Calendar of Events

   2020      

                                   

2020

June 8

Webinar: Practical Set-Up, Qualification of Cleaning Process in PCB Assembly  +

Organized by SMTA Europe



Hosted by: SMTA Europe Chapter 

Monday 8th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Bob WillisPresenter: Bob Willis, SMTA Europe

Overview

Most of the industry worldwide has been running no clean processes for many years and often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation and the demands of modern circuits cleaning has come back to eliminate selected failures. Conformal coating is another process which has demanded special levels of surface cleanliness to guarantee coating adhesion and long-term reliability. Although there are high reliability producers that use coating with no clean, others want that extra confidence.

Topics included:

  • Testing boards, components and assemblies
  • International specifications and reference books
  • Ionic testing & non-ionic testing
  • Surface insulation measurement
  • Ion Chromatography (IC) test techniques
  • Shop floor test methods
  • Testing frequency during PCB fabrication & assembly
  • Cleanliness failure types

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like cover in the webinar it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide


June 9

Webinar: Industry 4.0 for Electronics Assembly  +

Organized by SMTA Europe



Hosted by: SMTA Europe Chapter 

Tuesday 9th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenters: Liam Mills (MTC), Stuart Saunders (MTC) & Nigel Burtt (Renishaw)

Free for members!

Overview

Improving operational efficiencies has reached the point where only marginal gains can be achieved and therefore full business system and process transformations are required in order for businesses to stay competitive. Increased autonomy, connected devices & data, and digitalisation must be leveraged by businesses to become more agile and efficient, and by utilising the data and autonomy effectively this can lead to increased productivity, increased flexibility of products and reduced product quality variability. Businesses are at different stages on their Industry 4.0 journeys and there are a number of solutions available on the market to support businesses. In partnership with its members, the Manufacturing Technology Centre (MTC) in the UK has been implementing a Smart Factory demonstration test bed for Electronics Assembly, where upgrading legacy equipment with smart capability has been the primary focus, using these off-the-shelf solutions where possible, and open source tools like the IPC-CFX standard as the machine to machine communication language, that can save huge amounts of time and investment.

Topics included:

  • Overview of the MTC
  • Overview of Industry 4.0
  • IPC-CFX and Hermes
  • Focus on Smart Factory for legacy equipment
  • Future project opportunities

Who should attend?
Production Engineering, Process Engineering, Business Improvement, Continuous Improvement, Automation Engineering, Digital Engineering/Transformation Engineers.

The webinar will run for between 30-45min with question and answer session. The webinar is limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide


June 10

Puget Sound Chapter: Supply Chain Impacts on the Electronics Industry in the Covid-19 Era  +

Virtual Zoom Meeting - Link to be provided prior to meeting start



Please JOIN US for a June 10th Webinar discussing Supply Chain Impacts on the Electronics Industry in the Covid-19 Era. 

Arrow Account Manager Robert Baffi will provide us with context regarding the current component market. Robert comes to us with a total of 10 years’ experience in developing and selling technology solutions with 5 years’ of direct experience in the electronic components space in the PNW (2 years as a manufacturers rep and three as a distributor at Avnet). In his current role within Avnet, he's responsible for supporting customers at each stage of the product life cycle. From idea to design and from prototype to production. Avnet’s comprehensive portfolio of design and supply chain services makes Avnet the go-to guide for innovators who set the pace for technological change, especially during the uncertain business land scape COVID-19 provides.


June 10

Webinar: Supply Chain Impacts on the Electronics Industry in the Covid-19 Era  +

Free for Everyone!



Hosted by: SMTA Puget Sound Chapter

Wednesday, June 10th @ 1:00pm US Eastern Time

BaffiPresenter: Robert Baffi, Arrow Account Manager 

Overview

Presenting on the market impacts COVID-19 has had and the impact on the future of supply chain overall.

About the Presenter

Arrow Account Manager Robert Baffi will provide us with context regarding the current component market. Robert comes to us with a total of 10 years’ experience in developing and selling technology solutions with 5 years’ of direct experience in the electronic components space in the PNW (2 years as a manufacturers rep and three as a distributor at Avnet). In his current role within Avnet, he's responsible for supporting customers at each stage of the product life cycle. From idea to design and from prototype to production. Avnet’s comprehensive portfolio of design and supply chain services makes Avnet the go-to guide for innovators who set the pace for technological change, especially during the uncertain business land scape COVID-19 provides.

 

 


June 16

Intermountain (ID, UT) Chapter: 15th Annual Utah SMTA Intermountain Golf Scramble for 2020  +

Birch Creek Golf Course - Smithfield, Utah



15th Annual SMTA Golf Scamble for 2020
Held at Birch Creen Golf Course
Smithfield, Utah


What: 15th Annual SMTA Golf Scramble 2020
When: June 16th, Tee Time 8:00 AM Shotgun Start with lunch following
Where: Birch Creek Golf Course, Smithfield Utah


We would like to have all Team and Individual sign-ups done by Tuesday June 9th.
Team and Hole Sponsor sign-ups also due at that time.
If you need a sponsor sign made please send a graphics file of your company logo.


Costs: Team sponsor $375. Includes Golf and Lunch for 4 players, and Team Sponsor Sign Hole sponsors: $175. Includes Golf and Lunch for 1 player, and Hole Sponsor Sign. Prize Hole sponsors for Long Drive (Men and Women), Closest to the Hole (Men and Women), and Straightest Drive. Please Provide Prizes for these special holes.
Mulligans: $10 each, Can Purchase Before or At the event.
Individuals are Welcome!! We will sign you up to a team. Fee is just $75.
This includes Green fees, cart, and lunch.


Please Join us! Contacts to RSVP and for Sponsorships:
Gordan Jackman at 435-227-9659 e-mail gordan@campbellsci.com or Robert Winter at 801- 594-7435 e-mail rwinter@q.com

Contact for details about course, map: Birch Creek Golf, Smithfield, Utah 435-563-6825 www.birchcreekgolf.com

 



June 16

iNEMI/SMTA Webinar: Proposed Testing Protocols to Align Connector Reliability with Application Requirements  +

Free for Everyone!



Tuesday, June 16 @ 11:00am US Eastern Time

Presenter: Vincent C. Pascucci, TE Connectivity’s Aerospace, Defense, and Marine Business Unit

Co-Hosted by iNEMI

 

Overview

Since the 1980s there has been enormous growth in the use of electronic devices which has driven similar, if not greater, growth in the number of electrical interconnects. As we become more dependent on these devices the need to ensure their reliability becomes more important. Two factors complicate this effort. The first is the reduction in size of electrical contacts and the commensurate reduction in contact normal force available to ensure a stable interface. The other factor is that reliability is not free. Thus, as the number of interconnects increases, cost considerations drive a need to ensure the reliability of connectors is matched to the needs of their specific applications. Testing protocols to help achieve this match will be discussed in this presentation. 

 

About the Presenter:

Vincent C. Pascucci is Senior Principal Engineer, managing the Failure Analysis and Reliability Engineering group within TE Connectivity’s Aerospace, Defense, and Marine business unit. He has worked with TE Connectivity, and previously AMP, since 1984.

