SMTA International 2017 Concludes Successfully
The 2017 SMTA International Conference and Exhibition, which took place September 17 – 21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL, concluded successfully. A record number of international attendees from 22 countries were registered this year.
The technical conference continued the tradition of being the strongest in the electronics assembly industry. The Technical Innovations Symposium at the beginning of the week received much praise as it covered Micro-Dispensing and Additive Manufacturing Developments, Adhesive and Coating Development and Characterization, and a Lead-Free Current/Future Presentations Panel Discussion. The Technical Innovations Symposium keynote presentation by iNEMI’s Bill Bader on the 2017 Roadmap Highlights was well-received by attendees.
The Women’s Leadership Program brought together speakers from IBM, Intel, FLITE, WNIE, and Women in Manufacturing on Monday afternoon. The program closed with a panel discussion about diversity in the workplace followed by a wine and cheese reception.
On Tuesday morning a crowd filled the Keynote Presentation Session until it was standing-room-only to hear Microsoft’s GM of HoloLens Hardware Design, Rune Jensen, share his experiences developing the company’s premier mixed reality device. The presentation included several videos demonstrating the advanced capabilities of the HoloLens. The presentation inspired attendees to imagine how a device like this could change the future of manufacturing.
The Lead-Free Soldering Technology Symposium as well as the expanded Advanced Packaging, Manufacturing Excellence, Inspection Technologies, and HDP Consortium tracks kept the meeting rooms full until the very end of the conference on Thursday.
Over 170 exhibiting companies filled the exhibit hall bringing more equipment and new products than past years. Traffic on the show floor was noticeably higher this year.
Once again the Tech Tour program featured distinguished tour guides leading groups of attendees to exhibiting companies demonstrating new products and test equipment.
Next year the SMTA International Conference and Exhibition will be held October 14 - 18, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The IPC Fall Standards Development Committee Meetings will again be co-located.
For more information on SMTA International please contact Tanya Martin: email@example.com or 952-920-7682 or visit https://www.smta.org/smtai/.
LED A.R.T. Symposium Program Announced
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium held at the Archie K. Davis Conference Center in Research Triangle Park, NC from November 28 - November 30, 2017.
The technical program on November 28 and 29 features presentations on topics including LED Applications, Packaging, Failure Mechanisms, LED Solder Joint Reliability, and Board Processing with LEDs. Plus there is a keynote presentation by Ralph Tuttle from Cree.
Three workshops are offered Thursday, November 30. Ning-Cheng Lee, Ph.D., Indium Corporation, will instruct an all-day course on DFX for Advanced Soldering Technology. Martine Simard-Normandin, Ph.D., MuAnalysis Inc., will instruct a half-day course on Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Mode. Diganta Das, Ph.D., CALCE, University of Maryland, will instruct a half-day course on Failure Mechanisms and Qualification Tests for LEDs.
The early registration deadline is November 7, 2017. For more information or to register visit: https://smta.org/led/
Contact Jenny Ng at 952-920-7682 or firstname.lastname@example.org with questions.
SMART Group to Become SMTA Europe
Minneapolis, Minn. - SMTA and SMART Group announce plans for SMART Group to become SMTA Europe effective January 1, 2018. SMTA Europe will continue to host meetings in the UK, but will also support manufacturing regions in mainland Europe with additional educational programs and technical resources.
Members of both organizations will benefit with expanded opportunities to connect across the globe as well as mutual access to thousands of technical papers and online content.
This announcement comes months after the successful Contamination, Cleaning and Coating Conference co-organized by SMTA and SMART Group in Amsterdam. Plans are already underway for a 2018 conference in Amsterdam addressing Electronics in Harsh Environments.
"In this fast changing environment, industry associations can struggle to remain relevant and this will ensure that our growth continues,” said Keith Bryant, Chairman of SMART Group. “SMTA is a global organization with a huge reach. Together we will offer our members unrivalled events and support, increasing their knowledge, helping those overcome problems and become more successful.”
“The SMART Group mission and values perfectly align with that of SMTA.” said Tanya Martin, Executive Director for SMTA. ”The SMART Group has built a solid foundation and we look forward to welcoming their members into our family. This is an exciting time for SMTA as we strive to expand our international presence and bring education and connections to electronics professionals around the world.”
If you would like to apply to join the SMTA Europe Technical Committee and help organize great events, please contact Tanya Martin, email@example.com.
Electronics in Harsh Environments Conference Announced
Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.
This conference will focus on the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. The content will be focused on building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented.
The Call for Participation will be announced in the coming weeks.
Visit the website for more information: https://www.smta.org/harsh/
Contact Tanya Martin, firstname.lastname@example.org, with questions or comments.
SMTA Welcomes New Board Members
Those remaining on the SMTA Board of Directors include: President, Jeff Kennedy, Celestica, Inc.; Treasurer, Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.; Secretary, Richard Henrick, Sanmina Corporation; VP Communications, Sal Sparacino, ZESTRON Americas; VP Membership, Eileen Hibbler, TEK Products; Strategic Development Committee members include chairperson Matt Kelly, P.Eng., MBA, IBM Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology; Richard Coyle, Ph.D., Nokia; and Tim Jensen, Indium Corporation.
The SMTA will bid a fond farewell to departing VP Tech Programs, Raiyomand Aspandiar, Ph.D., Intel Corporation, and Strategic Development Board Member, Scott Priore, Cisco Systems, Inc. They are congratulated for a job well done and given thanks for the years of dedication to the SMTA.
The official transition will occur at the next SMTA Board of Directors meeting scheduled for September 17, 2017 at SMTA International in Rosemont, Illinois.
For more information on the SMTA Board of Directors election results, contact SMTA Executive Director Tanya Martin: email@example.com or 952-920-7682.