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AUTHOR
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New Underfill Materials Designed for Increasing Reliability of Fine-Pitch Wafer Level Devices
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Brian J. Toleno, Ph.D., Stanley Hu, Hoseung Yoo1, and Rong Zhang, Ph.D.
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Abstract
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A Second and Third Tier Supplier Control and Management Process
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Celine YC Chong, Kenneth Scea, Donald Thomas, Allen Miller, Stephen Chong, Lenz Pan WC
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Abstract
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Conformal Coating Process for Networking and Communication Devices in Harsh Environments
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Chuan Xia & Scott Priore
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Abstract
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Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints Via MN Doping
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Dr. Ning-Cheng Lee, Dr. Weiping Liu, Ronald C.Lasky, PhD, PE, and Timothy Jensen
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Abstract
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Causes, Characterization and Mitigation of Non Wet Open Defects for Area Array Components
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Dudi Amir, Satyajit Walwadkar, Srinivasa Aravamudhan, Lilia May and Kok Kwan Tang
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Abstract
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Case Study: Development of a Low Temperature Tin-Bismuth-Silver Solder Paste
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Emmanuelle Guéné and Céline Puechagut
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Abstract
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3D Board Level X-Ray Inspection Via Limited Angle Computer Tomography
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Evstatin Krastev Ph.D., David Bernard Ph.D. & Dragos Golubovic Ph.D.
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Abstract
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Solder Voiding in Assemblies Using Via-In-Pad Ball Grid Array Design
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Gurudutt Chennagiri, Satyanarayan
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Abstract
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Sealing Dispensing Requirements To Meet MEMS Packaging and Throughput Impact
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Heakyoung Park
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Changing Paradigms in Interconnect, Packaging, and Assembly
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Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D.
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Abstract
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High Reliability High Melting Mixed Lead-Free BiAgX Solder Paste System
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HongWen Zhang and Ning-Cheng Lee
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Abstract
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Procurement Cost Impact Analysis Tool
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Jane Wu, Jason Zhang, Philip Cheng, Ryan Zheng, Ellen Xu, Celine Chong
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Abstract
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Assembly and Design Challenges for New Generation 0.4/0.4mm Pitch Package on Package (PoP) and 0.3mm Pitch Chip Scale Package (CSP)
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Jonas Sjoberg, Ranilo Aranda, David Geiger and Murad Kurwa
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Abstract
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Optimizing Solder Paste for Void Minimization With Vacuum Reflow
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Keith Sweatman, Takashi Nozu, Tetsuro Nishimura
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Abstract
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Material Set Compatibility
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Kevin Tan, Reynaldo Rio, Casey Ng
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Abstract
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Factors Affecting Stencil Aperture Design for Next Generation Ultra Fine Pitch Printing
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Mark Whitmore, Jeff Schake & Clive Ashmore
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Abstract
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Cleaning Flux Residue Under Bottom Termination Components in Batch Spray-In-Air Tools
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Mike Bixenman, Chelsea Jewell, Kevin Soucy, Jan Declercq and Jason Chan
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Abstract
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Counterfeit Components Construction Analysis Methodology
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Ng Eric Sr., Xue Feng, Curtis Grosskopf
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Abstract
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Jetting Solder Paste Opens Up New Possibilities in Your SMT Production
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Nico Coenen
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Abstract
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Heatsink Adhesive Bonding Investigation
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Smile Ling, Jim Bielick, Michk Huang, Wayne Zhang, Blue Wang, Xiaoyun Xia and Divas Liu
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Abstract
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Counterfeit Electronics Parts, Avoidance, Detection, Mitigation
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Stanley H Salot Jr
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The Effects Of Formulation On Reflow Solderability Of Water Soluble Solder Paste In Air And Nitrogen
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T. P. Li, J. Y. R. Tan, S. A. Khoo, C. D. Breach and A. Hawkins
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Abstract
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Determine Critical Cleaning Process Parameters for QFNs
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Umut Tosun, M.S. Chem. Eng., Naveen Ravindran, M.S. Chem. Eng., and Michael McCutchen, M.S. Chem.
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Abstract
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An Evaluation to QFN Thermal Pad Void and Improvement
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Wayne Zhang, PK Pu, Ranndy Shi and Wilson Zhen
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Abstract
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PCB Assembly Process Development and Characterization of 0.3mm µCSP Packages
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Wu WeiPing (Jonathan Wu), RestyFonte Familara, LM Lim, Mohd Yusuf, Hien Ly, Chrys Shea
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Abstract
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