Status of the Proliferation of Lead-Free Alloys: 2010Presenter: Ronald Lasky, Ph.D., P.E.
Company: Indium Corporation
Date Published: 3/4/2010
In addition to research relating to SAC305 and SAC105, much investigation has been performed on the effects of small quantities (<0.1%) of alloying metals on lead-free alloys' process ability and reliability performance. These "dopants" can dramatically affect an alloy's performance.
All of the above work has resulted in what many are calling lead-free alloy proliferation as more and more alloys are being considered for implementation. This proliferation drives up solder paste cost as paste manufacturers cannot achieve economies of scale. In addition, with so many alloys to consider, it is difficult for researchers to develop extensive data bases of process and reliability performance. These new alloys and the introduction of new and miniaturized components, have also resulted in new failure modes such as "graping," and the "head-in-pillow" defect.
This webinar is an overview of this lead-free alloy proliferation, a discussion of these new failure modes and how to minimize them and an outlook on how alloy convergence might occur.
Lead-Free, Pb-Free, RoHS, alloys, graping, head-in-pillow, SAC305, SAC105
Members: $0.00 (Log on to receive the member rate)