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Cleaning, Coating and Functional Climatic Reliability

Presenter: Ravi Parthasarathy, M.S.Chem.Eng.
Company: ZESTRON Corporation
Date Published: 6/9/2009

Description: The ever-increasing use of high frequency in high density interconnect (HDI) assemblies, combined with the worldwide move towards lead-free manufacturing, has initiated a closer assessment of effective flux removal processes. As exact environmental conditions can't always be predicted, system signal integrity maybe vulnerable to failure through induced capacitive effects of hygroscopic activator residues. Furthermore, such contamination is no longer detectable by ion-equivalent measurements alone.

Most failures of electronic components in humid environment are caused by electrochemical migration and corrosion induced leakage currents. In this presentation, the origins and effects of such failure mechanisms are examined. In addition, we are also discussing the influence of alloy types with particular reference to lead-free formulations. The critical importance of contamination free surfaces in high frequency circuits is outlined and put into context with the quality of conformal coating.

Finally, we will describe different methods to determine climatic reliability as well as introduce a new and innovative test method.

Key Words: 

cleaning, coating, climatic reliability, HDI, flux removal

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