Calendar of Events

   2019      

                                   

2019

March 25

FREE Pre-Conference Webinar: Harsh Environment Failure - Causes & Cures  +

Organized by SMTA Europe Chapter



Monday 25th March at 2.30pm UK Time (10:30am US Eastern Daylight Time)

Join Keith Bryant & Bob Willis to find out more about the demands on Electronics in Harsh Environments as they showcase the  challenges faced by design and process engineers worldwide. Including some of the key issues that are faced in Power Electronics, Automotive, High Voltage, Assembly and High Reliability Products.

For the third year running SMTA Europe present the Electronics in Harsh Environments Conference and Exhibition 2-4th April in Amsterdam for more information visit: https://www.smta.org/harsh/

Still unsure if you should be in Amsterdam or need more info to convince your boss.  This is an ideal way of seeing in advance some of the people you will meet and things you will learn from industry experts, plus you will be able to show examples of what you have learned on the different failure modes in electronics.

By attending this FREE webinar, you also have the opportunity of winning a FREE pass to attend one day of the conference!

Topics include:

  • High Temperature
  • Condensing Environments
  • Water Immersion
  • Mechanical Strain
  • Corrosive Environments


March 26

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Boise Expo at BSU  +

Boise State University



The SMTA Intermountain chapter Boise Expo Technical presentations and vendor show will be held on March 26, 2019. 

Location: Boise State University 
Student Union Building - Jordan D Ballroom
1910 University Drive
Boise, ID 83725
  Presentations start at 9:00 am with the vendors show opening after the first talk is finished.  Wrap up will be about 3:15 pm.
 
Parking will be free in the parking terrace directly south of the union building, but attendees must register to get their  free parking password. 
 This is a totally free event for attendees, but please register below.  

Agenda: 
9:00  Presentation 1:   PCA DFM - Path to Higher Quality & Lower Costs,   
by Don Saunders, PCA NPI / CPE Engineer, HP Inc, Boise, Idaho.

Abstract:  With today’s tariffs, world consortiums, reduced schedules and changing partners … how can PCA designs stay in sync with component, assembly and distribution changes?  PCA Design for Manufacturing demonstrates the value of trusted relationships and tools to meet customer’s demands and stay competitive. Understanding and projecting true cost of cost reductions avoids costly product delays, recalls or bad customer experiences. What is total cost?  How does a cost reduction to one partner impact other partners & customers costs?
Affinity – “an attraction or force that encourages a group to combine” applies to all of our partners.
DFM helps designers succeed by aligning suppliers and manufacturing/assembly  partners strengths with theirs in delivering quality solutions to their customers on time.
Real contributions are achieved at each product proto, during development builds using production processes by NPI DFM team. New technology and components validated on state of the art assembly processes prior to releasing to production, results in strengthened partner relationships and successful product ramps.


10:00 Vendor Show opens.  Everyone welcome.  No Entrance Fee - 
Vendor show continues while talks are ongoing 

11:00 Presentation 2:  Low Temperature Solder Overview, Opportunities and Risk,
 Given by 
Kris Troxel, HP Inc. Boise Idaho

Kris Troxel is a Senior Reliability Engineer for the Strategic Quality and Reliability Engineering (SQRE) organization at HP Inc. Kris has been with HP since 1989, and has worked closely with external organizations such as iNEMI and IPC, in both participatory and leadership roles.  Kris led the HP Pb-free PCA assembly transition and has been involved with PCA materials, processes and industry & HP standards and has led several pan-HP initiatives. She supports all HP businesses. 

12:00 Free Lunch for all attendees in Vendor show area. 
Vendor show continues while talks continue

1:00  Presentation 3: “PCB Technology, Assembly and IC packaging”
Rich Brooks, Senior Manager Design Engineering - Jabil Corp, St. Petersburg,
Abstract
Miniaturization is one of the main trends going on today that are driving the electronics industry to push the limits of capabilities and driving the implementation of new technologies.  Some of the products that are driving miniaturization include: Wearables, Health Sensing, 3D Printing, IIoT, AI and AR/VR.  At Jabil, our goal is to understand the technology trends and to implement new solutions for our customers that will also drive the market.  For Miniaturization, Jabil does not only focus on the Manufacturing assembly process but also the advances in the PCB technology and IC packaging.  This presentation will review these various technology processes and how they impact the industry, as well as the Contract Manufacturers and how it will effect the way they do business.

BIOGRAPHY
Rich Brooks has degrees in both Chemistry and Chemical Engineering and he has been in the Electronics industry for 30 years.  His first role was with the Advanced Manufacturing Technology group at Motorola where he spent 14 years.  After Motorola, he joined the Indium Corporation of America as the Global Technical Manager for 9 years.  His most recent positions have been with the GE Oil&Gas Design team for 4 years and now for the past 2 years, he has been with the Jabil Design Organization.  At Jabil, he manages a team of SMEs (Subject Matter Experts) with various areas of technical knowledge. Rich Brooks’ area of expertise is in the PCB and soldering materials technology.


      Vendor show continues during and between talks - till the door prizes are given away.

3:15 Door prizes to be given away at end of day - must be present to win.

Questions? Contact:
Tony Whitt - Intermountain Chapter Vice President
Phone: 303-881-1623
West Tech Automation 
2011 Bannock St.
Denver CO. 80223


March 26

Intermountain (Boise) Expo & Tech Forum  +

Location: Boise State University
1910 University Drive
Boise, ID 83725
Show Hours: **Parking is FREE. Say you're with SMTA



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on Feburary 22nd, 2019!

Important Exhibitor Materials:



Attendees

Free Technical Program & Schedule:

8:00am

Registration Opens

 

9:00am

Speaker: Don Saunders, Hewlett-Packard Company

PCA DFM - Path to Higher Quality & Lower Costs 

Abstract:  With today’s tariffs, world consortiums, reduced schedules and changing partners … how can PCA designs stay in sync with component, assembly and distribution changes?  PCA Design for Manufacturing demonstrates the value of trusted relationships and tools to meet customer’s demands and stay competitive. Understanding and projecting true cost of cost reductions avoids costly product delays, recalls or bad customer experiences. What is total cost?  How does a cost reduction to one partner impact other partners & customers costs?


Affinity – “an attraction or force that encourages a group to combine” applies to all of our partners.
DFM helps designers succeed by aligning suppliers and manufacturing/assembly  partners strengths with theirs in delivering quality solutions to their customers on time.
Real contributions are achieved at each product proto, during development builds using production processes by NPI DFM team. New technology and components validated on state of the art assembly processes prior to releasing to production, results in strengthened partner relationships and successful product ramps.

