PCB Surface Finishing Overview How Process Parameters Effect Functional Performance
Presenter: Lenora Toscano Company: MacDermid Enthone Date Published: 4/20/2016
Description: The performance expectations of printed circuit board surface finishes are greater than just solderability preservation. Historically, they were designed solely to protect copper from oxidation prior to the soldering of components. This included any storage and transportation from board manufacture to the assembly facility. Now the expectations are much greater; superior solderability, contact performance, wire bondability, corrosion resistance, extended life in aggressive environments and all this must be achieved at a low cost. As the last step in the manufacture of printed circuit boards, all process steps leading to the surface finish must be taken into consideration. The quality of the product entering the surface finish line will affect the resultant performance. It is important to follow operating guidelines to ensure a wide operating window. This Tutorial will detail the surface finishes on the market and the pros and cons associated with them from a fabrication perspective. It will review process cycles and suggest areas from improvement. The session will focus on process parameters within the surface finish line to help promote a wide operating window and achieve desired performance.
This will not only benefit the line engineer but also supplier quality managers and the designers putting various finishes into their specifications. It will also give end users a better understanding of the challenges associated with each surface finish which may help with selection for specific technologies.