Electronics Industry News
ZESTRON to Raffle VIGON® RC 303 at SMTA New England Expo
Manassas, VA – November 10, 2017 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to feature our oven cleaning maintenance product, VIGON® RC 303, at the SMTA New England Expo on November 16th. Additionally, we will raffle a sample of VIGON® RC 303 cleaning agent complete with our newly developed pressure sprayer during the expo.
"We are excited to offer an oven cleaning maintenance product that in combination with our pressure sprayer, makes oven cleaning fast and efficient," said Sal Sparacino, Sales and Marketing Manager, ZESTRON.
Interlatin Announces BPM Microsystems as a New Business Partner
In Interlatin, for more than 18 years, we have always had one goal: to offer solutions for the complete transformation journey from a basic material into an assembled product. Because of this, our electronic Test business unit we were searching for a programming system for electronic devices not mounted on the pcb.
After an exhaustive search and an in-depth analysis of the needs of the electronics industry in Mexico, we have found the ideal partner - BPM Microsystems. Founded in 1985 with headquarters in Houston, Texas, BPM Microsystems is the leading global provider of both manual and automated universal programmers - serving the electronics and semiconductor industry.
With this new partner, we will provide an alternative when the programming time in your ICT test stations or functional test is very high, that will optimize the units per hour in your manufacturing process without sacrificing the quality of your product.
Hand to hand with BPM in our solutions offer we will cover the entire spectrum of electronic testing in the industry.
Interlatin anuncia a BPM Microsystems como nuevo socio de negocio.
En Interlatin, desde hace más de 18 años, siempre hemos tenido un objetivo: ofrecer soluciones para el viaje completo de transformación de un material a un producto ensamblado. Es por este motivo, que en la unidad de negocios de Prueba (Test) nos hacía falta algo: un sistema de prueba para dispositivos electrónicos no montados en la tarjeta.
Después de una búsqueda exhaustiva y un profundo análisis de las necesidades de la industria electrónica en el país hemos encontrado al socio ideal – BPM Microsystems. Fundada en 1985 y con oficinas centrales en Texas, BPM Microsystems es el proveedor líder, a nivel global, de programadores universales tanto manuales como automatizados – dándole servicio a la industria electrónica y de semiconductores.
De esta manera cuando el tiempo de programación en sus estaciones de prueba ICT o Prueba funcional sea muy alto, estaremos brindando esta alternativa que permitirá optimizar las unidades por hora en su proceso de manufactura sin sacrificar la calidad de su producto
Con este nuevo socio en nuestra oferta de soluciones cubriremos todo el espectro de prueba electrónica en la industria.
En caso de cualquier duda o requerir una consultoría sobre BPM, favor de contactar:
In case of any doubt or require a consultancy about BPM, please contact:
Edgar González, Test Manager
Adrián Corpus, Service Engineer
Cel: 331600 2673
Electronic Systems Inc. (ESI) Awarded Governor's Workplace Safety Award
SIOUX FALLS, S.D. -- Electronic Systems, Inc. was recognized for superior performance in workplace safety and health at the Governor’s Workplace Safety Awards luncheon on October 4 at the Sioux Falls Convention Center. At the luncheon, ESI accepted an award for Meritorious Achievement on behalf of its associates.
“This award is a direct reflection of ESI’s continued commitment to workplace safety made possible by our associates through the efforts they put in each day to ensure a safe work environment for all,” stated Greg Adams, Manufacturing Manager.
“Employers like ESI know that safety isn’t automatic,” said Cary Swenson, Executive Director of the South Dakota Safety Council. “It takes attention, dedication and continuous effort to protect their employees.”
Sponsored by the South Dakota Safety Council, the Governor’s Workplace Safety Award is given to companies in the State of South Dakota based upon specific criteria for DART rate, Incidence rate, and a comprehensive Safety Program Evaluation Scorecard. Companies whose incidence rates are better than the industry average for at least three years, and who score between 50 and 74 on a 100-point safety program evaluation scale are recognized for Meritorious Achievement.
The Governor’s Safety Awards luncheon was part of the 25th annual South Dakota Safety & Health Conference, coordinated by the South Dakota Safety Council. The conference is the largest gathering of workplace safety and health professionals in the region. The South Dakota Safety Council, founded in 1949, is a non-governmental, not-for-profit organization dedicated to improving the quality of life in South Dakota by preventing unintentional injuries (“accidents”).
CAPTION: Members of Electronic Systems Inc. proudly receive the award for Meritorious Achievement. Pictured from left to right: Sarah Perry, Chair-elect of the South Dakota Safety Council Board of Directors; ESI’s Chad Wolfgang, Electronic Technician and Tony Johnson, Associate Test Engineer; and Matt Michels, Lt. Governor of South Dakota.