 

10:00am

Expo Opens

 

11:00am

Speaker: Kris Troxel, HP Corp

Low Temperature Solder Overview, Opportunities and Risk

Bio: Kris Troxel is a Senior Reliability Engineer for the Strategic Quality and Reliability Engineering (SQRE) organization at HP Inc. Kris has been with HP since 1989, and has worked closely with external organizations such as iNEMI and IPC, in both participatory and leadership roles.  Kris led the HP Pb-free PCA assembly transition and has been involved with PCA materials, processes and industry & HP standards and has led several pan-HP initiatives. She supports all HP businesses. 
 

12:00pm

Complimentary Lunch

 

1:00pm

Speaker: Rich Brooks, Jabil Corporation

PCB Technology, Assembly and IC Packaging

Abstract: Miniaturization is one of the main trends going on today that are driving the electronics industry to push the limits of capabilities and driving the implementation of new technologies.  Some of the products that are driving miniaturization include: Wearables, Health Sensing, 3D Printing, IIoT, AI and AR/VR.  At Jabil, our goal is to understand the technology trends and to implement new solutions for our customers that will also drive the market.  For Miniaturization, Jabil does not only focus on the Manufacturing assembly process but also the advances in the PCB technology and IC packaging.  This presentation will review these various technology processes and how they impact the industry, as well as the Contract Manufacturers and how it will effect the way they do business.

Bio: Rich Brooks has degrees in both Chemistry and Chemical Engineering and he has been in the Electronics industry for 30 years.  His first role was with the Advanced Manufacturing Technology group at Motorola where he spent 14 years.  After Motorola, he joined the Indium Corporation of America as the Global Technical Manager for 9 years.  His most recent positions have been with the GE Oil&Gas Design team for 4 years and now for the past 2 years, he has been with the Jabil Design Organization.  At Jabil, he manages a team of SMEs (Subject Matter Experts) with various areas of technical knowledge. Rich Brooks’ area of expertise is in the PCB and soldering materials technology.

3:30pm

Expo Closes

 

**Parking is FREE. There will be attendants manning the parking area. Say you are with SMTA.**

 


March 29

Penang Chapter: SMTA Penang Chapter Free Webinar  +

Location
https://www.smta.org/webinars/#penang



Presenters: Dr. Mike Bixenman and Debbie Carboni, KYZEN Corporation
 
Overview:
Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. As these components reduce in size, the distance between conductors narrows. Reliability of these devices requires a high level of cleanliness, especially residues that are ionic in nature. The cleanliness question has been a topic area of concern over the past five years. To address this growing concern IPC – J-STD-001G, Amendment requires objective evidence to establish acceptable and unacceptable levels of residues on production hardware.
This webinar will teach important design variables that impact electrochemical reliability of Electronic Devices. The significant elements of influencing residues levels include:
•           Flux or flux-bearing materials
•           Cleaning agents
•           Changes in manufacturing suppliers
•           Changes in solder mask
•           Changes in printed board fabrication processes or surface metallization
•           Geographic change in manufacturing location
The webinar will identify and teach methods for screening materials and processes. From these methods, the attendees will gain a better understanding toward identifying and analyzing risks associated with contamination. They will learn about advanced control measures to eliminate these risks and their effects. The webinar will teach new methods for monitoring the effectiveness of these controls.


March 29

FREE Webinar: Key Design Variables that Impact Electrochemical Reliability of Electronic Devices  +

Organized by SMTA Penang Chapter

Location
Penang Malaysia



Friday 29th March @ 11:00am Penang Time GMT+8
(Thursday, March 28 @ 11:00pm US Eastern Daylight Time GMT -4)

Presenters: Dr. Mike Bixenman and Debbie Carboni, KYZEN Corporation

Free for all – only members will get access to recorded presentation!

Overview

Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. As these components reduce in size, the distance between conductors narrows. Reliability of these devices requires a high level of cleanliness, especially residues that are ionic in nature. The cleanliness question has been a topic area of concern over the past five years. To address this growing concern IPC – J-STD-001G, Amendment requires objective evidence to establish acceptable and unacceptable levels of residues on production hardware.

This webinar will teach important design variables that impact electrochemical reliability of Electronic Devices. The significant elements of influencing residues levels include:

  • Flux or flux-bearing materials
  • Cleaning agents
  • Changes in manufacturing suppliers
  • Changes in solder mask
  • Changes in printed board fabrication processes or surface metallization
  • Geographic change in manufacturing location

The webinar will identify and teach methods for screening materials and processes. From these methods, the attendees will gain a better understanding toward identifying and analyzing risks associated with contamination. They will learn about advanced control measures to eliminate these risks and their effects. The webinar will teach new methods for monitoring the effectiveness of these controls.

 

About the Presenters

Dr. Mike BixenmanDr. Michael Bixenman, Chief Technology Officer (CTO) and cofounder of KYZEN, has over 30 years of experience in the design of electronic assembly cleaning materials and process integration. Sharing his research, knowledge and experience is Mike’s passion as he is the author and co-author of over 100 technical papers and presentations presented all over the world. He believes in the power of collaboration, by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups that are committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).

 

Debbie CarboniDebbie Carboni's involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes. Having been with KYZEN for over 10 years, Debbie is dedicated to providing customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions. Her extensive real world experience helps guide engineers during qualification to ensure success in production conditions. Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations, and is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo. After attending Northern Arizona University, Debbie remains knowledgeable through numerous technical conferences and leading-edge research. Debbie has authored and co-authored several papers related to cleaning solutions and regularly presents at and attends industry events such as; SMTA International, Cleaning and Coating Symposium, ICSR, Apex. Always willing to share, Debbie is an excellent resource with lots of experience and passion.


April 2 - 4

Electronics in Harsh Environments Conference  +

Location
Amsterdam Netherlands


The conference will focus on building reliable electronics used in power electronics and harsh environments.


April 2 - 4

Electronics in Harsh Environments Expo  +

In conjunction with the Electronics in Harsh Environments Conference

Location: Park Plaza Amsterdam Airport
Melbournestraat 1
Lijnden (Amsterdam) NL-1175 RM



Exhibitors

Download the Application

Click Here to Pay in Euros

 

Exhibit Hours:
Tuesday, April 2: Afternoon

Wednesday, April 3: Full Day

Thursday, April 4: Morning

 

Exhibitor Table Top Options:

(Inside the Conference Room - Limit 9)
$1550 | €1350 (+ Dutch VAT)

  • Utilize your time the best by being inside the room! Get in front of our attendees the whole conference and make sure you don’t miss out on the action!
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration (a €725 value!)

(In the Foyer – Limit 10)
$1225 | € 1050 (+ Dutch VAT)

  • Promote your company in our private foyer! All refreshment breaks as well as the reception take place here.
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration ( a €725 value!)

