Package On Package (PoP) Design and AssemblyPresenter: Bob Willis
Date Published: 9/11/2012
PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.
Package on Package, PoP, stacked, x-ray, underfill
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