Practical Guidelines in Handling Moisture Sensitivity of SMT PackagesPresenter: Mumtaz Bora
Date Published: 6/25/2019
About the Presenter
Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX. She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation. She has worked with suppliers and subcontractors in several parts of Asia. She is currently a Sr. Staff Packaging Engineer at pSemi for qualification of RFIC packages for wireless, broadband and Automotive applications. She is a member of IPC standardization committees and contributes to the standards development. She has 16 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently on the Board for the IMAPS San Diego Chapter and Vice President of Communications at SMTA San Diego chapter.
MSD, moisture sensitivity, J-STD-020, J-STD-033, J-STD-075
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