 

Sponsorship Opportunities:

  • Premier Conference Sponsor - $2000/€1780 (limit 2)
  • Reception Sponsor - $1700/€1525 (limit 2)
  • Keynotes Sponsor -  $700/€625 (limit 1)  SOLD OUT
  • Lunch Sponsor - $500/€425 (limit 3)
  • Refreshment Break Sponsor - $500/€425 (limit 4)
  • Lanyard Sponsor $200/$400 (limit 1)

 

View the Floorplan Here!

*Table top selections are on a first come, first served basis
View the latest floorplan!


April 2

West Penn Expo & Tech Forum  +

Location: DoubleTree Monroeville
101 Mall Plaza Blvd.
Monroeville, PA 15146


Exhibitors

The West Penn Expo & Tech Forum is SOLD OUT! Please contact Expo Manager, Courtney Kalb, to be placed on the waitlist.
 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Monroeville



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Tuesday, April 2, 2019
10:00AM–3:00PM

 

8:00AM

Registration Opens

 

9:00AM - 10:00AM

The X-Factor: How X-Ray Technology is Improving the Electronics Assembly Process

Speaker: Bill Cardoso, Ph.D., Creative Electron, Inc.

It was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this presentation we’ll cover a broad range of applications:

-         Electronic component inspection and failure analysis.

-         Component counting and material management.

-         Reverse engineering.

-         Counterfeit detection.

-         Real-time defect verification.

-         Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection.

-         Design for manufacturing (DFM) and design for x-ray inspection (DFXI).

-         Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC).

We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way we manufacture and inspect things.

 

10:00AM

Expo Opens

 

11:00AM-12:00PM

The Four Pillars of Continual Improvement

Speaker: James Emes, New Pig Corporation

How to change your mindset to a culture of proaction and continual improvement using the P-D-C-A principals.  Is your culture reactive or proactive?

-         Evaluate Risk (Planning)

-         Process Approach (Doing)

-         Metrics (Checking)

-         Root Cause, Corrective Action, Improvement (Acting)

This will be a collection of ideas, concepts, and principals to promote the right approach and thought process in your business.  Attempt to change your paradigm.  Whether you are making printed circuit boards or toy trains, the principals are the same.  Plan, Do, Check, Act.  How to do those things effectively to truly change your culture and avoid the disasters that will come if you don’t plan and act appropriately and efficiently. 

 

12:00PM

Complimentary Lunch

 

Thank You to our Lunch & Refreshment Sponsor:

 

1:30PM-2:30PM

Accelerating the Solder Paste Evaluation Process

Speaker: Chrys Shea, Shea Engineering Services

Solder paste can make or break the profitability of SMT processes. Using the proper chemistry is critical to a successful operation.  Because solder pastes have so many different characteristics that affect their assembly line performance, they can be cumbersome and costly to evaluate.  As a result, many assemblers are using mature formulations that have since been improved upon, simply because they don’t have the resources to properly evaluate new, more process- or product-friendly materials.

This paper proposes a new solder paste evaluation regimen that helps engineers assess up to 25 solder paste properties on their assembly line in 5 hours or less.  It uses the new SMTA board that is available off-the-shelf from Practical Components and is part of a full kit developed specifically to help PCB assemblers choose the right solder paste for their operation, as quickly, easily and economically as possible.

 

3:00PM

Expo Closes


April 3

Space Coast (Melbourne FL) Chapter: "Solder Paste - Your SMT Line’s Gray Matter"  +

7505 Technology Drive Melbourne, FL 32904



Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"

Learn what it is and how to choose it, print it, reflow it and clean it
 
Instructors: Phil Zarrow & Chrys Shea

April 3, 2019

9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993

Registration Deadline is March 15!
Price:
  • Members: $200
  • Non-Members: $400
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 
The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

  • Some SMT assembly process experience
  • A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

  • How it is made, particle size classifications
  • How it behaves - viscosity, thixotropy, rheology
  • Balancing performance properties and why every formulation is different
  • 25 paste characteristics that affect SMT line performance
  • Finding the right product for the job
  • Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

  • Printing considerations and parameters
  • Gasketing
  • Coining
  • Support
  • Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

  • SPI Basics
  • Types of SPI technologies
  • Reasons for deploying
  • Implementation tips
  • Setting tolerances
  • Understanding thresholds

BREAK

Reflow Soldering

  • Methodologies:  Vapor phase, convection, laser
  • Profile Objective
  • Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
  • Solder Paste/solder behavior during reflow

Troubleshooting common defects:

  • Shorts
  • Opens
  • Solder balls
  • Tombstones
  • Head-In-Pillow
  • Voiding

Cleaning (time permitting)

  • Why clean - pictures of dendrites and corrosion
  • NC vs OA
  • Why clean the no-clean?
  • ROSE testing vs ion chromatography
  • The importance of monitoring the cleaning process

Q&A



About the Instructors:

Chrys SheaChrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

 


Phil ZarrowPhil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

 

Contact Karen Frericks at 952-920-7682 with questions.




April 3

Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"  +

Learn what it is and how to choose it, print it, reflow it and clean it

Location
Mack Technologies
Melbourne , FL 32904



Instructors: Phil Zarrow & Chrys Shea

April 3, 2019

9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993
Price:
  • Members: $200
  • Non-Members: $400
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 

The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

  • Some SMT assembly process experience
  • A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

  • How it is made, particle size classifications
  • How it behaves - viscosity, thixotropy, rheology
  • Balancing performance properties and why every formulation is different
  • 25 paste characteristics that affect SMT line performance
  • Finding the right product for the job
  • Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

  • Printing considerations and parameters
  • Gasketing
  • Coining
  • Support
  • Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

  • SPI Basics
  • Types of SPI technologies
  • Reasons for deploying
  • Implementation tips
  • Setting tolerances
  • Understanding thresholds

BREAK

Reflow Soldering

  • Methodologies:  Vapor phase, convection, laser
  • Profile Objective
  • Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
  • Solder Paste/solder behavior during reflow

Troubleshooting common defects:

  • Shorts
  • Opens
  • Solder balls
  • Tombstones
  • Head-In-Pillow
  • Voiding

Cleaning (time permitting)

  • Why clean - pictures of dendrites and corrosion
  • NC vs OA
  • Why clean the no-clean?
  • ROSE testing vs ion chromatography
  • The importance of monitoring the cleaning process

Q&A



About the Instructors:

Chrys Shea Chrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.


Phil ZarrowPhil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

 

Contact Karen Frericks at 952-920-7682 with questions.


