Calendar of Events

   2019      

                                   

2019

May 20

Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process  +



Bob WillisMonday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 21

Massachusetts (Boston) Chapter: Understanding the requirements of IPC-J-STD-001  +

Location
Radisson Hotel Nashua - 11 Tara Boulevard, Nashua, NH 03062



SMTA Boston Chapter cordially invites you to an evening meeting on Tuesday, May 21st, 2019 at the Radisson Hotel Nashua in Nashua, NH.
 
Understanding the requirements of
IPC-J-STD 001 Requirements for Soldered Electrical and Electronic Assemblies  
Abstract:  The presentation will cover many elements of the J-STD-001 document which are problematic in the understanding of the criteria. 
For example here are a few of the most misunderstood elements of the document:
  • Understanding the definition of the requirements, especially for the differentiation of the various criteria of acceptable, process indicators, no requirements, and defective conditions.
  • Conflict resolution. As is written it is very difficult to interpret the results of an inspection if the contract states, that the product will be built and inspected to the requirements of J-STD-001. This document is a soldering document.
  • Interpretation of the differences between, conductor and wire diameter as this was a difficult concept to understand my many in the industry.
  • Review the meaning of Objective Evidence and this is a problematic area to substantiate a point and criteria.
  • In the materials section, the need to qualify the materials being used or face rejection of the product as it was not build with qualified materials.
  • The conversion to lead-free solders and other alloys and the due diligence to qualify those materials.
  • Thermal profiles and the need of such.
  • The solder connection.
  • The definition of soldering a wire to a terminal and the new explanation of the visuals.
  • Lead Trimming and the impact of cutting leads after soldering.
  • The physical soldering requirements.
  • The term discernible and what it means.
  • Component with no class 3 requirements
  • Section 8 cleaning section being re-written
 
Speaker:  Leo Lambert Vice President, Technical Director, Consultant EPTAC Corporation
Bio:  
•    B.S.M.E. Lowell Technological Institute, now University of Massachusetts, Lowell
•    Vice President/Technical Director for EPTAC Corp. Manchester, New Hampshire
 
Publications:
        *    Text “Soldering for Electronic Assemblies”, published by Marcel Dekker 1987
        *    Published and presented numerous papers relative to the subject of Soldering and Cleaning at various Technical Seminars and Exhibitions worldwide.
        *    Edited books on soldering for Van Nonstrand Publishers, and Society of Metals,
        *    Former member of the Editorial Review board for Circuit Assembly Magazine 
        *    Develop, published and conducted seminars Deadline to Lead Free Seminars and Thriving in a RoHS/WEEE Environment.
 
Awards:
        *    IPC President Award 1989, for work conducted on solderable coatings for printed wiring boards. 
        *    TAEC chair 2008-2010
        *    IPC Hall of Fame 2019
        *    Charter member of the J-STD-001 and 610 committees
        *    Active participant in following IPC committees. 
        *    J-STD-001 and Handbook
        *    IPC-A-610 and 820 Handbook
        *    IPC-A-600
        *    IPC-6012
        *    IPC/WHMA –A-620
        *    Develop and wrote first IPC-A-600 training program
        *    Recipients of many Distinguished Committee Service Awards and Leadership Awards and Special Recognition Awards for the development of training programs
 
Other Activities:
        *    Charter Member on UNEP (United Nation Environmental Program) Technical Solvent Options Committee, overseeing worldwide activities in reducing CFC from use as cleaning material in Electronic Manufacturing. Part of Montreal Protocol
        *    Member of ICOLP (Industry Cooperative for Ozone Layer Protection)
        *    Past IPC Chairman of many committees relating to soldering and cleaning.
        *    Conducted many soldering seminars worldwide.
        *    Member of Mechanical Engineering advisory board, University of Massachusetts, Lowell MA.
        *    Member of Advisory Board for Greater Lowell Vocational School

 
“Rework and Assembly Processes for IPC-A-610 & J-STD-001” 
Abstract:  Hand soldering in the electronics industry is increasingly considered a reliability risk in electronics manufacturing.  Control over pc assembly with new software systems in placement, reflow and automated inspections has given engineering better control and traceability, improving yields and reliability.  These improvements have made the difference between automated assembly and hand soldering more apparent.   Some OEM manufactures have eliminated hand soldering by disposal of nonconforming product.  This is not practical when the pc assemblies have a high value.  
In companies with expensive assemblies there is a need to extend the control to the bench assembly.  JBC Tools has developed new software systems that work in conjunction with the soldering equipment for improving controls and providing traceability. IPC J-STD 610 sets standards for soldering that can be used as a basis for setting processes for rework and assembly. This standard can be used in the JBC QST software system; we will explain how this software can be used in the J-STD.

The presentation will provide the audience with a demonstration on how the system works and give examples of how it was implemented.
 

Speaker:   Sean Torrens, US Sales Manager, Business and Engineering in LaSalle School in Barcelona & Manhattan College in New York. Sean has successfully implemented the QST system in class 3 companies all over the US; upgrading their control and traceability process for hand soldering.
 
Date: Tuesday, May 21, 2019
Time: 5:00 PM to 8:45 PM
Location: Radisson Hotel Nashua
11 Tara Boulevard, Nashua, NH 03062
Cost: Members $25 ($30 after Thursday, May16, 2019)
Non-Member  $30 ($35 after Thursday, May 16, 2019)
Meeting Agenda:
5:00 – 6:00 PM Registration and Sign in, Socializing, Networking
5:45 – 6:45 PM Dinner and Announcements
6:45 – 7:30 PM Feature Presentation
7:30 – 7:45 PM Q&A
7:45 – 8:15 PM Feature: JBC Rework Presentation
8:15 – 8:45 PM Q&A: Demo
8:45 PM Adjourn
 
Sponsor for this event:
JBC The Soldering Co.

