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TITLE
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AUTHOR
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“WARM” MANUFACTURING
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Alan Rae, Marc Chason and Andrew Skipor
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Abstract
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JETTING ADHESIVES AND OTHER MATERIALS FOR SEMICONDUCTOR AND ELECTRONIC COMPONENT PACKAGING
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Alec J. Babiarz
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Abstract
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NEW CHALLENGES AND OPPORTUNITIES OF SYSTEM-IN-PACKAGE
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Anna Fontanelli
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Abstract
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EMBEDDING OF THINNED CHIPS IN PLASTIC SUBSTRATES
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Björn Vandecasteele, Jonathan Govaerts, and Jan Vanfleteren
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Abstract
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USING UNDERFILLS TO ENHANCE DROP TEST RELIABILITY OF Pb-FREE SOLDER JOINTS IN ADVANCED CHIP SCALE PACKAGES
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Brian Toleno, Ph.D., Dan Maslyk, and Tom White
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Abstract
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RELIABILITY ASSESSEMENT OF EMBEDDED CHIP BUILD-UP BGA PACKAGES
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Charles G. Woychik, Raymond A. Fillion, and James Aloise
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Abstract
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AN INTEGRATED APPROACH: FRAME LEVEL PACKAGING
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Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, and Jerry Tan
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Abstract
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ASSUMPTIONS ARE NOT THE ANSWER!
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Charlie Barnhart
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Abstract
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BGA SOLDER VOID CORRELATION TO VIA-IN-PAD, VIA FILL, SURFACE FINISH, AND LEAD-FREE SOLDER – FINAL REPORT
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Chrys Shea, Rahul Raut, Lou Picchione, Quyen Chu, Nicholas Tokotch, and Paul Wang
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Abstract
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CONSIDERATIONS IN SELECTING FLUXES FOR LEAD-FREE WAVE SOLDERING
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Chrys Shea, Sanju Arora, Steve Brown, and Steven Wong
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Abstract
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HAVE HIGH Cu DISSOLUTION RATES OF SAC305/405 ALLOYS FORCED A CHANGE IN THE LEAD FREE ALLOY USED DURING PTH PROCESSES?
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Craig Hamilton, Polina Snugovsky, Ph.D., and Matthew Kelly
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Abstract
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OPTIMIZATION OF WIRELESS SENSOR NETWORK LIFETIME BY MEANS OF EVOLUTIONARY ALGORITHMS
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Davide Caputo, Alessandro Gandelli, Francesco Grimaccia, Marco Mussetta, and Riccardo E. Zich
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Abstract
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LEAD FREE WAVE SOLDERING: PROCESS OPTIMIZATION FOR SIMPLE TO HIGHLY COMPLEX BOARDS
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Denis Barbini, Paul Wang, Peter Biocca, Quyen Chu, Tim Dick, Denis Jean, Stuart Longgood, Chrys Shea, Keith Sweatman, and Mike Yuen
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Abstract
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CIRCUIT BOARD AND SOLDER STENCIL DESIGN EFFECTS ON LEADLESS PACKAGING
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Dennis Lang and Chung-lin Wu, Ph.D.
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Abstract
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MANUFACTURING QUALIFICATION FOR THE LATEST GAMING DEVICE WITH Pb-FREE ASSEMBLY PROCESS
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Ding Wang Chen, Ph.D., Alex Leung, Alex Chen Raul Rodriquez, Paul P.E. Wang, Ph.D., and Michael Miller
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Abstract
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COMPARISON OF THE SOLDERABILITY PERFORMANCES OF INHIBITOR CONTAINING AND INHIBITOR-FREE IMMERSION SILVER COATINGS
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Edwin P. Lopez, Paul Vianco, Sam Lucero, and R. Wayne Buttry
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Abstract
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DOE OPTIMIZATION OF SAC 305 LEAD-FREE WAVE SOLDERING AND SPRAY FLUXER USING SELECTIVE SOLDERING PALLET
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Eric Fremd, Sunil Gopakumar, Wyeman Chen and Chu Lin
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Abstract
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HIGH-DEFINITION 2D/3D X-RAY IMAGING: THE COMPLETE STORY
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Friedhelm Maur
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Abstract
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THE GREAT SAC DEBATE: COMPARING THE RELIABILITY OF SAC305 AND SAC405 SOLDERS IN A VARIETY OF APPLICATIONS
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Heather McCormick, Polina Snugovsky, Craig Hamilton, Zohreh Bagheri, and Simin Bagheri
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Abstract
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THERMAL CYCLING RELIABILITY ASSESSMENT FOR 4 ARRAY RESISTOR OF MEMORY MODULE
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Hyo-Jae Bang
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Abstract
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STUDY OF IMPACT STRESS OF CSP SOLDER JOINTS USING HOMOGENIZATION METHOD AND FEM DROP-SIMULATION
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Ichiro Hirata and Hirofumi Nakamura
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Abstract
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ANALYSIS OF LOW-K DIELECTRIC IN FLIP CHIP DEVICES USING ACOUSTIC MICRO IMAGING
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Janet E. Semmens and Lawrence W. Kessler
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Abstract
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SOLDER-PASTE INSPECTION MACHINE - WHAT’S YOUR EXPECTATION?