Vincent serves as US Technical Advisor to IEC committees TC48 and SC48B and covenor (chair) of SC48B Working Group 5 responsible for electrical and electronic connector testing standards. He has authored papers on connector reliability topics presented at IEEE Holm and American Society for Quality conferences, along with the International Conference on Electrical Connectors, and others.

He is an American Society for Quality Certified Reliability Engineer and a graduate of the University of Rochester with degrees in Mechanical and Geomechanical Engineering. 


June 18

Atlanta Chapter: Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling  +

Webinar



Overview

Reliability of the new solder alloys has been a serious concern, especially in the harsh environment. Aging at elevated temperature alters the structural and mechanical properties of the solder joint and leads to the coarsening of the precipitates in the bulk solder and growth of the intermetallic compound layer, which in turn deteriorates the solder joint.  Various new elements such as bismuth, antimony, and nickel are micro-alloyed into the SnAgCu based alloys to slow down this deterioration process and improve the reliability. There haven’t been many studies about the effect of solder sphere alloys with bismuth pastes on the harsh thermal reliability. In this paper, the effect of mixing solder sphere alloys (SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.  Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to +125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres.   

About the Presenter:

Francy Akkara is pursuing his doctoral degree in Industrial and Systems Engineering at Auburn University. He has been working on electronics reliability for the past four years with focus on component reliability in thermal cycling. Francy has Masters degree in Electrical Engineering (Microelectronics) from Auburn University and is currently interning at Western Digital as  RAMP SSD Assembly Development Engineer. His research interests include reliability test design, effect of solder alloy composition and surface finishes, failure analysis, thermal cycling/mechanical shock reliability and defects in SMT assembly.

Free Registration 

 




June 23

Webinar: Communicating With Impact and Developing Your Authentic Presence  +

Free for Everyone!



Tuesday, June 23rd @ 11:00am US Eastern Time

Stephanie GoetzPresenter: Stephanie Goetz, Goetz Communications

Overview

The way you communicate and how you're perceived have a much bigger impact on your bottom line and your leadership than you think. But the good news is these are skills that anyone can refine and master with proper training and practice. In this webinar, you'll learn the best techniques of excellent communication and influential presence from renowned communication expert Stephanie Goetz of Goetz Communications. Stephanie coaches C-suite leaders and executives at Fortune 500 companies on how to be more dynamic, influential and impactful. You'll learn the skills of influencing your team, leading people in turbulent times, and the keys to having lasting influence.  

About the Presenter:

Stephanie Goetz is an award-winning journalist, executive speaker coach, pilot, philanthropist, and professional trainer. This Emmy-nominated broadcaster anchored and reported more than 5,000 newscasts at NBC, CBS, and ABC affiliates over 10 years. She is the founder and owner of Goetz Communications where she works with C-suite leaders, top executives and all walks of life to develop communications skills, media training, brand influence, and speaker effectiveness in preparing them for engagements with any size of audience. Her client list includes Fortune 500 companies like Microsoft,  Nike, T-Mobile, Cessna Aircraft, Thomson Reuters, Northwestern Mutual, Mastercard and more.


June 24

Europe Chapter: Solder Preform World - Not New Technology but a Very Interesting Option  +

Charity Online Webinar



Presented by Bob Willis and special guest Graham Wilson of Indium Corporation
2.30pm UK Time
To book your place FREE 
https://attendee.gotowebinar.com/register/8696232484957655309

Solder preforms are normally solid solder shapes specifically designed to make one or multiple solder joints in one reflow operation. Solder preforms can be coated, flux laminated between layers of different alloy or simply compressed cored solder wire. In the distant past some assembly operations have simply employed cored wire wrapped around a screwdriver or knitting needle and cut to form rings. Now preforms are incredibly engineered options which are as wide as your imagination

Preforms provide a defined volume of solder to form a reliable joint with the assembly process automated if volumes require. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the cost of simple preforms

Back in the day the presenter used preforms with vapour phase and hot air guns for feed through capacitors, wire wrap back planes, heat shields and cable forms. Welcome to the interesting and creative world of solder preforms

Our first preform webinar includes:
Soldering Applications
Solder alloys
Preform types
Fluxing options
Preform packaging
Soldering and temperature profiling
Reducing void formation
Traditional soldering, wire connections, die mounting & more
Inspection and process defect

Our webinar is FREE to join but we do ask attendees to consider contributing a small amount to our chosen charities
Mind – Better Mental Health  https://www.mind.org.uk/donate
Marie Curie – Living with Terminal Illness https://www.justgiving.com/mariecurie
 


June 24

Webinar: Solder Preform World - Not New Technology but a Very Interesting Option  +

Organized by SMTA Europe



Wednesday, 24th June @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)Bob Willis

Presenter: Bob Willis, SMTA Europe and Graham Wilson, Indium Corporation

Overview

Solder preforms are normally solid solder shapes specifically designed to make one or multiple solder joints in one reflow operation. Solder preforms can be coated, flux laminated between layers of different alloy or simply compressed cored solder wire. In the distant past some assembly operations have simply employed cored wire wrapped around a screwdriver or knitting needle and cut to form rings. Now preforms are incredibly engineered options which are as wide as your imagination

Preforms provide a defined volume of solder to form a reliable joint with the assembly process automated if volumes require. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the cost of simple preforms

Back in the day the presenter used preforms with vapour phase and hot air guns for feed through capacitors, wire wrap back planes, heat shields and cable forms. Welcome to the interesting and creative world of solder preforms

Our first preform webinar includes:
Soldering Applications
Solder alloys
Preform types
Fluxing options
Preform packaging
Soldering and temperature profiling
Reducing void formation
Traditional soldering, wire connections, die mounting & more
Inspection and process defect

 

Our webinar is FREE to join but we do ask attendees to consider contributing a small amount to our chosen charities
Mind – Better Mental Health  https://www.mind.org.uk/donate
Marie Curie – Living with Terminal Illness https://www.justgiving.com/mariecurie


June 30

Webinar: Problemas de Llenado de Barril: Causas Raices y Oportunidades que tenemos en nuestras manos  +

Free for Everyone!



*This webinar will be presented in Spanish*

Tuesday, June 30th @ 11:00am US Eastern Time (date/time is tentative)

Presenter: Omar Garcia, Flex

Overview

Los problemas de llenado de barril son cada dia mas complejos, en ensambles muy grandes con cientos de THs complican el soldado uniforme. Ensambles con mas capas/layers, conexiones internas, Capas mas gruesas de Cu internas de tierra y problemas de balance de Cu que los diseñadores no pueden compensar, dificultan en gran medida el llenado de barril con los procesos acuales. La ventana de proceso cada dia es mas pequeña dificultando la repetibilidad de los procesos de soldado que utilizados.
La intencion de este webinar es darte un punto de vista diferente en lo que podemos hacer que este en nuestras manos para incrementar la ventana de proceso de nuestro proceso.


Barrel fill issues are becoming every day more complex, Large assemblies with hundreds of TH quantities in large assemblies create a problem with the soldering uniformity. More # of PCB layers, larger internal connections, thicker Cu ground layers and poor Cu balance that in some cases cannot be fix by designers difficult current soldering processes narrowing process window and reduce process repeatability currently in use. This webinar intention is to give you a different point of view in regards what we can do to improve our current process window.

About the Presenter:

Omar currently works in Flex as Operations Engineering Director, working for AME (Advanced Manufacturing Engineering) for the America region. He provided technical support to all operations and implemented all new technologies in Flex for several customers.