Our 2018 Expo Sponsors:
   


For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22

To register for this event visit: https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4701
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

 
Future Events:
iMAPS NE – Tuesday May 7, 2019 – 46th Symposium & Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA Click here for more information
IEEE Boston REL - Wednesday May 8, 2019 - An Introduction to Use Case 7 at MIT Lincoln Laboratory 3 Forbes Road, Lexington, MA Click here for more information
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA
 


May 21

Medical Electronics Sponsorship and Table Top Exhibit  +

Cleveland, OH



Exhibitors

 

Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below. For more information contact SMTA, medical@smta.org or call 952-920-7682.

View Sponsorship Benefits

 

Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is April 15, 2019. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above. For a printable application form, click here.

 

Exhibiting Information

The conference will include an exhibition area featuring 25+ tabletop displays that will be open during conference breaks plus after hours.

Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings

 

Exhibit Pricing:
Member: $550
Non-member: $650


Exhibit Hours:
May 21: 9:00am – 5:00pm


Please note that exhibit traffic will be minimal while symposium is in session. Please e-mail SMTA at medical@smta.org or +1-952-920-7682 for sponsorship or exhibitor information.



Attendees

 

Exhibit Hall Hours:

May 21: 10:00am – 5:00pm
To Register for the technical conference, click here.


May 21 - 22

Medical Electronics Symposium  +

Location
The Tudor Arms Hotel Cleveland
Cleveland , OH 44106


May 21-22, 2019
The Tudor Arms Hotel, Cleveland, Ohio
 

Crystal Ballroom

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

 

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

 


May 28 - 30

Mexico - Guadalajara Chapter: Programa de Certificación SMTA - SMTA Program Certification  +

Location
Hotel RIU, Guadalajara.



The most respected sign of approval in the electronics assembly industry 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.)

This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt.


Why You Should Participate

Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Lean Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE or Lean Six Sigma Green Belt Engineer for Six Sigma.


​​​​​Duracion: Del 28 al 30 de Mayo, 2019.
Lenguaje: Ingles/Español 
Examen: Ingles 
Instructores: Jim Hall, ITM Consulting e Ivan Castellanos, Indium Corporation  




May 30

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: May 30th: SMTA Upper Midwest Chapter presents “What Worked Yesterday Won’t Work Tomorrow” At John Deere Electronic Solutions – Fargo, ND  +

Location
John Deere Electronic Solutions, Fargo, ND




Upper Mid-west Chapter is hosting a “You Drive, We Buy” event for the following topic:

“What Worked Yesterday Won’t Work Tomorrow”
Speaker: James A. Springer – Manager, Quality, Product Environmental and Safety Compliance – John Deere Electronic Solutions
 
Presentation Overview: 
Join many of your colleagues to hear tales from yesterday that worked, some that didn’t and some of the big changes over the years in technology and why what worked then won’t work now, or will it. From wave solder machines with foam fluxers, bottom only preheat into thin air and a wave that kind-a rolled as the assembled board pushed through the molten solder to wave solder machines where every parameter is controlled to very tight tolerances, the process has advanced but the principles remain the same. Many Engineers have overcome new manufacturing needs with various on the fly DOE’s, trial and error efforts, and other tricks to do new things. That may have worked in the past but will not today. The need for process control, Gage R&R’s and use of six sigma tools have never been more important. Join us for some history, present day knowledge and one leader’s opinion of where the future may go and why he believes the best days of technology are still to come. 
 
Date:     Thursday, May 30th, 2019
Cost:      FREE for Members / $20 Non-members (make checks payable to SMTA)
                        (Also FREE for non-members who become a Member at the Event!!)
 
Time/Agenda:
  • 11:30 AM to 12:00 PM - Registration
  • 12:00 PM to 12:30 PM – Lunch
  • 12:30 PM to 1:30 PM – Presentation
  • 1:30 PM to 3:30 PM – Q&A / Tour
 
Lunch will be provided by the SMTA Upper Midwest Chapter.
 
RSVP by May 27th to guarantee a spot for this session.
 
Address/Directions to John Deere Electronic Solutions:
John Deere Electronic Solutions
1441 44th St. NW
Fargo, ND 58102


James Springer Biography: 
 
Manager, Quality, Product Environmental and Safety Compliance
John Deere Electronic Solutions 
 
Education: 
1979 – Electronics Technology, Hesston Jr. College
1980 – General Studies, Goshen College
1986 – Computer Programming and Operations, Control Data Institute
 
Career Highlights:
2010   John Deere Electronic Solutions
           Manager, Quality, Product Environmental and Safety Compliance
2006   John Deere Electronic Solutions
           Quality Assurance Manager
2002   John Deere Electronic Solutions
           Manager, Advanced Technology
1999   Phoenix International - Springfield
           Operations Manager
1999   Phoenix International - Springfield
           Manager Advanced Technology
1999   Phoenix International
           Manager Manufacturing Engineering
            
Career Highlights:
           Installing first automated SMT line in Kansas City area - 1985
           Innovation Award Nomination and Patent for Heatsink Attachment to PCB
           Starting the MS-Lab – 2002




May 30

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter Meeting May 30th  +

COMET GROUP LAB ONE 3055 Orchard Drive., Suite 150, San Jose, CA 95134






https://www.smta.org/chapters/files/Silicon-Valley-Logo.jpg
cordially invites you to attend:
 
 TECHNICAL PRESENTATION MEETING HELD AT
COMET GROUP LAB ONE 
Theme:  5G ASSEMBLY PROCESSES
 
 
IMPORTANT INFO:
 
Date:  Thursday, May 30, 2019
Time:  Sign In/Registration:  2:15pm-3:00pm
Presentations:   3:00pm – 6:00pm
Location:  Comet Group Lab One
3055 Orchard Dr., Suite 150, San Jose, CA 95134
(Light refreshments to be served during breaks and registration.)


