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1997 Emerging Technologies Proceedings
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| TITLE | AUTHOR | |
| PCA’S: ULTRA-THIN IS IN | Dale E. Lee | Abstract |
| Reduced Oxide Soldering Activation (ROSA): Enabling Technology for Soldering of Flip Chip Assemblies | David Hillman | Abstract |
| INTEGRAL PASSIVE COMPONENTS | David L. Wolf | Abstract |
| CONFORMAL HIGH DENSITY INTERCONNECTS | Denis Barone | Abstract |
| Application of Flip Chip in Hard Disk Drive Industry | Milton Buschbom | Abstract |
| EARLY EXPERIENCES WITH ASSEMBLY OF CHIP SCALE PACKAGES | Peter Arrowsmith | Abstract |
| DEMYSTIFYING PC CARDS | Richard Freiberger | Abstract |
| ADVANCED CHIP SCALE PACKAGES OFFER MANUFACTURING ADVANTAGES | Ron Bauer | Abstract |
| ELECTRONICS: THE ROAD AHEAD | Ronald C. Lasky | Abstract |