He has been at Flex for last 12 years and been in the electronic industry for almost 22 Years; worked as a Technical Assistance Manager at Jabil for 3 years & as NPI Manager for Sanmina-SCI for close to 7 years

Omar has Mechanical Engineering degree from ITM (Instituto Tecnológico de Morelia). He also hold a Master degree in Metallurgy and Material Science by IIM (Instituto de Investigaciones Metalúrgicas) from the Universidad Michoacana. He is certified as a Six Sigma Black and has earned his certification as an SMTA Process Engineer. 

He participate at several SMTA regional events, also has participation at APEX as speaker, with different papers, holds 4 patents for Flex


July 6

Webinar: Solderability Benchmarking, Failures & Production Testing Methods  +

Organized by SMTA Europe



Monday, 6th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)Bob Willis

Presenter: Bob Willis, SMTA Europe

Overview

The webinar provides an introduction and a better understanding of the soldering process and the effect of poor solderability on modern manufacture. Surface mount components can be a problem area, as are some of the surface finishes used on printed circuit boards. The online session aims to provide a basic understanding of solderability failure including ageing, test methods, both theoretical and practical, for circuit boards and components. It also shows how to test BGAs, LGA, CSP, PoP and flip chip packages on the shop floor in 10min

The webinar gives practical hands-on experience of solderability testing of different solder finishes and assessment of results. Using the instructor’s unique video material many process faults will be demonstrated. In process testing non laboratory testing is illustrated as well as the correlation with real process conditions.

Webinar Content:

  • What is solderability ?
  • Component and printed board storage life
  • Storage conditions for longer life
  • Artificial ageing tests and impact on yields
  • International specifications and test methods
  • Cost of Gold, Copper, Palladium, Silver, tin etc
  • Protective coatings and effects of soldering operations
  • Solderability reflow wetting patterns
  • Solderability tests:

                Dip and inspect, wetting balance, rotary dip test

                Simple production reflow test methods and criteria

                Wetting balance measurements

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


July 8

Webinar: Systematic Failure Analysis  +

Organized by SMTA Europe



Hosted by: SMTA Europe Chapter 

Wednesday 8th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Stefan Strixner, ZESTRON Europe

Free for members!

Stefan StrixnerOverview

In case of malfunctions of electrical assemblies in the field a proper failure analysis to identiy its root cause and define future avoiding measures is mandatory. This presentation will give each delegate a step by step practical procedure to execute a proper failure analysis and introduces meaningful examination methods on field cases.


Topics included:
•    Definition: "Failure/Damage"
•    Field cases
•    Methodology for Arranging and Systematical Processing of Information for the Damage Event
•    Practical tips
•    Potential Examination methods
•    Data Collection
•    Hypotheses and Key Figures
•    Practical Examples

 

Stefan Strixner has a Master of Science in Technical Chemistry and supports customers since foundation of ZESTRON. He has supported the implementation of hundrets of post soldering cleaning process and consults and trains partners and ZESTRON subsidiaries in Europe and Asia in terms of cleanliness, reliability and failure analysis.

 

The webinar will run for between 60-90min with question and answer session. The webinar is limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide


July 9

Webinar: Creating the Best Data Package for PCB Fabrication  +

Free for SMTA & PCEA Members!



In association with: PCEA (Printed Circuits Electronics Association)

PCEA

Thursday, July 9th @ 11:00am US Eastern Time

Presenters: Stephen Chavez, Collins Aerospace & Mike Creeden, Insulectro

Overview

With this presentation attendees will learn what it takes to create a good manufacturing Data Package. A good data package starts with having good circuit data. Today’s circuit engineer must meet 3 Competing Perspectives for Success.  

Design For:

  • DFSolvability
  • DFPerformance
  • DFManufacturability

One must understand the end user’s requirements. These include cost targets, build quantities, performance, environment, testing, compliance, quality, and reliability goals. Manufacturing support starts with a partnership between your company and your supply chain. Early collaboration ensures that all expectations and requirements are established at the beginning of the development phase, prior to design completion. All these issues play a part of the design, manufacturing and performance of our end products.

Attendees will receive an understanding of how to create good design-data, allowing for manufacturing tolerance allowances. The goal is to ensure that the design data is correct by construction, can be manufactured with high producibility, high-yield, low-cost, and high-reliability.

Formats:

• Standard, non-intelligent data, such as Gerber files, NC Drill data, NC Rout Profile, Multi-up Array information; Fabrication & Assembly Drawings with all applicable materials, processes, manufacturing tolerances and acceptance criteria.

• ODB++ or IPC-2581 – Intelligent data output (With controlled settings).

Creation of manufacturing output should be a tightly controlled and accurate event providing exactly what the manufacturer needs to complete the build. 

About the Presenters:

Mike has over 43 years of industry experience: as an Educator, PCB designer, applications engineer and business owner.  

• Insulectro - Technical Director Design Education; helping OEM’s & fabricators to achieve design success for best material utilization  

• Executive Board, Vice Chairman - PCEA Printed Circuit Engineering Association

• Master Instructor CID+ IPC Designer Certification program 

• Primary Contributor for the CID+ curriculum 

• Currently teaching IPC-CID/CID+ curriculum with EPTAC  

• Founder of San Diego PCB Designs (Nationally recognized design center, sold in 2016) 

Steph Chavez

 

 A senior-level Printed Circuit Engineer with 29 years’ experience, Stephen Chavez has spent the last 10 years as a Staff Engineer and Technical Lead of PCB design for the Electronic Systems Center (ESC) division of Collins Aerospace. He is an acknowledged and recognized Subject Matter Expert (SME) in PCB design globally within the industry, and within Collins Aerospace. He is the Chairman of the PCEA, an IPC Certified Master Instructor Trainer (MIT), and an IPC Certified Advanced PCB Designer (CID+) for PCB Design. He has been an active IPC member and an industry contributor since 2003. He created an industry column in both Iconnect007 (PCBDesign007) magazine called “The Digital Layout” and in UP Media (Printed Circuit Design & Fabrication) magazine called the “The Digital Route”. As Chairman of PCEA, he continues to write under both these two columns, but under the sections “Message From The Chairman”. He has a very strong and extensive background regarding PCB design within the diverse fields of commercial, aerospace, military, space and medical electronics industries. He has Principal level industry experience which covers the full spectrum of PCB design, fabrication, and assembly. His experience ranges from simple two layer prototypes through complex multi-layer HDI and micro HDI technology PCBs where the structures ranged from rigid, flex, rigid-flex, and hybrids, with circuits containing analog, digital, RF, mixed signal, high speed, high power, and high voltage PCBs. He is a veteran of the United States Marine Corps, where he served five years as an Avionics Technician, and holds an A.S. degree in mathematics.


July 14

Intermountain (Boise) Expo & Tech Forum  +

Location: Boise State University - Jordan ABC Room
1910 University Drive
Boise, ID 83725



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular) (click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $50 per outlet.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to mckenna@smta.org before Monday, June 22, 2020.

Important Exhibitor Materials:
Exhibitor Application PDF
Sponsorship Application PDF
Please contact the SMTA Expo Manager at mckenna@smta.org with questions or for additional information.



Attendees

It is our top priority to keep everyone at our events healthy and well.