SMTA Members: Free; Non-Members: $20
(By cash or check payable to ‘SMTA Silicon Valley Chapter’ at the door)


SMTA Membership 
(Individual: $95 per year, Membership sign up at www.smta.org)

CLICK HERE TO REGISTER TODAY!
https://www.smta.org/chapters/rsvp.cfm?bee_id=4690


https://www.smta.org/news/smta_calendar/calendar.cfm?YEAR=2018&MONTH=11 
 
 
Topic 1
Two Materials, One Board: High Frequency Hybrid Constructions

Speaker:  Jonathan Weldon – Principal Investigator, Du Pont Electronics and Imaging
 

 

Abstract: The ever-increasing demand for higher data rates and higher operating frequencies in traditional applications has pushed PCB materials to their performance limit.  Additionally, introduction of advanced technologies such as phased array antennas or millimeter wave radars into the consumer market has created a plethora of similar performance, cost, and supply chain challenges.  Technical concerns such as high latency (high dielectric constant), skew (glass reinforcement), and high insertion loss (high loss tangent and copper roughness) are just some of the issues that must be overcome when designing with traditional laminates.  Solving these problems often requires either high cost materials, yield losses in manufacturing, or a complete redesign of the high frequency PCB section; all of which is highly undesirable in a cost sensitive application.  The question at hand then, is not just how do we solve these problems, but how do we solve these problems without breaking the bank or designing something not manufacturable?  To that end, this topic will discuss design concepts and material choices for hybrid PCB constructions that will not only satisfy performance requirements but also help minimize cost through deliberate combination of both high performance and commodity grade materials.
 
Biography:  Jonathan Weldon is a Principal Investigator in DuPont’s Electronics and Imaging business.  In this role, he focuses on the characterization of high frequency materials along with the design of RF systems and interconnects.  Jonathan received his B.S. in Electrical Engineering from Texas Christian University and his M.S. in Electrical Engineering from Wright State University. He has more than a decade of experience in the development of radio frequency (RF) systems for defense applications through his time as an officer in the United States Air Force and an engineer at Sandia National Laboratories.
 

 
Topic 2
Materials and Techniques for Soldering in 5G Architecture 

Speaker: Seth Homer – Indium
 

 
Abstract:- This presentation discusses key soldering material selections as well as techniques that are critical to the performance and reliability of 5G architecture. Topics to be discussed include paste and preform selections and a hybrid solution for QFN voiding.
 
 
 

Biography:  Seth Homer has worked with Indium Corporation for more than 25 years, serving in both manufacturing operations and marketing roles. He is responsible for many of the products within the engineered solders product offering especially as it relates to RF Infrastructure and Power Electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.
 
Topic 3
5G - Tackling some real life problems
 Speaker: Eran Dor – CEO of CRadar.Ai
 
 

 
Abstract:- The 5th generation of cellular communications holds countless promises that many people are looking forward to. However, once the hype fades away and the dust settles, it will be time to deliver on these promises and scrutinize the tradeoffs. This talk will examine the pro's and con's associated with the different frequency bands in terms of RF performance, the risks and benefits of drastically increasing the amount of 5G base stations / small cells as well as examining how PCB manufacturing and SMT assembly may influence RF performance.
 
Biography:  Entrepreneur, wireless enthusiast, mentor and tirelessly curious synergy creator, Eran Dor has spent more than 20 years driving innovation in various wireless industry verticals and is currently the CEO of CRadar.Ai, revolutionizing how Radars see the world. In addition, Eran serves on advisory boards of other startups. Eran previously led large scale complex multi-radio designs for Wi-Fi/IoT networks, Point-to-Point radio links and Satellite payloads valued at over $1B. Eran also studies and practices leadership and mentoring skills with the goal of bringing out the best in people and teams.
 



June 4 - 6

International Conference for Electronics Enabling Technologies 2019  +

Location
Markham , ON Canada


The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

 

Value Proposition for Participation

  • Broaden your knowledge of the wider enabling technologies
  • Deepen your skills on traditional soldering and electronics
  • Access to local engineering and science talent
  • Opportunities for cross-sector collaboration/innovation
  • Industry exposure to your work – generate interest, support, awareness & excitement
  • Build network and local-ecosystem that aligns various needs and service providers
  • Held at ventureLAB, a leading innovation hub in York Region, Canada's densest ICT cluster
  • Recognition for Best Conference Paper

 


June 4

FREE Webinar: Improving Reliability of Assemblies from a Soldering Materials Development Standpoint  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India



Tuesday 4th June @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: Shantanu Joshi, Koki Solder America Inc.

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products with the challenge to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux residue with the presentation discussing ways to improve lead-free solder joint reliability/robustness. Though SnAgCu solder alloys fulfill most soldering requirements, alternative solders are needed to meet more stringent environmental regulations, requirements for greater mechanical reliability, and more demanding high temperature service environments such as under the-hood in automobiles and in avionics systems. Development was done on alternative lead-free alloys with varying percentages of tin-silver-bismuth-indium in comparison with a number of conventional lead-free solder alloys in soldering evaluations. Accelerated thermal cycling test was performed on boards assembled with various different alternative alloys and the results were compared with conventional lead-free alloys. For the solder paste flux, there is a need in automotive and other high reliability applications to have reliable and high insulation resistance even in an atmosphere of high temperature and high humidity. Development was done on a type of ‘crack free' flux paste to inhibit flux residue cracking under extreme environments making it more reliable to stringent surface insulation resistance and electro-migration criterion from automotive and other high reliability product manufacturers. Testing was done to various industry electro-migration and dew test standards.

 

About the Presenter

Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from Binghamton University and Bachelor of Engineering degree in Production Engineering from Pune University, India. He also serves as a Secretary on SMTA Ohio Valley Chapter board.

He is currently pursuing Ph.D. in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from Binghamton University. He is published over dozen papers in various national and international conferences over the years. His co-authored paper won the “Best of Proceedings” award in SMTA International 2013. Shantanu has also won 1st prize in the poster competition held at GE Global Research Center, Niskayuna, NY for poster titled "LGA Solder Joints with Superior Reliability".

