1997 Emerging Technologies Proceedings
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TITLE | AUTHOR | |
PCA’S: ULTRA-THIN IS IN | Dale E. Lee | Abstract |
Reduced Oxide Soldering Activation (ROSA): Enabling Technology for Soldering of Flip Chip Assemblies | David Hillman | Abstract |
INTEGRAL PASSIVE COMPONENTS | David L. Wolf | Abstract |
CONFORMAL HIGH DENSITY INTERCONNECTS | Denis Barone | Abstract |
Application of Flip Chip in Hard Disk Drive Industry | Milton Buschbom | Abstract |
EARLY EXPERIENCES WITH ASSEMBLY OF CHIP SCALE PACKAGES | Peter Arrowsmith | Abstract |
DEMYSTIFYING PC CARDS | Richard Freiberger | Abstract |
ADVANCED CHIP SCALE PACKAGES OFFER MANUFACTURING ADVANTAGES | Ron Bauer | Abstract |
ELECTRONICS: THE ROAD AHEAD | Ronald C. Lasky | Abstract |