Electronics Packaging Simulation/ Modeling Engineer

Anywhere in USA 05/15/2019
I am a soon to Graduate PhD in Mechanical Engineering from Auburn University. My area of expertise in Finite Element Modeling for Electronic Assemblies subjected to Harsh Environments like Thermal Cycling, Thermal Aging, Drop/Shock, and Vibration. I also specialize in failure detection and reliability of first and second level interconnects. I have a strong publication and research record in this area and am looking for a full time opportunity.

Please send inquiries to nak0007@auburn.edu.