 


June 5

Long Island Chapter: Long Island SMTA Presents: The “DEADLY SINS” OF SMT ASSEMBLY Presented by Phil Zarrow  +

Location
Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779



Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell.  There are also the “Deadly Sins” of SMT - there are more than just 7 – and they can make your assembly process a “hell on earth”.
 
During the course of ITM’s assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems.  In other words, a lot of people are making the same mistakes.  The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%.  In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.
 
This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes.  Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented.  Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems.  It will include identification of vendor and source problems including components and materials as well as design related problems.
6/5/19 | Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779


June 5

SMTA Ontario Chapter Expo & Tech Forum  +

In conjunction with the International Conference for Electronics Enabling Technologies (ICEET)

Location: ventureLAB
3600 Steeles Ave. East
C-106
Markham, ON L3R 9Z7



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, and directory listing. Electricity is an additional $25 per outlet. Early bird pricing ends on May 3, 2019!  

 



Attendees

Register here to attend the expo only!
Technical conference and workshops not included.

Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

 

You Are Invited to the ReMAP Reception

Tuesday, June 4 | 6:30pm – 9:30pm
All attendees and exhibitors are invited to attend the ReMAP Reception on Tuesday, June 4 from 6:30pm – 9:30pm at ventureLAB. Join fellow technologists, business leaders and researchers for food, fun and networking! This event is free to attend but please RSVP to Jaclyn@smta.org to let us know if we can expect you.

RSVP Here 

 

Exhibit Hours:
Wednesday, June 5, 2019: 10:00am – 3:00pm

 

Thank You to our Coffee Break Sponsor:

 

Thank You to our Refreshment Sponsor:

9:00am

Registration Opens

 

10:00am

Expo Opens

 

10:30am-11:00am

High Reliability Lead-Free Solder Alloys for High Brightness LED Application

Speaker: Jie Geng, Indium Corporation

 

11:00am-11:30am

Low Temperature Transient Liquid Phase Bonding for Joining SIC Power Modules

Speaker: Jae Pil Jung, University of Seoul, South Korea

 

11:30am-12:00pm

Flux Medium and Voiding: an Empirical Study

Speaker: Sirine Bayram, AIM Solder

 

12:00pm-1:00pm

Complimentary Lunch

 

1:00pm-1:45pm

Keynote: Dealing with the Challenges in the New Advanced Packaging Era

Speaker: Jan Vardaman, TechSearch International, Inc.

 

1:45pm-2:15pm

Smart Textile Applications in Medical Devices & Senior Care

Speaker: Alex Chen, Celestica, Inc. & Milad Afshar, Myant Inc.

 

3:00pm

Expo Closes


June 6

Western Pennsylvania (Pittsburgh) Chapter: West Penn Technical Webinar Sessions  +

Web-Based Webinar



SMTA West Penn is pleased to announce a web-based series of two technical sessions!

Thursday June 6, 2019 - 2 sessions: 8:00AM to 10:00AM and 3:00PM to 5:00PM.  View either session or both, up to you!

Session 1 (8:00 AM to 10:00 AM) - Conformal coating selection, application & cure, testing coatings, inspecting coatings, and the future of coating technology.  Speaker is Doug Pauls, Collins Aerospace.
Session 2 (3:00 PM to 5:00 PM) - Moisture Sensitivity (MSL) overview, managing MSL devices,  conforming to J-STD-033, long and short duration exposure, double sided PCBA, baking and packaging.   Speaker is Greg Benoit, Cogiscan.   

This will be a live web-based event.  Registerants will recieve links to log in and view the presentation with ability to ask questions in real time.

No cost to SMTA members!   $20 for non-members.   RSVP at the link below.   View one or both sessions - up to you!  You will receive login information about a week before the sessions.  

Thanks!
Jason Emes, West Penn President


June 11

Ohio Valley Chapter: 4th Annual SMTA Member Appreciation Golf Outing  +

Location
Raintree Golf & Event Center, Uniontown, Ohio



The SMTA Ohio Valley Chapter is pleased to invite you to participate in our “4th Annual Member Appreciation Golf Outing”.  Golf format is a four person scramble with team prizes and skill awards.  Skins challenge $5.00 per player ($20.00 team).

Participation is absolutely “FREE” for SMTA Members and Sponsors.  Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner.

Winning team prizes, Skill Challenge prizes and Team Skins awards will follow dinner.

Hotel: Cambria Hotel & Suites in Uniontown, OH. 
Room cost is $109.00 a night for the night of June 10th.  For those wishing to stay an additional night , the price will be the same.  To make reservations, contact Cambria Hotel at the number below and mention Ohio Valley SMTA Chapter. 
Hotel information:
Cambria Hotel & Suites
1787 Thorne Drive
Uniontown, OH  44685
330-899-1990

Enjoy networking with fellow SMTA members and vendors in a relaxing, fun atmosphere.
 
“Bring a guest.”  Guest golfer - not a SMTA Member: $50.00

Not a golfer, no problem. Join us for the day, enjoy riding around the course visiting with the golfers and dinner afterwards.

 
You may organize your own four-some or we will pair you up.  When registering please use the company field
(after listing your company) to enter the names of players you wish to play with.

 


June 11

Capital (DC) Chapter: SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM: A PCB Perspective  +

Country Inn & Suites 1717 W Nursery Rd. Linthicum Heights, MD 21090



SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM: A PCB Perspective
 
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
 
Do not miss this full day educational event with presentations by Yaad Eliya and Jim Barry of PCB Technologies. This is your chance to gain knowledge for improvements in reliability, yield and therefore overall product cost. Come learn about PCB advancements from engaging speakers with years of experience and global industry knowledge.
 
This tutorial is a great value, at half the cost of one at SMTA International and it’s offered right in your backyard! Lunch, coffee breaks, course handouts and a certificate of completion are all included and topics include:
 
RF/Microwave Design Considerations and Options
Innovative solutions, based on close cooperation between mil/aero designers and the fabricator. Explore implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design, including for rigid-flex.
 
