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Sanmina SCI Switches to ZESTRON® For Underside Cleaning

Significantly reducing number of solder balls per board

ZESTRON underside cleaning Sanmina SCI recently replaced IPA in their existing underside cleaning process with ZESTRON® SW. The switch was prompted by the New Product Introduction Center (NPI), which is responsible for the definition and implementation of all processes at Sanmina SCI. The key reason for the switch was to significantly reduce the number of solder balls per board to comply with the IPC-610 standard. Various process optimizations with IPA failed, which led to the search for a new cleaning agent.

Due to the change to ZESTRON® SW many process advantages were achieved. These advantages included the prevention of solder balls on the boards, a significant reduction in the consumption of the cleaner, a shorter process time, and a higher flash point, which led to increased operational safety. Overall, due to the change to ZESTRON® SW, all requirements of Sanmina SCI were exceeded and a technically safe and cost effective process was implemented.

Go to the Sanmina SCI detail page in the Member Directory for more company info, and read more about ZESTRON® on their corporate member detail page in the Member Directory.

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