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Role of Bi in Lead-free Electronics - All You Need to Know

Presenter: Dr. Jennie S. Hwang
Company: H-Technologies Group
Date Published: 3/14/2018

Description: Dr. Jennie S. Hwang

Bismuth (Bi), which is introduced either through the supply chain or by design, is becoming an inevitable element in lead-free electronic products. With the deliberation of all relevant parameters, theoretical and practical, Bi plays a “potent” role in electronic solder systems, which impact the performance and reliability of electronic package and assembly including solder joint performance, tin whisker mitigation, among others. The proper use of Bi can profoundly benefit the performance and reliability, and the improper use could degrade the performance and reliability. An adequate understanding of the property parameters of Bi is critical to product reliability. This webtorial will discuss the relevant aspects of Bi to help dispel misconceptions and to demonstrate performance criteria related to Bi. The webtorial will also highlight the distinction between Sn-based-Bi-containing alloys and Bi-based alloys. The goal is to help achieve the desired level of performance and product reliability. Your questions and issues for solutions and discussions are welcome.

Main Topics for Part 1:

  • Your issues & concerns related to Bi
  • Bi - characteristics, resources, safety data
  • Bi effects in 63Sn37Pb solder joint
         Physical properties
         Mechanical behavior
  • Effects of Bi from component coating and PCB surface finish
         Dissolving into solder joint
         Estimation of concentration of Bi in solder joint
         Effect of compositional change
  • Bi effects in SAC solder joint (SnAgCuBi)
         Compositional change
         Stress vs. strain
         Fatigue behavior
  • Bi effects in other Pb-free alloys (SnCu, SnAg, SnAgIn)
         Stress vs. strain
         Fatigue performance

 

Main Topics for Part 2:

  • Historically established Bi-containing electronic solder alloys
         Pb-containing
         Pb-free
  • Bi-containing Pb-free solder alloys
         Melting temperature range
         Compositional control level
         Physical, mechanical properties
         BGA thermal fatigue performance
  • Distincion between Sn-based-Bi-containing alloys and Bi-based alloys
  • Case study - PCB through-hole fillet-lifting vs. Bi
         Causes
         Solutions
  • Low temperature BiPbSn phase
         Presence or absence
         Thermograms
         Detectable or non-detectable effects
         General guidelines
  • Design limit in Pb-free solder joints vs. solder joint reliability
  • Concluding points

 

Who Should Attend:
The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.

 

About the Instructor
Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.



Pricing:
  Members: $200.00 (Log on to receive the member rate)
  Non-Members: $295.00



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