly
 
Clark Webster’s – Bio:
Clark is an Applications Engineer with All Flex Flexible Circuits & Heaters, primarily supporting customers in their designs to improve reliability and ensure that the final products will perform as needed.  Clark has been in circuit manufacturing industry for 53 years, working in Materials Development for flexible circuits, Product Fabrication testing for both flexible and rigid circuits, and Applications Engineering for many specialized customers, designs, and products.  Clark has excelled at and enjoyed working on difficult projects with customers to find solutions for challenging designs and applications.  Clark is a member of the IPC Flex Circuits Committees, holds three patents on flexible and rigid circuit designs, and has a wealth of knowledge of all aspects of the supply chain.  Clark’s one resounding failure to date in his last 12 years (working with All Flex) has been his inability to retire from the manufacturing industry.  
 


December 11

SMTA Webinar: Inspecting PWB Assemblies for Defects  +



Tuesday, December 11, 2018 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

Bob Wettermann What You Can Learn From This Course:

This webinar is designed to help the EMS and PWB builders screen for, test and develop inspectors for PCB final assembly. The people attending this session should have familiarity with the latest IPC-A-610 inspection standard. We will review some of the more common “gotchas” found in the final inspection of PWBs. The session will also discuss the options for manual inspection equipment including but not limited to lighting, magnification aids and ESD control in the inspection area. In addition, this session will go on to discuss eyesight issues, visual acuity, color siting, hand-eye coordination and testing of these attributes. This will help in the screening process for nurturing that next inspector. Finally, there will be a real time short “test” of various devices and boards with anomalies and sample defects.  

This is intended for production personnel, process engineers and QC managers trying to hire, train up and nurture the next tier of inspectors.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.


December 13

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting Notice- December 13th  +

Location
Jabil Circuit 10560 MLK Blvd St. Peterburg, FL 33716



This is a reminder to set time aside for this quarters meeting on Thursday, December 13th at 5:30 PM.
The link to register is below.

Our speaker will be Bruce Misner, principal of Advanced Technical Services, who will be discussing Tin Whiskers: Mitigation Techniques and Assessing Reliabilty.

The advent of lead free solder and the growth of pure tin component finishes have exacerbated the reemergence of tin whisker growth, increasing the potential for field failures. Many high reliability programs, especially within the aerospace realm, require varying degrees of tin whisker mitigation. This presentation will summarize the five reliability levels as defined in GEIA-STD-0005, the widely accepted industry standard for mitigating the effects of tin whiskers. Situations will be identified where whisker growth is most prominent, increasing the importance of mitigation. Conversely, situations where mitigation is of less concern will also be identified. With this knowledge, a key method for assessing reliability has been ascertained for the attendee’s knowledge. A variety of techniques for mitigating the effects of tin whiskers will be presented such that the assessed reliability can be significantly improved. Even in electronic assemblies where whisker mitigation is not required, engineers can impart reliability improvement through understanding of the reliability 
assessment, areas most at risk, and associated mitigations that can reduce that risk. 



Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819