SMTA follows the social distancing guidelines from both the local health authorities as well as the World Health Organization.

We will continue to practice these precautions for the foreseeable future.

 

AGENDA

8:00AM
Registration Opens

9:15AM

New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBFs/PCBAs

Speaker: Robert A Boguski Jr., Datest

Digital Computed Tomography, or CT Scanning, has advanced in both equipment as well as techniques in recent years, such that it has now become the method of choice in many applications where workmanship, fabrication, process, and component-related defects are difficult, and often otherwise virtually impossible to find. 

This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT scanning versus other nondestructive and destructive failure analysis methods, both from the standpoint of results as well as cost.  Numerous examples will be shown, with an emphasis on PCBA and PCBF failure analysis and defect detection.

10:00AM

Expo Opens

12:00PM 

Complimentary Lunch

1:00PM
Oven Reflow and X-Ray Best Practices, for Preprogrammed Flash Memories

Speaker: Dave Rohona, Data I/O Corporation
Today’s modern luxury cars are governed by around one hundred million lines of code, and that number is likely to soar for connected and autonomous cars.  According to Neil Shah, partner and research director, Counterpoint Research, “Storage is one of the fastest growing semiconductor applications in a connected autonomous car. The advanced in-vehicle infotainment (IVI), AI, and sensor- driven autonomous driving systems generate large amounts of data that need to be processed and stored locally at the edge. The average capacity of storage required per vehicle is expected to balloon beyond 2TB by 2022.”

To support this explosive growth in software and data, automotive manufacturers are transitioning their storage architecture from the eMMC interface to Universal Flash Storage (UFS) and PCI express (PCIe/NVMe) to take advantage of the higher capacity, power efficiency, and higher performance that these memory technologies have to offer.  Preprogramming is the preferred method used in automotive today, delivering the lowest total cost of programming.

Preprogrammed flash memories processed through oven reflow and X-ray inspection require production line managers follow recommended best practices.  This presentation will discuss the impact of thermal heat and dose radiation on preprogrammed Flash Memories along with Data I/O’s recommended best practices to ensure data retention post oven reflow and X-ray.

2:30PM
Cleaning Process Do's and Don'ts...Avoiding Common Pitfalls

Speaker: Ram Wissel, KYZEN

The cleaning approach and technology has significantly evolved over the last 10 years.    What use to work may not be enough to meet the new standards, or new assemblies.   Understand the capabilities of your cleaning process are critical to establish process stability.  

Cleaning expert Debbie Carboni will present:

·         Modern Cleaning advancements.

·         Modern equipment Advancements

·         Design considerations

·         Environmental Myths

·         Common Machine Set Up Blunders

·         Common Process Control Blunders.

·         Common Board Fixturing Blunders

·         Rinsing is not just DI Water

·         How to effectively clean modern assemblies to meet the new standard, and more importantly, be reliable and prove it.

4:00PM

Expo Closes
Door Prizes - Must be Present to Win

 


July 21

Webinar: Human Automation: Hands-Free Industry 4.0  +

Free for Members!



Tuesday, July 21st @ 11:00am US Eastern Time

Michael FordPresenter: Michael Ford, Aegis Software, UK

Overview

So many examples already exist of the utilization of Augmented Reality (AR), as it relates to assembly manufacturing operations. The vast majority of these are demos, carefully and painstakingly crafted to show the potential of the technology. Others are somewhat niche cases of real applications, again however, supported by significant customization and preparation behind the scenes, for each and every application instance.

This is only the first step however for Augmented Reality technology, which has a central part to play in our standards-driven Industry 4.0 Smart digital factory. AR provides hands-free, fully focused assembly support, when properly integrated into the latest digital MES tools. Providing interactive step by step guidance, allows operators to be fully flexible, without the need to be experts or specifically experienced in what they are doing.

This presentation details how AR technology available today, is to be a critical part of any Smart digital Industry 4.0 factory, sooner than you may think.

About the Presenter:

Working for Aegis Software, provides Michael the opportunity to apply his years of electronics assembly manufacturing experience, to drive both business process and technology solution innovation with customers and partners, that satisfies evolving needs in digital manufacturing, in a way that is value-driven and sustainable.

Starting his career with Sony, including eight years working in Japan, Michael has been instrumental in creating and evolving leading software solutions for assembly manufacturing, that meet the most demanding expectations, leading industry forward.

Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to IPC industry standards, including the Connected Factory Exchange (CFX) and IPC-1782 traceability standard, as well as helping promote and position others that together form IPCs digital manufacturing “best practices”. Michael regularly contributes articles, columns and blogs in several leading industry publications.


August 4 - 6

Symposium on Counterfeit Parts and Materials 2020  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD 20783


Technical Symposium and Expo: August 4-5, 2020
Professional Development Courses: August 6, 2020

College Park Marriott Hotel & Conference Center

Attendees at the 2019 Symposium on Counterfeit Parts and Materials

The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 


August 4 - 5

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

 

Sponsorship Opportunities

Download Sponsorship/Exhibitor PDF 

Updated as of 05/08/2020

Lunch Sponsorship - $750 (1 available)

  • Logo Recognition in Onsite Show Directory
  • Logo Recognition on Conference Website
  • Logo Recognition on Conference Signage
  • Table Tents Featured Throughout Lunch Area

Refreshment Sponsorship - $750 (1 available)

  • Logo Recognition on Reusable Cup Sleeves used During all Breaks
  • Logo Recognition in Onsite Show Directory
  • Logo Recognition on Conference Website
  • Logo Recognition on Conference Signage
  • Table Tents Featured Throughout Refreshment Area

Conference Room Sponsorship - $750 (1 available) SOLD OUT!

  • Sponsor Provides Item of Choice for Distribution
  • Logo Recognition in Onsite Show Directory
  • Logo Recognition on Conference Website
  • Logo Recognition on Conference Signage
  • Table Tents Featured Throughout Conference Area

Lanyard Sponsorship (1 available) - $500 SOLD OUT!
(Sponsor Provides Lanyards)

  • Exclusive Conference Lanyard
  • Logo Recognition in Onsite Show Directory
  • Logo Recognition on Conference Website
  • Logo Recognition on Conference Signage

Tote Bag Sponsorship (1 available) - $400/$800 SOLD OUT!
(Produced by SMTA ($400) Provided by company ($800))

  • Your Logo on All Conference Attendee bags!
  • Logo Recognition in Onsite Show Directory
  • Logo Recognition on Conference Website
  • Logo Recognition on Conference Signage

Reception Sponsorship - $1,000 (1 available) SOLD OUT!

  • Logo Recognition on Drink Tickets Providing Each Attendee with One Complimentary Drink
  • Logo Recognition in Onsite Show Directory
  • Logo Recognition on Conference Website
  • Logo Recognition on Conference Signage
  • Table Tents Featured Throughout Reception Area

Interested in a customized sponsorship opportunity? Contact counterfeit@smta.org for more information! 

 

Exhibitor Information

Contact SMTA for available booth space: 952-920-7682 or counterfeit@smta.org

Please note that exhibit traffic will be minimal while symposium is in session.

