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Tin Whiskers: All You Should Know

Presenter: Jennie Hwang, Ph.D.
Company: H-Technologies Group
Date Published: 3/11/2014

Description: For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The course provides a holistic coverage on tin whisker from both physical/phenomenal occurrence and fundamental scientific perspectives. The course also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed.

What will you learn:
Part 1:

  • Definition & clarification
  • Physical phenomena
  • Reference point
  • Causes and factors
  • Concerns & impact
  • Reliability

    Part 2:

  • Test conditions
  • Mitigation remedies
  • Relative effectiveness
  • Plausible mechanism
  • Tin whisker vs. tin pest
  • Summary

    Who Should View:
    The webinar provides a working knowledge to all who are involved with or interested in tin whisker and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

    Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as in lead-free electronics, brings to the webinar her 30+ years experience in hands-on production and as an advisor to OEMs, EMS and U.S. government. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. She has received numerous honors/awards including the U.S. Congressional certificate of recognition, induction into WITI International Hall of Fame, named "R&D Star-to-Watch" by Industry Week, YWCA Women of Achievement Award; election to the National Academy of Engineering. She is the author of 400+ publications and several ground-breaking books on solder, SMT manufacturing and lead-free technology and implementations and an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University's Board of Trustees.

  • Key Words: 

    Tin Whiskers,mitigation,causes,

      Members: $200.00 (Log on to receive the member rate)
      Non-Members: $300.00

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