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AUTHOR
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EVALUATION OF THERMAL STRESS IN A FLIP CHIP PACKAGE BY HYBRID EXPERIMENTAL-ANALYTICAL METHOD
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A.Shirazi, H.Lu and A.Varvani-Farahani
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Abstract
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WATER JET CUTTING FOR CROSS SECTIONING AND DE-PANELLING APPLICATIONS
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Alex Kaldor, A.C. Rinella and Bev Christian
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Abstract
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HIGH QUALITY REFLOW SOLDERING WITH VAPOR PHASE THE NEW APPROACH OF VAPOR PHASE TECHNOLOGY
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Andreas Flechtmann and Andreas Thumm
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Abstract
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CONFESSIONS OF A NEOPHYTE IN TEMPERATURE PROFILING A BATCH REFLOW OVEN
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Bev Christian
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Abstract
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FINE FEATURE STENCIL PRINTING 0.3MM PITCH COMPONENTS
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Chris Anglin, et al.
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Abstract
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VAPOURPHASE VACUUM-SOLDERING: A NEW PROCESS TECHNOLOGY OPENS TREMENDOUS PRODUCTION CAPABILITIES WHEN REFLOW-SOLDERING
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Claus Zabel and Allen Duck
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Abstract
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RELIABILITY ASSESSMENT OF ALTERNATIVE LEAD-FREE ALLOYS USED DURING WAVE AND REWORK
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Craig Hamilton, et al.
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Abstract
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RELIABILITY OF SAC305 AND SN3.5AG SOLDERS UNDER HIGH TEMPERATURE THERMAL CYCLING
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Elviz George, et al.
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Abstract
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MOVING TOWARDS A STABLE PROCESS: MINIMIZING VARIATION IN SOLDER PASTE PRINTING
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George Babka
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Abstract
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NANOBOND® ASSEMBLY – A RAPID, ROOM TEMPERATURE SOLDERING PROCESS
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Greg Caswell
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Abstract
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EFFECT OF ASSEMBLY VARIATIONS ON PACKAGE ON PACKAGE RELIABILITY IN THERMAL CYCLING
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Heather McCormick, et al.
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Abstract
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GUIDELINES FOR ESTABLISHING A LEAD-FREE WAVE SOLDERING PROCESS FOR HIGH-RELIABILITY APPLICATIONS
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J. Scott Nelson
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Abstract
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ELECTROPLATE BUMPING WITHOUT PHOTORESIST AND SI DICE STACKING WITH TSV FOR 3D PACKAGING
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Jiheon Jun, Inrak Kim, Younggon Lee and Jae Pil Jung
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Abstract
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HOT AIR SOLDER LEVELLING – A SOLUTION TO LEAD-FREE SOLDERABILITY PROBLEMS
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Keith Howell and Keith Sweatman
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Abstract
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Control Of Spalling in SAC Pb-Free Solder Alloys When Used with a Ni Substrate
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L. Snugovsky, et al.
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Abstract
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ADDRESSING THE CHALLENGE OF HEAD-IN-PILLOW DEFECTS IN ELECTRONICS ASSEMBLY
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Mario Scalzo, CSMTPE
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Abstract
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LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS
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Matthew Kelly, et al.
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Abstract
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THERMAL CYCLE TESTING OF PWBS – METHODOLOGY
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Michael Freda and Paul Reid
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Abstract
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PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY
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Mukul Luthra
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Abstract
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THE USE OF SEGREGATED HYDROFLUOROETHERS AS CLEANING AGENTS IN ELECTRONICS PACKAGING APPLICATIONS
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Philip G. Clark, Erik D. Olson, and Hiromi Kofuse
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Abstract
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EFFECT OF SILVER IN COMMON LEAD-FREE ALLOYS
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Ranjit Pandher and Tom Lawlor
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Abstract
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PROBABILISTIC ASSESSMENT OF COMPONENT LEAD-TO-LEAD TIN WHISKER BRIDGING
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S. McCormack and S. Meschter
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Abstract
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SOLDER JOINT MICROSTRUCTURE AND RELIABILITY STUDY OF PLASTIC BALL GRID ARRAY (PBGA196) AND MICRO LEAD FRAME (MLF) COMPONENTS IN LEAD FREE PROCESSES
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Simin Bagheri, et al.
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Abstract
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FLUID FLOW MECHANICS - NEW ADVANCES IN LOW STANDOFF CLEANING
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Sinisa Aleksic, Ph.D., et al.
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Abstract
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PREDICTING THE STRENGTH OF SOLDER JOINTS USING COHESIVE ZONE MODELING
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Siva P. V. Nadimpalli and Jan K. Spelt
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Abstract
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SOLDERING CHALLENGES IN A HALOGEN-FREE PCB ASSEMBLY PROCESS
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Timothy Jensen, Ronald Lasky and Amanda Hartnett
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Abstract
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IMPACT OF REWORK ON RELIABILITY OF PLASTIC BALL GRID ARRAYS SUBJECTED TO MECHANICAL BEND TEST
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Vikram Srinivas, et al.
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Abstract
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RoHS2 and REACH: The Next Steps for Restricted Substances Solutions and services for Environmental Compliance
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Walter Jager
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Abstract
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CREEP FRACTURE MECHANISM OF PLATED-THROUGH-HOLE(PTH) SOLDER JOINTS BASED ON PHYSICS-OF-FAILURE(PoF)
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Won Sik Hong, et al.
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Abstract
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