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Jump Start - An Introduction to SMT Process Basics and Troubleshooting

Presenter: Chrys Shea, Tom Foley, Fred Dimock
Company: Shea Engineering, ASM, BTU
Date Published: 10/14/2018

Description: The objective of this course is to deliver a basic understanding of SMT fundamentals to technical professionals new to the industry.

What You Will Learn:

  • Process Basics
  • Troubleshooting Methods
  • SMT Survival Skills

    For Three Core SMT Processes:

  • Stencil Printing
  • Placement
  • Reflow

    By Well-Known Experts:
    Printing: Chrys Shea, Shea Engineering Services
    Placement: Tom Foley, ASM Assembly Systems
    Reflow: Fred Dimock, BTU International

    Who Should Attend:
    Engineers, technicians, quality personnel who want to:

  • Learn more about SMT assembly
  • Get more uptime on their assembly lines
  • Improve yields on their assembly lines
  • Reinforce the basics before attending more advanced programs at the conference

    Topics Covered
    SOLDER PASTE PRINTING – Chrys Shea, Shea Engineering Services
    1. Solder Paste Behavior
       1.1. Properties & characteristics
       1.2. Behaviors during the printing process
       1.3. Printability differences between no-clean and water wash, tin-lead and lead-free
    2. Mechanics of the Printing Process
       2.1. Alignment and gasketing
       2.2. PCB support
       2.3. Squeegee or direct print head motion
       2.4. Paste setup & release
       2.5. Area ratios and transfer efficiencies
    3. Troubleshooting Process Problems
       3.1. 5-minute system check
       3.2. Typical defects and likely root causes to investigate

    COMPONENT PLACEMENT – Tom Foley, ASM Assembly Systems
    4. Placement Machine Fundamentals
       4.1. Component Supply
       4.2. Placement Head & Vision System
       4.3. Nozzles & Grippers
    5. Placement Machine Software Fundamentals
       5.1. Placement Program Optimization
       5.2. Line Changeover Software
       5.3. Line Productivity Software
    6. Drivers for High Quality Placement

    SOLDER REFLOW – Fred Dimock, BTU
    7. Purpose of Solder Reflow
       7.1. Oven recipe
       7.2. Profiles
       7.3. Process Windows
    8. Material Properties
       8.1. Solder
          8.1.1. Eutectic
          8.1.2. Non -eutectic
       8.2. Flux with a Purpose
    9. Profile shapes
       9.1. Heating Rate
       9.2. Soak
       9.3. Spike
       9.4. Cooling Rate
    10. Obtaining Profiles

    In-Person Moderator: Keith Favre, FHP Reps

  • Key Words: 

    solder paste printing, component placement, reflow soldering

      Members: $0.00 (Log on to receive the member rate)
      Non-Members: $0.00

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