April 9

Empire (Rochester, NY) Chapter: SMTA EMPIRE Chapter EXPO 2019  +

Location
Holiday Inn Syracuse-Liverpool (I-90 Exit 37)



We are delighted to welcome IPC Hall of Famers Dave Hillman and Doug Pauls from COLLINS AEROSPACE (formerly Rockwell Collins) as the featured speakers at our 2019 EMPIRE Expo Event!  The finalized Expo program agenda is provided in the table below.  NOTE the "Young Professionals" event (scheduled before exhibits formally open) is targeted towards students and newly employed individuals upon invitation only.  Please contact us if you wish to attend this special breakfast session.
Expo Registration:  https://www.smta.org/expos/#empire

About our featured speakers:


To register as an attendee or exhibitor, please visit:
https://www.smta.org/expos/#empire

 


April 9

Empire Expo & Tech Forum  +

Location: Holiday Inn Syracuse/Liverpool
441 Electronics Parkway
Liverpool, NY 13088



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Holiday Inn Syracuse-Liverpool by March 9, 2019.

Group Code: SMTA

315-457-1122

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Tuesday, April 9, 2019
10:00AM–4:00PM

8:30am

Registration Opens for Expo & Tech Forum

 

9:30am

Expo Opens

 

10:00am - 10:45am

Doug Pauls, Collins Aerospace

Hold My Circuit Board and Watch This!  The Consequences of Poor Design and Assembly Decisions for High Performance Electronics

Bio: Principal Materials and Process Engineer with Collins Aerospace, an Aerospace OEM, in Cedar Rapids, Iowa.  Doug holds a B.A. in Chemistry and Physics and a B.S. in Electrical Engineering, but has morphed into a materials engineer over his career.  He has worked for the Naval Avionics Center in Indianapolis, Indiana as a Materials Engineer and as Technical Director of Contamination Studies Laboratories, Kokomo, Indiana, before joining Rockwell Collins in 2000.  Doug has been an active IPC Chairman for 35 years, serving as the Chairman of the Cleaning and Coating Committees for 10 years and chairing the Technical Activities Executive Committee from 2012-2014.  In addition to his goofy sense of humor, Doug is most notably known for his expertise in surface insulation resistance testing, cleaning and cleanliness assessment, conformal coatings, and how to qualify manufacturing processes.  He has been a U.S. representative to ISO and IEC working groups on SIR, electromigration, and cleanliness reliability standards.  He has participated in numerous national and international consortia on electronics manufacturing materials and processes.  He has led a group of industry subject matter experts to revise the ionic cleanliness provisions of J-STD-001, culminating in J-STD-001 Revision G, Amendment 1.  And to top it off, in 2017 Doug received IPC's highest honor service recognition, the Raymond E. Prichard Hall of Fame Award.

 

11:15am - 12:00pm

Dave Hillman, Collins Aerospace

QFN Reliability and Voids

Bio: David D. Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa.  Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering.  In Dave’s early career he served as a Metallurgical Engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis.  In his present assignment at Collins he serves as a consultant to manufacturing on material and processing problems.  Some of Dave’s notable industry contributions include serving as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009 and publishing numerous technical papers, with the 2011 SMTAI Conference paper being selected as "Best of Proceedings Paper."  He continues to serve today in the role of Chairman on the IPC JSTD-002 Solderability committee.  He is also a member of the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), Surface Mount Technology Association (SMTA), and the Institute for Interconnecting and Packaging of Electronic Circuits (IPC).  Dave’s outstanding contributions to his company and service to industry are deservedly recognized as named a Rockwell Collins Fellow in 2016 and recipient of the prestigious IPC Raymond E. Prichard Hall of Fame Award in 2018.

 

12:00pm

Complimentary Lunch

 

1:00pm - 1:45pm

Dave Hillman, Collins Aerospace

Utilization of Lead-Free Ball Grid Arrays (BGAs) in a Tin/Lead Soldering Process

 

2:15pm - 3:00pm

Doug Pauls, Collins Aerospace

Residue Assessment, Impact and Control in Manufacturing High-Performance Products

 

3:00pm

Reception of Show Floor

 

4:00pm

Expo Closes


April 10

San Diego Chapter: 04/10/19 SMTA Chapter Meeting - Gold Planar Bumps for Challenging Flip-Chip Applications and Factory Tour of Palomar Innovation Center  +

Location
Palomar Technologies Inc. 2728 Loker Ave West, Carlsbad CA 92010



Palomar Techologies will be presenting and giving a live demo and factory tour...


Topic: Gold Planar Bumps for Challenging Flip-Chip Applications
Speaker:  Evan Hueners, Product Marketing Manager




The semiconductor packaging industry continues a relentless pursuit to make smaller packages with a higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. This presentation will explore the shrinking specifications of wire bonding requirements in regards to ball bump mashed ball diameter and top heights, and how to achieve them.


Date: 04/10/19
Registration: 4:45 PM
Social/Dinner: at 5:00PM
Presentation: 5:30PM

Factory Tour: 6:30PM
$5 Members and $15 Non Members
Location: Palomar Technologies Inc., 2728 Locker Ave West, Carlsbad CA 92010
 


April 10

Long Island Chapter: Chapter Meeting  +

Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779



Wednesday, April 10th   2019  ... 5:30 PM.... see below to RSVP on Line
Courtyard Long Island MacArthur Airport
5000 Express Drive South - Ronkonkoma, NY 11779
Phone: 631-612-5000 Fax: 631-612-5001
 
SMTA Long Island Chapter Presents
 
Solder Jet Printing Technology
Presented by 
 
Gustaf Martensson 
Mycronic's
Expert on Complex Fluids
Research & Development 
 
 
Viktor Olsson 
 Mycronic's Product Manager for
Assembly Solutions
This presentation will focus on Jet Printing from an application and technological perspective. 
 
The lecture will cover the basics of jet printing, deposition and material trends, applications and specific advantages, and component variations/shortage. The course will be concluded with a look into the future with reference to what materials and technologies will be needed to fulfill the needs of the electronics industry. 
 
Meeting and Dinner Buffet (Cash Bar):
 
For Individual and Corporate Participating Members: 
$0.00...Great Deal! ...our way of saying "Thanks" for all your support!
 
Non Members:   
Dinner and meeting only without membership...$35.00
 
 Join the SMTA...Individual Membership $95
Enrollment includes 1 year SMTA membership; free attendance and dinner at this meeting... This is a great deal! 
 
 Due to room size we may be limited to 50 attendees...
Please RSVP. 
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4685
 



April 11

Atlanta Chapter: Atlanta SMTA 23RD Annual EXPO  +

Location
*******NEW LOCATION***** TECH PARK ATLANTA 107 Technology Pkwy NW, Peachtree Corners, GA 30092 *******NEW LOCATION*****



SMTA EXPO, April 11, 2019
For 22 years the SMTA Atlanta Chapter has worked very hard to organize a best-in-class event for our local and regional  SMTA exhibitors and visitors. Our chapter is well known for many reasons and our Expo has always been on top of the list. Every year Atlanta SMTA chapter officers and volunteers put their heads together to try and create a show with something for everyone. The combination of business and networking opportunities is a proven recipe for success  - and this year will be no different.
 
