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Low Temperature Solder: Enabling the Future

Presenter: Kevin Byrd
Company: Intel Corporation
Date Published: 5/19/2020

Description: Co-organized by iNEMI

As trends in consumer electronics continue to drive thinner and lighter designs, managing SMT yields and product reliability when using SAC reflow is increasingly challenging.  Recent solder paste development activities have been targeted at addressing the historical reliability challenges of Tin-Bismuth based low temperature solder (LTS) materials.  These updated materials are showing great promise in meeting product requirements while enabling significant reductions in reflow peak temperature.  This topic will review the status of Sn-Bi solders, requirements for effective conversion from SAC to LTS, and suggest areas that would benefit from additional industry research efforts.

About the Presenter:
Kevin Byrd is the Low Temperature Solder Program Manager for Intel Corporation.  He holds a BS in Materials Science from the Massachusetts Institute of Technology and an MS in Innovation Management from the University of Sussex, UK.  Kevin joined Intel in 1988 and as a fab process engineer and has been working on small form factor SMT path finding since 2005.



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