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PCB Depaneling with Lasers: A Comparison of Laser to Traditional Depaneling Methods

Presenter: Josh Brown
Company: LPKF Laser & Electronics
Date Published: 2/9/2012

Description: Depaneling of modern circuit boards can be a difficult task. Smaller, more complex PCBs are creating a demand for more sophisticated depaneling solutions. This webinar will walk you through the advantages and disadvantages of laser depaneling in comparison to more traditional methods of depaneling such as routing, die cutting and dicing saws. By the end of the webinar you will have a better understanding of laser depaneling and if it is a viable solution for your needs.

What you will learn:
A full comparison of depaneling methods
Smaller boards, less stress and more precision
Cost reduction: an unveiling of the costs involved in all methods
Versatility: is your depaneling technology giving you an edge?

Who would benefit from viewing this webinar?
PCB Engineers/Designers
Manufacturing and Production Engineers
Production Managers

Key Words: 

Laser Depaneling, UV, O2

  Members: $0.00 (Log on to receive the member rate)
  Non-Members: $75.00

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