Our traditional venue at the Infinite Energy Center is going through some major renovations and for that reason, among others, we are relocating in 2019 to Atlanta Tech Park.  Conveniently located in the Peachtree Corners/Norcross area where “Atlanta high-tech” began back in the 70's, the facility is new and spacious. Exciting new features for exhibitors include video monitors throughout the show floor where your ads can be running continuously during the show. 

The new venue also allows us to choose our own catering company which means a hot buffet lunch and a beer/wine reception at the end of the show. No more box lunches.
 
We are finalizing the technical program and should have details soon. Pete Waddell will be back with his Designers Round Table plus more technical sessions to be announced.


We are very excited about our local charity partner this year. Canine Assistance has been training service dogs for over 27 years in Alpharetta. They have an incredible history and story to tell. Come to the Expo to meet some of their beautiful furry students!  


 
 
 
SPACE IS GOING FAST – SIGN UP TO EXHIBIT TODAY!


 
 


April 11

Rocky Mountain (Colorado) Chapter: Business After Hours at Advanced Circuits  +

Location
21101 E. 32nd Parkway Aurora, CO 80011



SAVE THE DATE!
The SMTA Rocky Mountain Chapter
After Hours Meet & Greet Event on April 11, 2019
3:00-6:00PM
Hosted by: Advanced Circuits

  




Join us for a free SMTA After Hours Meet & Greet event at Advanced Circuits.  Enjoy a tour of the facility and a presentation by Isola Group, manufacturer of pre-pregs and laminate materials used in fabricating printed circuit boards.  Refreshments will be provided. 
Tours will start at 3:30PM and 4:45PM.



April 11

Atlanta Expo  +

Location: *NEW LOCATION* Atlanta Technology Park
107 Technology Parkway
Peachtree Corners, GA 30092



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Hyatt Place by March 13, 2019.

5600 Peachtree Parkway Norcross, Georgia, United States, 30092

Group Code: SMTA 

770-416-7655

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Show Hours: 10:00AM – 4:00PM

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:

9:00AM:

Registration Opens

10:00AM:

Expo Opens

10:30AM:

Bill Cardoso, Ph.D., Creative Electron

10 Years of iPhone X-Rays – What Have We Learned

Abstract: It’s been over 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly the most advanced smartphone in the market today, the iPhone is a technology marvel. The double stacked boards, dual battery, and a face recognition sensor bring the iPhone to a whole different level. 


In this presentation, we’ll explore these technological advances by a live teardown of several iPhones. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the iPhones, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put these devices together – and how this process has changed in the past decade. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled. 

Bio: Our benevolent overlord is an overeducated Brazilian who became an electronics technician at 13, continued in life to get a BS, MS, and PhD in Electrical Engineering, and topped off with an MBA. While taking way too many classes, Bill ran a top engineering design department at Fermilab, the leading high energy and nuclear physics research lab in the USA. After almost a decade in Chicago, Bill moved to San Diego in search of perpetual summers. In San Diego, Bill founded Creative Electron, where he obsesses about building the best x-ray machines in the world. When not on a plane, Bill spends time on the beach listening to Car Talk with his beautiful wife and three kids.

 

THANK YOU TO OUR LUNCH SPONSOR: 

ITS

12:00PM:

Complimentary Lunch

 

12:15PM:

KEYNOTE LUNCH PRESENTATION:

Heinz Wegener, Cross Technologies, Inc., Todd Peneguy, and Gary Webb, Tiger Labs Corporation

Yesterday, Today, Tomorrow

Wegener is an early Icon of electronics manufacturing in Atlanta and he is speaking on the Early beginnings of Electronics in Atlanta, Gary is heavily engaged in Today’s industry and Todd has an announcement about tomorrow and it should be a jaw dropper!

WegenerBios: Heinz Wegener is President and Owner of Cross Technologies, Inc., a private company which manufactures electronic equipment for the satellite and telecommunications markets. Heinz earned a bachelor of science degree (summa cum laude) from Indiana Institute of Technology in 1970. He is a member of the Institute of Electrical and Electronic Engineers (IEEE), a past member of the Executive Committee of the Southeast Council of the American Electronics Association (AEA), and served as Chairman of the Southeast Council of the AEA in 1992. He was also a past member of the Board of Advisors of Technology Executive Roundtable.

 

 

Todd PeneguyTodd Peneguy is a Sales and Marketing professional with a Degree, in Speech Communications, from the University of Georgia. Todd was a founding member of both the TAG Mobility Board, the TAG Cloud Board and was the Executive Charmain of the First TAG Internet of Things Symposium. 

 

 

 

Gary WebbGary Webb began his journey in product development in Atlanta at Georgia Power and two pioneering technology firms, DC Hayes Microcomputers and Quadram. Upon graduation from Georgia Tech, Mr Webb spent a few years in Boca Raton FL where he was a member of The Original IBM PC development teams and later designed dozens of IBM servers out of Raleigh, NC.He and his Skunkworks™ Tiger Labs team have designed over 100 products ranging from small sensors and gateways through award-winning high performance data storage devices and enterprise servers. He has consulted senior executives in companies tlike The Home Depot and his products and designs have generated over 4B$ of revenue for both small and large organizations such as IBM, Dell, and Seagate. He has been awarded 6 patents with several pending. Mr Webb is currently engaged in over a dozen state-of-the-art IOT and M2M product development programs, some in early concept stages with others entering volume manufacturing.

 

THANK YOU TO OUR SNACK SPONSOR:

 

2:00PM:

Industry Roundtable

Moderated by Pete Waddell, technical editor, PRINTED CIRCUIT DESIGN & FAB and president, UP Media Group (UPMG) and Ken Holmes, Holmes Electronics

Abstract: An informal Industry Roundtable that will focus on challenges within the PCB supply chain. This promises to be a lively look at the world of PCB design, fabrication, assembly…and beyond. Be ready to tell us “what keeps you up at night” and to share your industry experience with fellow professionals.

Bio: Prior to launching UP Media Group in 2002, Pete Waddell had been publisher and editor-in-chief of Printed Circuit Design Magazine, publisher of PC FAB, and conference director of the PCB Design Conferences. He spent over 20 years as a draftsman and designer in the electronics industry, working for some of the largest military and commercial contractors in the US.

 

 

THANK YOU TO OUR RECEPTION SPONSOR: 

3:00PM:

Reception on Show Floor

4:00PM

Expo Closes

 

2019 CHARITY RAFFLE INFORMATION


The Atlanta Chapter is holding a charity raffle again this year with drawings for great prizes throughout the day.

