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Key Technical Challenges and Process Improvements for an Electronics Manufacturing Provider

Presenter: Bob Farrell
Company: Benchmark Electronics, Inc.
Date Published: 1/21/2016

Description: This webinar summarizes key technical challenges and process improvements for an Electronics Manufacturing Service (EMS) provider. The topics encompass SnPb assembly, hybrid assembly (Pb-free Ball Grid Array on a SnPb assembly), and Pb-free assembly for IPC Class 2 and 3 assemblies using no clean and water soluble chemistries. Assemblies include large, thick, heavy boards that are thermally disparate.

About the speaker: Bob Farrell has a Bachelors of Science in Mechanical Engineering from Union College, a Masters of Science in Mechanical Engineering from Worcester Polytechnic Institute, and a graduate nanotechnology certificate from the University of Massachusetts Lowell. He is an advanced development engineer and has been on the Benchmark Electronics corporate Pb-free team from 2003 to the present and has provided on site support to a number of Benchmark manufacturing facilities as they converted to Pb-free manufacturing. Bob has been an active member of the New England Lead Free Electronics consortium from 2004 until the present and has worked closely with the Center for Advanced Life Cycle Engineering (CALCE) based at the University of Maryland on a number of projects including PoP's, alternative Pb-free alloys, and a nanotechnology based printed circuit board finish. He has extensive experience developing SnPb and Pb-free rework processes for through hole and BGA components. Bob is a co-author of Chapter 6 of the book "Green Electronics Design and Manufacturing" by Dr Sammy Shina and he has made a number of technical presentations at IPC, IMAPS, SMTA, and CALCE conferences.

Key Words: 

EMS, Electronics Manufacturing, SnPb assembly, hybrid assembly, challenges

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  Non-Members: $75.00

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