Thermal Mitigations Options at the Raw Card Level
The most extreme temperatures and stress facing the PCBA is often the reflow cycle. However, the “post-reflow” or operating temperatures facing the product in the field can be detrimental and even disastrous. Learn how smaller, more complex designs are creating thermal mismatches and intense temperature. Explore options in design, materials, and “adder options” such as heatsinks and coins to
mitigate temperature.
 
Reliability: Design for Reliability & Design for Manufacturability
A focus on two parts of the PCB process: the design and how it affects product performance, and what happens once the design reaches the PCB manufacturer. Review nonfunctional pads, via fill, stacked vs. staggered, cross-hatched grounds in rigid-flex, conductor routing, and more. Also, how manufacturer processes affect solderability, looking at DC plating vs. reverse pulse, multiple finishes, edge
plating, and hole placement.
 
Cost and Registration information HERE!
*Registration deadline is June 1st
 
Location:
Country Inn & Suites
1717 W Nursery Rd.
Linthicum Heights, MD 21090
 


June 11

Capital Chapter Tutorial Program - "Supporting High Reliability at the OEM: A PCB Perspective"  +

Location
Country Inn & Suites
Linthicum Heights , MD 21090



Instructors: Yaad Eliya and Jim Barry, PCB Techologies

June 11, 2019

9:00 a.m. - 3:00 p.m.
Country Inn & Suites
1717 West Nursery Road
Linthicum Heights, MD 21090
(443) 577-1036
 
Price:
  • Members: $200
  • Non-Members: $400
  • Capital Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!


Topics of Discussion:

RF/Microwave Design Considerations and Options; by Yaad Elia

RF/Microwave & high-speed boards required many considerations and aspects for maximizing thermal and electrical performance. Designers for high frequency applications must understand critical parameters at the PWB stage. These parameters must be understood in order to eliminate noise, reliability, poor electrical performance, high price and low yield risks. The presenter will highlight innovative solutions, based on close cooperation between Mil/Aero designers and the PWB vendor. Actual field performance sometimes demands “beyond IPC rules/specification”, and in that respect one must provide innovative solutions such as: implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design. This is even more critical, when the hybrid/mixed materials are combined into a rigid flex stack up. Enabling designers to bring an innovation to fruition, with ALL material types in the same stack up, selective final finishes, back drill/deep cone drill/ HDI, so the compatibility between all technical requirements is optimized, will be explored during this discussion.

Thermal Mitigation Options at the Raw Card Level; by Jim Barry

Temperature is and always has been a major factor within the PCB Raw Card level. We know that the most extreme temperatures and stress facing the PCBA today, is often the reflow cycle as seen in some of the recent via stacking issues facing the industry. However, we sometimes forget the “Post Reflow” or Operating temperatures facing the product in the field; this can also be detrimental and even disastrous causing fire or catastrophic failure. The presenter will look at how the shrinkage and complexity of today’s designs are creating thermal mismatch and intense temperature. We will explore what options we have in the design, material choices and “adder options” such as heatsinks and coins to mitigate temperature. If this post thermal factor is ignored – long term effects on the operation and/or life of a product can be severely compromised. Improved thermal performance can also lead to immediate improvements and increase in performance as with thermal imaging. 

Reliability – Design for Reliability & Design for Manufacturability; by Yaad Elia & Jim Barry

The presentation will focus on two parts of the PCB Process; the first being the design and how it can directly affect the performance of the product such as a result of decisions made in the design phase. Getting your supplier(s) involved early will prevent time, save cost and provide a base for a robust design that is manufacturable. Items such as non-functional pads, via fill, stacked vs. staggered, cross-hatched grounds in Rigidflex, conductor routing, PTH preparations, pad sizes, pad/pad spacing, blind/ buried and more. The premise is to balance needs of the designer, whilst trying to maintain a reliable and robust build.

The second part of this discussion focuses on what happens to the design once it hits the PCB Manufacturer. What you specify on your design can significantly affect cost, reliability and lead-time – items such as IPC classification, compensation factors and tolerances needed and material choices. We will discuss how, as a manufacturer, processes can affect solderability issues at the assembler. Things such as DC plating vs. reverse pulse, multiple finishes, edge plating, hole placement on a rigidflex, etc.

 

Note about the presenters and the topics:

The goal of this technical meeting is to share our knowledge as a PCB Manufacturer, with the designer and the OEM, as well as the contract assembler (EMS).  PCB Technologies builds some of the world's most demanding designs and has nearly 40 years of manufacturing experience.  We are not presenting to sell but hoping to share our knowledge of the process and thus gain improvements in the reliability, yield and therefore cost of the products we all touch every day. 


About the Instructors:
Yaad EliyaYaad Eliya
CTO, R&D and Technology Manager

  • Working in PCB Technologies for the last 12 years
  • B.Sc. Engineering at Ben-Gurion University of the Negev
  • Electronic Materials Expert, especially with Rigid Flex, RADAR/Microwave and RF applications
  • Process and machinery design & architecture manager, in the PCB industry
  • Responsible for R&D and special application development, for Medical/Space & Military segments
  • Expert as "tailor made" in design stage application, and a leader in all prototypes when move from R&D to mass production
  • Background and experience - TOWER Semiconductor/Engineering & Photolithography Expert (MUV/DUV)

Jim BarryJim Barry
Solutions Architect and North American Sales Manager - PCBT

  • Printed Circuit Industry veteran for over 39 years - proficient within the disciplines of Engineering, Manufacturing & Sales...  PCB Technologiest including Design, Assembly and Box build...
  • Experienced professional; trained in mechanical engineering, PCB applications, materials and failure analysis.  Working knowledge of IPC, MIL NADCAP, AS9100 and other applicable industry specifications
  • Held various positions within the PCB Industry ranging from Manufacturing, R&D, Sales & Marketing, Engineering, as well as Corporate and Executive levels within various companies
  • Today working as a lead consultant for the world's leading Israeli PCB/PCBA manufacturing operation of High-Density Electronics for Mil/Aero & medical applications

 

Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine

SMTA Capital Chapter    Circuits Assembly


Contact Karen Frericks at 952.920.7682 with questions.
 