Canine Assistantsmission is to educate dogs and the people who need them so they may improve the lives of one another. We believe that dogs who are asked to improve the lives of people deserve to be treated with the utmost respect and kindness. We want the relationships we facilitate between people and their working dogs to serve as the model for all relationships between dogs and people.

We place Service and Companion Dogs with people who have mobility difficulties, type I diabetes, epilepsy, and other medical needs. We also place Facility Dogs who provide therapy and intervention services to children and adults. We provide a Disabilities Awareness Education Program and K-9 Kids Reading Program for school-age children as well as Animal Assisted Therapy and Interventions.

Exhibitors are invited to donate raffle prizes. Raffle tickets will be sold the day of the Expo, with all proceeds benefiting Canine Assistants. For information on how to donate contact SMTA at hannah@smta.org!

 

THANK YOU TO OUR RAFFLE DONORS:

UP MEDIA GROUP- $50 LOWE's gift card

I. Technical Services, LLC - Thompson 31Fifty wine

Amitron Corporation - 2 $50 gift certificates 

Viscom - $100 gift card


April 16

Massachusetts (Boston) Chapter: Selecting High Tech Adhesives  +

Location
Honle UV America, Inc. 261 Cedar Hill Street, Bldg C, Marlboro, MA 01752



SMTA Boston Chapter evening meeting on Tuesday, April 16, 2019 at Honle UV America, Inc. in Marlboro, MA.
What You Need To Consider Before Selecting High Tech Adhesives
 
Abstract:  Choosing the best adhesive for a specific application can be complex. There are many variables to be considered and numerous types of chemistries, all with different capabilities. An understanding of the most important parameters will help to narrow the choices.  The discussion will cover some of the more important issues and chemistries needed for choosing the best adhesive.  These parameters are applicable to macro and micro applications for all industries.
Speaker:   Barry Siroka – Business Development Manager – EpoxySet Inc.
Bio:  Barry Siroka started in the chemical industry as a urethane production chemist and moved into technical service of specialty materials in 1980.  Over the course of his 40+ year career, he has worked for several polymer manufacturers and distributors in various technical service/sales/marketing roles.  He has been responsible for training in the use of adhesives to sales personnel, distributors and engineers in most high tech industries. His emphasis is in customer service and solving material problems.  Barry has continued his marketing/sales/customer relationship efforts as the Business Development Manager since joining EpoxySet in 2015.
 
Date: Tuesday, April 16, 2019
Time: 5:00 PM to 9:00 PM
Location: Honle UV America, Inc.
261 Cedar Hill Street, Bldg C, Marlboro, MA 01752
Cost: Members $25 ($30 after Thursday, April 11, 2019)
Non-Member  $30 ($35 after Thursday, April 11, 2019)
Meeting Agenda:
5:00 – 6:00 PM Registration and Sign in, Socializing, Networking
6:00 – 7:30 PM Factory Tour – Adhesive Curing Demo
6:30 – 7:30 PM Dinner and Announcements
7:30 – 8:30 PM Feature Adhesive Presentation
8:30 -8:45 PM Q&A
8:45 PM Adjourn
 
Our 2018 Expo Sponsors:
   

For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22
 
To register for this event visit: https://smta.org/chapters/rsvp.cfm?BEE_ID=4680
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190


Future Events:
iMAPS NE – Tuesday May 7, 2019 – 46th Symposium & Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA
SMTA –May 21 or 22, 2019 – IPC Standard Update & JBC Rework Station, TBD
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA


April 17

FREE Webinar: Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India



Wednesday 17th April @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenters: Ansuman Das, Ph.D., MacDermid Alpha Electronics Solutions

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Although most of the PCB assemblies manufactured today involve no-clean process – many of the applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements or due to the requirement from a downstream process. With quantum of changes electronics world has gone through in past two decades cleanability requirements for the PCB assembly have also changed to keep up with new requirements. Change in design, materials and manufacturing processes involved in assembling has also made the cleaning process more and more complex. In this presentation we will discuss the challenges faced by todays industry in terms of post soldering flux cleaning from the assembly and how to address such challenges with available methods. Discussion will explain the chemistry involved in cleaning of different types of fluxes in different cleaning processes. It will also cover some of the methods to evaluate the cleanliness of the PCB assembly.

 

About the Presenter

Ansuman Das, Ph.D., is currently a formulation scientist and technology leader for MacDermid Alpha Electronics Solutions at the India Research Centre, Bangalore. He received his Ph. D in Chemistry from University of Calcutta, India. Dr. Das has more than 14 years of experience in development of soldering fluxes and solder paste for board, substrate and wafer level applications.

 


April 29

Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys  +



Bob WillisMonday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 2

Carolinas Expo & Tech Forum  +

Location: DoubleTree by Hilton - Research Triangle Park
4810 Page Creek Lane
Durham, NC 27703



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 1, 2019!

 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Research Triangle Park



Attendees

Exhibit Hours:
Thursday, May 2, 2019
10:00AM–3:00PM

Free Program and Technical Schedule Coming Soon!

 


May 3

Dallas Chapter: LED Do’s and Don’ts  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



LED Do’s and Don’ts

Speaker: Matt Osborne, Regional Territory Manager, Trans-Tec America

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on May 3, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!



Abstract

What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.

Biography

Matt Osborne
Trans-Tec America
Territory manager
  • Attended University of Delaware.
  • Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
  • Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
  • Worked for Quad Systems as a Field Service Engineer.
  • Engineer for Decatur Electronics in microwave radar.
  • Redesigned to Jugs professional radar gun used by Major League Baseball.
  • Opened his own contract manufacturing business, Contract Assembly Service, Inc.
  • Vice President of American Circuits located in Charlotte, NC.
  • Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
  • Trans-Tec America territory manager.



May 7

Wisconsin Chapter: 2019 Wisconsin SMTA Expo  +

Crown Plaza Milwaukee Airport 6401 S. 13th Street Milwaukee, WI



Save the date and Join us! 
The 2019 Wisconsin SMTA Expo is scheduled for Tuesday, May 7th at:

Crowne Plaza Milwaukee Airport
6401 S. 13th Street
Milwaukee, WI 53221
 
Please RSVP today to reserve your spot!   This Expo will be the largest yet.   Come to see the vendors and stay to network with others in our industry!
50+ vendors, Lunch, Door Prizes, raffles, 2nd Annual Golf Outing sign up & more!
We plan to have 3 Technical speakers featuring Chrys Shea who will present:

“Accelerating the solder paste evaluation process”
 
We are excited to see everyone on May 7th.   The Expo is free of charge, but please RSVP today to let us know that you are attending!

