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Solder Joint Voids: All You Should Know

Presenter: Jennie S. Hwang, Ph.D.
Company: H-Technologies Group
Date Published: 1/27/2016

Description: Four fronts in the industry have rekindled the interest and concerns about solder joint voids - the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics containing "smaller" solder joints; and the increased demand in solder joint reliability for high reliability products. Different types of solder joint voids, their causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance will be outlined. The webtorial will conclude with the steps to minimize solder joint voids of both the BGA (array solder ball) solder joints and lead-frame solder joints.

Main topics:

Part 1

  • Potential effects
  • Likely impact on Reliability
  • Case studies
  • Different Sources
  • Factors contributing to each of the sources
  • Role of solder alloy composition

    Part 2

  • Mitigating approaches
  • BGA voiding - additional factors
  • BTC solder joint voids
  • Voids criteria vs. applications
  • Inspection
  • Summary & recommendations

    Who should Attend:
    The webtorial provides the working knowledge to all who are concerned about the reliability or interested in understanding the solder joint properties in relation to voids including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

    About the Speaker:
    Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge to this webtorial through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications. She has 450+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker at innumerable international and national events. Dr. Hwang has received many honors and awards. She has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory, and on the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army Science and Technology. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.

  • Key Words: 

    solder joints, reliability, voids, BTC, BGA

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      Non-Members: $300.00

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