Lead-Free Soldering Technology SymposiumPresenter: SMTA International
Date Published: 10/18/2012
As Pb-free solders continue to gain use in electronic products, there is an increased awareness of the need to introduce Pb-free technologies – solder alloys, processes, and interconnection reliability – that are an optimum fit to the specific needs of an application, rather than implementing a "one-size-fits-all" solution. In particular, the growth of alternative Pb-free solders is the one such technology that is responding to application-specific requirements.
What You Get: For the same price as attending the live event, you get the MP4 video recording of all four sessions (each about one hour and a half long.) Downloads will take a long time due to the large file size of each video (up to 900mb.)
Session LF1 - iNEMI Pb-Free Alloy Characterization Project Report: Thermal Fatigue Performance
(1 hour and 38 minutes, 869mb)
An extensive investigation was recently concluded by the iNEMI consortium, which examined the reliability of several new Pb-free solders. The results of that multi-facet study were presented in 4 parts by Elizabeth Benedetto, Richard Parker, Keith Sweatman, and Richard Coyle, Ph.D., respectively.
Sessions LF2&3 - PERM Consortium Workshop: Dependable Electronics with Lead-Free Components/Systems
(LF2: 1 hour and 25 minutes, 834mb; LF3: 1 hour and 18 minutes, 733mb)
The symposium will then turn towards the results of the Pb-free Electronics Risk Management (PERM) consortium efforts. This group is addressing the impact of Pb-free solutions on high-reliability electronics that are built for military, space, and avionic applications. Issues range from tin whisker mitigation and supply chain management (including counterfeit parts) to rework/repair activities that are crucial to long-term sustainment of fielded systems. This report on the PERM efforts will provide a unique opportunity to understand Pb-free technology from the viewpoint of this market sector.
Session LF4 - Lead-Free Solder Joint Reliability: Meet the Experts - Assemblies in Aerospace and High Performance Electronic Systems
(1 hour and 25 minutes, 694mb)
The final segment of the symposium is comprised of four papers that address important aspects of predicting Pb-free interconnection reliability. This session begins with an in-depth discussion of empirical techniques and data analysis. The discussion will then turn towards the growing interest in assessing solder joint reliability under combined thermal and vibration environments. The symposium will be brought to a close with a fascinating paper that looks at the effects of processing and thermal aging on the long-term performance of area-array interconnections.
Lead-Free, pb-free, electronics, iNEMI consortium, PERM Consortium, Risk-Management
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