Process Controls in Classifying, Handling, Storing and Baking Devices and PWBsPresenter: Steven Martell and Mumtaz Bora
Company: Sonoscan and Peregrine Semiconductors
Date Published: 8/26/2009
Description: The handling, transportation, storage and packaging of Devices and PWBs has become critical as the industry has migrated to higher temperature lead free assembly processes. Devices have expanded beyond the traditional SMD ICs and now includes any non-IC device that will likely be subjected to the higher temperature lead free (Pb-free) soldering, such as capacitors, LEDs, etc. Additionally, the advent of alternative surface finishes such as Immersion tin, Immersion silver, Organic solderability preservative(OSP), Hot Air Solder Leveling (HASL), Electroless Nickel/Immersion Gold (ENIG) has added complexity in packaging, handling and storage of PWBs and assure good solderability during assembly. It has been a challenge to come up with an industry standard for handling moisture sensitivity in PWBs due to the variety of laminate materials, PWB thicknesses and environmental conditions for storage. This presentation will give an overview of process controls in handling, storage and baking of Devices and PWBs, conducting supplier audits and some of the ongoing efforts in developing industry guidelines for Device and PWB handling and storage.
MSD, process control, supplier audit, handling, storage
Members: $0.00 (Log on to receive the member rate)