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Material Properties and How They Affect Electronic Devices

Presenter: Neil Poole, Ph.D.
Company: Henkel Electronic Materials LLC
Date Published: 10/6/2015

Description: Adhesives, polymers, and soldering materials play an important role in manufacturing electronic devices. When looking at a technical data sheet for these materials it is important to understand how the properties defined on these data sheets affect the performance and reliability of the final end product. Furthermore, understanding how these properties are measured and what can and should be compared between data sheets. We will also look at how the process conditions play a role in these properties. We will discuss properties such as glass transition temperature (Tg), coefficient of thermal expansion (CTE), modulus, decomposition temperature (Td) and other material terms often used in technical data sheets. Attendees are encouraged to bring example technical data sheets and/or questions for discussion.

We will then apply what had been discussed to look at one specific type of adhesives used in surface mount technology - Methods and Selection of underfill and encapsulant materials. We will discuss the differences between underfilling, potting, conformal coating, and encapsulation the advantages and disadvantages of each approach and the relation of performance to material properties for each.


  • Polymer Chemistry Basics
  • Rheology – Study of Flow
  • Physical Properties of Cured Adhesives
  • Glass Transition Temperature (Tg)
  • Coefficient of Thermal Expansion (CTE)
  • Modulus
  • Decomposition Temperature (Td)
  • Ionic Content
  • Conductivity
  • Thermal
  • Electrical
  • Adhesion
  • Adhesion Mechanisms
  • Measuring Adhesion
  • Curing
  • Heat
  • Light
  • Other
  • Physical Properties and Performance – a study

    Who Is This For:
    Engineers who use and specify adhesives and material in electronic applications. Anyone who uses material supplier technical data sheets to make decisions on material selection.

    After this training course attendees will have a better understanding of how these material properties affect reliability performance, the relationship between process and properties and understand what properties can be compared between data sheets.

  • Key Words: 

    electronics, materials, glass transition temperature, coefficient of thermal expansion

      Members: $200.00 (Log on to receive the member rate)
      Non-Members: $300.00

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