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MIRTEC To Premier Its Technologically Advanced Automated Optical Inspection Systems At SMTAI 2011


MIRTEC MV-7xi In-Line AOI MachineOXFORD, CT - September 2011 - MIRTEC, "The Global Leader in Inspection Technology," announced that it will premier its complete line of AOI systems in Booth #124 at SMTA International 2011, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, Texas.  
At the show, MIRTEC will feature its award-winning MV-7xi In-Line AOI System configured with its exclusive 10 Mega Pixel ISIS Vision System. This revolutionary optics system is comprised of a 10 Mega Pixel Top Down camera and a Precision 13.4 Micron Telecentric Compound Lens. The MV-7xi also will be configured with Four (4) Ten Mega Pixel Side-View Cameras, a 2D camera bar code reader, a high throughput, three-stage PCB conveyor and a PCB under board support system. MIRTEC's patented "Quad Angle Lighting System" provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi also will feature MIRTEC's industry acclaimed Intelli-Scan Laser System that provides: superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. The MV-7xi is powerful yet simple to use. A comprehensive Package Type Library provides simple "Drag and Drop" component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.
MIRTEC also will display its award-winning MV-3L Desktop AOI System. The MIRTEC MV-3L is heralded as the industry's most widely accepted Five Camera Desktop AOI system. This machine will be configured with the same 10M ISIS Vision System as that of the MV-7xi, providing true program compatibility across both platforms.  The MV-3L also will be configured with Four (4) Ten Mega Pixel Side-View Cameras as well as MIRTEC's exclusive Intelli-Beam Laser System. This advanced technology provides: Four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability in a cost effective desktop AOI system. 
"MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment," stated Brian D'Amico, president of MIRTEC's North American Sales and Service Division. "We are confident that this ground-breaking technology will undoubtedly set a new standard by which all other inspection equipment will be measured. We look forward to welcoming visitors to our booth #124 during the two-day event." 

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