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ZESTRON to present “Fluid Flow Mechanics: New Advances in Low Standoff Cleaning” at SMTAI


Manassas, Va. – August 4, 2008 - ZESTRON America, the global leader in high precision cleaning products will be presenting the findings from a recently finished "Fluid Flow Mechanics: New Advances in Low Standoff Cleaning" at the upcoming SMTA-I tradeshow during the Technical Sessions on Tuesday, August 19th from 1:30pm to 3:00pm at the Disney's Coronado Springs Resort Orlando, Florida.

In this technical paper, Mr. Umut Tosun, M.S. Chem.Eng., Application Technology Manager with ZESTRON America discusses new innovative approaches that are being introduced to further address the increasing demand for low standoff cleaning. These include innovations on the mechanical side as well as on the chemical side. Chip components for example are currently placing the highest demand on removability as gaps are being reduced to less than 1 MIL. The presence of the latest chip components (i.e. 0201, 01005 and 01812) combined with other geometric obstacles has been noticed in the cleaning community. As such challenges emerge, users must therefore first determine that residues are cleanable by the cleaning agent of choice before even addressing this new geometric challenge. This paper is the third in a series of experimental data to be presented that will help users to overcome their respective cleaning challenges. "These findings are based on specifically designed cleaning fluids, developed through fluid mechanic modeling for the highest currently known cleaning requirements." said Umut Tosun, accredited cleaning expert.

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