Exhibit Table Costs*:

Investment Before July 10, 2020 Investment After July 10, 2020
Member - $550 Non-Member - $650 Member - $650 Non-Member - $750

*All Tables Include Electricity


Exhibit space entitles you to:

6 ft. Draped table
One (1) conference pass
Attendee list
Lunch & Breaks
Conference Proceedings

 

Click Here to View the 2020 Floor Plan



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Access to the Keynote Speaker
  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks

    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


August 5

Ohio Expo & Tech Forum  +

Location: Embassy Suites Cleveland Rockside
5800 Rockside Woods Boulevard
Independence (Cleveland), OH 44131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular) (click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $50 per outlet.

Early registration pricing ends on July 15, 2020!

Important Exhibitor Materials:

Sponsor/Ad Form
Exhibitor Application PDF

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before Thursday, July 9, 2020.

 

Ohio Expo Room Block Information:

Click here to book your hotel reservation with the Ohio Expo room block!

Phone: 614.602.0116



Attendees

It is our top priority to keep everyone at our events healthy and well.

SMTA follows the social distancing guidelines from both the local health authorities as well as the World Health Organization.

We will continue to practice these precautions for the foreseeable future.

 

Free Technical Program Coming Soon.....



August 10

Webinar: Monitoring & Benchmarking Your Processes & Assembly Yields  +

Organized by SMTA Europe



Bob Willis

Hosted by: SMTA Europe Chapter 

Monday, 10th  August @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

There are no easy methods for companies to compare their manufacturing yields with other similar businesses. A common question asked by many company managers is "How does my process compare with other companies in terms of yield"? The information does not exist or is not easily available to small and medium volume companies

The most commonly used method of illustrating yield is Part Per Million (PPM) Defective. This provides a measure of the defect level against a process stage or a specific product compared against a known number of opportunities for defects to occur. There are IPC and IEC documents and procedures which do exist to monitor a process. This webinar will show how to implement a defect monitoring project in your company and the yield data produced. Bob Willis ran the SMART Group PPM Monitoring project supported by DTI and helped implement the LEADOUT project. these were the first project or their type in the world

Topics included in our webinar:

  • Why monitor your process for yield?
  • PPM, DPM or DPU
  • Collecting Inspection Data
  • Screen Printing
  • Inspection Criteria
  • Common Defects
  • Component Placement
  • IPC Inspection Criteria
  • Reflow Soldering
  • IPC Inspection Criteria
  • Wave Soldering
  • Collaborative Data Collection
  • Assembly Types
  • Comparing company yields

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here



August 18

Heartland Expo & Tech Forum  +

Location: Marriott Kansas City Overland Park
10800 Metcalf Avenue
Overland Park, KS 66210



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $50 per outlet.

Early bird pricing ends on July 21, 2020!

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before July 21, 2020.

 

Heartland Hotel Information:

Marriott Kansas City Overland Park

10800 Metcalf Ave., Overland Park, KS 66210

$139 USD per night

Cut Off Date: June 21, 2020

Phone: 913-451-8000

Click here to book your hotel room with the SMTA room block!



Attendees

It is our top priority to keep everyone at our events healthy and well.

SMTA follows the social distancing guidelines from both the local health authorities as well as the World Health Organization.

We will continue to practice these precautions for the foreseeable future.

 

Event Schedule Coming Soon!


August 20

Upper Midwest Expo & Tech Forum  +

Location: DoubleTree by Hilton Minneapolis - Park Place
Park Ballroom
1500 Park Place Blvd.
Minneapolis, MN 55416



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non-corporate members is $450/$550 (early/regular) (click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $50 per outlet.

Early registration pricing ends on July 17, 2020!

 

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before Friday, July 17, 2020.

Important Exhibitor Materials:
Please contact Courtney - SMTA Expo Manager courtney@smta.org with questions or for additional information.

 

Click here to book your hotel room with the SMTA room block!

DoubleTree by Hilton Minneapolis Park Place

Phone: 952-853-5310

August 19-20, 2020



Attendees

It is our top priority to keep everyone at our events healthy and well.

SMTA follows the social distancing guidelines from both the local health authorities as well as the World Health Organization.

We will continue to practice these precautions for the foreseeable future.

 

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, August 20, 2020
10:00AM–3:00PM

 

8:00AM

Registration Opens

More Information to follow...


August 25

Empire Expo & Tech Forum  +

Location: *NEW LOCATION* RIT Inn and Conference Center
5257 West Henrietta Road
Henrietta, NY 14467



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular) (click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $50 per outlet.

Important Exhibitor Materials:

Sponsor/Ad PDF
Exhibitor Application PDF

Early registration expires on July 21, 2020!

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to mckenna@smta.org before Tuesday, July 28, 2020.

Important Exhibitor Materials:

  • Please contact SMTA Expo Manager McKenna Hill at mckenna@smta.org with questions or for additional information.
     

Book a discounted room rate at the RIT Inn and Conference Center by March 31, 2020:

5257 W. Henriette Road, Henriette, NY 14467

Phone: 585-359-1800 and ask for the "Empire Expo" room block

Website: Book Rooms Today!  

1. Select the reservation tab

2. Under "Add Code" you can choose "Group Attendee" from the drop down menu and then input the block code 200422SMTA



Attendees

It is our top priority to keep everyone at our events healthy and well.

SMTA follows the social distancing guidelines from both the local health authorities as well as the World Health Organization.

We will continue to practice these precautions for the foreseeable future.

 

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Tuesday, August 25, 2020
10:00AM–4:00PM

More Information to Follow..


August 26

Webinar: Learning to Lead, Leading to Learn  +

Free for Everyone!



Wednesday, August 26 @ 12:00pm US Eastern Time

Presenter: Katie Anderson, KBJ Anderson Consulting

Overview

Katie Anderson will share insights and practices about leadership and learning – and challenge you to set your intention for your personal improvement. Katie will provide you with examples from the forthcoming book “Learning to Lead, Leading to Learn” – the result of years of conversations between her and Isao Yoshino, a 40-year Toyota leader and John Shook’s first manager at Toyota - and both of their practices as leaders, coaches, and learners. In this session you will:

• Understand the three principle roles of a leader

• Hear stories and quotes that appear in the book , "Learning to Lead, Leading to Learn: Lessons from Toyota Leader Isao Yoshino on a Lifetime of Continuous Learning".

• Discover three practices that can help you become a more intentional people-centered leader

• Set your intention for practice for personal improvement.

About the Presenter:

Katie Anderson is an internationally recognized leadership coach, consultant, and professional speaker, Katie is best known for her focus on helping individuals and organizations lead with intention. In 2013, Katie launched KBJ Anderson Consulting to work with leaders at all levels and organizations of all sizes to connect and align their purpose, process, and practice to achieve higher levels of performance. Katie has lived in five countries outside the United States – including the UK, Australia, and Japan. It was during her family’s 18-month experience in Japan that she developed a professional relationship with 40 year Toyota leader Isao Yoshino. What began as a connection filled with deep conversations evolved into the forthcoming book, Learning to Lead, Leading to Learn: Lessons from Toyota Leader Isao Yoshino on a Lifetime of Continuous Learning. Katie retains a strong connection to Japan and regularly leads study trips to Japan for leaders looking to deepen their knowledge of lean practices and Japanese culture. Visit www.kbjanderson.com - or email Katie directly at katie@kbjanderson.com.


