SMTA Querétaro Achieves Official Chapter Status
Minneapolis, MN - The SMTA is pleased to announce that the SMTA Querétaro Chapter has successfully completed the formation process and is now recognized as an official and active chapter of the SMTA. The chapter organized a successful kick-off meeting on May 3, 2017.
The formation committee officers include Miroslaw Dziuba, PRETTL Electronics Querétaro S.A. de C.V. (President); Omar Gomez, ASYS Group Americas Inc., (Vice President); Juan Mollinedo, E.G.O., (Secretary); Jorge Vazquez, Kostal Mexicana SA de CV, (Treasurer); Flor Fabiola Ortiz, Interlatin (VP of Membership); Noemi Romero, Representaciones y Metales SA de CV (Membership); Fernando Coyotecatl Varela, Viscom (Webmaster); and Guillermo Maldonado, Servicio y Tecnologia Europea Latinoamericano SA de CV (Technical Programs). The officers are commended for their leadership and dedication.
Details regarding the Querétaro Chapter can be found on their website at:
For more information contact Karen Frericks: 952-920-7682 or email@example.com.
SMTA International Conference Program Finalized and Registration Now Open
The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 140 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Technical tracks will cover Advanced Packaging Technology; Manufacturing Excellence - process and assembly; Substrates/PCB Technology; Flux, Solder and Adhesives; and Inspection Technologies. Engineers from major manufacturing companies like Celestica, Flex, IBM, Intel, Lockheed Martin, Sanmina Corporation, and several universities will present their latest research on critical process improvements, new materials and technologies. One session on Monday afternoon comprised of all women presenters will be followed by a panel discussion on the technical achievements of women, mentoring, and STEM initiatives. Three focused symposia rounding out the technical conference are the Technical Innovations Symposium, Harsh Environments Symposium, and Lead-Free Soldering Technology Symposium.
Twenty half-day educational workshops are offered Sunday and Monday from expert instructors on topics including Fan-Out Wafer-Level Packaging and 3D Packaging, DfX, Cleaning, Ball Grid Array (BGA) issues, Flex Circuits, Reliability, Inspection, Temperature Profiling, Reflow Soldering, Stencil Printing, Surface Finishes, Process Troubleshooting and more.
Microsoft’s General Manager of their HoloLens Hardware Design Team, Rune Jensen, will keynote the conference with a presentation Tuesday morning titled “Experiencing Mixed Reality - using the Microsoft HoloLens.” The ability to project 3D images into a user’s field of view has many exciting applications in the industrial space with the ability to provide real-time information or images fixed in-space to a real-world object. Microsoft calls this “mixed reality.” Rune will share technical challenges and triumphs as well as illustrate several practical applications of this innovative technology.
Over 170 exhibiting companies will display equipment, materials, and services at the Electronics Manufacturing Exhibition, which will be held Tuesday and Wednesday, September 19 - 20. Attendees are invited to join Tech Tours to get an inside look at the latest in equipment and technology available. Lunch coupons will be provided both days on the show floor.
IPC Fall Standards Development Committee Meetings are co-located with the conference. The full schedule for IPC committee meetings are on the IPC website. Registration is required.
Several events at SMTA International are free to all attendees including Spotlight Sessions with presentations on Component Challenges, Reliability, Solder Alloys, Soldering, Process Control, RoHS and Traceability. Other complimentary events available to all attendees are the Women’s Leadership Program, New Product Showcase, Fun Run, Appreciation Reception, Tech Tours, and the Students and Young Professionals Night Out.
The 10th Annual SMTA International Golf Tournament will kick-off with a shotgun start at 8:30am on Thursday, September 21. Over 60 golfers are expected to participate in the tournament at the Maple Meadows Golf Club.
The early registration deadline is August 25, 2017. For full details and to register for SMTA International, visit http://www.smta.org/smtai or contact SMTA Executive Director Tanya Martin: 952-920-7682 or firstname.lastname@example.org.
Awards Announced for SMTA China East Conference 2017
SMTA China announces that it presented awards for Seven papers at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Flex’s Henley Zhou was awarded The Best Paper of Technology Conference One for the paper titled “The Study of The Efeect of PTH Diameter, Connection Type and Amount of Connected Copper On PTH Hole Fill Percentage By Wave Soldering.”
Kyzen’s Daniel Gao was awarded The Best Paper of Technology Conference Two for the paper titled “Cleaning Agent Innovation for Highly Dense Electronic Assemblies.”
