A Study of Surface Finishes for IC Substrates and Wire Bond Applications
Presenter: Lenora Toscano Company: MacDermid Date Published: 5/17/2012
Description: The combination of performance enhancements and increased precious metal costs within the electronics industry have left fabricators and OEMs questioning what the best surface finish is for cost-effective, high reliability applications. Currently, the IC substrate market relies heavily on electroless nickel/electroless palladium/immersion gold as a solderable and superior wire bondable finish. The use of this finish has allowed manufactures to avoid reliability concerns associated with electroless nickel/immersion gold. Yet, with the increased prices of gold and palladium it needs to be determined if the industry can sustain these high metal prices. In the mid 1990's electroless nickel/electroless palladium/immersion gold was used as a surface finish for printed circuit boards. The price of palladium soared to an all time high and the market turned to alternate surface finishes. In today's market, specifically over the last year, we have watched the price of gold increase 1.3x and the price of palladium double. In this webinar Lenora will present the use of lower cost, alternate surface finishes for IC substrate applications.
What you will learn: Experimentation will center on wire bond capabilities and solderability. She will also discuss simpler process cycles and costs associated with these new finishes. These alternate finishes will be compared against the conventional electroless nickel/electroless palladium/immersion gold.
Who should see this: This webinar will benefit fabricators and OEMs who are looking for cost reductions to ENIG projects. Also those who want to pursue new alternatives to ENEPIG. Discussion is applicable to process engineers, assemblers, quality control, technical and commodity managers.
Surface Finish, Silver, Nickel, IC substrate applications, Wire bond, solderability