Electronic Systems, Inc. (www.electronicsi.com) is headquartered in Sioux Falls, SD and operates three facilities there. The company offers complete EMS (Electronic Manufacturing Services) for PCB assembly through final system-level assemblies including supply chain management and order fulfillment. Customers include OEM’s in the Industrial, Commercial, Energy, and Medical markets. The company is ISO 9001:2008 and ISO 13485:2003 (Medical) certified and ITAR registered.
IBE to exhibit at Northwest Design-2-Part Showcome to visit us at booth #325
See The Best Manufacturers Face-to-Face at the Region's Largest Contract Manufacturing Trade Show
For over 40 years, Design-2-Part Shows has connected the finest American job shops and manufacturers face-to-face with OEM engineers, management and buyers who need their expertise and services to solve their manufacturing challenges.
IBE Electronics USA, LLC, as a new PCB Assembly Contract Manufacture located in Hillsboro, OR, participate this trade show.
Actually IBE has been serving the contract manufacturing (EMS) industry nearly 20 years in China. The service includes Electronic Design, PCB Fabrication, SMT and PCB Assembly, Components Sourcing, Prototyping, Box Build, and Turnkey Solution. To expand the business and provide better services to North American customers, IBE opened a new facility IBE (USA) in Hillsboro, OR in 2017, which can provide a full range of PCB assembly service.
Come to visit us at booth #325, our team will be available to discuss with you how to fit your needs.
SHENMAO to Introduce New Low Residue Liquid Flux and Lead-free Solder Pastes at IWLPC
SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-WB51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055, 0.05 mm Dia. - 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.
As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon. Please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: email@example.com
Versa Electronics Completes ISO 9001:2015 Transition and Achieves ISO 13485:2003 Registration
ZESTRON to Exhibit at SMTA Guadalajara Expo
Manassas, VA – October 6, 2017 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, will feature our latest cleaning technology, HYDRON® at the SMTA Guadalajara Expo on October 18th-19th.
“We are excited to feature our latest cleaning technology at the expo,” said Sal Sparacino, Sales and Marketing Manager, ZESTRON. “Our team will be available to discuss our precision cleaning solutions as well as our automatic concentration monitoring offerings to ensure the quality of your high reliability products.”
HYDRON® is an innovative cleaning technology developed by ZESTRON. HYDRON® cleaning agents are single phase, water-based, covering a wide range of cleaning applications, such as defluxing of PCBAs, power electronics, advanced packages, and wafers. HYDRON® Technology enables the complete removal of all contaminants from various electronic and semiconductor substrate surfaces.
The SMTA Guadalajara Expo and Tech Forum will be held at the Hotel Riu Guadalajara on October 18th-19th. For more information or to register, please visit smta.org.
Kester Launches Robotic Cored Wire
Kester is proud to announce the launch of 268 Flux-Cored Wire, a zero-halogen wire optimized for robotic soldering applications. With its unique chemistry system, 268 provides consistent workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/ halide-based systems. 268 provides a clean release which prevents occurrences of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 268 results in a clear post-soldering residue without the need for cleaning.
For additional information on this product including technical and safety data sheets, please visit http://www.kester.com/products/product/268-flux-cored-wire.
For any questions or additional information, please contact: Chad Showalter, Global Product Manager at firstname.lastname@example.org.
### Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.
Kester to Exhibit at SMTA Guadalajara 2017
Kester will be exhibiting (booth #67) at the SMTA Guadalajara 2017, which will take place October 18-19 at the Hotel RIU in Guadalajara. For more information on the show, please click here, or contact Francisco Barajas at email@example.com.
Sypris Electronics Selling Surplus Assets
EMS provider Sypris Electronics will be installing a new electronics manufacturing SMT production line. As part of this process; they will be liquidating some of their surplus equipment utilizing the online auction services of Baja Bid. The bidding for this online auction will open at 8:00 am EST on September 28, 2017 and the bidding period will close promptly at 5:00 pm EST on October 12, 2017.
The items in this event include Universal SMT Pick & Place Machines & Feeders; Heller 1808 EXL Reflow Oven; Dek Horizon 01 Screen Printer; Shuttle Gate Conveyor; Benchtop AOI and more….
SAKI America's Complete 3D Inspection System Solution Featured at SMTA Guadalajara 2017Drives Industry 4.0 capabilities and opportunities
Fremont, CA - 3 October 2017 - Saki Corporation, an innovator in the field of automated optical and x-ray inspection equipment, will be presenting a complete 3D automated inspection system solution at SMTA Guadalajara 2017, being held October 18 and 19, at RIU Guadalajara, Chapalita, Guadalajara Mexico.
"Electronics manufacturing in Mexico is a major area of growth for 3D inspection equipment and the Smart Factory," said Satoshi Otake, general manager of SAKI America. "To maintain quality, reliability, and high-volume production, the Smart Factory/Industry 4.0 is going to prevail. Automated inspection equipment will use innovative technology to collect sensor information from other equipment along the assembly line, analyze this massive amount of data, and give real-time feedback, optimizing production, not just in one factory, but in manufacturing plants connected globally. Saki has been the leading inspection equipment manufacturer in these developments. We invite you to meet with our representatives at SMTA Guadalajara to find out how Saki's 3D SPI, AOI, and AXI systems can improve your end results."