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Jiang Xiaodong
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Abstract
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PACKAGE ON PACKAGE (POP) PROCESS DEVELOPMENT AND RELIABILITY EVALUATION
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Jonas Sjoberg, David A. Geiger, Todd Castello, and Dongkai Shangguan, Ph.D.
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Abstract
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A STUDY OF THE MECHANISM AND DETERMINATION OF THE ACTIVATION ENERGY FOR DIE PAD UNDER BUMP METAL RESISTANCE INCREASE ON FLIP-CHIP DIE USING SCANNING ACOUSTIC MICROSCOPY AND HIGH TEMPERATURE STORAGE
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Joseph Patterson, Hong Yang, and Damon Rachell
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Abstract
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MICRO ELECTRO MECHANICAL SYSTEMS BASED ULTRASONIC SENSORS FOR NON DESTRUCTIVE EVALUATION
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Karthik Tondapu
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Abstract
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SOLVING THE COUNTERFEIT ELECTRONICS PROBLEM
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Kaushik Chatterjee, Diganta Das, Michael Pecht, Christopher Ricci and Peter Suorsa
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Abstract
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HIGH THROUGH-PUT PRODUCTION MATERIAL SCREENING METHODS FOR ROHS COMPLIANCE
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Kenneth L. Smith, Drew Hession-Kunz, and Donald W. Sackett, Ph.D.
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Abstract
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EVALUATION OF Pb-FREE BGA SOLDER JOINT RELIABILITY ON Ni-BASED SURFACE FINISHES USING ALTERNATIVE SHEAR AND PULL METROLOGIES
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Kuldip Johal, Hugh Roberts, Thomas Beck, Sven Lamprecht, Hans-Juergen Schreier, and Christian Sebald
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Abstract
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WAFER LEVEL PACKAGE USING PRE-APPLIED ANISOTROPIC CONDUCTIVE FILMS (ACFS) FOR FLIP-CHIP ASSEMBLY
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Kyung-Wook Paik, Ho-Young Son, and Chang-Kyu Chung
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Abstract
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STUDY OF BGA SOLDER JOINTS INTERFACIAL FAILURE MECHANISM RELATED TO WAVE SOLDERING
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Liu Sang, Tu Yunhua, Chen Limin, Xu Yunxia, Yuan Wang, Ye Yuming, and Luo Chaoyun
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Abstract
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EFFECTS OF PROCESS PARAMETERS ON THE MATERIAL CHARACTERISTICS OF DIE ATTACH ADHESIVES
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Mark T. McMeen and Casey H. Cooper
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Abstract
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65nm FCBGA RELIABILITY FOR NEXT GENERATION GAMING DEVICE PHASE I-A METHODOLOGY FOR STREAMLINE PRODUCT DESIGN CYCLE AND 2ND AND SYSTEM LEVEL QUALIFICATION
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Paul P.E. Wang, Ph.D., DongJi Xie, Ph.D., Michael Miller, Jelena Larsen, Julia Purtell, Daniel Lau, Daniel Chang, Jerry Tzou, Brian Hung, Hector Marin, Dan Rooney, Ph.D., Chrys Shea, Ravi Bhatkal, Ph.D., and Dongkai Shangguan, Ph.D.
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Abstract
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SHAPE SENSITIVITY ANALYSIS OF MICROSTRIP PATCH ANTENNA FOR USE IN A WIRELESS SENSOR NET
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R. E. Zich, A. Gandelli, M. Forcati, D. Monopoli, A. Pirisi, and P. Pirinoli
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Abstract
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NANOPACKAGING
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Rao Tummala, P. Markondeya Raj, Ankur Agrawal, Jack K. Moon, C. P. Wong, Janagama Goud, Tapobratha Bandyopadhyay, and Mahdevan Iyer
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Abstract
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ACCELERATED STRESS TEST COMPARISON OF CURRENT CARRYING LIMITATIONS; FLIP CHIP VS GE EMBEDDED CHIP BUILD-UP
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Ray Fillion, Charles Woychik, and Don Bitting
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Abstract
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EFFECTS OF ADHESION PROMOTION TREATMENT ON ELECTRICAL SIGNAL ATTENUATION
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Roger Krabbenhoft and Bruce Lee
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Abstract
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UNVEILING THE NEXT GENERATION IN SUBSTATE TECHNOLOGY
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Ron Huemoeller, Sukianto Rusli, Steve Chiang, Tsung Yuan Chen, Dave Baron, Lutz Brandt and Bernd Roelfs
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Abstract
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COOLING ENHANCEMENT OF A MULTI-WICK VAPOR CHAMBER
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S. H.-K. Lee, C. C. C. Choi, and Y. Jaluria
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Abstract
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RESEARCH AND APPLICATION OF A THERMAL MANAGEMENT DEVICE (CoolCapTM) FOR ELECTRONIC ASSEMBLIES
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Sameer Jain, Daryl Santos, Ph.D., and Brian Lewis, Ph.D.
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Abstract
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SnPb, Pb-FREE, AND BACKWARD COMPATIBLE SOLDERING PROCESSES OF HIGH-SPEED BGA CONNECTORS
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Scott Priore, Hien Ly, and Doug Prosenik
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Abstract
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A STUDY ON COPPER ELECTRODEPOSITION USED FOR VIA INTERCONNECTION, FOR THE APPLICATION OF WAFER LEVEL PACKAGING
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SeungJin Oh, YoonChul Sohn, WoonBae Kim, KeDong Baek, and ChangYoul Moon
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Abstract
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MICROFABRICATED POLYIMIDE BASED ACTUATORS
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Stephen M. Bobbio, Stephen W. Smith, Jason M. Zara, Scott M. Goodwin
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Abstract
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GAS PHASE FLUXLESS SOLDERING, CHEMISTRY AND APPLICATIONS
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Stephen M. Bobbio, Thomas D. DuBois, and Robert F. Lipscomb
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Abstract
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LEAD-FREE SOLDER DURABILITY TESTING AT ACCELERATED THERMAL EXCURSIONS FOR QFN AND DFN PACKAGE INTERCONNECTS
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Steve Sytsma and Mark Wrightson
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Abstract
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FROM PRINTING TO REFLOW: PROCESS DEVELOPMENT FOR 01005 ASSEMBLY
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Sudeep Nambiar, Daryl Santos, Vatsal Shah, Rita Mohanty, and Joe Belmonte
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Abstract
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INVESTIGATING DENDRITIC GROWTH USING A LOCALIZED EXTRACTION TECHNIQUE
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Terry Munson
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Abstract
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CLEANING PROCESS CONSIDERATIONS FOR ADVANCED PACKAGING DEVICES AND ASSEMBLY
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Thomas M. Forsythe and Michael Bixenman
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Abstract
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3D PACKAGING OF IMAGING AND MIXED FUNCTION ICs FOR NEXT GENERATION ELECTRONICS
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Vern Solberg
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Abstract
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POLYIMIDE BASED EMBEDDING TECHNOLOGY FOR RF STRUCTURES AND ACTIVE COMPONENTS
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Wim Christiaens, Bart Vandevelde, Steven Brebels, and Jan Vanfleteren
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Abstract
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OPTIMIZE OXYGEN LEVEL IN SEMI-INERT WAVE SOLDERING - NITROGEN CONSUMPTION COST DOWN
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Xiao Shenghan
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Abstract
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RESEARCH ON QFN ASSEMBLY PROCESS
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Zhenkai Qin and Shoukai Zhang
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Abstract
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