Jana Esselmann

WI SMTA Secretary
262-305-0568


 


May 7

Wisconsin Chapter: Milwaukee Brewers Game May 7th  +

1 Brewers Way, Milwaukee WI 53214



Wisconsin SMTA hosts an evening at Miller Park with the Milwaukee Brewers
 
Join WI SMTA Officers for the Brewers Game after the Expo on Tuesday May 7th!
The Milwaukee Brewers play the Washington Nationals at 6:40pm.
We have 30 tickets reserved.  
 Our ticket package is in Section 211.  Row 8-12. 
Price per ticket is $15.00.
Please sign up and pay to secure your ticket.   You must pay to secure your seat.   
Tickets will be handed out at the WI SMTA Expo on May 7th.


Please contact Jana Esselmann with questions.  262-305-0568
 


May 7

Wisconsin Expo & Tech Forum  +

Location: Milwaukee Airport Crowne Plaza
6401 S 13th St,
Milwaukee, WI 53221


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.



Attendees

Attendees can register on the SMTA Wisconsin Chapter page.

Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


May 8

Mexico - Guadalajara Chapter: SMTA Expo and Tech Forum Chihuahua Edition  +

Salon Villarreal



Te esperamos, registrate en el siguiente link para poder asistir

Registro Aqui / Register Here

Evento gratuito gracias a nuestros patrocinadores, consulta proximamente la agenda de conferencias y listado de empresas participantes en la zona de Expo.
 
¿Te gustaria ser expositor? escribenos a jaime.arreola@pemtron.com ya tenemos mesas disponibles para la Expo.



May 8

Great Lakes (Chicago) Chapter: Accelerating the Solder Paste Evaluation Process - By Chrys Shea  +

TBD



SMTA Great Lakes Chapter Meeting:

Wednesday, May 8th, 2019


Time & Location: TBD

 


ACCELERATING THE SOLDER PASTE EVALUATION PROCESS
 
 
By
Chrys Shea
Shea Engineering Services
East Greenwich, RI, USA
Chrys@sheaengineering.com


 
Abstract
 
Solder paste can make or break the profitability of SMT processes. Using the proper chemistry is critical to a successful operation.  Because solder pastes have so many different characteristics that affect their assembly line performance, they can be cumbersome and costly to evaluate.  As a result, many assemblers are using mature formulations that have since been improved upon, simply because they don’t have the resources to properly evaluate new, more process- or product-friendly materials.

This paper proposes a new solder paste evaluation regimen that helps engineers assess up to 25 solder paste properties on their assembly line in 5 hours or less.  It uses the new SMTA board that is available off-the-shelf from Practical Components and is part of a full kit developed specifically to help PCB assemblers choose the right solder paste for their operation, as quickly, easily and economically as possible.


 
About the Speaker:


CHRYS SHEA
President, Shea Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.  Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her research on solder paste printing.  In 2012, she was honored with the SMTA “Member of Technical Distinction” award.  Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island.  She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.


May 9

Huntsville Expo & Tech Forum  +

Location: Stone Event Center/ Campus 805
2620 Clinton Avenue
Huntsville, AL 35805



Exhibitors

The cost to exhibit for corporate members is $375/$475 (early/late) and $450/$550 (early/late) for non-corporate members. The cost to exhibit includes: one 6ft draped table, two chairs, company sign, directory listing and attendee list. Electricity is an additional $30 per outlet. Earlybird pricing expires April 12th, 2019! 

Important Exhibitor Materials:

Book a discounted room rate at the Springhill Suites by Huntsville Downtown  by April 17, 2019.

 745 Constellation Place Drive SW, Huntsville, Alabama 35801 USA

Group Code: SMTA 

256-512-0188

Book Rooms Today!  

 



Attendees

Free Technical Program & Schedule:
8:00AM
Registration opens
 

More information to follow...

 

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:


May 16

Puget Sound Expo & Tech Forum  +

Location: DoubleTree by Hilton Seattle Airport
18740 International Boulevard
Seattle, WA 98188



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on April 12, 2019!

 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton Seattle Airport



Attendees

May 20

Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process  +



Bob WillisMonday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 21

Medical Electronics Sponsorship and Table Top Exhibit  +




Exhibitors

 

Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below. For more information contact SMTA, medical@smta.org or call 952-920-7682.

View Sponsorship Benefits

 

Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is April 15, 2019. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above. For a printable application form, click here.

 

Exhibiting Information

The conference will include an exhibition area featuring 25+ tabletop displays that will be open during conference breaks plus after hours.

Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings

 

Exhibit Pricing:
Member: $550
Non-member: $650


Exhibit Hours:
May 21: 10:00am – 5:00pm


Please note that exhibit traffic will be minimal while symposium is in session. Please e-mail SMTA at medical@smta.org or +1-952-920-7682 for sponsorship or exhibitor information.



Attendees

 

Exhibit Hall Hours:

May 21: 10:00am – 5:00pm
To Register for the technical conference, click here.


May 21 - 22

Medical Electronics Symposium  +

Location
The Tudor Arms Hotel Cleveland
Cleveland , OH 44106


May 21-22, 2019
The Tudor Arms Hotel Cleveland, Ohio
 

Crystal Ballroom

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

 

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

 



June 4 - 6

International Conference for Electronics Enabling Technologies 2019  +

Location
Markham , ON Canada


The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

 

Value Proposition for Participation

  • Broaden your knowledge of the wider enabling technologies
  • Deepen your skills on traditional soldering and electronics
  • Access to local engineering and science talent
  • Opportunities for cross-sector collaboration/innovation
  • Industry exposure to your work – generate interest, support, awareness & excitement
  • Build network and local-ecosystem that aligns various needs and service providers
  • Held at ventureLAB, a leading innovation hub in York Region, Canada's densest ICT cluster
  • Recognition for Best Conference Paper

 


June 5

SMTA Ontario Chapter Expo & Tech Forum  +

In conjunction with the International Conference for Electronics Enabling Technologies (ICEET)

Location: ventureLAB
3600 Steeles Ave. East
C-C106
Markham, ON L3R 927



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on May 3, 2019!  

 



Attendees

Register here to attend the expo only!
Technical conference and workshops not included.

Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

 

Exhibit Hours:
Wednesday, June 5, 2019: 10:00am – 3:30pm

 

Thank You to our Coffee Break Sponsor:


June 7

Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s

Speaker: Robert Boguski, President, Datest

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on June 7, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choice in many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.
This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numberous examples will be shown, with emphasis on PCBA and PCBF failure analysis and defect detection.


Biography

Robert Boguski, President, Datest

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS).  Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE.  Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC).  Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.



June 11

Ohio Valley Chapter: 4th Annual SMTA Member Appreciation Golf Outing  +

Location
Raintree Golf & Event Center, Uniontown, Ohio



The SMTA Ohio Valley Chapter is pleased to invite you to participate in our “4th Annual Member Appreciation Golf Outing”.  Golf format is a four person scramble with team prizes and skill awards.  Skins challenge $5.00 per player ($20.00 team).