August 27

Houston Expo & Tech Forum  +

Location: The Stafford Centre
10505 Cash Road
Stafford, TX 77477



Exhibitors

The Cost to Exhibit Includes:

 - One 10x10 Pipe-and-Draped Booth
 - One 6ft Draped Table
 - Two Chairs
 - Company Sign
 - Lunch
 - Directory Listing
 - Attendee List

Electricity is an additional $50 per booth. Early bird expires on Friday, July 24th, 2020!

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to mckenna@smta.org before Thursday, July 30th, 2020.

Please Contact Expo Manager - McKenna Hill with questions.



Attendees

It is our top priority to keep everyone at our events healthy and well.

SMTA follows the social distancing guidelines from both the local health authorities as well as the World Health Organization.

We will continue to practice these precautions for the foreseeable future.

 

Event Schedule:

9:00am

Registration Opens

10:00am

Expo Opens

11:00am - 11:45am

Tolerance Mistaken: Impacts of not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limiations

Speaker: Dale Lee, Plexus Corporation

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through developing ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately addressed during design, PCB fabrication, assembly and test.

11:45am

Drawing for Prizes

12:00pm - 12:45pm

Free Lunch

12:45pm

Drawing for Prizes

1:00pm - 1.45pm

Preparing Soldering Materials for 5G Environment

Speaker: Ning-Cheng Lee, Indium Corporation

5G is coming. This is based on the market need and anticipation. The requirement coming with 5G is also the need of upgrading assembly materials to cope with the vast increase in the speed of electronic signal as well as the demand on reliability. In this talk, the desired features and directions of soldering materials will be presented, including both flux features and solder alloy features.

2:00pm - 2:45pm

Computed Tomography (CT) X-Ray Analysis for Failure Analysis of Electronics

Speaker: Stephen Schoppe, Process Sciences, Inc.

Stephen Schoppe will deliver a presentation concerning the use of computed tomography (CT) X-ray for failure analysis of electronic assemblies and components. The presentation will cover when CT X-ray is an appropriate method to be used. It will discuss what types of features and defects can be discerned. Multiple case studies in failure analysis will be reviewed. These will include locating fractures in solder joints and defects in buried circuit board vias. This presentation will be applicable for manufacturers and developers of all variety of electronic products. Some details concerning the features of the equipment will be discussed so anyone planning to purchase CT equipment should find the presentation useful.

3:00pm

End of Show


Thank You to Our Refreshment Sponsors!

 

 

 

 

 

Thank You to Our Lunch Sponsor!


September 7 - 9

SMT Processes Certification (Juarez, Mexico)  +

Location
Juarez , CH Mexico


Location: 

TBA

 

  • September 7- Course (8:30-5pm)
  • September 8- ½ day of course + exam
  • September 9- All day exam (8:30-5pm)

  • Instruction: Spanish
    Test: English
    Instructor: Ivan Castellanos


September 10

Dallas Chapter: SMTA Dallas Chapter Meeting  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



SMTA Dallas Chapter Meeting

Speaker: TBD

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on September 11, 2020
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

MORE DETAILS TO COME! 


Abstract

TBD

Biography

TBD



September 10

Juarez Expo & Tech Forum  +

Location: TBD
Chihuahua, CP 31217



Exhibitors

EXHIBITOR TABLE INCLUDES:
6 ft. Draped Table | Two Chairs | Attendee List | Onsite Event Guide Listing | Company Sign | Lunch

 Early Registration Rates End August 10, 2020
 SMTA Corporate Members receive reduced rates!

 Corporate Member 

 Non-Corporate Member 

 One (1) booth before May 18, 2020

 $550 - USD
 $10,000 - MXN

 $650 - USD
 $12,000 - MXN

 One (1) booth after May 18, 2020

 $650 - USD
 $12,000 - MXN

 $750 - USD
 $14,000 - MXN

 Booth Electricity

 $50 - USD
 $1,000 - MXN

 Exhibitor Application PDF
 Advertisement & Sponsorship Application PDF

 Questions? Contact expos@smta.org.

 


 



Attendees

It is our top priority to keep everyone at our events healthy and well.

SMTA follows the social distancing guidelines from both the local health authorities as well as the World Health Organization.

We will continue to practice these precautions for the foreseeable future.

 

More Information on Technical Sessions Coming Soon!


Sep 27 - Oct 1

SMTA International 2020  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


Sep 29 - Oct 1

SMT Processes Certification (Rosemont, IL)  +

Location
Donald E. Stephens Convention Center
Rosemont , IL


Location:

Donald E. Stephens Convention Center

Rosemont, IL, USA

Schedule: 

  • September 29- Course (8:30-5pm)
  • September 30- ½ day of course + exam
  • October 1- All day exam (8:30-5pm)
  • Instruction: English
    Test: English
    Instructors: Jim Hall, ITM Consulting 

 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

Why You Should Participate

  • Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 13 - 15

International Wafer-Level Packaging Conference  +

Bridging the Boundaries: Wafer, Panel and Beyond

Location
DoubleTree San Jose Airport Hotel
San Jose , CA 95110


SMTA and Chip Scale Review are pleased to announce the 17th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

The IWLPC Technical Committee would like to invite you to submit an abstract for this program.

Abstract Deadline Extended: May 15, 2020


October 13 - 14

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 13-14, 2020
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 12
Move in: 12:00pm-5:00pm

Tuesday, October 13
10:00am-5:00pm

Wednesday, October 14
10:00am-4:00pm
Move out: 4:00pm-7:00pm

Click here to review Sponsorships and Exhibits

 

How Much is it to Exhibit?

  Early Registration
Before/On July 29th
Regular Registration
After July 29th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 

Click here to view the 2020 floorplan



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 13

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular) (click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.

Electricity is an additional $50 per outlet. Early bird pricing ends on September 18, 2020!

Ad/Sponsorship Form
Exhibit Application PDF

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before Wednesday, September 16, 2020.



Attendees

 


October 15

Additive Electronics TechXchange  +

Location
DoubleTree by Hilton San Jose
San Jose , CA San Jose


Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices. 

The format of this techXchange is to showcase the needs and requirements of the end users and provide an opportunity for the supply chain to respond.

Submit your abstract today! 

Abstract Submission Deadline: July 1, 2020


October 18 - 20

SMT Processes Certification (Guadalajara, Mexico)  +

Location
Guadalajara , JA Mexico


Location:

Guadalajara, Jalisco MX

Schedule: 

  • October 18- Course (8:30-5pm)
  • October 19- ½ day of course + exam
  • October 20- All day exam (8:30-5pm)
  • Instruction: English/Spanish
    Test: English
    Instructors: Ivan Castellanos, Indium Corporation

 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

Why You Should Participate

  • Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 20

Intermountain Utah Expo & Tech Forum  +

Location: Weber State University - in Shepard Union
3910 W. Campus Drive
Ogden, UT 84408



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members.
The cost to exhibit for non corporate members is $450/$550 (early/regular) (click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.

Electricity is an additional $50 per outlet. Early bird pricing ends on September 30th, 2020!

Ad/Sponsorship Form
Exhibitor Application PDF


Important Exhibitor Materials:

  • Please contact McKenna Hill, SMTA Expo Manager with questions or for additional information.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to mckenna@smta.org before Wednesday, September 23, 2020.