June 13

Atlanta Chapter: Chapter Meeting  +

ASM 3975 Lakefield Ct suite 106, Suwanee, GA 30024



Leading Successful Change
Organizations today must have targeted strategies for leading change both within their company as well as in their marketplace. There is no place for merely throwing out ideas and seeing what sticks.
Leadership must practice more than wishful thinking and dreaming. They must have more than a vision and direction. Leading successful change requires a strategy driven by a clear understanding of the current reality coupled with the resources to build for the future.
Leadership is tasked with making a difference from the inside-out. This requires a measured, proven methodology. Strategies for leading and communicating successful change initiatives are the centerpiece of this presentation.
 
Presented By: Don R. Witzel
Don R. Witzel is an independent organization development coach with over 40 years’ experience. He has held key leadership positions in the public and private sectors on a nationwide basis with responsibilities for the development and performance improvement of people and organizations. Don has a Bachelor of Arts degree in Communications, a Master of Arts degree in Adult Education, and a Doctor of Education degree in Adult Learning. In addition to the above, Don has extensive experience in managing and leading large, dynamic organizations through complex change and growth.
Don received his Quality Management System training from Georgia Institute of Technology. Don has helped numerous companies or divisions obtain their QMS credentials during their first certification audit. Don also serves as an outsourced internal auditor for several organizations. In addition to the above training, Don received his training and certification as ISO Lead Auditor from Georgia Technical Institute as well as AS9100 Internal Auditor training and certification.
Some companies with which Don has coached and consulted are: BellSouth, Gwinnett County Public Schools, Gwinnett County Tax Commissioner, AMI Technologies, EMS Technologies, CIBA Vision, Lucent Technologies, Rooms To Go, Johnson & Johnson, Verizon Telecommunications, Volt Information Sciences, Marriott Hotel Properties and with work in many other industries.
 
 When: June 13, 2019
 Where:  ASM

3975 Lakefield Ct suite 106,
Suwanee, GA 30024

Sign in and networking - 4:30
Dinner - 5:00 - 5:45
SMTA business and update 5:45 - 6:00
Presentation - 6:00 - 7:00

RSVP HERE 



June 13

Mexico - Juarez (Formation) Chapter: SMTA Juarez - Technical seminar  +

Location
Centro de Convenciones Cuatro Siglos






¡Anunciamos el próximo evento SMTA-Juarez!
 
Información importante:
Fecha:  Jueves, Junio 13, 2019
Hora:  5:30-9:00 p.m.  
Ubicación: Centro de Convenciones Cuatro Siglos
Dirección: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona.
Ciudad Juárez 32402
Conferencias:
   a) Inspección con rayos-x para identificar voids y HiP
   b) Cómo prevenir los voids y los HiP a través de mejoras en el Proceso

Más información:
smtajrz@gmail.com



 




June 14

Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s

Speaker: Robert Boguski, President, Datest

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on June 7, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choice in many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.
This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numberous examples will be shown, with emphasis on PCBA and PCBF failure analysis and defect detection.


Biography

Robert Boguski, President, Datest

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS).  Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE.  Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC).  Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.



June 17

University of Texas at Arlington Student Chapter Chapter: SMTA UT Arlington Student Chapter Speaker Event  +

Location
Nedderman Hall, Room 100, The University of Texas at Arlington; Address: 701 S Nedderman Dr, Arlington, TX 76019



Title: 3D Xray Techniques for Field Failure Analysis

Pricing:      FREE for all 
 

RSVP now,  request no later than 6/14/2019 to this link: https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4681

Please forward this invitation to others.

 

Speaker:
Steven Kummerl
Analog Packaging R&D & 
WW SMT Customer Support
Texas Instruments
Bio: Steven Kummerl received his B.S. degree in Mechanical Engineering from University of Texas El Paso. He is a member of technical staff at Texas Instruments supporting semiconductor packaging and has worked in the field of high volume/high mix surface mount assemblies and more recently at TI supporting sensor packaging R&D.  He holds over eighteen patents in the field of package design and has authored multiple publications focused in packaging design, SMT package assembly, & reliability.

Parking: Parking details will be sent after RSVP. 




June 17

Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions  +



Bob WillisMonday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



June 18 - 20

Wisconsin Chapter: 2019 SMTA Certification Course with Jim Hall  +

Rockwell Automation 6400 Enterprise Dr. Mequon, WI 53092



This course is sponsored by SMTA National Training program.
For more information on Jim click below:
https://www.itmconsulting.com/?itm_consultant=jim-hall 

Recommended Prerequisites
·  Two years of college (or equivalent).
·  2-3 years of experience in all aspects of SMT, including process optimization.
·  Knowledge of all process and systems steps, including calculations from screen printing and dispensing through test and inspection.

Curriculum
All applicants must pass a combined open and closed book exam focusing on the following curriculum:
·  SMT Materials Component Placement
·  SMT Components Reflow Soldering
·  Stencil Printing Wave Soldering
·  Dispensing Test and Inspection
·  Line Balancing (Downtime, line design)
To register for the 2019 SMT Certification please follow the link below.
https://www.smta.org/education/registration/event_registration2.cfm?event_id=70
 


June 18 - 20

SMT Processes Certification (Mequon, WI)  +

Location
Rockwell Automation
Mequon , WI 53092-4400


Hosted at Rockwell Automation

  • June 18- Course (8:30-5pm)
  • June 19- ½ day of course + exam
  • June 20- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall


June 20

Houston Chapter: Houston Chapter Meeting  +

Magseis-Fairfield 1111 Gillingham Lane Sugarland, TX 77478



Presentation Schedule:
5:00        Welcome Attendees
5:20        Dinner
6:10        Tour SMT Room
6:30        SMT Technical Presentation, Q&A
7:20        Clean-up
7:45        Adjourn
 
 


June 20 - 21

eSMART Factory Conference  +

Location
The Dearborn Inn
Dearborn , MI 48124


Software Systems & Processes • Robotics • 3D Printing

eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.