Participation is absolutely “FREE” for SMTA Members and Sponsors.  Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner.

Winning team prizes, Skill Challenge prizes and Team Skins awards will follow dinner.

Enjoy networking with fellow SMTA members and vendors in a relaxing, fun atmosphere.
 
“Bring a guest.”  Guest golfer - not a SMTA Member: $50.00

Not a golfer, no problem. Join us for the day, enjoy riding around the course visiting with the golfers and dinner afterwards.

 
You may organize your own four-some or we will pair you up.  When registering please use the company field
(after listing your company) to enter the names of players you wish to play with.

 



June 17

University of Texas at Arlington Student Chapter Chapter: 3D Xray techniques for field failure analysis  +

Location
UT Arlington; Nedderman Hall, Room 100



Steven Kummerl from Texas Instruments will give a presentation on "3D Xray techniques for field failure analysis".


June 17

Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions  +



Bob WillisMonday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



June 18 - 20

SMT Processes Certification (Mequon, WI)  +

Location
Rockwell Automation
Mequon , WI 53092-4400


Hosted at Rockwell Automation

  • June 18- Course (8:30-5pm)
  • June 19- ½ day of course + exam
  • June 20- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall


June 20 - 21

eSMART Factory Conference  +

Location
The Dearborn Inn
Dearborn , MI 48124


Software Systems & Processes • Robotics • 3D Printing

eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.

 


June 25 - 27

Symposium on Counterfeit Parts and Materials 2019  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD


2019 call for abstracts and registration is now open. The program will be finalized in Spring 2019. 

 

Counterfeit Symposium Panel Discussion

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

 


 

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 



The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


June 25 - 26

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

Sponsorship Opportunities:

**All sponsorships require an exhibit booth reservation**
 

Lanyard Sponsorship (Limit 1) - $500 - Company to provide lanyards SOLD!
Provide your company lanyards and they will be the official lanyard for the conference. You will receive logo recognition in the show directory, conference website and signage.

Tote Bag Sponsorship (Limit 1) - $400 (if provided by company/$800 if produced by SMTA) SOLD!
Provide your logo on all of the conference attendee bags! If you would like SMTA to produce the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.

Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$750 SOLD!
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

 

Exhibitor Information:

Contact SMTA for available booth space. 952-920-7682 or counterfeit@smta.org Please note that exhibit traffic will be minimal while symposium is in session.



Exhibit space entitles you to:

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings


Download a hard copy of the registration form


Cost to exhibit:
Rates increase $100 after May 31, 2019

Booth type CALCE/SMTA Members Non-Members
One table
includes access to Electrical Outlet
$550 $650
One table
no access to Electrical Outlet
$500 $600


 

 



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks


    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


June 27

Upper Midwest Expo & Tech Forum  +

Location: DoubleTree by Hilton Minneapolis - Park Place
Park Ballroom
1500 Park Place Blvd.
Minneapolis, MN 55416



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on May 31, 2019!

Important Exhibitor Materials:

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, June 27th, 2019
9:00AM–3:00PM

 

 


July 15

Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process  +



Bob WillisMonday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


July 18

Heartland Expo & Tech Forum  +

Location: Marriott Kansas City Overland Park
10800 Metcalf Avenue
Overland Park, KS 66210



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on June 7, 2019!

 

 

Click Here for Discounted Hotel Rooms 



Attendees


August 8

Ohio Expo & Tech Forum  +

Location: Holiday Inn Cleveland Strongsville
15471 Royalton Road
Strongsville, OH 44136



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on July 8, 2019!
 



Attendees

August 12

Webinar: Conformal Coating - Successful Implementation & Quality Control  +



Bob WillisMonday 12th August @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



August 15

Queretaro Expo & Tech Forum  +

Location: Misión Grand Juriquilla, Queretaro
Blvd Villas Del Meson 56
Juriquilla, QR 76230



Exhibitors

The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $55 per outlet. Early registration pricing ends on July 12th, 2019!

Important Exhibitor Materials:

 

 

Booths are assigned in the order they are received. 

Important Exhibitor Materials:

  •  In the case of bank transfers, the dollar exchange rate must be calculated on the basis of the interbank purchase price and not the selling price. All transfers require an additional $50 USD.    
  • To pay by wire transfer please contact SMTA HQ. 1-952-920-7682 or hannah@smta.org
  • Please contact SMTA Expo Manager Hannah Funk with questions or for additional information.



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Please see the Queretaro Chapter Page for More Information on Technical Sessions.

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, August 15, 2019
11:00AM–6:00PM

 


August 22

Capital Expo & Tech Forum  +

Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends August 2nd, 2019!

Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, August 22nd, 2019
9:00AM–3:00PM
Registration Opens at 8:00AM
 



September 22 - 26

SMTA International 2019  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


September 24 - 25

SMTA International Electronics Exhibition  +

Location: Donald E. Stephens Convention Center
Rosemont, IL


Exhibitors Register Now
Exhibitors

SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


September 24 - 26

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • September 24 - Course (8:30-5pm)
  • September 25 - ½ day of course + exam
  • Spemteber 26 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 8

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8ft pipe & draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird rates expire on September 13, 2019!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up. 

 



Attendees

Free Technical Program & Schedule Coming Soon!

 

 


October 10

Mexico - Querétaro Chapter: Design for Manufacturing - Symposium  +

UTEQ



Call for Papers ! 
Now accepting papers for review.
SMTA Members please log in to auto-fill your contact info and save time ! 
or email to 
Guillermo Maldonado  gmaldonado@ste-latinoamerica.com
Marco Solis  Marco.Solis@gmx.com
 


October 15

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15, 2019!



Attendees

October 17

Long Island Expo & Tech Forum  +

Location: Melville Marriott Long Island
1350 Walt Whitman Road
Melville, NY 11747


Exhibitors

Please contact Sharon Dietrich with questions or for additional information.



Attendees
Attendees Register Now

Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.

 


October 22 - 24

International Wafer-Level Packaging Conference  +

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.


October 23 - 24

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2019 After April 30, 2019
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.


October 23 - 24

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-5:00pm
5:00pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-5:00pm
Move out: 5:00pm-7:00pm

Click here for the latest floorplan


IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 28

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Utah Expo  +

TBD



Utah Vendor Expo actual date and location TBD.  Will not be at U of U this year.


November 5

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!



November 7

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!


November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

 



Attendees

Exhibit Hours:
Wednesday, November 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:
 


December 4

Silicon Valley Expo & Tech Forum  +

San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 15th, 2019!

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:00PM

Free Technical Program & Schedule:
Information to follow...



Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819