Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment
Presenter: Dr. Ansuman Das Company: MacDermid Alpha Electronics Solutions Date Published: 4/17/2019
Description: Although most of the PCB assemblies manufactured today involve no-clean process – many of the applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements or due to the requirement from a downstream process. With the quantum of changes the electronics world has gone through in the past two decades, cleanability requirements for the PCB assembly have also changed to keep up with new requirements. Change in design, materials and manufacturing processes involved in assembling has also made the cleaning process more and more complex. In this presentation we will discuss the challenges faced by today's industry in terms of post soldering flux cleaning from the assembly and how to address such challenges with available methods. Discussion will explain the chemistry involved in cleaning different types of fluxes in different cleaning processes. It will also cover some of the methods to evaluate the cleanliness of the PCB assembly.
About the Presenter
Ansuman Das, Ph.D., is currently a formulation scientist and technology leader for MacDermid Alpha Electronics Solutions at the India Research Centre, Bangalore. He received his Ph.D. in Chemistry from University of Calcutta, India. Dr. Das has more than 14 years of experience in development of soldering fluxes and solder paste for board, substrate and wafer level applications.