 


June 25

Wisconsin Chapter: PCBA Workshop - Workshop  +

Radisson N88 W14750 Main Street Menomonee Falls, WI 53051



Join us on Tuesday June 25th, 2019 for a one day workshop!
The workshope will cover DFM, Selective Soldering,  Conformal Coating, Cleaning and Flux chemistries.

Check in to begin at 8am.  Lunch will be served. 
Bring any current industry challenges to be discussed.  Lets make this an interactive workshop!


Check in is at : 8am,  Workshop 8:30am- 4:00pm
SMTA Members: $50 / Non- SMTA Members $60


Presenters Include:
-
DFM: Dale Lee, Plexus
Selective soldering: Joe Clure, Ersa
Conformal coating:  Chad Showalter, Humiseal
Cleaning Chemistries : Mike Bixenman,  Kyzen
Flux chemistries and flux reliability: Denis Jean, Kester



 


June 25 - 27

Symposium on Counterfeit Parts and Materials 2019  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD


The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

 

Counterfeit Symposium Panel Discussion

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

 


 

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 


 

 


June 25 - 26

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

Sponsorship Opportunities:

**All sponsorships require an exhibit booth reservation**
 

Lanyard Sponsorship (Limit 1) - $500 - Company to provide lanyards SOLD!
Provide your company lanyards and they will be the official lanyard for the conference. You will receive logo recognition in the show directory, conference website and signage.

Tote Bag Sponsorship (Limit 1) - $400 (if provided by company/$800 if produced by SMTA) SOLD!
Provide your logo on all of the conference attendee bags! If you would like SMTA to produce the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.

Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$750 SOLD!
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

 

Exhibitor Information:

Contact SMTA for available booth space. 952-920-7682 or counterfeit@smta.org Please note that exhibit traffic will be minimal while symposium is in session.



Exhibit space entitles you to:

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings


Download a hard copy of the registration form


Cost to exhibit:
Rates increase $100 after May 31, 2019

Booth type CALCE/SMTA Members Non-Members
One table
includes access to Electrical Outlet
$550 $650
One table
no access to Electrical Outlet
$500 $600


 

 



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks


    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


June 27

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: 2019 SMTA Upper Midwest Expo & Tech Forum  +

Location
DoubleTree by Hilton Minneapolis - Park Place Minneapolis, MN 55416



 
 
Upper Midwest 
Expo & Tech Forum
Your local electronics assembly and manufacturing trade show!
 
June 27th, 2019
DoubleTree by Hilton Minneapolis - Park Place
Minneapolis, MN 55416
 
 
 
 
Plan Now to Join us at the 
SMTA Upper Midwest Expo & Tech Forum!
 
- 3 Great Technical Presentations
- FREE Lunch
- Networking with Exhibitors
 
 
ALL FREE but you must RSVP to reserve your spot!
 
 
 
 
Technical Program & Schedule
 
8:00 am:
Registration Opens
9:00am:
Expo Opens
9:00am-10:00am:
Speaker 1 TBD
11:00am-12:00pm:
Speaker 2 TBD
12:00pm:
Complimentary Lunch
1:30pm-2:30pm:
Speaker 3 TBD
2:30pm:
Awards, Door Prize Drawing, & Announcements
3:00pm:
Expo Closes
 
 
 
 
 
Any Questions?
Please contact 
Hannah Terhark
SMTA Expo Manager
952-920-7682
 
We Look Forward to 
Seeing you in June!
 
 
The SMTA Upper Midwest Chapter
 
 
 



June 27

Upper Midwest Expo & Tech Forum  +

Location: DoubleTree by Hilton Minneapolis - Park Place
Park Ballroom
1500 Park Place Blvd.
Minneapolis, MN 55416



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on May 31, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Doubletree by Hilton Minneapolis - Park Place.

1500 Park Place Blvd Minneapolis, MN 55416

Group Code: UME

(952) 542-8600

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, June 27th, 2019
9:00AM–3:00PM

 

8:00AM

Registration Opens

 

9:00AM

Advanced Inspection and Automation Solutions for Today's Smarter Factory

Speaker: Brad Ward, Omron 

 

10:00AM

Expo Opens

 

11:00AM

Hot to Buy PCBs Better & Smarter

Speaker: Greg Papandrew, Better Board Buyer

 

12:00PM

Complimentary Lunch

 

1:30PM

Impact of Storage Conditions on the Integrity of a No Clean Solder Paste

Speaker: Dave Sbiroli, Indium Corporation

 

2:30PM

Awards, Door Prize Drawing, & Announcements

 

3:00PM

 Expo Closes


July 15

Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process  +



Bob WillisMonday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


July 18

Heartland Expo & Tech Forum  +

Location: Marriott Kansas City Overland Park
10800 Metcalf Avenue
Overland Park, KS 66210



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on June 7, 2019!

 

 

Book Your Room with the SMTA Hotel Rate

or call: 800-228-9290 to book your room with the SMTA room block.

 



Attendees

8:00am

Registration Opens

 

8:30am-10:00am

Change in Ionic Cleanliness Requirements for J-STD-001, and Tin Whiskers

Speakers: Dave Pauls & Doug Pauls, Collins Aerospace

 

10:00am

Expo Hall Opens

 

11:00am-12:00pm

X-Ray Technology Improving Electronics Assembly Processes

Speakers: Bill Cardoso, Ph.D., & Carlos Valenzuela, Creative Electron, Inc.

 

12:00pm

Complimentary Lunch

 

1:30pm-2:30pm

Cleaning with DI Water Works - Is a Chemistry Needed?