Attendees

Free Parking Information for Attendees and Exhibitors:

Park in the Pay Lot, which is right by the Shepard Union where the expo is located. You will receive a business card from a SMTA staff member when you leave. You will then take the card and the stub you get when you pulled in and put them in the yellow envelope that will be on your car. This will give you FREE parking, if you do not follow this then you will have to pay $8.

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Tuesday, October, 20, 2020
10:00AM–4:00PM

More on the Technical Sessions to Follow.....


October 21 - 22

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2020 After April 30, 2020
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information

 



Attendees

More information coming soon!

 

Click here to view the SMTA Guadalajara Expo Floor Plan!

 


October 27

Dallas Chapter: Dallas Expo & Tech Forum  +

Location
Plano Event Center, 2000 E. Spring Creek Pwky, Plano, TX 75074



Location: Plano Event Center
2000 E. Spring Creek Pkwy
Plano, TX 75074 

 

Attendees
 
 

Event Schedule:
Postponed to October 27th
Setup is October 26th, 12:00pm - 4:00pm
 
October 27th

  • 8:00 Registration opens
  • 8:30 Speaker 1
  • 9:15 Keynote Speaker 2
  • 10:00 EXPO Opens
  • 11:00 Speaker 3
  • 12:00 Lunch starts
  • 1:30 Speaker 4
  • 3:00 EXPO Closes
  • 3:30 Happy Hour Starts (with Jeopardy Game)
  • 3:45 Live! Jeopardy (A Fun Game with a Technical Format)
    • Moderator: Dr. Mark Currie - Director of Solder (Henkel)
    • Judge: Chrys Shea, Shea Engineering Services
    • Judge: Dr. Neil Poole - Chemistry Fellow (Henkel)
    • Contestants: 4 of the leading DFW Process Engineers

First Expo Speaker:

CT Scanning: 3 Case Studies

Speaker: Rob Boguski, Datest

Digital Computed Tomography, or CT Scanning, has advanced in both equipment as well as techniques in recent years, such that it has now become the method of choice in many applications where workmanship, fabrication, process, and component-related defects are difficult, and often otherwise virtually impossible to find. Nevertheless misconceptions linger concerning the suitability of CT scanning as a nondestructive test and failure analysis methodology. This presentation will address some of those misconceptions by featuring 3 specific and recent applications of CT scanning, illustrating its wide potential for use as a diagnostic tool. Examples will be shown from the medical/biotech, military/aerospace, and electronics sectors. In each case we will state the specific problem to be addressed; highlight some significant, if not decisive images; and show conclusions drawn from compilation and analysis of the images, with any applicable lessons learned along the way.


 

Second Expo Speaker:

The Future of the Digital Thread - Industry 4.0

Speaker: Dr. Don Kinard, Lockheed Martin Senior Fellow

For the past 20 years the Digital Thread has enhanced development of manufacturing technologies including robotics, automation, graphical work instructions, AR, optical/laser projection, and more recently, the introduction of laser and structured light scanning. This digital thread has also brought industry to the foothills of the next industrial revolution, Industry 4.0, the revolution of data. The introduction of integrated IT architectures, the application of analytics and AI, as well as the focus on data strategy and data automation will dramatically change the landscape of corporations as they look for these new technologies to provide improved unprecedented insight into performance and the ability to predict and mitigate disruptions. As with previous revolutions some companies will fail to embrace the technology and flounder, and others will ride the data wave to secure their future.  
 

Third Expo Speaker:

See the Heat - Troubleshooting PCB & Electronic Product Design with Thermal Imaging

Speaker: Desmond Lamont, FLIR Systems Inc.

As electronic circuit boards and components get smaller and more powerful, inherent heat can cause failures and significant damage. FLIR Business Development Manager for Science, Jerry Feeney, compares traditional temperature measurement devices with infrared imaging. He uses real-world infrared images and examples to detail how infrared thermography can more easily identify hot spots, allowing for improved thermal management and greater advances in circuit board design.

 

Fourth Expo Speaker:

Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations

Speaker: Dale Lee, Plexus Corporation

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume.  The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces.  However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products.  This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

 

Thank You to Our Door Prize Sponsor:

 

 

Thank You to Our Breakfast Sponsor:

 

Thank You to Our Happy Hour Sponsor:



Other Sponsors:





October 29

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: 10 ft. x 10 ft. partitioned exhibit space, one draped table, two chairs, company sign, lunch, directory listing and registrant list.

Early registration expires on: October 2, 2020!

Electricity is an additional $100 per outlet.

The cost to exhibit includes:
 - One 6 ft. Table
 - Two chairs
 - Company Sign
 - Lunch
 - Directory Listing
 - Attendee List
 

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up.
Exhibit Application PDF
Sponsorship/Ad Form PDF

For additional information or questions, please contact McKenna, SMTA Expo Manager.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to mckenna@smta.org before Wednesday, October 7, 2020.



Attendees

Free Technical Program, Schedule and Exhibitor List Coming Soon!

 


November 3 - 5

SMTA-IPC High Reliability Cleaning and Conformal Coating Conference  +

Location
DoubleTree Hotel Dallas Market Center
Dallas , TX 75207


Organized by SMTA and IPC

November 3-5, 2020
DoubleTree Hotel Dallas Market Center
Dallas, TX


November 6

Dallas Chapter: SMTA Dallas Chapter Meeting  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



SMTA Dallas Chapter Meeting

Speaker: TBD

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on November 6, 2020
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

MORE DETAILS TO COME! 


Abstract

TBD

Biography

TBD



November 10

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025



Exhibitors

$375/$475 (early/regular) for corporate members
$450/$550 (early/regular) for non-corporate members
Early registration pricing ends on October 16, 2020!
(click here for membership information).

$50 Electricity

Included in Cost:
 - One 6ft. Draped Table
 - Two Chairs
 - Company Sign
 - Lunch
 - Onsite Event Guide Listing
 - Post Event Attendee List

Important Exhibitor Materials:

Exhibitor Application PDF
Sponsor/Ad Form

Important Exhibitor Materials:
Please contact an SMTA Expo Manager courtney@smta.org with questions or for additional information.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before Friday, October 16, 2020.



Attendees

November 12

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members.
The cost to exhibit for non corporate members is $450/$550 (early/regular).
(click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $50 per outlet. Early bird pricing ends on October 19, 2020.

Ad/Sponsorship Form
Exhibit Application PDF

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before Monday, October 19 2020.



Attendees

November 17

Tampa Expo & Tech Forum  +

Location: University of South Florida
4202 E. Fowler Avenue
Marshall Student Center
Tampa, FL 33620



Exhibitors

Exhibit Cost Includes:
6 ft. Draped Table | Two Chairs | Attendee List | Directory Listing | Company Sign | Lunch

  SMTA Member
(corporate, global, professional)
Non SMTA Member
One Booth Before October 19, 2020 $ 375 $ 475
One Booth After October 19, 2020 $ 450 $ 550
Booth Electricity $ 50 $ 50

(click here for membership information)

Early registration expires on Monday, October 19, 2020

Sponsorship PDF
Exhibitor Application PDF

Please contact an SMTA Expo Manager courtney@smta.org with questions or for additional information

Hotel room block information available soon!

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before Friday, October 23, 2020.



Attendees

Technical Session Information Coming Soon!


