South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings

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Solder Paste Residue Corrosivity Assessment: Bono Test Céline Puechagut, Anne-Marie Laügt, Emmanuelle Guéné, Richard Anisko  Abstract
Discussion on Cu Dissolution in Pb-Free PTH Rework Chuan Xia, May Yan, Scott Priore, and Kangeyan K.Ramachandran  Abstract
Reliability Study on the Polymer Core Solder Balls under Multiple Reflow and HTS Stress Tests Dr. Yap Boon Kar, Tan Cai Hui, Dr. Agileswari, and Calvin Lo  Abstract
A Study of Surface Finishes for IC Substrates and Wire Bond Applications Ernest Long PhD and Lenora Toscano  Abstract
Investigation of Oxidation on Electronic Connector Leads Through Multiple Heat Cycles F.Che Ani, A.S Harun, S. E Lim  Abstract
DI-Water Vs. Chemistry: Comparative Cleaning Study to Showcase The Effective Removal of OA Flux Residues Harald Wack, Ph.D., Umut Tosun, M.S., Jigar Patel, M.S., Joachim Becht, Ph.D., and Ravi Parthasarathy, M.S.  Abstract
Two Different Ways of Resolving BGA Head-In-Pillow Defects Henley Zhou, William Uy, Jumbo Huang  Abstract
Data Center Woes: Reliability Issues Plague RoHS-Compliant Electronics Henri Seng and Chris Muller  Abstract
The Influence of Solder Paste Formulation on Control and Elimination of Defects in SMT Assembly J. Z. Hussain, S. A. Khoo, J. Bondarowicz, C. D. Breach, and A. Hawkins  Abstract
Benefits of Inert Gas Soldering for Printed Circuit Board Assembly Processes Jerry Wu, Ph.D., Gregory K. Arslanian, and Emily Tan  Abstract
The Ease of Doing Business within the Malaysian E&E Sector with Emphasis on: Excess Inventory Disposition, Customs Issues, Trade Facilitation, Sourcing, Quality Assurance, Storage, Distribution, Inventory Management, Fulfillment... Jeyasingam Ratnasingam  Abstract
Entek OM, an OSP Alternative High Performance Final Finish Jim Kenny, Karl Wengenroth, John Fudala, Melanie Rischka, Dr. Yung Herng Yau  Abstract
0.3mm Pitch Chip Scale Package (CSP) Process Development and Printed Circuit Board (PCB) Design Jonas Sjoberg, Ranilo Aranda, and David Geiger  Abstract
The Status of Low-Halogen Material Usage in Supply Chain Electronic Components Juley Lissy Rajan, Curtis Grosskopf, Feng Xue, Jackie Adams  Abstract
Overcoming the Challenges of the QFN Package Karl Seelig and Kevin Pigeon  Abstract
Underfill and Flux Compatibility from a Curing Perspective Kevin Tan, Juan Sun, Pong Yew Kong, Casey Ng  Abstract
Silver Plated Copper Filler Die Attach Adhesive Characterization on LQFP Package for Automotive Device Application Khoo Ly Hoon, Nor Shafika Mashuri, Anis Aridah Abd Razak, Yap Boon Kar  Abstract
Surface Mounted Oleo-Sensor on System Boards for Early Detection of Burning or Over Heated Chips Marie S. Cole, Francisco D. Liwa, Glynn Farrow, Megan ML Tay  Abstract
A Qualification Tool for Component Package Environmental Feasibility in the Electrical and Electronic Equipment Matti Rahko  Abstract
Preventing White Residue By Controlling Upstream and Downstream Process Conditions Mike Bixenman, D.B.A., Jason Chan, and Ram Wissel  Abstract
Flux Cleaning Process for Ceramic Flip Chip Ball Grid Array (FCCBGA) Noor Azrina Talik, C.S Foong, B.K Yap, C.Y Tan  Abstract
Flip Chip Assembly Process Optimizations and Material Selections Through Validated Simulations Ron Zhang, Rajesh Katkar, Michael Huynh, and Laura Mirkarimi  Abstract
Alternate Alloys to SAC305 for Pb-Free SMT Assembly Timothy Jensen, Ronald Lasky, Ph.D., PE, Sehar Samiappan  Abstract
Material and Process Optimization for HiP Defect Elimination Timothy Jensen, Ronald Lasky, Ph.D., PE, Sehar Samiappan  Abstract
Pad Cratering Susceptibility Wong Boon San and Julie Silk  Abstract
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