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Cleaning a No-Clean Flux and Related Reliability Issues

Presenter: Eric Camden
Company: Foresite
Date Published: 8/13/2013

Description: There is a well known problem in the electronics industry with no-clean flux residues and the after effects it can have on reliability. If the fluxes are not fully complexed after reflow or completely removed after the wash process, there are a number of failure mechanisms attributed directly to the flux. There is a tendency for the no-clean flux to become entrapped under low standoff parts and parts with very tight spacing such as BGAs, QFNs, and other similar type components.

Potential issues include, partially activated flux residues; localized cleaning that has created a trapped surface residue and other unseen issues. We will also look at the types of failure modes directly related to improperly processed flux residues. Proven cleaning methods for no-clean flux will also be discussed with a focus on both cleaning at time of original manufacturing as well as recovery cleaning for hardware that was improperly processed during the original build.

Who Should Attend: Directors of quality, program managers, really anyone that has a desire to produce PCBA's with as little process residue as possible.

About The Presenter: Eric Camden is a Lead Investigator at Foresite, Inc., an analytical testing and consulting laboratory. Over the past 13+ years, Eric has worked with many large OEMs and contract manufacturing companies optimizing their manufacturing processes and assisting with the identification of electronic hardware failures utilizing various analytical techniques. He is active in industry-related organizations and speaks regularly at many industry conferences around the world. He is also a J-STD-001 and IPC-A-610 certified instructor trainer as well as IPC-A600 certified specialist.

Key Words: 

no-clean, flux, reliability, residues

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