Speaker: Debbie Carboni, KYZEN Corporation

 

3:00pm

Expo Closes

 



August 8

Ohio Expo & Tech Forum  +

Location: Holiday Inn Cleveland Strongsville
15471 Royalton Road
Strongsville, OH 44136



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on July 8, 2019!
 

 

Book Your Room with the SMTA Hotel Rate



Attendees


August 12

Webinar: Conformal Coating - Successful Implementation & Quality Control  +



Bob WillisMonday 12th August @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



August 15

Queretaro Expo & Tech Forum  +

Location: Misión Grand Juriquilla, Queretaro
Blvd Villas Del Meson 56
Juriquilla, QR 76230



Exhibitors

The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $55 per outlet. Early registration pricing ends on July 12th, 2019!

Important Exhibitor Materials:

 

 

Booths are assigned in the order they are received. 

Important Exhibitor Materials:

  •  In the case of bank transfers, the dollar exchange rate must be calculated on the basis of the interbank purchase price and not the selling price. All transfers require an additional $50 USD.    
  • To pay by wire transfer please contact SMTA HQ. 1-952-920-7682 or hannah@smta.org
  • Please contact SMTA Expo Manager Hannah Terhark with questions or for additional information.



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Please see the Queretaro Chapter Page for More Information on Technical Sessions.

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, August 15, 2019
11:00AM–6:00PM

 

 

THANK YOU TO OUR RECEPTION SPONSOR: 

AIM Solder


August 21

Wisconsin Chapter: WI SMTA 2nd Annual Golf Outing  +

Brown Deer Park Golf Course 7625 N Range Line Rd Milwaukee, WI 53209



Please join us for our 2nd Annual Golf Outing on Wednesday August 21st
The event will be at the beautiful Brown Deer Park Golf Course
18 holes of golf, raffle prizes, lunch, awards for closest to the pin, longest drive and more!
This event will fill up fast.  Sign up begins on May 7, at the Expo.
Stay tuned for more details!



August 22

Capital Expo & Tech Forum  +

Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends August 2nd, 2019!

Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, August 22nd, 2019
9:00AM–3:00PM
Registration Opens at 8:00AM
 


September 10 - 12

Advanced Electronics Assembly Conference  +

Location
Hungary & Romania
Budaörs, Budapest 2040 Hungary




September 16

Michigan Chapter: Michigan Chapter SMTA Golf Outing & Technical Meeting  +

Location
Oak Pointe Country Club



Save the Date for the Annual Michigan Chapter SMTA Golf Outing and Technical Meeting at Oak Pointe Country Club! More details coming soon!


September 22 - 26

SMTA International 2019  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


September 24 - 25

SMTA International Electronics Exhibition  +

Location: Donald E. Stephens Convention Center
Rosemont, IL


Exhibitors Register Now
Exhibitors

SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


September 24 - 26

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • September 24 - Course (8:30-5pm)
  • September 25 - ½ day of course + exam
  • September 26 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.



October 8

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8ft pipe & draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird rates expire on September 13, 2019!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up. 

 



Attendees

Free Technical Program & Schedule Coming Soon!

 

Thank You to Our Lunch Sponsor:


October 10

Mexico - Querétaro Chapter: Design for Manufacturing - Symposium  +

UTEQ



Call for Papers ! 
Now accepting papers for review.
SMTA Members please log in to auto-fill your contact info and save time ! 
or email to 
Guillermo Maldonado  gmaldonado@ste-latinoamerica.com
Marco Solis  Marco.Solis@gmx.com
 


October 15 - 17

SMT Processes Certification (Melbourne, FL)  +

Location
Mack Technologies
Melbourne , FL 32904


 

  • October 15 - Course (8:30-5pm)
  • October 16 - ½ day of course + exam
  • October 17 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 15

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15, 2019!



Attendees

October 17

Long Island Expo & Tech Forum  +

Location: Melville Marriott Long Island
1350 Walt Whitman Road
Melville, NY 11747


Exhibitors

Please contact Sharon Dietrich with questions or for additional information.



Attendees
Attendees Register Now

Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.

 


October 22 - 24

International Wafer-Level Packaging Conference  +

Advanced Packaging in the New Connected World

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.


October 23 - 24

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2019 After April 30, 2019
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.


October 23 - 24

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-5:00pm
5:00pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-5:00pm
Move out: 5:00pm-7:00pm

Click here for the latest floorplan


IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 24 - 25

Additive Electronics Conference: PCB Scale to IC Scale  +

Location
DoubleTree by Hilton San Jose
San Jose , CA 95110


Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box.  Additive manufacturing enables environmental advantages, open up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design.   This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 micron, but also provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices.

 


October 28

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Utah Expo  +

TBD



Utah Vendor Expo actual date and location TBD.  Will not be at U of U this year.


October 29

Intermountain Utah Expo & Tech Forum  +

Location: *NEW LOCATION* Weber State University
3910 W. Campus Drive
Ogden, UT 84408


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 30th, 2019!

Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Tuesday, October, 29, 2019
10:00AM–4:00PM

 

8:00am
Registration Opens 

 

10:00am
Expo Opens 


4:00pm
Expo Closes

 

Information on the Technical Sessions to follow...


November 5

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!



Attendees


November 7

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!



Attendees


November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

Book a discounted room rate at the Hilton Melbourne Rialto Place!

200 Rialto Place, Melbourne, FL 32901

Group Code: SMTA 

321-768-0200

Book Rooms Today!  



Attendees

Exhibit Hours:
Wednesday, November 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:
 


December 3

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter Golf Tournment  +

Spring Valley Golf Course Milpitas, CASMTA



SMTA Silicon Valley Golf Tournament Shotgun Start at Noon


December 4

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter EXPO  +

Bestronics Inc. 2090 Fortune Drive San Jose, CA 95131



Table Top exhibitors and 3 Technical Presentations followed by social hour at 3:30PM


December 4

Silicon Valley Expo & Tech Forum  +

San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 15th, 2019!

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:00PM

Free Technical Program & Schedule:
Information to follow...



Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819