Keith Bryant, from SMT Solutions and Michael Tang, from YXLON International GmbH received the award for The Best Presentation of Technology Conference One for the presentation titled “Computer Tomography From Microelectronics To Assembled Products.”
Dr. Wayne Koh, from Pacrim Technology Inc. received the award for The Best Presentation of Technology Conference Two for the presentation titled “Progress In Low Temperature Lead-Free Solder for SMT Assembly.”
Ji Xu, from ASM Assembly Systems Ltd. received the award for The Best Presentation of Vendor Conference One for the presentation titled “Smart #1 SMT Factory-Our Smart Move to Industry 4.0.”
Derek Wang, from AIM Solder (Shenzhen) Company Limited received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Impact of Reduced Solder Alloy Powder Size On Solder Paste Print Performance”
Yu Xiang, from Shenzhen City TongFang Electronic New-material Co.,Ltd. received the award for The Best Presentation of Vendor Conference Three for the presentation titled “QFN Solder Void Solution Study.”
Dongguan Anda Automation Equipment Co., Ltd. received the award for The Best Emerging Exhibit of the Year 2017 China East with the product of “Dispenser Machine” and Model of “AD-16.”
Cencorp Automation Oy, received the award for The Best Exhibit Technology of the Year 2017 China East with the product of “In-Line Router” and Model of “1000BR.”
For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail: email@example.com
Best Paper / Best Presentation Awards presented by SMTA China during the SMTA China East Conference 2017
Best Emerging Exhibit / Best Exhibit Technology Awards presented by SMTA China during the SMTA China East Conference 2017
SMTA Welcomes New Strategic Engagement Manager
The SMTA recently named Matt Bourgeois to the position of Strategic Engagement Manager. The newly-created position fulfills a need for increased engagement among corporate members, smaller manufacturers, young professionals, and students.
With input and guidance from SMTA members and the Board of Directors, the vision for this new role is to strengthen the electronics industry by fostering collaboration among individuals and corporations. This vision will ultimately strive to match potential employers with like-minded young people. Matt will facilitate, educate, and serve as a dedicated resource supporting this initiative.
Matt Bourgeois joins SMTA with experience in project management and finance in the electrical industry, as well as business ownership in the electronics sector. Matt earned an MBA from St. Mary’s University and holds two undergraduate degrees from the University of North Dakota. He also speaks Spanish fluently. Matt is certain to be an asset for the association and the industry.
Matt welcomes ideas, questions, or comments regarding internships, education, mentoring, or student chapters. Matt Bourgeois can be reached at firstname.lastname@example.org or 952-920-7682.
IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference
Amsterdam, Netherlands – SMTA and SMART Group announce experts from IBM Corporation and Siemens AG will keynote the Contamination, Cleaning and Coating Conference. The conference is scheduled May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam.
On Tuesday, May 23, Prabjit Singh, Ph.D., IBM Corporation, will provide his keynote presentation on the “Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers.” He will offer a history of electronic corrosion and survey/occurrence of corrosion in data centers worldwide. The presentation will delve into Mixed Flow Gas (MFG) and Flowers of Sulphur (FOS) testing of hardware for corrosion propensity, recent advances in FOS testing for creep corrosion, effect of humidity on creep corrosion, effect of temperature and humidity on copper and silver corrosion, as well as conformal coatings and their testing. Dr. Singh is a Senior Technical Staff Member in the Materials and Processes Department in IBM Corporation with 38 years of experience in the metallurgical engineering aspects of mainframe computer power, packaging, cooling and reliability.
Ruediger Knofe, Siemens AG, will keynote Wednesday, May 24 with his presentation titled “Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks When Cleaning Process is Not Optimal.” The talk will highlight key objectives for cleaning of electronics including processes, cleaning agents, influencing factors, evaluation, and potential damage risks. Mr. Knofe currently works as a senior key expert engineer at Siemens AG, responsible for different material qualifications, reliability failure analyses and also cleaning processes for electronics.
This two and a half day technical event focuses on the most important and timely issues on contamination, cleaning and conformal coating in the manufacture of electronics. Conference sessions will include Residues Trapped under Component Terminations, How Problematic are Contaminants Left on Printed Circuit Assemblies, Process Control and Cleaning Material Innovations and Conformal Coating Materials and Processes.
Visit the website for more information: http://www.smta.org/contamination/
Contact Tanya Martin, email@example.com, with questions or comments.