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LORD Corporation's Wang To Speak At Del Mar Electronics Show


LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries - has announced that Larry Wang, Ph.D., Staff Scientist, Electronic Materials Research & Development, LORD Corporation will present a paper at the 2011 Del Mar Electronics & Design Show.
The meeting will take place May 4 at the Del Mar Fairgrounds in San Diego, Calif. at 2 p.m. Wang's paper is entitled: "Inherently Flexible Epoxy Gel Encapsulant - New Alternative for Low Stress Electronic Packaging."  
The presentation will highlight new encapsulation material solutions and material test results for the packaging industry. In today's marketplace, electronic components are used in a variety of industries and integrated into new and more demanding applications. Under harsh environments, such as increasingly extreme temperatures, high moisture, heavy vibration and chemical exposure, fragile electronic devices become vulnerable to stresses that can cause mechanical and electrical failures. To meet these demands in the industry, LORD Corporation responded by developing a unique low stress epoxy gel encapsulant - ES-100. This epoxy encapsulant provides an alternative option for customer applications with harsher demands such as resistance to high temperatures and chemicals.
Wang is responsible for the development and commercialization of new materials for the electronics market. With expertise of technology areas including conductive materials, adhesives, underfills, potting and encapsulants, he has also served as a technical supporting role for electronic business. Having worked for LORD Corporation for 10 years, Wang has more than 20 years of combined industrial experience focused on adhesives, coatings and potting encapsulants for the electronics industry. Wang earned his Ph.D. in polymer science from Peking University.

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