Indium Corporation Wins Global Technology AwardWorld’s first reworkable, air reflowable, Pb-free no-flow underfill
Indium Corporation has received the Global Technology Award for its NF260 No-Flow Underfill. Sponsored by Global SMT & Packaging magazine, the award recognizes product excellence and innovation in semiconductor packaging and electronics assembly. It was presented at Productronica in Munich, Germany.
|NF260 is the world’s first reworkable, air reflowable, Pb-free no-flow underfill. It is designed for chip scale package (CSP) and BGA or flip-chip assemblies using a single reflow process. NF260 offers both a fluxing and underfilling capability for the chip, while providing increased reliability and environmental protection.||Designed for Pb-free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing. The underfill curing is completed in one reflow pass and no post-cure is required. NF260 reduces costs when compared to capillary flow underfills, and also achieves higher yields.|
Two trends are converging and driving the need for more advanced PCB assembly materials:
NF260 satisfies both these needs. To learn more about NF260 visit the Indium Web site. Also visit the SMTA corporate member detail page in the Member Directory for Indium Corporation.