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Failure Analysis: Lessons Learned in Manufacturing

Presenter: Martin Anselm, Ph.D.
Company: Universal Instruments Corp.
Date Published: 7/19/2012

Description: Overview:
Universal Instruments Corp's Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP, 01005 defects, and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.

Topics Covered:
  • What are the major difficulties in lead-free reliability testing
  • Mixed alloy assembly best practices
  • PCB plating considerations
  • Analytical testing techniques and what they can identify root causes for production failures.
  • Lead-free laminate selection and testing procedures: Can your board withstand 9x reflow?
  • Learned lessons from actual failure analysis case studies

    Please bring specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. In my experience many problems can be solved with a brief discussion of the issues.

    Instructor Bio:
    Since 2002 Martin has been working in electronics Failure Analysis and currently oversees all the failure analysis projects for the Universal Instruments Corporation's Advanced Process Lab (APL). Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.

  • Key Words: 

    Failure Analysis

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