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Practical Guidelines in Handling Moisture Sensitivity of SMT Packages

Presenter: Mumtaz Bora
Company: Peregrine Semiconductor
Date Published: 9/13/2016

Seika Machinery, Inc.

Description: Handling of moisture sensitive packages is an ongoing learning process in volume manufacturing. Improperly handled and stored MSDs can impact yields and reliability. The presentation will cover a review of the industry standards for MSDs (J-STD-020, J-STD 033 and J-STD 075) and their applications in moisture control. PWBs used for assembly also require controlled storage and handling. Board surface finishes, storage and baking guidelines will be reviewed per the IPC 1601 standard. Handling of MSDs from receipt to use at reflow will be reviewed, including practical guidelines in labeling, tracking, packing, storage and supplier audits.

About the Presenter:
Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX. She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation. She has worked with suppliers and subcontractors in several parts of Asia. She is currently a Sr. Staff Packaging Engineer at Peregrine Semiconductor for qualification of RFIC packages for wireless, broadband Automotive and Hi-Rel/Space applications. She is a member of IPC standardization committees and contributes to the standards development. She has 16 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently President of the IMAPS San Diego Chapter and Vice President of SMTA San Diego chapter.

Key Words: 

MSD,MSL,moisture,SMT packages,electronics

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