For more information contact Saki at +1.510.623.SAKI (7254), email firstname.lastname@example.org, or visit our website at www.sakiglobal.com.
IDENTCO Opens Second Facility in MexicoRegional Operations Center in Juarez expands company's reach, improves customer service
INGLESIDE, Ill. (September 21, 2017) – To better serve customers in one of Mexico’s fastest growing industrial areas, IDENTCO has opened a Regional Operations Center (ROC) in Juarez.
The ROC is an integral part of IDENTCO’s global strategy and will support growing customer demand. Services provided in Juarez include warehousing, logistics, Thermal Transfer print services and technical assistance.
"I am extremely pleased to announce the opening of our latest Regional Operations Center in Juarez, Mexico. This new location is of strategic importance to IDENTCO and will enable us to provide extremely high levels of service and technical assistance to our customer base in Juarez," said IDENTCO Chief Operating Office Victor Holbein.
IDENTCO has been operating in Mexico since 1999. In 2015 the company opened a new m manufacturing facility in Monterrey with state-of-the-art printing and converting equipment, warehousing and distribution.
Headquartered outside Chicago, IDENTCO has been delivering technology-driven, high-performance labeling solutions since 1986. We challenge ourselves to develop innovative solutions that can withstand any number of extremes and meet the strictest performance standards. With ISO-certified manufacturing facilities in the U.S., Mexico and Germany, we have a global presence and local expertise. For more information, visit www.identco.com.
Online SMT Auction (September 20th and 21st) Featuring Items From TX Solutions
SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste at SMTAI
ASC International to Highlight 3D AOI/SPI Innovations at SMTA International
MEDINA, MINNESOTA - September 2017 - ASC International, a leading global manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will exhibit at the SMTA International Expo, Booth 1412, on September 19-20, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.
ASC International will provide live demonstrations of their industry leading SPI and AOI solutions. Product innovations will be highlighted by the LineMaster Fusion offering the industry’s only true 3D offline SPI /AOI combination package - all wrapped up into a price point similar to single technology platforms. The VisionPro HSi with recent sensor advancements now capable of high speed, 100% inspection coverage and the VisionPro M500 offering the industry’s standard for an affordable approach to cutting edge true 3D bench top SPI.
"We are very excited to once again be part of the SMTA International Expo," stated Steve Arneson, National Business Manager. "ASC continues to advance our mainline products and the recent release of our LineMaster Fusion is a testament to our relentless commitment of offering our customers the most affordable inspection solutions possible."
The VisionPro and LineMaster series of inspection systems incorporate the most advanced, rapid 3D/2D sensor technologies coupled with a feature-rich, intuitive graphical user interface all packaged in a rugged, bench-top or stand alone platform.
For more information about ASC International, visit www.ascinternational.com
SHENMAO Introduces New Solder Paste at SMTAI
SHENMAO Technology, Inc. introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.
SHENMAO PF606-P140 improves ICT testability with flux completely removed from top of solder to prevent contamination of Test Pins during Test operation. Minimal Flux Residue gathers near outside of Solder Joint on the PCB Substrate, a substantial improvement over legacy solder Paste.
For more than 44 years, SHENMAO has been dedicated to produce Solder Products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
SHENMAO Solder Materials are available at affordable cost from 10 worldwide locations.
For more information, please contact:
SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: email@example.com
Naveen Ravindran, ZESTRON Americas, to Present at SMTAI
[Manassas, VA – September 7, 2017] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer will present “PCB Surface Finishes and the Cleaning Process - A Compatibility Study” at SMTA International 2017, in Rosemont, IL.
Depending on the cleaning process employed, it is possible for stains to appear on the plating or in the worst case, for the plating to be completely stripped from the PCB rendering the applied surface finish useless. This study was designed to investigate the effect of reflow and various cleaning agent types on surface finishes. Additionally, baseline tests were conducted on boards with all finish types without exposure to reflow or the cleaning process in order to assess the effect of the reflow process.
Vision Engineering Launches FREE Electronics Academy Webinar Series to help identity and rectify PCB
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.
The series begins on June 16th with Solder Joint Inspection & Process Defects. During this webinar participants will learn how to minimize inspection and process defects, identify common joint failures, causes, cures and corrective actions. Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). On June 29th Counterfeit Component Inspection & Detection will be broadcasted. Production, quality and purchasing teams will learn how to inspect conventional and surface mount devices to identify counterfeit component and avoid expensive consequences. In this webinar Bob will illustrate the most common issues faced by these teams, how to test parts and demonstrate the importance of photographic documentation to provide reference standards for the future.
The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers. For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar