Presenter: Dr. Chris Hunt and Bob Willis Company: National Physical Laboratory (UK) Date Published: 9/10/2014
Description: There is an increase in the demand for high temperature interconnect solutions with recent introductions of high power semiconductors. Application areas for these new devices include the electric vehicle and renewable energy. Characterization of electronic interconnect properties operating at temperatures above 200ºC, has not been undertaken in great detail. These new materials form different interconnection joints, dimensionally, structurally, and with different bond strengths. Understanding the degradation mechanism for these material solutions is in its infancy.
We will also outline some of the existing interconnection methods and materials used for organic printed circuit substrates for high temperature operation up to 200ºC. Although there are many applications and companies running these processes there is very little literature in the public domain on PCB assembly.