International Conference on Soldering & Reliability 2013 Proceedings

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Process Control And Reliability Of Reworked Bga Solder Joint Adrian Hirceaga and Ishrat Hasan  Abstract
Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 1 – AXI Capability for HoP Detection Alex Chan, Paul Brown, Lars Bruno, Anne-Kathrine Knoph, Thilo Sack, David Geiger, David Mendez, Mulugeta Abtew, Iulia Muntele, and Michael Meilunas  Abstract
Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 2 – Warpage Acceptance Proposal Alex Chan, Paul Brown, Richard Coyle, Lars Bruno, Anne-Kathrine Knoph, Thilo Sack, David Geiger, David Mendez, Ron Kulterman, Mulugeta Abtew, Iulia Muntele, and Kirk VanDreel  Abstract
Fracture Of Lead-Free Solder Joints As A Function Of Strain Rate, Local End Geometry And Thickness Amir Nourani and Jan K. Spelt  Abstract
Generalizations About Component Flatness At Elevated Temperature Bev Christian, Linda Galvis, Rick Shelley and Matthew Anthony  Abstract
Material Selection And Parameter Optimization For Reliable Tmv Pop Assembly Brian Roggeman, David Vicari, Lee Smith, and Ahmer Syed  Abstract
Reliability Challenges For Bottom Termination Components Brook Sandy-Smith  Abstract
Less Is More – Vapor Phase – Quality Improvement Under Oxidation Free Soldering Conditions Claus Zabel  Abstract
Void-Free Soldering With A New Vapor-Phase With Vacuum Technology Claus Zabel and JB Byers  Abstract
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump Dohyun Jung, Myung Hoon Roh, Jun Hyeong Lee, Soonjae Lee, and Jae Pil Jung  Abstract
Development Of A Suitable Flux Medium For Cleanable And No-Clean Solder Pastes Based On Tin-Bismuth-Silver Alloy Emmanuelle Guéné and Céline Puechagut  Abstract
Microstructure And Reliability Of Low Ag, Bi-Containing Solder Alloys Eva Kosiba, Simin Bagheri, Polina Snugovsky, Ph.D., Doug Perovic, Ph.D.  Abstract
The Potential of Stencil Technology - Choosing The Right Stencil Options to Maximize Yield and Earnings Harald Grumm and Dominique Graupner  Abstract
NASA DoD Phase 2: SAC305 and Sn100C Copper Dissolution Testing Jeff Kennedy, Dave Hillman, and Ross Wilcoxon  Abstract
Statistical Methods For Discriminating Between Tin-Lead And Lead-Free Solder Interconnect Failure Data In High Cycle Fatigue Applied To Multi-Factor Test Vehicle Testing Joseph M. Juarez, Ph.D., Craig Hillman, Ph.D., and Nathan Blattau, Ph.D.  Abstract
Characterization Of Hybrid Conformal Coatings Used For Mitigating Tin Whisker Growth Junghyun Cho, Stephan J. Meschter, Suraj Maganty, Dale Starkey, Mario Gomez, David G. Edwards, Abdullah Ekin, Kevin Elsken, Jason Keeping, Polina Snugovsky, and Jeff Kennedy  Abstract
Microalloyed Sn-Cu Pb-Free Solder For High Temperature Applications Keith Howell, Keith Sweatman, Motonori Miyaoka, Takatoshi Nishimura, Xuan Quy Tran, Stuart McDonald, and Kazuhiro Nogita  Abstract
Converting Cable Assembly Manufacturing To Lead Free Solder Lynda L. Anderson, Robert Mahoney Jr.  Abstract
Factors Affecting Stencil Aperture Design For Next Generation Ultra Fine Pitch Printing Mark Whitmore, Jeff Schake, and Clive Ashmore  Abstract
The Elimination Of Whiskers From Electroplated Tin Masanobu Tsujimoto, Shigeo Hashimoto, Masayuki Kiso, Raihei Ikumoto,Toshikazu Kano and Genki Kanamori  Abstract
Stencil Printing Yield Improvements Mike Bixenman, D.B.A, Debbie Carboni, Jason Chan  Abstract
Jetting Solder Paste Opens Up New Possibilities In Your SMT Production Nico Coenen  Abstract
Dielectric Material Damage Vs. Conductive Anodic Filament Formation Paul Reid M. Sc.  Abstract
SERDP Tin Whisker Testing And Modeling: High Temperature/High Humidity Conditions Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri, and Eva Kosiba  Abstract
3M Electronic Grade Conformal Coating for Moisture and Corrosion Protection of PCB and Electronic Components Weixing Hou and Bob Salvaraski  Abstract
The Study Of Corrosion Behaviour Of Cu In Some Commercial Beverages By Chemical And Electrochemical Measurement Xiaonan Wang, Bev Christian, and Mark Pritzgker  Abstract
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