November 19

Space Coast (Melbourne FL) Chapter: Space Coast Expo & Tech Forum  +

Melbourne Auditorium




November 19th,  2020 (10AM - 4PM)
Location: Melbourne Auditorium
625 East Hibiscus Blvd, Melbourne FL 32901

 

PLAN TO ATTEND AND MEET INDUSTRY LEADING SUPPLIERS, AND ATTEND OUR FREE TECHNICAL SESSIONS

                                            
The Space Coast chapter of SMTA would like to invite you to attend our Technical Conference and Exposition free of charge. The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.  

                                                                                                  

REGISTER HERE

******SEND US YOUR BEST SOLDERERS******
1:00PM

Soldering Challenge Begins
To Our Valued Suppliers
The Space Coast Chapter SMTA will be holding our 3rd annual ‘Soldering Challenge’ at this year’s EXPO and Tech Forum November 20th at the Melbourne Auditorium. We have set the limit to 48 contestants, divided up into 8 heats. The challengers will be assigned the task of building a standard IPC mechanical sample circuit card assembly, using current soldering methods and materials, within a specified time frame. Tools will be furnished by participating vendors and suppliers, and experienced engineering staff from Harris Corporation and Career Source. will be coordinating the event, for which prizes will be awarded to the most and best solder joints per IPC610 completed during the challenge.

PRIZES AS FOLLOWS

1 - 55" 4k Television
2 - Samsung pad
3 - $100 Gift card
4 - $100 Gift Card
5 - $100 Gift Card


To sign up as a soldering challenge contestant,
Download the Form here, fill it out, and email it to Michael Newman: Michael.Newman@L3Harris.com
We are soliciting corporate and supplier sponsorships in the amount of $250.00, to help support this event.

Can we count on your support?
Click here for Ad and Sponsorship opportunities!

 

Technical Program & Schedule: 

Free Technical Program Schedule:

7:45AM
Registration Opens


8:00AM
Student and Young Professionals Breakfast

9:00AM – 10:00AM


10:00AM
Expo Opens

10:45AM - 11:30AM


11:30PM - 1:00PM
Complimentary Lunch

12:30PM - 1:15PM
  
 

1:00PM
Soldering Competition on Show Floor

2:00PM - 2:45PM
.

4:00PM
Expo Closes

5:00PM - 7:00PM

After Expo Networking Social at The Mansion:

1218 E New Haven Ave, Melbourne, FL 32901

THANK YOU TO OUR TECHNICAL SESSIONS SPONSOR:


THANK YOU TO OUR REFRESHMENT SPONSOR:


THANK YOU TO OUR SOLDERING COMPETITION SPONSOR:

THANK YOU TO OUR AFTER EXPO NETWORKING SOCIAL SPONSORS:



2019  Exhibitor List

A-Tek Systems
Acculogic, Inc.

ACL Staticide, Inc.
Advanced Circuits
AIM Solder
Air Centers of Florida
America Tape and Reel
American Hakko Products, Inc.
Ascentec Engineering
ASM Assembly Systems, LLC
Austin American Technology
Aven Tools, Inc.
Biofit
BlueRing Stencils
BOFA Americas, Inc.
BTU International, Inc.
Compunetics, Inc.
Conductive Containers, Inc.
Cornerstone Technical Marketing
Datum Alloys Inc.
Electronic Assembly Products, LTD
Eltek USA Inc.
EMC3 Group

EPTAC Corporation
Essemtec USA
Fancort Industries, Inc.
Garland Service Company
Guild Manufacturing Solutions
Hentec Industries Inc.
Horizon Sales
ICAPE-USA
Indium Corporation
Inovaxe
InsulFab PCB Tooling
KIC
Kurt Whitlock Associates
Kurtz Ersa, Inc.
KYZEN Corporation
Lindstrom Precision Tools
LPMS USA
Maximum / Pioneer Circuits
METCAL
MicroCare Corporation
Nikon Metrology, Inc.
Nordson DAGE
Omron Inspection Systems
PACE Worldwide
Panasonic
PARMI USA, INC.
PFC Flexible Circuits Limited
Photo Etch Technology
Pillarhouse USA, Inc.
PVA
Quantum Storage Solutions
REStronics Florida
Robert McKeown Co. Inc.

Robotas Technologies Ltd
SCHUNK Electronic Solutions
Scienscope International
SEHO North America
Seica Inc.
Shenmao America, Inc.
SiliconExpert
Smart Splice LLC
SMT.Repair
Solutions Manufacturing, Inc
SPEA America
Specialty Coating Systems, Inc.
StaticStop a Div. of SelecTech
Technical Resources Corporation
Techspray/Chemtronics
TRONEX
Tropical Stencil, Inc.
Universal Instruments Corporation
Virtual Industries Inc.
Viscom Inc.
Vision Engineering
Weller Tools
Yamaha Motor Corporation USA
ZESTRON


HOTEL INFO
Hilton Melbourne Rialto Place   Group rate Name= SMTA  $129
Hilton Melbourne Beach Oceanfront                                   
Doubletree Suites Hilton Melbourne Beach Oceanfront      
321 777-5000 
3003 North Highway A1A I Indialantic, FL 32903 


 





December 1 - 3

Electronics in Harsh Environments Conference 2020  +

Location
Park Plaza Amsterdam Airport
Amsterdam (Linden) 1175 RM Netherlands


The conference will focus on building reliable electronics used in power electronics and harsh environments.


December 8 - 10

International Conference for Electronics Hardware Enabling Technologies 2020  +

ICEHET

Location
HILTON TORONTO/MARKHAM SUITES CONFERENCE CENTRE &
Markham , ON L6G 1A5 Canada


Do you have a proven solution or compelling research to share? We want you!

Choose between three different presentation types: Supplier Presentation, Technical Presentation and Standard Paper Presentation. 

The ICEHET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, conformal coating and other methods to achieve high reliability in aggressive environments.

Submit an abstract to present at the 2020 ICEHET! 

 


December 9

SMTA Ontario Chapter Expo & Tech Forum  +

In conjunction with International Conference for Electronics Hardware Enabling Technologies (ICEHET)

Location: Hilton Toronto/Markham Suites
8500 Warden Ave
Markham, ON L6G 1A5
Show Hours: 10:00am- 3:00pm



Exhibitors

Increase your company’s visibility at the 2020 ICEHET as an exhibitor or sponsor! 

Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below.

Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is October 26, 2020. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above.

View Sponsorship and Advertisement Opportunities

 

Exhibition Information

The conference will include an exhibition area featuring a variety of tabletop displays that will be open during conference breaks.

Exhibit benefits:

  • One (1) admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Lunch & Breaks
  • Electronic conference proceedings

View Exhibit Application- Hard Copy

Exhibit Early Pricing:
Member: $375
*Non-member: $475

Early Pricing Ends: Friday, November 20, 2020

Electricity: $50

*Become an SMTA Corporate Member to Receive the Discounted Rate! 

Click here for SMTA membership information

Registration for the Technical Conference is open. Register today!

Current Exhibitor List:

 



Attendees

Register here to attend the expo only!
Technical conference and workshops not included.

Exhibit Hours: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Access to the Keynote Speaker
  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks

 

Please contact Conference Manager, Jaclyn Sarandrea, jaclyn@smta.org or call 952-920-7682 with questions or to request additional information.


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819